JPH10289415A - Manufacturing method for mr head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an MR head which is made narrow in the track width of its upper layer recording core. SOLUTION: To form the narrow track width of the upper layer recording core, a groove is formed on an AL2 O3 film 2 covering an intermediate shield 1 by using SiO2 . The SiO2 layer 3 (0.5 μm) is etched by RIE(reactive ion etching) to narrow width. In this case, a Cr layer 4 which does not react in RIE is sputtered and formed on the SiO2 layer 3 to 10 to 20 nm. Consequently, variance in profile is prevented and the track width precision is improved. Further, resist 5 is applied thinly (approximately 0.8 μm), patterning is performed to recording core width, and an opening part of etching the SiO2 layer 3 is formed in the Cr layer 4; and then extraction is good since the film thickness of the resist 5 is thin, and problems of sagging, etc., can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an MR head, and more particularly to a method for forming a high precision narrow track recording head.

[0002]

2. Description of the Related Art Recording and reproduction to and from a high-capacity hard disk device have been made possible by an MR head. However, in response to a demand for a higher-density storage device, an MR head having a higher recording and reproduction sensitivity has been required. Developed and put into practical use.

FIG. 5 is a perspective view of a typical MR head. The MR element 8 is a read-only sensor that detects the magnetic field from the medium as a resistance change, and the front electrode 12 and the rear electrode 13 of the MR element 8 are connected to the MR element 8.
Are provided before and after the MR head, and a bias conductor 14 is for applying a magnetic field by applying a bias to cut off the magnetization of the MR element 8 toward the operation region. The upper core 16 is a magnetic material for extracting a magnetic field generated by the coil 14 to the ABS surface.

The intermediate shield 1 and the lower shield 19 are magnetic shields for preventing unnecessary signals from being sucked into the MR element 8 in the circumferential direction of the medium.

FIGS. 6 to 8 show a process of manufacturing a conventional upper recording core 16. As shown in FIG. 6A, after forming an intermediate shield 1 and an Al ₂ O ₃ film 2 thereon, an underlying sputter (Cr / Ti / NiFe) layer 6 is formed, and the following patterning conditions are formed thereon. To form a frame with the resist 7 (FIG. 6B).

At this time, since the thickness of the resist 7 is as thick as 5 μm, it is difficult to remove the resist 7 and it is difficult to form a highly accurate profile. Resist patterning conditions Resist Resist solution: SJR-5740 Rotational speed: 5000 rpm Resist thickness: 5 μm Exposure Nikon Stepper NSR-1505 2500 msec Developing Developing solution: 450 Dev

Next, a recording core layer 16 'having a thickness of 3 μm is formed by plating (FIG. 7A), the resist 7 is peeled off (FIG. 7B), and the underlying layer 6 is etched (FIG. 7B). FIG. 7 (c)). Then, a core cover is formed with the resist 7 (FIG. 7D), and the exposed portion of the plating layer (recording core layer) 16 'is peeled off (FIG. 8A).
Is wet-etched (FIG. 8B), and the resist 9 is peeled off to complete the upper recording core 16 (FIG. 8).
(C)).

[0008]

In order to achieve a high recording density with an MR head, it is necessary to make the upper recording track width as narrow as possible. Conventionally, the track width of the upper recording core has been formed of a resist as described above. However, at present, narrow tracks have become indispensable conditions due to the increase in recording density, and resists have problems such as track width accuracy, and problems such as overexposure and overdevelopment that the side surfaces of the recording core spread in an inverted trapezoidal shape. It was very difficult to form a narrow track of 5 μm or less. An object of the present invention is to provide an MR head in which the upper recording core has a narrow track width.

[0009]

The above object of the present invention is attained by the following constitution. That is, a manufacturing method of an intermediate shield on MR head forming the upper magnetic core, it was sputtered SiO ₂ film on the intermediate shield, the S
This is a method for manufacturing an MR head, wherein RIE ion etching is performed on an iO ₂ film to form a groove for regulating a track width when an upper recording core is formed.

On a SiO ₂ film of about 0.5 μm, a Cr layer is sputtered, preferably with a thickness of 10 nm to ₂₀ nm, and the Cr layer is subjected to RIE ion etching of the SiO ₂ film.
Preferably, the layer is a masking layer.

[0011] A method for manufacturing an MR head, wherein an upper recording core is formed by plating a profile obtained by the method for manufacturing an MR head, is also within the scope of the present invention.

As a process for forming the upper recording core portion, Si
The use of an O ₂ film is a feature of the present invention. A core is formed on the SiO ₂ film by RIE (reactive ion etching). At this time, Cr which does not react to RIE of the SiO ₂ film is formed.
By using the masking by the layer, the formation of the narrow track width of 1.5 μm or less, which was difficult by the conventional resist forming method, can be realized by forming SiO ₂ by RIE. This is because the Cr layer is an RI of SiO ₂ film.
This is because, since the recording layer is not affected at E, a vertical profile of the upper recording core can be formed, and a narrow track recording head with a highly accurate plating film can be formed.

[0013]

Embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1 to FIG.
In order to form a narrow track width, a groove was formed on the Al ₂ O ₃ film 2 covering the intermediate shield 1 by using SiO ₂ . S
The iO ₂ layer 3 (0.5 μm) is etched to a narrow track width by RIE (ion etching). In that case, S
The Cr layer 4 which is not reactive to RIE is formed on the SiO ₂ layer 3 by 10 to 2 times.
It is formed by sputtering 0 nm. As a result, variations in the profile can be prevented, and the accuracy of the track width can be improved. Further, the resist 5 is thinned (0.8 μm
When coating and patterning the recording core width to form an opening for etching the SiO ₂ layer 3 in the Cr layer 4, the resist 5 has a small thickness, so that the resist 5 is easily removed and causes problems such as dripping. Can prevent. A recording track is formed by plating on the recording core profile formed by the above process.

FIGS. 1 to 4 show an ABS (air beari).
The details of the manufacturing process of the upper recording core 16 are shown in a cross-sectional view as viewed from an ng surface) surface. First, FIG.
After forming the Al ₂ O ₃ layer 2 on the intermediate shield 1 (a), the SiO ₂ layer 3 by sputtering (0.5 [mu] m), further SiO ₂ layer 3 as shown in FIG. 1 (b) RIE on top
A Cr layer 4 (10 to 20 μm) which does not react with the above is formed by sputtering, thereby forming a vertical profile. Next, in order to form an opening in the Cr layer 4 for etching the SiO ₂ layer, resist patterning is performed under the following conditions (FIG. 1C). Resist 4 at this time
The film thickness is set to be as thin as about 0.8 μm in order to easily remove the film. Resist patterning conditions Resist Resist solution: AZ-6108 Rotational speed: 4000 rpm Resist thickness: 0.8 μm Exposure Nikon Stepper G3 200 msec Developing Developing solution: AZ-600MIF

Next, as shown in FIG. 1D, the Cr layer 4 is ion-etched to form an opening in the SiO ₂ layer 3 during RIE ion etching. Si from the opening of the Cr layer 4
The O ₂ layer 3 is subjected to RIE (ion etching) to form a core profile (FIG. 2A).

Next, as shown in FIG.
Is peeled off, and the underlying sputter (Cr / Ti / NiFe) layer 6 is removed.
Is formed (FIG. 2C). The width of the groove of the underlayer sputter layer 6 becomes the track width of the upper recording core layer 16 '.
Since the Cr layer 4 is not attacked during the RIE of the SiO ₂ layer 3 in FIG. 2A, the groove of the underlayer sputtered layer 6 forms a vertical groove, so that the underlayer becomes the track width of the upper recording core 16. The upper recording core layer 1 is formed by the grooves of the sputter layer 6.
A 6 'vertical profile can be formed.

A frame (4 μm) is formed on the underlying sputtered layer 6 by a resist 7 (FIG. 2D). Then, as shown in FIG. 3A, a plating layer 16 ′ for the recording core 16 is formed with a thickness of 3 μm, the resist 7 is peeled off (FIG. 3B), and the underlying layer 5 is etched (FIG. 3B). 3
(C)). Then, a core cover is formed with the resist 9 (FIG. 3D), and the exposed portion of the plating layer (recording core layer) 1 is formed.
6 'is peeled off (FIG. 4A), the underlayer 5 and the Cr layer 4 are wet-etched (FIG. 4B), and the resist 9 is peeled off to complete the upper recording core 16 (FIG. 4).
(C)).

[0018]

According to the present invention, an MR head in which the track width of the upper recording core is reduced can be obtained.

[Brief description of the drawings]

FIG. 1 shows a method for manufacturing an MR head according to one embodiment of the present invention.

FIG. 2 shows a method of manufacturing an MR head according to one embodiment of the present invention.

FIG. 3 shows a method of manufacturing an MR head according to one embodiment of the present invention.

FIG. 4 shows a method for manufacturing an MR head according to one embodiment of the present invention.

FIG. 5 shows a perspective view of a typical MR head.

FIG. 6 shows a method for manufacturing a conventional MR head.

FIG. 7 shows a method for manufacturing a conventional MR head.

FIG. 8 shows a method for manufacturing a conventional MR head.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 intermediate shield 2 Al ₂ O ₃ film 3 SiO ₂ layer 4 Cr layer 5, 7, 9 resist 8 MR element 6 underlayer sputter (Cr / Ti / NiFe) layer 16 ′ recording core layer 16 recording core

Claims (3)

[Claims] 1. A method for manufacturing an MR head having an upper recording core formed on an intermediate shield, comprising:
A method of manufacturing an MR head, comprising sputtering an iO ₂ film and performing RIE ion etching on the SiO ₂ film to form a groove for regulating a track width when an upper recording core is formed. 2. A sputtered Cr layer on the SiO ₂ film,
_2. The M layer according to claim 1, wherein the Cr layer is used as a masking layer during RIE ion etching of the SiO ₂ film.
How to make an R head. 3. A method for manufacturing an MR head, comprising forming an upper recording core by plating on a profile obtained by the method for manufacturing an MR head according to claim 1.