JPH10303465A - Face mounting semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip element which enables itself to be mounted at a face on, for example, a printed wiring board or the like without providing a mounting hole called chip mount, or surface mounting, or the like. SOLUTION: As a face mounting semiconductor element where a mold 24 covering a mounting board 41 mounted with an LED chip is thicker than the substrate 41 and covers the whole face of one side at least of the substrate 41, and the substrate 41 and a terminal are not protuberant to the periphery from the mold 24 when the mold is viewed from the direction of the normal of the substrate on the side where the chip is provided, a face mounting LED element 40 is obtained, which is downsized to an indispensable minimum size by enlarging the rate of the area Ac of the face of being placed on the chip substrate of the semiconductor chip 21 placed on the substrate 41 to the projected area As in the direction of the normal to the substrate of the said face mounting type of semiconductor element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component element called chip mount, surface mounting, etc., which can be mounted on a surface without providing mounting holes on a printed wiring board or the like. Things.

[0002]

2. Description of the Related Art As a conventional surface mount device,
No. 330637 and JP-A-8-321634.
An electrode terminal 95 is formed on a chip substrate 94 as shown in FIG. 15, and a surface mount type LED element 90 having an LED chip 91 electrically connected to the electrode terminal and a molded portion 93 on one substrate surface is known. is there. The LED element 90 is manufactured, for example, in the order of the process explanatory diagrams shown in FIGS.

At first, a substantially rectangular through-hole 82 is formed at an appropriate interval on a base substrate 80 such as a known printed circuit board formed by attaching copper foil 81 to both surfaces of an insulating substrate such as glass epoxy. To form a cross section as shown in FIG.

Next, in order to electrically connect the copper foils 81 provided on both surfaces of the base substrate 80, electroless plating of copper or the like, electrolytic plating, A conductive film 83 whose surface is covered with gold is formed by a method such as repeated plating and gold plating, and both surfaces are electrically connected through a through hole 82. Next, the mother substrate 80
A resist is applied to the copper foil 81 between the through-holes so as to form a desired wiring pattern, and a part of the copper foil is removed by a known means such as etching to form a plurality of LED chips as shown in FIG. Are formed in parallel to form a pad portion 84 and a wiring portion 85 on one surface side of the mother substrate 80. A substantially rectangular insulating portion 86 is also formed on the copper foil 81 on the back surface of the opposite substrate by the same means, whereby the mother substrate 80 is completed.

Then, as shown in FIG. 12, a P-type or N-type chip electrode of the LED chip 91 is mounted on the pad portion 84 with a conductive adhesive or the like, and the LED chip 9 is mounted.
The other electrode 1 and the wiring portion 85 are connected to a wire 9 such as a gold wire.
2 by bonding. Next, the LED chip 91 and the wire 92 connected in this manner are covered with a substantially trapezoidal column-shaped transparent insulating resin parallel to the through-hole 82 to form a molded portion 93. Next, the mother substrate 80 on which the molded portion 93 is formed is cut along a cutting line D shown in FIG.
By using a cutter or the like along the line, the mother substrate on which the mold portion is formed is divided into a plurality of surface-mounted LED elements 90 having LED chips 91.

The surface mount type LED element 90 manufactured in this manner has a substantially trapezoidal molded portion 93 and an electrode terminal 95 projecting laterally from the molded portion and connected to the chip electrode of the LED chip, facing the chip substrate 94. The shape has two sides.

[0007] In this method, when the mold portion is covered with a resin, it is set in a mold and molded. Therefore, the mother substrate 80 on which the LED chip 91 is mounted is mounted on the upper mold 96 and the lower mold 9 as shown in FIG.
7, a molding part 93 is formed therebetween. In this molding, if the molding is performed using an upper mold having a mold portion that reaches the portion of the through hole 82 of the base substrate 80, the resin of the molding portion is
To the back surface of the mother board through the
1 is attached to the surface of the surface mount type LED element 9.
However, when 0 is attached to a printed circuit board or the like, there is a disadvantage that electrical connection cannot be made, and the production yield is significantly reduced. In particular, when the surface-mount type LED element 90 is made small, the area of the copper foil exposed on the back surface of the base substrate 80 is also small, so that the resin should not flow around the back surface of the base substrate. Is important. Therefore, as shown in FIG. 13, it is assumed that the upper mold 96 and the electrode terminal 95 of the mother board are in surface contact with each other at the mold holding section 98 having a certain size. It is surely prevented from going around the back.

[0008]

In the conventional surface mount type device in which the semiconductor element is covered by the mold portion, a mold holding portion is required on the side of the mold portion for the above-described reason. It was inevitable that it would protrude from the part. The external dimensions of the minimum level of this type of surface mount type LED element currently commercially available are, for example, BR1111C manufactured by Stanley Electric Co., Ltd.
, The length Ls = 1.6 mm and the width Ws = 0.8 m
m, height Hs = 0.7 mm, length Ls =
1.6 mm, width Ws = 0.8 mm, height Hs = 0.8 m
m (CL-190), both of which have a 0.2 mm die holding portion at each of the electrode terminals on both sides of the molded portion. Even if these LEDs are said to be ultra-small, the electrode terminals 95 protrude outward from the mold part 93, and the protruding dimensions are 0.2 mm each in the element length Ls direction, ie, 0 mm in total. A region as large as 0.4 mm protrudes. The present applicant has studied to form the molded portion by minimizing the dimensions of the electrode terminals 95 protruding to the outside. However, the dimensions of the mold holding portions 98 of the electrode terminals were set to 0.1 mm on both sides of the molded portion. In this case, it often goes around the back surface of the substrate due to the positioning accuracy and error during manufacturing, and in reality, a dimension of about 0.2 mm is required. It has not been practically possible to reduce the dimensions of the terminals.

Further, since the LED chip 91 and the wiring portion 85 are connected by the wire 92, it is necessary to further protect the upper surface of the LED chip 91 by adding a wiring height to the wire. Also, it has been difficult to reduce the size in the height direction of the mold section. Further, since the wiring portion 85 connected on the other side of the wire also needs a certain area, it is difficult to further reduce the size of the mold portion in the wire bonding direction.

Further, misalignment is likely to occur between the upper mold and the mother substrate during resin molding, and even if the positioning is intended to be performed accurately, the molding resin may flow around the back surface of the substrate or may be completed. In some cases, the position of the light emitting portion of the surface-mounted LED may be displaced, which is one of the factors that lower the yield.

As means for solving such a problem, Japanese Patent Application Laid-Open No. 9-45964 has been invented by the present applicant. According to the prior invention, as shown in FIG.
The chip electrodes of the LED chips 91 arranged at a predetermined pitch P between the electrode plates 71, 71 are connected to the electrode plates 7.
1 and a bonding agent 72, and a transparent resin 73 is injected and hardened in this gap, and then cut and separated between adjacent LED chips to obtain a small-sized device as shown in FIG. The surface-mounted LED element 70 can be obtained. Since the LED element 70 does not require a wire bond, there is no need to take the height of the lead of the wire, and a die holding part when forming the mold part is also unnecessary. The size can be reduced.

However, since the LED element 70 manufactured by this manufacturing method is manufactured by sandwiching both side surfaces of the plurality of LED chips 91 between opaque electrode plates,
Since each LED chip 91 is not uniformly and reliably bonded to the electrode plate 71, there is a problem that the bonding strength of the electrode plate is weak and peeling failure easily occurs. The light emitted from the surface-mounted LED element 70 is blocked on two of the six rectangular parallelepiped surfaces, and the surface of the transparent resin 73 of the surface-mounted LED element 70 is a cut surface. Therefore, there is also a problem that the shape cannot be made curved and it is difficult to give the mold resin a lens function.

Accordingly, a first object of the present invention is to obtain a surface-mount type semiconductor device having no portion protruding outside the molded portion. A second object is to obtain a surface-mount type semiconductor element which is reduced in size to a predetermined ratio or less with respect to a semiconductor chip. A third object of the present invention is to provide a chip substrate for a surface-mount type semiconductor element which can efficiently manufacture the above-mentioned surface-mount type semiconductor element. Fourth, it is an object of the present invention to provide a manufacturing method for obtaining a surface mount type semiconductor element having a small portion protruding outside of a mold portion using the chip substrate.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a description will be given based on an embodiment of the present invention. FIG. 6 shows an example of a surface-mount type semiconductor device obtained by the present invention.
This is an example of the ED element 40. An electrode terminal 44 is provided on each of two opposing sides 42 and 43 of the mounting board 41, and the LED chip element 21 is provided on one surface of the board 41.
The chip electrodes are connected to the respective electrode terminals 44 by the conductive paste 22, and the mold portion 24 covering the LED chips is provided to cover the entire surface of the mounting substrate 41.

FIGS. 1 to 3 show the steps of the method of manufacturing the surface-mount type LED element 40 in the surface-mount type semiconductor element 40.
This will be described with reference to FIG. First, the manufacturing process of the chip substrate 20 that will become the mounting substrate 41 will be described in order. FIG.
(A) to (h) are cross-sectional views showing a manufacturing process of the chip substrate 20, which is partially cut away in FIG.

[0015] To facilitate understanding of the features of the present invention, the above-mentioned drawings exaggerate the dimensions in the vertical direction with respect to the dimensions in the horizontal direction. Also, for convenience of explanation, the upper surface in the drawing is referred to as an upper surface, and the lower surface is referred to as a lower surface.

First, a copper foil 2 was attached to the entire lower surface of a substrate 1 made of an insulating resin material film of an insulating material, for example, polyimide, polyester, epoxy or the like, and a release paper was provided on the entire upper surface. An adhesive layer 3 such as an adhesive sheet is provided (FIG. 1A). This base is pulled out into a shape as shown in FIG. 1 (b ') by means of a press or the like to form line-shaped through holes 10 in parallel, and on the remaining base, that is, at a position between adjacent through holes 10 A chip element is mounted in a later step. FIG. 2B is a cross-sectional view taken along the line II of FIG. A conductive plate 4 made of copper foil or the like is adhered to the base 1 through the adhesive layer 3 on the upper surface of the base having the through-holes 10 formed thereon or, in the case of an adhesive sheet, peeling off the release paper to form an adhesive layer. A plating layer 5 is formed on a conductive substance such as copper by means such as electroless plating as shown in FIG. As a result, all of the upper surface, the lower surface, and the inner surface of the through hole 10 which is the side surface of the insulating substrate 1 are covered with the plating layer 5, and the upper surface and the lower surface of the substrate are electrically connected. 10 will be spatially covered. Therefore, a chip substrate 20 different from the conventional one electrically connected through the through hole 10 in which the upper surface and the lower surface of the insulating substrate 1 are open can be obtained.

Next, an etching step of forming a conductive portion serving as an electrode terminal into a predetermined shape is performed in order to electrically separate an electrode terminal serving as a cathode electrode and an electrode terminal serving as an anode electrode later. Specifically, a resist 6 is applied to the upper surface other than the pattern grooves 11 to form the pattern grooves 11 located on the substrate 1 as shown in FIG.
A resist 6 is applied to a portion of the lower surface of the base other than the separation portion 12 located substantially parallel to the through hole 10. Thereafter, the pattern groove 11 and the separation portion 12 serving as insulating portions are formed by etching by an appropriate means to obtain a chip substrate as shown in FIG. In this description, it is assumed that the chip substrate as shown in FIG. 1E is obtained by the steps (a) to (e), but the separation portion 12 is provided on the upper surface of the base and the pattern groove 1 is provided on the lower surface.
1, a chip element may be mounted on the lower surface, or a conductive portion such as a conductive plate and a pattern groove may be formed on the substrate 1 provided with the through hole 10 by printing or laminating. An insulating portion may be formed.

Next, as shown in the cross sections of FIGS. 2 and 2F, the plating layer on the upper surface other than the portion where the chip element is mounted in the later step and the portion where the solder layer 8 is formed in the later step 5
The insulating layers 7, 7 'are formed in a predetermined shape so as to cover the surface of the chip substrate, and the solder layers 8, 8' are formed on conductive portions where the upper and lower surfaces of the chip substrate are exposed by means such as electroplating. (G) A chip substrate 20 as shown in FIG.

Although the chip substrate is functionally completed by this step, a mark 9 for identifying the cathode electrode of the chip element 20 is formed of an insulating colored resin or the like as shown in FIG. At the same time, the insulating mark 9 is also formed on a part of the separation portion 12 on the lower surface, thereby completing the chip substrate 20 as shown in FIG. The insulating layer 7,
Since there is a portion of the base 7 ′ and the base 1 exposed on the surface of the completed mounting substrate 41, the chip element 21 mounted on the chip substrate
Is a light emitting element such as an LED, it is better to form them with an insulating material having a high reflectivity, and it is particularly preferable to use a white insulating material.

Next, LE on the completed chip substrate 20
A chip element 21 which is a semiconductor chip such as D is mounted on the insulating layer 7 on the upper surface of the chip substrate. At this time, each of the LED chip electrodes 21b provided opposite to both ends of the chip with the PN junction surface 21a of the chip element interposed therebetween is connected to the through hole 10
Side, that is, on the solder layer 8 side, the PN junction surface 21a is placed so as to be in the normal direction of the chip substrate, and each of the electrode 21b and the solder layer 8 is joined by a conductive paste 22 such as a silver paste. The chip substrate 20 as shown in FIG. 3 is completed.

Next, a step of covering the chip element 21 with a translucent insulating resin material is performed. This step is performed, for example, in FIG.
Can be used. The chip substrate 20 is set between the molds 30 having a predetermined shape, and the mold resin 23 is injected into the upper surface of the chip substrate. At this time, although the through hole 10 is formed in the chip substrate 20 but is covered with the conductive plate 4 or the like, the upper surface and the lower surface are not spatially connected by the through hole 10 unlike the conventional chip substrate. Therefore, the problem that the injected resin 23 goes around the lower surface of the chip substrate 20 through the through hole 10 does not occur at all.

The chip substrate 20 taken out of the mold 30
As shown in FIG. 5, only one surface of the chip substrate is covered with the mold resin 23, and the mold resin does not wrap around to the opposite surface of the substrate. The gap between the chip elements 21 is cut along the cut line 33 by a known method such as dicer cutting. When cut at the portion of the through hole 10, the electrode terminal 44 whose upper surface and lower surface are electrically connected via the conductive plate 4, the plating layer 5, etc., which covered the through hole.
Thus, the surface-mounted LED 40 as shown in FIG. 6 is completed.

In this manner, the two sides 4 of the insulating substrate 1 facing each other
A mounting substrate 41 having a pair of electrode terminals 44, 44 at 2 and 43, and electrically connected via the conductive paste 22 to the respective electrode terminals 44, 44 mounted on the upper surface of the mounting substrate 41. A surface-mounted LED element 40 having a configuration including a chip element 21 having a pair of chip electrodes 21b and a mold portion 24 covering the entire upper surface of the chip element 21 and the mounting substrate 41 is obtained. When the surface mounting type LED element 40 is viewed from the normal direction of the mounting substrate 41 on the side where the chip element 21 is provided, the mounting substrate does not protrude outward from the mold part 24. . Therefore, the surface mount type LED having the same size as the mold portion 24 having the minimum size relative to the chip element 21 is required.
An element can be obtained, and the size can be significantly reduced as compared with the conventional one. In the step of cutting the surface-mount type semiconductor element or the like, a part of the electrode
Although there may be a case in which it slightly protrudes outside the range of 4, it is naturally included in the present invention because even in such a case, it does not substantially protrude.

As described above, when almost the entire upper surface of the chip substrate 20 is covered with the molding resin 23, the molded chip substrate 20 may warp depending on the material used. Therefore, in the molding process, as shown in the cross-sectional view of FIG.
An upper die 31 having a plurality of grooves parallel to 0 is formed, and a chip substrate is molded with a plurality of parallel rows of molding resin 23 as shown in FIG. The surface-mounted LED element 40 having the substantially trapezoidal mold portion can be easily manufactured while easily suppressing the warpage of the substrate. However, in this case, if the position of the chip substrate and the upper die 31 are not accurately adjusted, the position of the light emitting unit will be shifted from the mounting substrate, which is the same as the conventional one.

Next, the surface mount type LED element 4 of the present inventor
A specific study result of 0 will be described. 0.06 thickness
A copper foil 2 having a thickness of 0.02 mm is attached to one surface of a base 1 made of a polyester film having a thickness of 0.8 mm, and the base 1 having a width of 0.8 mm passes through a plurality of stripe-shaped through holes 10 having a width of 0.8 mm. After the copper foil having a thickness of 0.02 mm was adhered to the entire surface of the other surface, copper was electrolessly plated to form a plating layer 5 on the surface. This confirmed that the upper and lower surfaces of the base 1 were electrically connected. When the cross section was observed with a microscope, it was confirmed that the plating layer 5 was also formed on the inner surface of the through-hole of the base 1. Subsequently, an ultraviolet-sensitive resist 6 is applied,
Exposure and development are performed using a mask, and etching is performed so as to form a predetermined pattern. A pattern groove 11 in which both adjacent through-holes are saw-toothed is formed on the upper surface of the base, and the through-hole 10 is formed.
A striped spacing portion 12 substantially parallel to the above was formed on the lower surface of the base to form an insulating portion. The dimension of the portion of the pattern groove 11 where the pattern groove is narrowest on the substrate is set to be substantially the same as the size of the LED chip element 21 to be mounted later, so that the chip element 21 can be connected to the solder layer 8 well in this portion. ing. Then, the pattern groove 11 formed on the base surface
After the insulating layer 7 'is formed simultaneously on the upper surface of the substrate 1 so as to cover the plating layer 5 other than the predetermined portion, the insulating layer 7 is formed between the portions having the narrowest interval, and then the plating layer 5 exposed by the electrolytic plating is formed.
After forming the solder layers 8 and 8 ′ on the substrate, the mark 9 was printed to complete the chip substrate 20.

The LED chip element 21 is formed by growing a GaAlAs-based compound on a GaAs substrate to form a PN junction surface 21a substantially parallel to the GaAs substrate. A pair of chip electrodes are provided on the bottom surface of the GaAs substrate and on the uppermost surface opposed to the bottom surface. 21b
0.3mm × 0.3mm × 0.3mm LED with LED
Many chips 21 were used. This LED chip element 21
Is placed on the insulating layer 7 of the chip substrate 20 so that the PN junction surface 21a is substantially orthogonal to the base 1 and the opposing chip electrode 21b is in a direction substantially parallel to the adjacent through-hole 10. The layers 8, 8 and the pair of chip electrodes 21b were joined.

This was set in a mold as shown in FIG. 4, molded with a transparent epoxy resin, cut, and cut into a length Ls = 1.0 mm, a width Ws = 0.5 mm, and a height Hs =
A 0.5 mm surface-mounted LED element 40 was obtained. This device had a rectangular parallelepiped small size in which the size of the mold portion 24 and the size of the surface mount device 40 were substantially the same, since the substrate, the terminals, and the like did not protrude outside the mold portion.

As an example of a conventional surface mount type LED device in which electrode terminal portions protrude outward from the mold portion, a surface mount type device having the same shape as BR1111C manufactured by Stanley Electric Co., Ltd. is used. × 0.3mm ×
A case where a comparative study is performed using the 0.3 mm LED chip 91 will be described.

As shown in FIG. 12, one of the chip electrode surfaces of the LED chip 91 is attached to the chip substrate 94, and the other electrode is connected to the electrode terminal 95 by wire bonding from the upper surface of the LED chip 91. Attached to. This was molded with a mold as shown in FIG. 13 to obtain a surface-mounted LED element 90 as shown in FIG. The size of this element is length Ls = 1.6 mm and width Ws
= 0.8 mm, height Hs = 0.7 mm, and the mold holding portions had 0.2 mm on both sides of the mold portion in the Ls direction.

In order to reduce the size of the electrode terminal 95 protruding outward from the mold portion 93 in order to reduce the size, a surface contact portion between the upper die 96 and the electrode terminal 95 in the molding process,
That is, the size of the mold holding portion 98 is set to 0.2 mm to 0.1 mm.
Was obtained, an element having a length Ls = 1.4 mm was obtained, but the yield was reduced. Also, the size of the mold holding section 98 is 0.1 m.
An attempt was made to make the mold resin smaller than m. However, almost all of the mold resin became defective because the mold resin wrapped around the back surface, and it was practically impossible to further reduce the mold holding portion.

Therefore, it was examined how much the size of the mold part can be variously reduced for the surface mount type device of the present invention with the same size of the LED chip. LED
Assuming that the surface area of the surface of the chip in contact with the chip substrate is Ac and the projected area of the surface-mounted semiconductor element when viewed from the normal direction of the substrate on the side where the chip is provided is As, As / Ac =
(1.6-1.4 × 0.7) / (0.3 × 0.3) = 1
2.4 to 10.8, In the case of the previous embodiment of the present invention, As
/Ac=(1.0×0.5)/(0.3×0.3)=
It becomes 5.55. Various studies were conducted on As / Ac by changing the size of the surface-mounted element while keeping the size of the LED chip the same. However, in the conventional method, assuming that the surface-mounted element had As / Ac of 10.0 or less, For this reason, a surface-mount type device having a size of 9.0 or less cannot be obtained.
However, according to the present invention, As / Ac can be reduced to 9.0 or less, and in particular, a small surface-mount LE which cannot achieve As / Ac by 7.0 or less can not be obtained at all.
It is possible to obtain a very small device that gives an impression only slightly larger than the D device and the chip device.

In the above embodiment, since the LED chip electrode 21b and the solder layer 8 are directly connected without using wire bonding, the dimension in the length direction and the height direction of the surface mount element is small. can do. Conventionally, the LED chip had electrodes on two opposing surfaces, and it was necessary to place the two surfaces on the upper and lower surfaces of the chip substrate for wire bonding. However, according to the present invention, the LED chip element 21 in which the wire bonding is unnecessary and the thickness of the chip element itself is reduced can be further reduced. For example, L
Assuming that the thickness of the ED chip element 21 when it is mounted on the chip substrate is Dc, the LE mounted on the conventional surface mount element is
D chip is Dc approximately equal to the thickness of the GaAs substrate wafer.
= 0.3 mm or less is difficult, and a height for wire bonding is also required. In the present invention, if the size of the LED chip element cut out from the GaAs substrate wafer is reduced, a chip element with Dc = 0.18 mm can be obtained, for example, and the height for wire bonding connection is not required. Therefore, the height of the surface mount element itself can be significantly reduced.

Further, a pair of electrode terminals 44 and 4 of the mounting board are used without using wire bonding as in the above embodiment.
In the case where the LED chip electrode 21b is directly connected to the solder layers 8 and 8 connected to the respective elements 4 by the conductive paste 22, a gold plating layer necessary for wire bonding connection as in the related art is used for the chip element. It is not necessary to provide it on the substrate, so that the process can be simplified and the cost can be reduced.

In the above description, as the chip element 20 provided on the mounting substrate 41, a chip element 21 having chip electrodes 21b on the entire two opposing surfaces of a rectangular chip element is described.
However, when a PN junction surface is formed on an insulating material such as sapphire and a chip element or the like having a P-type chip electrode and an N-type chip electrode on one of the sapphire surfaces is used. In the method described above, the chip element cannot be joined by the method of the above embodiment. In such a case, it is necessary to use means for connecting the P-type and N-type chip electrodes formed on one surface to the solder layer 8 by wire bonding. In this case, a chip substrate having a gold plating layer formed by a known means instead of the solder layer 8 may be prepared.
In such a case, the height of the surface mount element cannot be made as low as that of the above-described embodiment as compared with the case of using the chip element of the above-described embodiment having a pair of chip electrodes at both ends. A solder layer 8 right next to the chip element,
8, the length and width of the surface-mounted LED element 40 can be reduced in size as in the above-described embodiment. When viewed from the line direction, a small surface-mounted element in which the substrate and the terminal do not protrude from the mold portion to the outer periphery can be obtained. Although an LED (light emitting diode) has been described as an example of the chip element, the present invention is not limited to the LED, and may be another light emitting element or a semiconductor element such as a light receiving element.

Although the embodiment of the surface-mount type LED element has been described above, the present invention is not limited to this. A surface-mount type semiconductor element is obtained, or a place where a chip element is mounted is lowered, and other insulating layers 7 ′ and the like are formed to have a thick predetermined shape to form an insulating layer 7 ′ which also serves as a substantially mortar-shaped reflecting surface. Various modifications obvious to those skilled in the art are also included in the present invention. Further, a process such as enhancing the directivity or diffusivity of light by performing a cut having a lens effect on the mold portion, or providing a reflective layer on the surface of the mold portion may be performed.

[0036]

As described above, according to the present invention, when the mold portion is viewed from the normal direction of the substrate on which the chip is provided, the substrate and the electrode terminals project outward from the mold portion. Thus, a small and small surface-mounted element can be obtained. It is possible to use a mounting board with a projected area equal to or smaller than the minimum size of the mold part necessary to protect the LED chip element, and to reduce the external dimensions of the surface-mount type semiconductor element to protect the LED. It is possible to provide a particularly small-sized surface-mounted semiconductor element having an outer dimension almost the same as the size of the required mold part. Further, when a surface-mount type semiconductor device is produced, a plurality of semiconductor devices are mounted.
This makes it possible to place the substrates on a single substrate at a higher density than in the past, and to efficiently mass-produce the substrates, thereby reducing the cost as a whole.

Further, since there is no mold holding portion protruding outward from the molded portion, the area of the light emitting portion of the LED chip element is enlarged in the case of a surface mount type device having the same outer shape as the conventional maximum outer shape. , And especially improve directivity,
When handling the surface-mounted semiconductor device by an automatic mounting machine such as a mounter, the handleability is improved when the device is vacuum-adsorbed and mounted at a predetermined position on a printed wiring board.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing a manufacturing process of a chip substrate of the present invention.

FIG. 2 is a perspective view illustrating a chip substrate according to the present invention with a part thereof cut away.

FIG. 3 is a perspective view showing a state where an LED chip is bonded to the chip substrate of FIG. 2;

FIG. 4 is a schematic explanatory view showing a resin molding step of the present invention.

FIG. 5 is a schematic cross-sectional perspective view illustrating a state when the chip substrate molded in FIG. 4 is cut.

FIG. 6 is a perspective view showing an example of the surface-mount type semiconductor device of the present invention.

FIG. 7 is a schematic explanatory view showing another resin molding step of the present invention.

FIG. 8 is a schematic cross-sectional perspective view illustrating a state when the chip substrate molded in FIG. 7 is cut.

FIG. 9 is a schematic cross-sectional view of a chip substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 10 is a schematic cross-sectional view of a chip substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 11 is a schematic plan view of a chip substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 12 is a schematic cross-sectional view of a chip substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 13 is a schematic explanatory view showing a conventional resin molding process.

FIG. 14 is a schematic plan view illustrating a state in which the chip substrate molded in FIG. 13 is cut.

FIG. 15 is a perspective view showing an example of a conventional surface mount LED.

FIG. 16 is a schematic perspective view showing a method for manufacturing another conventional surface-mounted LED.

FIG. 17 is a schematic cross-sectional perspective view showing another conventional surface-mounted LED.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base | substrate 2 Copper foil 4 Conductive plate 5 Plating layer 7, 7 'insulating layer 8, 8' solder layer 10 Through-hole 20 Chip board 21 Chip element 24 Mold part 40 Surface mount type LED element 41 Mounting board 42, 43 side 44 Electrode Terminal 90 Surface mount type LED element 91 LED chip 92 Wire 93 Mold part 94 Chip substrate 95 Electrode terminal 98 Type holding part

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Satoshi Hirama 2-14-1 Edanishi, Aoba-ku, Yokohama-shi, Kanagawa Prefecture Stanley Electric Co., Ltd. Yokohama Technical Center

Claims (10)

[Claims] A substrate having a pair of conductive pattern terminals provided on two opposite sides of an insulating substrate;
A semiconductor chip provided on one surface of the substrate and connected to the terminal portion, and a surface-mount type semiconductor device having a mold portion covering the chip, wherein the mold portion is thicker than the thickness of the substrate, and at least a portion of the substrate. A surface covering the entire surface of the one surface, wherein the substrate and the terminal portion do not protrude from the mold portion to the outer periphery when the mold portion is viewed from the normal direction of the substrate on which the chip is provided. Mounting type semiconductor element. 2. As / Ac, where As is the projected area of the surface-mounted semiconductor element in the normal direction of the substrate, and Ac is the area of the surface of the semiconductor chip mounted on the substrate mounted on the chip substrate. The surface-mounted semiconductor device according to claim 1, wherein ≤ 10.0. 3. The length of the surface-mount type semiconductor device is L.
s, width Ws and height Hs, Ls ≦ 1.5
The surface-mounted semiconductor device according to claim 1, wherein mm Ws ≦ 0.5 mm and Hs ≦ 0.5 mm. 4. The semiconductor device according to claim 1, wherein said semiconductor chip is a light receiving element. 5. The surface-mounted semiconductor device according to claim 1, wherein said semiconductor chip is a light-emitting device. 6. The semiconductor chip according to claim 1, wherein the semiconductor chip is a light-emitting element having a pn junction, and the semiconductor chip is provided such that an end face of the pn junction is located on an upper surface of the base. Surface mount type semiconductor device. 7. The semiconductor device according to claim 1, wherein a solder layer is formed on the surface of the substrate, and the solder layer and the semiconductor chip are connected by a conductive paste. Surface mount type semiconductor device. 8. An insulating substrate having a plurality of parallel through holes, a conductive plate material covering the through holes on one surface side of the substrate, a substrate surface on the other surface side of the substrate, and the through hole. A conductive layer that covers an inner surface of the hole and is electrically connected to the conductive plate at the through-hole portion, and the conductive plate is partially removed at a position on the base to form a pattern groove. In the conductive layer formed on the other surface of the base, a part of the conductive layer is removed on the other surface side of the base, and a separated portion is formed substantially in parallel with the through hole. A chip substrate on which a surface-mount type semiconductor element is mounted. 9. A step of preparing the chip substrate, and a step of mounting a plurality of semiconductor chips via an insulating layer in a portion of a pattern groove provided in a conductive plate material of the chip substrate;
A step of electrically connecting the semiconductor chip and the conductive plate material; a step of molding the plurality of semiconductor chips and a surface on the side where the chips are provided with an insulating resin; Cutting at a gap between the semiconductor chips. 10. The method according to claim 9, wherein the resin mold covers substantially the entire surface of the substrate with an insulating resin so as to cover the plurality of semiconductor chips. .