JPH10290100A - Recognition method for pattern of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to precisely recognize whether the position of an element substrate is right or wrong by a method wherein illumination which is used to recognize a recognition pattern is projected from the side end face of the element substrate, the part of the recognition pattern is made dark color, parts other than the part are made bright color and the position of the pattern is recognized on the basis of binary recognition. SOLUTION: A recognition pattern M on an element substrate A composed of a glass epoxy resin blank is projected from the side end face (a) of the element substrate A by means of illumination by a projector 1, the place of the recognition pattern M is made dark color by a recognition camera 2 which is situated just above the recognition pattern M, parts other than the place are made bright color, and the position of the recognition pattern M is recognized on the basis of binary recognition. As a result, when the recognition camera 2 is connected to a monitor, the position of the recognition pattern M can be recognized precisely, a recognition signal is sent to an element working machine, and the operation and the stop of the working machine can be controlled. As a result, whether the position of the element substrate A is right or wrong can be detected precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for recognizing a pattern of an electronic component.

[0002]

2. Description of the Related Art Conventionally, among electronic components used for a head for a thermal printer and other electronic products, there is an electronic component using a glass epoxy material substrate as a translucent material.

[0003] Operations such as die bonding and wire bonding are performed on the element substrate of these electronic components in the flow of automation.

[0004] That is, when the element substrate is transported to various work places, accurate positioning is performed at the work places, and operations such as die bonding and wire bonding are automatically performed by a required robot. .

As described above, in order for a robot to perform a predetermined operation at an accurate position on an element substrate, it is necessary to accurately position the element substrate. A recognition pattern for positioning is formed at a required position on the element substrate, and the recognition pattern is recognized by a required means to determine whether or not the element substrate is at a correct position.

When such a recognition operation is performed by multi-valued recognition, the recognition means operates accurately and there is little possibility of erroneous recognition. In many cases, a pattern recognition method based on image recognition is used.

For example, an element substrate made of a glass epoxy material of an electronic component used for a head for a thermal printer will be described. As shown in FIG. 3, a punched hole Xm is provided at the center of the corner of the element substrate XA. The recognition pattern XM of the copper plate is attached, and as shown in FIG. 4, by performing the oblique illumination from the oblique direction of the element substrate XA, as shown in FIG. In addition, the position recognition of the element substrate through the recognition pattern XM is performed by the binarization recognition using the dark color recognition XD of the element substrate ground. In FIG. 4, X1 is a projector for epi-illumination, and X2 is a camera as recognition means.

[0008]

However, in the above-described binarization recognition method, if the reflection of falling illumination by the projector X1 with respect to the recognition pattern XM is insufficient, the camera X2 can accurately determine the recognition pattern XM. However, the positioning of the element substrate XA became inaccurate, which was erroneously detected as a positioning error and hindered the flow to the next process.

That is, since the recognition pattern XM is formed by being applied in multiple layers, there is no surface accuracy, the recognition pattern XM does not accurately reflect, and does not reflect bright colors at the position where bright color recognition is required. In some cases, a detection error occurs in the recognition position of the recognition pattern XM, and a positioning error is detected even though the element substrate XA is at the correct position, and the element processing operation is stopped urgently, hindering the work process. It is what has occurred.

[0010]

SUMMARY OF THE INVENTION According to the present invention, an illumination for recognizing a recognition pattern attached to an element substrate made of a light-transmitting material used for an electronic component is projected from a side end face of the element substrate. An object of the present invention is to provide a pattern recognition method for an electronic component, wherein a pattern portion is darkened and other portions are lightened to accurately recognize a pattern position under binarization recognition.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, when positioning an element substrate for processing an element substrate made of a glass epoxy resin material as a light-transmitting material used for a head of a thermal printer, etc. Light is projected onto a recognition pattern provided at a predetermined location by illumination, and the recognition pattern is binarized and recognized by a camera based on the presence or absence of light transmission, and whether or not the element substrate is located at a predetermined position is recognized. is there.

That is, when light is projected by illumination for binary recognition, if the light is projected from the side end face of the element substrate and the light is transmitted through the glass epoxy resin, the recognition pattern does not transmit the light. Because it is difficult to transmit, the part of the recognition pattern is recognized by the camera in dark color, the light transmitted from the element substrate is recognized in bright color, and the binary recognition of the recognition pattern is performed reliably, and the correctness of the position of the element substrate is accurately determined. Can be detected.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an embodiment of the method according to the present invention, in which a recognition pattern M of an element substrate A made of glass epoxy resin is applied to a side end face a In this state, the light is further projected, and the position of the recognition pattern M is recognized by the recognition camera 2 located directly above the recognition pattern M under the binarization recognition.

The light projector 1 is configured to collect light by a lens provided at the tip of an optical fiber, collect the light, and project the light.

The recognition camera 2 is connected to a monitor (not shown) so that the position of the recognition pattern can be visually recognized accurately and sends a recognition signal to the element processing machine to control the stop of the processing machine. I can do it.

The element substrate A is an electronic component element substrate used for a thermal printer head as one embodiment.
The material is glass epoxy resin, and the embodiment of the present invention can be applied to any element substrate as long as the material is translucent.

A recognition pattern M is provided at one corner of the element substrate A.

The recognition pattern M is formed in a rectangular shape having a predetermined size with a square central hole m at the center.

The material of the recognition pattern M is a copper material, which is formed by applying and baking copper powder or etching a copper plate. Are also applied and baked, so the surface accuracy of the surface is not good.

The background of the element substrate A is exposed in the central hole m at the center, and the inner surface of the central hole m and the outer surface of the rectangular recognition pattern M are the same glass epoxy material element. The surface of the substrate A is exposed.

The necessity of the recognition pattern M of the element substrate A will be described. In the element manufacturing process of die bonding on the element substrate A and wire bonding to the electrodes, the element substrate A is transported along the transport route. The robot stops at a predetermined element processing step on the way, performs accurate positioning, and performs element processing by a robot. At this time, the recognition pattern M is necessary for positioning the element substrate A. By correctly recognizing the position of the recognition pattern M, the correct position setting of the element substrate A has been performed. The element setting operation is performed by sending a position setting signal to the robot.

The recognition pattern M includes a mark and a display mark for position recognition.

The recognition pattern M is recognized by the recognition camera 2 by illuminating the inside of the element substrate A from the projector 1 from the side end face a of the element substrate A.

That is, when the illumination from the light projector 1 is viewed from directly above the element substrate A, the rectangular recognition pattern M is shaded as shown in FIG. The outer side transmits light to become a bright color C. Based on the binary recognition of the light and dark, the position of the recognition pattern M is detected by the recognition camera 2 and the correctness of the position of the element substrate A is recognized.

Therefore, after that, it is possible to set the coordinates for the next step, die bonding, based on the central hole m of the recognition pattern M.

When the recognition pattern M is subjected to light / dark binarization recognition, the light and dark portions are configured to perform spot recognition, and the light and dark portions, that is, the center hole m and the rectangle are formed. The bright part of the outer part of the recognition pattern M is recognized by a plurality of spots, and the dark part of the rectangular recognition pattern M is recognized by the same spot.

[0028]

According to the present invention, when an electronic component element substrate made of a glass epoxy resin material is positioned for stopping in an element manufacturing process, light is projected from a side end face of the element substrate provided with a recognition pattern. The pattern is recognized as a dark color from immediately above the recognition pattern, and the other pattern is recognized as a bright color 2
By recognizing the position of the element substrate by value recognition, it is possible to recognize whether or not the element substrate is set at a position that does not hinder accurate element manufacturing, so that accurate position recognition is possible. Has the effect of

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an embodiment of a method of the present invention.

FIG. 2 is an explanatory diagram showing a bright and dark state of a recognition pattern in a state where illumination is projected from an element substrate side end surface.

FIG. 3 is a plan view of a conventional recognition pattern provided on an element substrate to be recognized.

FIG. 4 is an explanatory diagram showing an implementation state of a conventional electronic component pattern recognition method.

FIG. 5 is an explanatory diagram of a state in which illumination is projected onto the recognition pattern of FIG. 2 from above.

[Explanation of symbols]

 M recognition pattern A element substrate 1 floodlight 2 camera m central hole

Claims (1)

[Claims] 1. An illumination for recognizing a recognition pattern attached to an element substrate made of a translucent material used for an electronic component is projected from a side end face of the element substrate to darken a portion of the recognition pattern. A pattern position of the electronic component, which is a bright color, and accurately recognizes a pattern position under binarization recognition.