JPH10321424A - Method and apparatus for trimming film surface - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a deleterious effect of temperature rise during trimming in the trimming of film surface. SOLUTION: An apparatus and method consist of a high-pressure fluid generator pressurizing a fluid, a nozzle 13 which connects to the high-pressure fluid generator and injects a jet 16 of the fluid to a film surface at high speed, and a device for moving an injection point enabling an injection point on the film surface of the jet 16 to be moved. And the fluid is pure water, and abrasive of extremely small particle size is mixed with the fluid to grind the film surface formed on a chip surface by a jet of the high-speed fluid.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for trimming a film surface.

[0002]

2. Description of the Related Art Conventionally, in the manufacturing process of a chip type resistor or the like, a film-shaped resistor made of ruthenium oxide or the like is formed on the surface of a chip made of a ceramic or the like, and the film-shaped resistor is formed by a laser trimming process. Processing is performed to match the resistance value of the film-shaped resistor to a desired resistance value.

FIG. 4 is an explanatory view of a laser trimming step for a single chip. In a single chip a, the film resistor b is excessively removed during trimming or the film resistor b is scattered. In order to prevent oxidation or the like, a thin glass coating c is applied in advance.

[0004] Thereafter, a film-like resistor b is connected via a probe d.
The laser light e controlled by the feedback control based on the measured value while measuring the resistance value of the film-shaped resistor b to linearly remove a part of the film-shaped resistor b to form a trimming groove f. A desired resistance value is given to the chip.

On the other hand, in the case of a large-sized ceramic substrate, a lattice-shaped break groove is formed on the ceramic substrate, and a film-shaped resistor formed in each area defined by the break groove is respectively provided. There is a manufacturing method in which the above ceramic substrate is divided into single chips after forming the chips by laser trimming. In this method, unlike the single chip, the film resistor of each chip is divided before dividing the ceramic substrate. Is sequentially trimmed one by one.

[0006]

However, in the conventional trimming method described above, there is a danger that the visual acuity is impaired when the laser beam e or its reflected light enters the eyes.

Further, in order to prevent the film resistor b from being excessively removed at the time of laser trimming, it is necessary to apply a thin glass film on the upper surface of the film resistor. Therefore, there is a problem that the cost is increased.

In addition, the film-like resistor and the scum of the glass coating scattered during trimming are baked on the upper surface of the glass coating and remain without being removed by washing or the like, and this protects the chip. There is a problem that this causes a pinhole to occur in the coating.

Further, since the heat generated during laser trimming causes the temperature of the chip or the film-shaped resistor to rise and the resistance of the film-shaped resistor to fluctuate, it is difficult to precisely adjust the resistance. .

In order to solve such a drawback, a method of measuring the temperature of a film-shaped resistor or a chip during trimming and estimating a resistance value after cooling from the measured temperature to control the trimming amount can be considered. In an actual film-shaped resistor, since the individual difference of the temperature resistance coefficient is large, it is difficult to obtain the accuracy of the resistance value adjustment.

In particular, in the above-described method of manufacturing a large-sized ceramic substrate, when the film-like resistor of each chip before division is sequentially trimmed, the temperature of the ceramic substrate gradually increases, and the adjusted resistance value increases. However, there is a problem that a large error is apt to occur, and it is necessary to perform trimming with a long interval or to cool the ceramic substrate.

[0012]

SUMMARY OF THE INVENTION In view of the above, the present invention provides a method of trimming a film surface formed by grinding a film surface formed on the surface of a chip with a high-speed fluid jet. .

[0013] The present invention has the following features.

The fluid is pure water.

[0015] Mixing an abrasive having an extremely small particle size into the fluid.

A high-pressure fluid generator for pressurizing the fluid to a high pressure, a nozzle communicating with the high-pressure fluid generator and jetting a jet of fluid at high speed toward the membrane surface;
An injection point moving device which is capable of moving an injection point of the jet onto the film surface.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the embodiment of the present invention, the film surface to be trimmed is a film resistor of a chip type resistor, and the purpose of trimming is to adjust the resistance value of the film resistor. A part of the film-shaped resistor is linearly removed by a high-speed fluid jet to form a trimming groove so that the resistance value of the film-shaped resistor matches a desired value. The resistance value of the resistor is continuously measured, and based on the measured value, the movement of the jet injection point is feedback-controlled to obtain a desired resistance value.

The fluid used for the jet may be a fluid that does not hinder the resistance measurement for the feedback control, for example, a liquid having extremely low electric conductivity such as pure water or an organic solvent, or air, reducing, or the like. A gas such as an inert gas can be used, and an abrasive having an extremely small particle size can be mixed into the fluid to increase the grinding ability of the jet.

As described above, by using the fluid jet for trimming the film-shaped resistor, the temperature rise of the film-shaped resistor and the chip is prevented, the trimming can be performed at a constant temperature, and the resistance value can be adjusted with high precision. It can be carried out.

When pure water or an organic solvent is used for the jet, the film resistor and the chip can be washed simultaneously with the trimming.

Also in the above-mentioned manufacturing method, the ceramic substrate is not heated, and the trimming is always performed at a constant temperature. Therefore, the trimming can be performed in the shortest time interval. And can be compatible.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of trimming a film-shaped resistor according to the present invention will be described with reference to the accompanying drawings, in which an embodiment of trimming a chip having a film-shaped resistor made of ruthenium oxide using a large-sized ceramic substrate will be described.

FIG. 1 shows a chip assembly 3 formed by assembling a large number of chips 2 on an undivided ceramic substrate 1 before a trimming step. A grid-like break slit formed on the ceramic substrate 1 is shown in FIG. A substantially rectangular film-shaped resistor 5 is formed by printing and baking a paste-like material on the surface of each of the sections divided by 4, and electrodes respectively connected to opposing ends of the film-shaped resistor 5. 6,6.

The chip assembly 3 is divided into individual chips 2 along the above-mentioned break slits 4 in a process close to the final stage of the production, and the chip 2 has a resistance value. There is a deviation that cannot be used as it is due to variations in the printing thickness and baking temperature of the paste-like coating material, and the deviation is adjusted within an allowable range by a trimming process, and then divided for each chip 2, An electrode is formed and commercialized as a chip-type resistor having an accurate resistance value.

In the trimming, only the adjustment of the resistance value in the increasing direction is possible. Therefore, in the manufacture of the chip assembly 3, the width of the film-shaped resistor 5 and the paste-like material are considered in anticipation of the adjustment allowance by the trimming. Set the print thickness and so on.

FIG. 2 shows a trimming apparatus used in this embodiment.
10, a trimming device 10 includes a transfer device 11 capable of moving the chip assembly 3 at intervals of one pitch, a high-pressure fluid generator 12, and a nozzle communicating with the high-pressure fluid generator 12.
13 and two servo motors that support the nozzle 13 and
An injection point moving device 18 for moving the injection point 17 of the jet 16 from the nozzle 13 in the X and Y directions in conjunction with the nozzles 14 and 15
A resistance measuring device 20 including a probe 19 that can be connected to the electrodes 6 and 6 of the chip 2 for measuring the resistance value of the film-shaped resistor 5 during trimming; a control program; Based on the measured value and a preset target value, the operation of each of the servo motors 14 and 15 and the feedback control of the jet 16 injection / stop, and the servo motors 14 and 15 , A pattern recognition camera 23 and a monitor 24, a joystick 25 for manual operation, and a suction device 26.

The high-pressure fluid generator 12 includes a high-pressure pump for pressurizing pure water to a high pressure, a booster for further pressurizing the pressurized water from the high-pressure pump, and an accumulator for smoothing the pulsation of the high-pressure water from the booster. And so on.

The nozzle 13 has a thin ejection hole,
The high-pressure pure water is ejected from an ejection port as a high-speed jet 16, and the jet 16 is ejected substantially perpendicularly to the surface of the film-shaped resistor 5 to grind and remove the film-shaped resistor 5. ing.

The suction device 26 is composed of a suction pump 27 and a suction port 28 connected to the suction pump 27 and opened toward the chip 2 being trimmed. Suction removal of water splashes and grinding debris of the film-shaped resistor 5 is performed.

Next, a trimming process using the trimming device 10 will be described.

FIG. 3 shows a single chip 2 in the chip assembly 3 set in the transfer device 11 of the trimming device 10.
And a probe 19 of a trimming device 10 is pressed into contact with both electrodes 6 and 6 of each chip 2.
The resistance of the film-shaped resistor 5 is measured by conducting the current. Based on the measured value, the jetting / stopping of the jet and the movement of the jetting point 17 are feedback-controlled, and the film-shaped resistor 5 of each chip 2 is controlled.
The injection point 17 is moved in a direction traversing between the electrodes 6 and 6 from one side edge until reaching a constant resistance value smaller than a desired resistance value to form a first trimming groove 29, and then, In the direction of the electrode 6, the injection point 17 is moved to form the second trimming groove 30 until the desired resistance value is reached while performing feedback control substantially in the same manner as described above.
The chip assembly 3 is moved by the pitch, a trimming process is performed on the adjacent chips 2, and the trimming process is repeated to trim all the chips 2 of the chip assembly 3.

Also, during the trimming process, splashes and grinding debris generated are suctioned and removed from the suction port 28 of the suction device 26, so that the splashes and grinding debris are removed from the visual field of the camera 23 for resistance value measurement and pattern recognition. Is prevented from being hindered.

In this manner, the chip assembly 3 on which all the chips 2 have been trimmed is provided with a glass coating for protecting the film-like resistor 5 after trimming, and a marking indicating the resistance value, the accuracy class, and the like. After processing, the chip 2 is divided individually along the break slits 4 between the chips 2, and the end surfaces and the back surfaces of the electrodes 6, 6 of each chip 2 are subjected to plating treatment for conduction with the outside. Manufactures chip resistors as products.

As described above, since the film resistor 5 is trimmed by the fluid jet, the ceramic substrate 1 and the film resistor 5 are not heated, and the trimming process can be performed at a constant temperature throughout. Accordingly, there is no temperature drift of the film-shaped resistor 5 and precise resistance value adjustment can be performed.

Further, since pure water is used for the jet 16, the chip 2 can be washed at the same time as trimming.

It should be noted that a fluid other than pure water can be used for the jet 16, and a fluid which does not hinder the resistance measurement for the feedback control, such as an oil or an organic solvent, has an extremely high electric conductivity. A low liquid or a gas such as air or an inert gas can be used, and an abrasive having an extremely small particle size can be mixed into the fluid to improve the grinding ability.

In the above embodiment, the film resistor 5 is set in the trimming device 10 with the film resistor 5 facing upward. However, the jet 16 is set in the trimming device 10 with the film resistor 5 facing down. Jetting the film resistor 5 from below, setting the film resistor 5 vertically, jetting the jet 16 to the film resistor 5 from the horizontal direction, and trimming the film resistor 5 by inclining Set it on device 10 and jet 16
Can be sprayed substantially perpendicularly to the film-shaped resistor 5 to facilitate the removal of splashes and grinding debris.

Further, in the above embodiment, the droplets and grinding debris are removed by suction. However, the droplets and grinding debris can be removed by blowing high-pressure gas.

Further, in the above-described embodiment, the jet is jetted substantially perpendicular to the film surface. However, when the adhesion between the chip surface and the film surface is weak, the jet is inclined and jetted to the film surface. Thereby, peeling of the film surface can be prevented.

The present invention is not limited to the above-described trimming of the film-shaped resistor of the chip type resistor, but is applicable to the trimming of various film surfaces formed on the surface of the chip.

[0041]

According to the present invention, the following effects can be obtained.

According to the first aspect of the present invention, the film surface formed on the chip surface is ground by a jet of a high-speed fluid, so that the film surface can be trimmed at a constant temperature all the time. It can be performed.

In particular, even when a large number of chips are formed on a large-sized ceramic substrate and the chips are successively trimmed, the chips maintain a constant temperature throughout, so that the adverse effects of heat can be prevented. Highly reliable products can be mass-produced.

In the laser trimming, when each chip is sequentially trimmed, the temperature of the ceramic substrate gradually increases, and the adverse effect of heat is greatly affected.

According to the second aspect of the present invention, since the fluid is pure water, the chip is cleaned at the same time as the trimming, so that the cleaning step is omitted to reduce the manufacturing cost or to protect the chip in the next step. The reliability of the coating film can be manufactured.

By mixing an abrasive having an extremely small particle size into the fluid, the grinding ability of the film-shaped resistor can be increased and trimming can be performed efficiently.

According to the third aspect of the present invention, the trimming device includes a high-pressure fluid generating device that pressurizes the fluid to a high pressure, and a nozzle that communicates with the high-pressure fluid generating device and jets a fluid jet at a high speed toward the membrane surface. And a jet point moving device that can move the jet point of the jet onto the film surface, so that the above-described trimming of the film surface by the fluid jet can be realized.

[Brief description of the drawings]

FIG. 1 is a plan view of a chip assembly.

FIG. 2 is a perspective explanatory view showing a configuration of a trimming device.

FIG. 3 is an explanatory perspective view of a trimming step.

FIG. 4 is an explanatory perspective view of a conventional laser trimming step.

[Explanation of symbols]

 2 Chip 5 Membrane resistor (membrane surface) 10 Trimming device 12 High pressure fluid generator 13 Nozzle 16 Jet 17 Injection point

Claims (4)

[Claims] 1. A method for trimming a film surface, wherein the film surface formed on the surface of the chip is ground by a jet of a high-speed fluid. 2. The method according to claim 1, wherein the fluid is pure water. 3. The method for trimming a film surface according to claim 1, wherein an abrasive having an extremely small particle size is mixed in said fluid. 4. A high-pressure fluid generator for pressurizing a fluid to a high pressure, a nozzle communicating with the high-pressure fluid generator and jetting a jet of fluid at high speed toward a membrane surface, and a jetting point of the jet onto the membrane surface. And an injection point moving device capable of moving the trimming device.