JPH10308574A5 - - Google Patents

Info

Publication number
JPH10308574A5
JPH10308574A5 JP1997132950A JP13295097A JPH10308574A5 JP H10308574 A5 JPH10308574 A5 JP H10308574A5 JP 1997132950 A JP1997132950 A JP 1997132950A JP 13295097 A JP13295097 A JP 13295097A JP H10308574 A5 JPH10308574 A5 JP H10308574A5
Authority
JP
Japan
Prior art keywords
thin film
conductive thin
wiring
film layer
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997132950A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10308574A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP13295097A priority Critical patent/JPH10308574A/ja
Priority claimed from JP13295097A external-priority patent/JPH10308574A/ja
Publication of JPH10308574A publication Critical patent/JPH10308574A/ja
Publication of JPH10308574A5 publication Critical patent/JPH10308574A5/ja
Pending legal-status Critical Current

Links

JP13295097A 1997-05-08 1997-05-08 配線形成方法およびそれに用いられる基板 Pending JPH10308574A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13295097A JPH10308574A (ja) 1997-05-08 1997-05-08 配線形成方法およびそれに用いられる基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13295097A JPH10308574A (ja) 1997-05-08 1997-05-08 配線形成方法およびそれに用いられる基板

Publications (2)

Publication Number Publication Date
JPH10308574A JPH10308574A (ja) 1998-11-17
JPH10308574A5 true JPH10308574A5 (cg-RX-API-DMAC10.html) 2005-04-07

Family

ID=15093295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13295097A Pending JPH10308574A (ja) 1997-05-08 1997-05-08 配線形成方法およびそれに用いられる基板

Country Status (1)

Country Link
JP (1) JPH10308574A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100396867B1 (ko) * 2001-02-26 2003-09-03 산양전기주식회사 절연성 고분자를 이용한 연성인쇄회로기판의 제조방법
JPWO2010137549A1 (ja) * 2009-05-26 2012-11-15 荒川化学工業株式会社 フレキシブル回路基板及びその製造方法

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