JPH10313075A - Board for chip mounting use and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to shorten the process for manufacturing a board for chip mounting use in comparison with a machining to manufacture the boards for chip mounting use one piece by one piece by a conventional facing work by a method wherein a through hole plated layer is provided in through holes and a through hole for component sealing and mounting use to form a circuit and the through holes are subjected to etching work. SOLUTION: Through holes 42 are formed in the periphery of a laminated board 40 at constant intervals and after a through hole plated layer is provided in these holes 42, the holes 42 are subjected to etching work to form a circuit, the holes 42 are diced or a polishing agent is mixed into water to cut the holes 42 at a high pressure and a circuit 44 is formed by a mold processing. Moreover, an IC chip is provided on each terminal 28 for chip mounint use and a metal plate or a resin plate 46 is bonded to the board 40 or is laminated on the board 40 to form integrally the board 40 with the metal plate or the plate 46. Thereby, as the method for manufacturing this board for chip mounting use is one using the formation of a pattern and an etching excluding a hole processing of a through hole for component sealing and mounting use, a shortening of the process for manufacturing the board becomes possible in comparison with a machining to manufacture the boards for chip mounting use one piece by one piece by a conventional facing work.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting substrate and a method of manufacturing the same, and more particularly, to a chip mounting that can be directly joined to a molded product having a thick material with a thickness of several hundred microns and does not require a socket. The present invention relates to a substrate for use and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, recesses at locations where chips are mounted one by one have been formed on a substrate by machining such as spot facing. This method required adjustment in X and Y axis directions in addition to adjustment in the Z axis (vertical axis) direction in units of several microns.

[0003]

[Problems to be solved by the invention]

(1) Machining must be performed accurately and requires considerable skill and time. (2) A method of forming a wall (commonly called a dam) having a required height by a printing method has also been proposed, but the thickness is limited, and the adhesive used for the wall flows out, so that the wall is several tens of microns or less. Only processing was possible. (3) It is difficult to form a necessary and reliable circuit and bonding pad on the intermediate layer because the circuit has a thickness of several tens of microns and the intermediate layer has a thickness of several hundreds of microns.

[0004]

According to one aspect of the present invention, there is provided a chip mounting board and a method of manufacturing the same, comprising a copper foil, an insulating layer, and a laminated material each having a required width and thickness. Forming a through hole for mounting a component of a required size in a required portion of the first substrate material; a second substrate material comprising a copper foil, an insulating layer, and a copper foil each having a required width and thickness; Forming a component mounting through hole of a required size at a position corresponding to the component sealing and mounting through hole of one substrate material;
A step of forming an exposed circuit and a terminal on the copper foil of the second substrate material after pattern formation to form an exposed circuit and a terminal, and providing a chip mounting pad; and a step of forming a non-flow type on the laminated surface of the first substrate material. Applying an adhesive, applying a metal plating resist to the circuit of the second substrate material, and pressing and laminating the first substrate material and the second substrate material at a high temperature and a high pressure for a required time. And forming a through board around the laminated board.
Forming a hole, forming a circuit by applying a plated-through-hole layer to the through-hole and the through-hole for sealing and mounting the component, and performing an etching process. It is.

[0005] The other gist of the present invention is to provide a first substrate material having a required size and thickness for forming a through hole for encapsulating and mounting components, a copper foil having a required width and thickness, an insulating layer and a laminated material, respectively. Forming a through hole for sealing and mounting of a required size at a position corresponding to the through hole for sealing and mounting the component, performing a required width and etching to form an exposed circuit and a terminal, and mounting the chip; A pad is provided, a non-flow type adhesive is applied to the lamination surface of the first substrate material, and the circuit is combined with a second substrate material obtained by applying a metal plating resist by plating,
After forming a pattern by forming a pattern on the periphery of the laminated substrate and the through hole for component sealing and mounting by pressing the laminated substrate for a required time at a high temperature and a high pressure, and forming the pattern around the laminated substrate, etching is performed. To form an exposed circuit and terminals, provide chip mounting pads, and attach a non-
Apply a flow type adhesive and apply metal plating to the circuit.
A laminated substrate pressed with high temperature and high pressure for a required time together with the second substrate material subjected to the resist, and a hole is formed in the laminated substrate, through-hole plating is performed, and the sealing and through holes for mounting components are formed. This is a chip mounting substrate obtained by applying various platings to an exposed circuit in which a pattern is formed by etching a substrate.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a chip mounting board according to the first and third aspects will be described with reference to the accompanying drawings. Claim 1
In FIG. 1 showing an embodiment of the method for manufacturing a chip mounting substrate described above, first substrate members 10 each having a required width and thickness are shown.
Comprises a copper foil 12, an insulating layer 14 made of glass fiber epoxy resin, and a bonding sheet 16 made of a semi-curable resin, and through holes 12a, 14a of a required size are formed in required portions of the first substrate material 10 by drilling. And 16a.

In FIG. 2, a second substrate material 20 comprises a copper foil 22, an insulating layer 24, and a copper foil 26 each having a required width and thickness.
In the second substrate 20, component mounting through holes 22 of a required size are formed in the corresponding positions of the component mounting through holes 12 a, 14 a and 16 a of the first substrate 10 by drilling.
a, 24a and 26a are respectively formed by drilling.

Referring to FIGS. 2 and 3, a photosensitive agent is laminated on the copper foil 22 on the upper surface of the second substrate member 20, exposed and developed to form a required pattern, and then etched to form an exposed circuit 22b. Form.

Next, chip bonding wire bonding terminals 28 are formed on the exposed circuit 22b.

Referring to FIGS. 1-3, the first substrate material 20 has a first
A metal plating resist is applied to the exposed circuit 22b on the joint surface with the substrate material 10.

The first substrate material 10 and the second substrate material 20 are heated at a high temperature of 100 to 200 ° C. and a high pressure of 5 to 70 kg / cm ^2.
, And pressurized for a required time to form a laminated substrate 40.

In FIGS. 5 and 6, through holes 42 having a diameter of 0.1.phi. Or more are formed at regular intervals around the laminated substrate 40, and through holes 42 are plated in the through holes 42. Then, a circuit is formed by etching, a through hole is diced, or an abrasive is mixed with water and cut at a high pressure, and the circuit 44 is formed by another method or die processing.

An IC chip 34 is provided in the through hole for component sealing and mounting (chip mounting terminal 28) of the laminated substrate 40, and a metal plate or a resin plate 46 or the like is bonded or laminated to be integrated.

The manufacturing method of the embodiment of the second aspect of the present invention differs from the embodiment of the first aspect of the present invention in that
The substrate material 20 is formed in the through holes 12a, 1
It is assumed that no component mounting through holes corresponding to 4a and 16a are formed.

In an embodiment of the present invention, a metal substrate for heat radiation is not provided on the back side of the laminated substrate 40.

In an embodiment of the present invention, the synthetic resin is sealed (filled) instead of the metal plating resist.
It was done.

According to an embodiment of the present invention, in a first substrate material 10 comprising a copper foil, an insulating layer and a laminated material, a copper foil 12, a glass fiber epoxy resin insulating layer 14, The bonding sheet 16 is made of a semi-curable resin.

In an embodiment of the present invention, the insulating layer 14 is made of glass fiber epoxy resin and
The circuit 22b on No. 4 is subjected to metal plating to form a metal resist.

As described above, in the chip mounting board according to the embodiment of the present invention, the non-flow type adhesive is applied to the lamination surface of the second board member 20 so that the first board member is provided. 10 are laminated together at a high temperature and a high pressure to form a laminated substrate 40.

[0020]

As described above, according to the method for manufacturing a chip mounting board according to the present invention, (1) the manufacturing method according to the present invention can be compared with the conventional one-by-one machining by spot facing. Is based on pattern formation and etching except for hole processing of the through hole for sealing and component mounting, so that the process can be significantly shortened.

(2) In a known method, a wall (commonly called a dam) having a required height is formed by a printing method, so that the thickness is limited and an adhesive used for the wall flows out. Only those having a size of 10 μm or less were unstable.
However, the non-flow flow
By applying a type of adhesive, this defect can be completely removed.

[Brief description of the drawings]

FIG. 1 is a partially enlarged longitudinal perspective view of a first substrate material in which a component sealing and a mounting hole are formed in an embodiment of a method of manufacturing a chip mounting substrate according to the present invention.

FIG. 2 is a partially enlarged longitudinal perspective view of a second substrate material in which component sealing and mounting holes are formed as in FIG.

FIG. 3 is a partially enlarged longitudinal sectional side view schematically showing a circuit formed by pattern formation and etching on copper foil on both surfaces of a second substrate material shown in FIG. 2;

FIG. 4 is a partially enlarged longitudinal perspective view showing the embodiment of FIG. 3 cut at another portion.

FIG. 5 is a front view of the chip mounting substrate manufactured by the method of manufacturing a chip mounting substrate according to the present invention.

FIG. 6 is an enlarged schematic perspective view cut along the line VI-VI of FIG. 5;

FIG. 7 is a side view of FIG. 6;

FIG. 8 is a partial side schematic view showing through holes formed in a laminated substrate.

[Explanation of symbols]

 Reference numeral 10: first substrate material; 12: copper foil; 12a: through hole; 14: insulating layer; 16: laminated material; 16a: sealing through hole; · 2nd substrate material; 22a · · · through-hole for component sealing and mounting · 22 b · · · circuit; 24 · · · insulating layer; 24 a · · · through-hole for mounting components; ··· Through-holes for component sealing and mounting; 26b ··· Copper foil for forming an exposed circuit; 22b ··· circuit; 28 ··· terminal for chip mounting; · Laminated substrate; 42 · Through hole; 44 · Circuit; 46 · Metal substrate for heat dissipation or multipurpose synthetic resin plate.

Claims (8)

[Claims] Forming a through hole for sealing and mounting a required size of a component in a required portion of a first substrate material comprising a copper foil, an insulating layer, and a laminated material having a required width and thickness, respectively; ;
A second board member made of a copper foil, an insulating layer, and a copper foil each having a required width and thickness, and a component of a required size is provided at a position corresponding to the component sealing and mounting through hole of the first board material. Forming a through hole for sealing and mounting; and performing etching after forming a pattern on the copper foil of the second substrate material to form an exposed circuit and a terminal, and providing a chip mounting pad; Applying a non-flow type adhesive to the laminated surface of the first substrate material; applying a metal plating resist to the circuit of the second substrate material; and applying the first substrate material and the second Pressurizing and laminating a substrate material at a high temperature and a high pressure for a required time to form a laminated substrate; and forming a through-hole around the laminated substrate and a through-hole for sealing and mounting the component. Forming a circuit by hole plating and etching;
A method for manufacturing a chip mounting substrate comprising: 2. A step of forming through holes for sealing and mounting parts of a required size at required positions of a first substrate material comprising a copper foil, an insulating layer and a laminated material each having a required width and thickness. ;
In the copper foil of the second substrate material, through holes for sealing and mounting parts of a required size are formed at required places, and after pattern formation, etching is performed to form exposed circuits and terminals, and chip mounting is performed. Providing a pad; applying a non-flow type adhesive to the lamination surface of the first substrate material; applying a metal plating resist to the circuit of the second substrate material; Pressing and laminating one substrate material and the second substrate material at a high temperature and a high pressure for a required time to form a laminated substrate; a required number of the same substrate materials as the first substrate material and the second substrate material And a step of forming a circuit by plating a through hole around the laminated substrate and a through hole for sealing and mounting the component to form a circuit, and performing an etching process. The method for manufacturing a chip mounting substrate according to claim 1. 3. A required size is provided at a required portion of a first substrate material having a copper foil, a polyimide, a modified epoxy resin, a glass fiber resin insulating layer and a semi-curable resin bonding sheet each having a required width and thickness. Forming a through hole for component sealing and mounting; a second substrate material comprising a copper foil, a glass fiber epoxy resin insulating layer, and a copper foil each having a required width and thickness; Forming a component sealing and mounting through-hole of a required size at a position corresponding to the component sealing and mounting through-hole of a plate material;
Etching after forming the pattern to form an exposed circuit and a terminal to provide a chip mounting pad; applying a non-flow type adhesive to the lamination surface of the first substrate material; Applying a metal plating resist to the circuit of the substrate material; and applying the first substrate material and the second substrate material to a high temperature,
Pressing at a high pressure for a required time and laminating to form a laminated substrate;
2. The process according to claim 1, further comprising the steps of: forming a circuit by applying through-hole plating to the through-hole and the through-hole for sealing and mounting the component around the laminated substrate to form a circuit; Manufacturing method for chip mounting substrate. 4. The method for manufacturing a chip mounting substrate according to claim 1, wherein no metal substrate for heat radiation is provided on the back side of said laminated substrate. 5. The method for manufacturing a chip mounting substrate according to claim 1, wherein a synthetic resin is sealed (filled) in place of said metal plating resist. 6. A first substrate material having a copper foil, an insulating layer and a laminated material; said insulating layer is made of glass fiber epoxy resin;
6. The method for manufacturing a chip mounting board according to claim 1, wherein said laminated material is a semi-curable resin bonding sheet. 7. A first substrate material having a copper foil, an insulating layer and a laminated material; said insulating layer is made of glass fiber epoxy resin;
7. The method for manufacturing a chip mounting board according to claim 1, wherein a metal plating resist is applied to the circuit on the laminated material. 8. A first substrate material having a required size and thickness of a copper foil, an insulating layer, and a laminated material, each having a required size of a component sealing and mounting through hole; Forming a through hole for mounting a component of a required size at a position corresponding to the hole, having a copper foil having a required width and thickness, an insulating layer and a copper foil, and performing etching after pattern formation on the copper foil. Form an exposed circuit and terminals, provide chip mounting pads,
A laminated substrate which is provided with a non-flow type adhesive on the laminating surface of the first substrate material, is combined with a second substrate material having a metal resist applied to the circuit, and is pressed at a high temperature and a high pressure for a required time; After forming a pattern by etching the periphery of the substrate and the through hole for component sealing and mounting, a metal plating resist is applied to the circuit, and the through hole formed around the laminated substrate, the component sealing and A chip mounting substrate comprising a mounting through-hole and an exposed circuit formed by performing through-hole plating and then etching.