JPH10310245A - Curing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate extraction of a lead frame after curing treatment by forming a curing device free to operate a carrying direction of the lead frame on a lead frame delivery part in both directions of a magazine direction and its opposite direction. SOLUTION: A large number of carrier rollers 16 to place lead frames P on them are arranged in parallel on a lead frame delivery part 14, and the lead frames P are carried in the longitudinal direction by rotating them by driving a belt suspended on a pulley 16a. The lead frames P are delivered in an A direction by the lead frame delivery part 14 in an ordinary driving state and are stored in a magazine M by an elevator 12a. The lead frames P after curing treatment are delivered in a B direction by rotating the carrier rollers 16 of the lead frame delivery part 14 and are transferred and placed on a lead frame 15 in case of extracting and inspecting the lead frames P. Consequently, it is possible to facilitate extraction of the lead frames and to extensively shorten time required for inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing apparatus, for example, a method of manufacturing a semiconductor device such as an LSI by bonding a chip to a lead frame by a die bonder (die bonding process), and then thermally curing the adhesive to form the chip. The present invention relates to a curing device used for fixing the fixing device to a lead frame.

[0002]

2. Description of the Related Art In a curing apparatus used in a process of manufacturing a semiconductor device, a lead frame die-bonded by a die bonder is introduced into a heat-curing chamber, heated to a predetermined temperature, and an adhesive (paste) used in the die bonding process is removed. Thermosetting, for example, as disclosed in JP-A-4-13581
As described in Japanese Patent Application Laid-Open Publication No. H07-106348 and Japanese Patent Application Laid-Open No. Hei 7-106348, there is a structure in which a lead frame is sequentially placed on a plurality of heat blocks heated and held at a predetermined temperature and heated while being transported. doing.

[0003] The lead frame after the curing process is
Normally, since it is transported to the next process in the state of being stored in the magazine, the curing device is provided with a magazine transport device for transporting the magazine for storing the lead frame,
At the exit of the heat curing chamber, there is provided a lead frame sending section for sending the cured lead frame to a magazine which is transported to a predetermined position by a magazine transport device.

The magazine is formed so as to accommodate a large number of lead frames in upper and lower tiers. When accommodating the lead frames, the magazine is moved at a predetermined pitch by an elevator provided in a magazine transport device. The lead frame is moved up and down, and a large number of lead frames are sequentially stored at predetermined positions in the magazine. That is, the lead frame that has been cured through the heat-curing chamber is sent out in the magazine direction by the lead-frame sending section provided at the outlet of the heat-curing chamber, and is sequentially stored in the magazine.

On the other hand, when the type of the lead frame or chip to be processed, the type of the paste, and the like are changed, the lead frame after the curing process is extracted and observed with a microscope or the like, and the adhesion state of the paste is inspected. I have to. Conventionally,
The extraction inspection lead frame is configured to extract the one stored in the magazine after the curing process, and the extraction of the lead frame is performed after the predetermined lead frame is stored in the magazine. The operation is performed after the elevator is idled and the magazine is transported to a magazine removal position.

[0006] After the inspection, the lead frame is returned to the original position of the magazine, the magazine is moved to a predetermined position on the elevator, and then a normal process is started. During the sampling inspection of the lead frame, the die bonder, the curing device, and the magazine transport device are in a predetermined standby state.

[0007]

However, it takes a certain amount of time to transport the magazine due to the idle feeding of the elevator, so that in order to reduce the time required for inspection, the magazine on the elevator is taken out and the lead frame is mounted. There was a thing that I had to remove. As described above, when the magazine on the elevator is removed, the magazine transport device may determine that an error has occurred because the magazine is not located at the predetermined position.Therefore, it takes time to release the error or reset the magazine to the predetermined state. There was such a case.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a curing apparatus that can easily remove a lead frame after a curing process, and can greatly reduce the time required for a lead frame removal inspection. .

[0009]

In order to achieve the above-mentioned object, a curing apparatus according to the present invention comprises a lead frame after a curing process, which is provided at an outlet of a heat curing chamber for curing a lead frame die-bonded by a die bonder. In a curing device having a lead frame sending unit for storing in a magazine conveyed by a magazine conveying device, the lead frame sending direction of the lead frame sending unit can be operated in both directions of the magazine direction and the opposite direction. A lead frame receiving section for receiving the lead frame conveyed in the opposite direction is provided in series with the lead frame sending section.

[0010]

FIG. 1 is a plan view showing one embodiment of a curing apparatus according to the present invention. The curing device 10 includes a lead frame transport device 11 that transports a lead frame P that has been sent from the die bonder 20 and that has been subjected to die bonding processing,
A magazine transport device 12 for transporting a magazine M for accommodating the cured lead frame; and a lead frame receiving portion 15 connected to a lead frame sending portion 14 provided at an outlet 13a of the heat curing chamber 13. It was established. In addition, a cover (not shown) is provided around the lead frame transport device 11, the heat curing chamber 13, and the elevator 12a of the magazine transport device 12, so that the user can touch the lead frame P or the magazine M in a normal state. It is formed so that it cannot be done.

The lead frame sending section 14 has a plurality of transport rollers 16 on which a lead frame P is mounted, and the transport rollers 16 are arranged in parallel with each other. The lead frame P (not shown) is rotated in a predetermined direction by being driven by a motor, and transports the lead frame P in the longitudinal direction.

Further, the lead frame receiving section 15 comprises:
It has a number of rollers provided at the same level as the lead frame sending section 14, and by linking these rollers with the transport roller 16, the lead frame P can be transferred to and from the lead frame sending section 14. It is formed as follows. This lead frame receiving section 15
Has no cover or has a cover that can be easily opened and closed, and is formed so that the lead frame P on the lead frame receiving portion 15 can be easily taken out or returned.

In a normal operation state, the lead frame P sent from the die bonder 20 is transported by the lead frame transport device 11 to the entrance 13b of the heat-curing chamber 13 and is cured through the heat-curing chamber 13. Thereafter, the arrow A is output by the lead frame sending section 14 of the exit section 13a.
It is sent out in the direction and stored in a magazine M which moves up and down to a predetermined position by the elevator 12a.

When the lead frame P is to be sampled, the transport roller 16 of the lead frame sending section 14 is rotated in the reverse direction to send the cured lead frame P in the direction of arrow B. Transfer to the top.

As described above, by transferring the lead frame P to be subjected to the sampling inspection onto the lead frame receiving portion 15, the lead frame P for the sampling inspection can be easily taken out. The lead frame P after inspection can be returned only by placing the lead frame P on the lead frame receiving portion 15, and storing in the magazine simply requires rotating the transport roller 16 in the forward direction by a predetermined program. It can be done with simple operations.

[0016] Therefore, since the idle feeding of the elevator is not required, the time required for the sampling inspection of the lead frame P can be greatly reduced. Furthermore, by incorporating an appropriate sampling inspection program, the inspector can arbitrarily set the number of lead frames to be extracted after changing the type of lead frame and paste, etc. It is also possible to take out an arbitrary lead frame inside.

Further, it is preferable that the lead frame receiving section 15 is provided with a guide for positioning when returning the lead frame after inspection. Further, the lead frame receiving portion 15 can be formed by a rail that slides the lead frame. In this case, a lead frame transport roller is provided near a portion connected to the lead frame sending portion 14, or a lead frame is provided. Or a pusher for pushing the wire toward the lead frame sending section 14 may be provided.

Since the lead frame transport device 11, the magazine transport device 12, and the heat curing chamber 13 can be formed in the same structure as that of a conventional well-known device, detailed description of these structures and operations is omitted. I do.

[0019]

As described above, according to the curing apparatus of the present invention, a lead frame for sampling inspection can be easily taken out, and the time required for sampling inspection can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a curing device of the present invention.

[Explanation of symbols]

10: Cure device, 11: Lead frame transport device, 1
2 Magazine transport device 13 Heat curing chamber 14 Lead frame sending section 15 Lead frame receiving section 16
... Conveying rollers, 20 ... Die bonder, M ... Magazine, P
…Lead frame

Claims (1)

[Claims] 1. A lead frame sending section for accommodating a cured lead frame in a magazine conveyed by a magazine conveying device is provided at an outlet of a heat curing chamber for curing a lead frame die-bonded by a die bonder. In the curing device, the lead frame transporting direction of the lead frame sending unit is formed so as to be operable in both the magazine direction and the opposite direction, and the lead frame receiving unit that receives the lead frame transported in the opposite direction. The curing device is connected to the lead frame sending section.