JPH10286805A - Woody composition board and its manufacture - Google Patents

Woody composition board and its manufacture

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Publication number
JPH10286805A
JPH10286805A JP9716197A JP9716197A JPH10286805A JP H10286805 A JPH10286805 A JP H10286805A JP 9716197 A JP9716197 A JP 9716197A JP 9716197 A JP9716197 A JP 9716197A JP H10286805 A JPH10286805 A JP H10286805A
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Japan
Prior art keywords
wood
board
base material
adhesive
woody
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JP9716197A
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Japanese (ja)
Inventor
Teruyoshi Kamisaka
輝義 上坂
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Eidai Co Ltd
永大産業株式会社
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Application filed by Eidai Co Ltd, 永大産業株式会社 filed Critical Eidai Co Ltd
Priority to JP9716197A priority Critical patent/JPH10286805A/en
Publication of JPH10286805A publication Critical patent/JPH10286805A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To cut a manufacturing cost to a considerably low level without deteriorating the mechanical strength while maintaining a required surface smoothness by bonding and laminating a woody fiber board which is split in hales in the thickness direction using a slicer to one face or both faces of a woody base material in such a manner that the split face sides are turned up as front face sides.
SOLUTION: Woody fiber boards 1a, 1b obtained by splitting a wood in halves in the thickness direction using a slicer 10 are bonded and laminated to one face or both faces of a woody base material 2 with the help of a formalin adhesive of urea resin or an acrylic adhesive so that the split face sides are turned up as front face sides, i.e., the split face sides do not become adhesive face sides with a woody base material 2 such as a plywood, a block board, a bonded wood or a particle board. Consequently, it is possible to obtain a laminate showing excellent adhesion with the same amount of coating of an adhesive as when the wood fiber board 1 is bonded and laminated as it is to the woody base material 2. further, the laminate shows almost the same physical property value and the same surface characteristics as the laminate comprising the wood fiber board 1 bonded to the woody base material 2. Thus the wooden composite board with high strength can be obtained at a low cost by making the woody base material 2 thick.
COPYRIGHT: (C)1998,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は木質複合板及びその製造方法に関し、特に、木質基材の片面又は両面に木質繊維板を接着積層することによって表面平滑化を図るようにした木質複合板及びその製造方法に関する。 The present invention relates to relates to wood composite board and a manufacturing method thereof, wood composite board and was set to achieve surface smoothing by bonding laminating the wood fiber board on one or both sides of the wood substrate As a method for manufacturing.

【0002】 [0002]

【従来の技術】木質基材の表面に突板、化粧紙等の化粧表面層を積層した木質化粧板は知られており、広い分野で用いられている。 BACKGROUND OF THE INVENTION Veneer on the surface of the wood substrate, the wood veneer with a decorative surface layer of the decorative paper or the like is laminated is known, it is used in various fields. 木質基材としては、合板、OSB The wood substrate, plywood, OSB
(Oriented Strand Board)、ブロックボード、集成材、 (Oriented Strand Board), block board, laminated wood,
パーチクルボード等、多くのものが用いられるが、このような木質基材は表面平滑性が不足しており、そのままで突板等を貼着すると、化粧表面層の表面に微細な凹凸や割れ(クラック)が生じる場合がある。 Particle board etc., many things are used, such wood substrate has surface smoothness is insufficient and adhering the veneer or the like as is, fine irregularities or cracks on the surface of the decorative surface layer (crack) there is a case to occur. そのために、 for that reason,
通常、木質基材の表面にはなんらかの平滑化処理が施される。 Usually, some smoothing process on the surface of the wood substrate is applied.

【0003】平滑化処理としては、代表的には、ワイドベルトサンダー等による表面研磨処理が行われ、より高い平滑性を得る場合には、例えば、特開昭50−705 [0003] As the smoothing process, typically, when the surface polishing treatment by a wide belt sander or the like is performed to obtain a higher smoothness, for example, JP 50-705
09号公報や特公平6−88375号公報等に記載のように、木質基材の表面に目止剤を塗布して乾燥・研磨し平滑化した後、その上に接着剤塗布して乾燥させ、そこに薄紙を貼着する、というような複数工程による処理が行われる。 As described in 09 and JP fair 6-88375 Patent Publication, after coating and drying, polishing and smoothing the Metome agent to the surface of the wood substrate, dried and an adhesive coated thereon , there is stuck a thin, treatment with multiple steps, such as that is performed.

【0004】他の表面平滑化処理として、木質基材の表面に薄いMDF(中質繊維板)あるいはHDF(ハードボード)等を接着積層することが行われる。 [0004] Other surface smoothing treatment, it is performed to bond the laminated thin MDF (Medium Density Fiberboard) or HDF (hardboard) or the like on the surface of the wood substrate. MDFやH MDF and H
DFのような木質繊維板は表面がもともと平滑であり、 Wood fiber board, such as the DF surface is originally smooth,
かつ、安定した表面特性を有していることから、処理工程が簡単であることに加え、突板や化粧紙を化粧表面材として貼着しても、表面にクラックが生じ難い利点がある。 And, since it has a stable surface property, in addition to the process steps is simple, even by sticking the veneer or decorative paper as decorative surface material, there is an advantage that cracks hardly occurs in the surface. さらに、異方性がないために、膨潤、収縮や曲げ強度等の物性に方向性がない利点がある。 Furthermore, since there is no anisotropy, swelling, and in that it has no directionality in the physical properties such as shrinkage or bending strength.

【0005】 [0005]

【発明が解決しようとする課題】しかしながら、MDF The object of the invention is to be Solved However, MDF
やHDFのような木質繊維板は、基材として用いられる合板等と比較して高価なものであり、木質繊維板の貼着により表面平滑化処理を行った木質複合板は、他の表面平滑化処理を行った木質材と比較して、コスト高となっている。 Wood fiber board like or HDF are those expensive compared to plywood or the like used as a base material, wood composite board was subjected to a surface smoothing treatment by adhering the wood fiber board, other smooth surface processing the compared to wood material subjected, has a high cost. さらに、MDFの場合、表面層としてのMDF Furthermore, in the case of MDF, MDF as a surface layer
は表面平滑性を向上させることができれば十分であり、 It is sufficient if it can the be improved surface smoothness,
そのためには、1.5mm程度の厚みで十分であることが経験的に知られているが、このような薄手のMDFは高価であると共に、市場から入手すること自体が困難である。 For this purpose, it is known from experience with 1.5mm thickness of about sufficient, with such thin MDF are expensive, it is difficult itself be obtained from the market.

【0006】そのために、比較的安価で容易に入手できる厚みが2.5〜5.0mm程度の厚手のMDFが通常用いられるが、それを基材の両面に貼り付けて所定の厚みの木質複合板を得ようとすると、安価に製造できる反面、MDFの厚み分だけ基材が薄いものとなり、薄手の木質複合板を製造する場合に、強度を低下させる結果を招いている。 [0006] Therefore, relatively inexpensive but thickness readily available are usually used thick MDF of about 2.5 to 5.0 mm, with and wood composite of predetermined thickness bonded to it on both sides of the substrate an attempt to obtain a plate, although that can be manufactured at low cost, it is assumed thickness of only a substrate of MDF is thin, in the case of producing a thin wood composite board, has led to the result of lowering the strength.

【0007】本発明は、表面層にMDFやHDFのような木質繊維板を貼り付けた木質複合板でありながら、製造コストが比較的安価であり、かつ、所要の表面平滑性を有しながら、木質複合板としての機械的強度を低下させることのない、木質複合板及びその製造方法を提供することにある。 [0007] The present invention, while being wood composite board pasted wood fiberboard such as MDF or HDF in the surface layer, production cost is relatively cheap, and, while having the required surface smoothness , does not degrade the mechanical strength of the wood composite board is to provide a wood composite board and its manufacturing method. また、本発明は、木質繊維板と木質基材との間での接着不良(剥離強さの低下)を招くことのない木質複合板及びその製造方法を提供することにある。 Further, the present invention is to provide a wood composite board and its manufacturing method that does not lead to adhesion failure (decrease in peel strength) between the wood fiber board and wood substrates.

【0008】 [0008]

【課題を解決するための手段】上記課題を解決するための本発明による木質複合板は、基本的に、木質基材の片面又は両面に、木質繊維板をスライサー等を用いて厚さ方向に2分割したものを、その分割面側を表面側として接着積層してなることを特徴とする。 Means for Solving the Problems] wood composite board according to the present invention for solving the above problems, basically, on one or both surfaces of the wood substrate, the wood fiber board in the thickness direction by a slicer or the like those divided into two, and characterized by being adhesively laminated to the divided side as the surface side. 用いる木質繊維板はMDF(中質繊維板)が特に有効であるが、HDF It used but wood fiber board MDF (Medium Density Fiberboard) is particularly effective, HDF
(ハードボード)のような他の木質繊維板であってもよい。 It may be another wood fiber board such as (hardboard).

【0009】また、本発明は、木質繊維板をスライサー等を用いて厚さ方向に2分割し、該2分割された木質繊維板を、その分割面側が表面側となるようにして木質基材の片面又は両面に接着積層することを特徴とする木質複合板の製造方法をも開示する。 Further, the present invention is a wood fiber board is divided into two in the thickness direction by a slicer or the like, the 2-divided wood fiber board, wood substrate as the division surface is the surface side also discloses a method of making wood composite board, characterized in that the adhesive laminated on one side or both sides.

【0010】本発明において、用いる木質基材に特に制限はなく、合板、OSB、ブロックボード、集成材、パーチクルボード等を適宜用いることができる。 [0010] In the present invention, not particularly limited to wood substrate used, it is possible to use plywood, OSB, block board, laminated wood, particle board or the like as appropriate. その厚みも任意である。 Its thickness is also arbitrary. また、木質繊維板はスライサー等を用いて厚さ方向に2分割することにより、厚み1.0〜1. Further, wood fiber board by 2 divided in the thickness direction using a slicer or the like, the thickness 1.0 to 1.
5mm程度の木質繊維板が少なくとも一枚は得られるものであればよく、好ましくは、現在市場に広く出回っている厚み2.5〜5.0mmの木質繊維板であってよい。 As long as it about 5mm of wood fiber board is at least one resulting, preferably, it may be a wood fiber board of 2.5~5.0mm thickness currently widely available on the market.

【0011】MDFのような木質繊維板は解繊した植物繊維を接着剤の存在下で熱圧成形して作られるが、成形上、熱盤に接する表裏面が最も高い密度となり、厚み方向中央部に行くに従い密度が低下する傾向にある。 [0011] wood fiber board such as MDF is made by thermal pressure molding in the presence of the adhesive plant fibers defibrated, molded on, the most high density front and back surfaces in contact with the heating plate, the thickness-direction center there is a tendency that the density decreases as it goes to the department. 例えば、平均密度0.75〜0.8のMDFの場合、通常、 For example, for the MDF average density 0.75-0.8, usually,
表裏面の密度は0.9程度であり、厚み方向中央部の密度は場合によっては0.4程度と低い値となっている。 The density of the front and back surfaces is about 0.9, the density in the thickness direction central portion has a 0.4 degree and a low value in some cases.
そのために、木質繊維板を、例えば鋭利な平刃を持つスライサー等により2分割した場合、その分割面には密度の低い層が露出する。 Therefore, the wood fiber board, when bisected by slicer or the like having, for example, sharp flat blade, less dense layer is exposed to the dividing plane. 密度の低い層は高い部分と比較して繊維間空隙が多く存在しており、その面に接着剤を塗布して接着積層しようとすると、接着剤が層内部に浸透してしまい、十分な接着力が得られない。 The less dense layers are present many fiber void as compared with the high part, an attempt to adhesively laminated by applying adhesive to the surface, the adhesive ends up penetrating into the layer, sufficient adhesion force can not be obtained. 十分な接着力を得ようとするとより多くの量の接着剤を塗布する必要がある。 Sufficient it is necessary to apply a greater amount of adhesive is to be obtained adhesion.

【0012】従って、本発明においては、スライサー等を用いて厚さ方向に二分割した木質繊維板を、その分割面側を表面側となるようにして、すなわち、木質基材との接着面とはならないようにして、木質基材の片面又は両面に接着積層する。 Accordingly, in the present invention, a two-divided wood fiber board in the thickness direction using a slicer or the like, and the divided surface so that the surface side, i.e., the adhesive face of the wood substrate so as not to adhere laminated on one side or both sides of the wood substrate. それにより、木質繊維板をそのまま木質基材に接着積層する場合と同じ接着剤の塗布量で接着性の良好な積層体を得ることができる。 Thereby, it is possible by applying the same amount of adhesive to the case of adhesive lamination the wood fiber board as it is to the wood substrate obtained adhesion good laminate.

【0013】用いる接着剤は、尿素樹脂等のホルマリン系接着剤、アクリル系接着剤、ウレタン系接着剤等、従来の化粧材の積層に用いられる接着剤を適宜そのまま用いればよく、接着剤成分や硬化タイプに特に制限はない。 [0013] using adhesives, formalin-based adhesive such as a urea resin, acrylic adhesive, urethane adhesive or the like, may be used adhesives appropriately as used in the lamination of the conventional decorative material, Ya adhesive component There is no particular limitation on the curing type. また、貼り付け方法も従来と同様であってよい。 Also, paste method may be similar to the prior art.

【0014】本発明によれば、市場から安価にかつ容易に入手できる比較的厚みの厚い木質繊維板をスライサー等により厚み方向に二分割して得られる木質繊維板を表面層として用いるので、木質基材に対する木質繊維板のコスト割合を低下させることができると共に、薄い木質繊維板を用いる分だけ、木質基材の厚みを厚くすることができ、表面平滑性に優れかつ高い機械的強度を持つ木質複合板を低コストで製造することが可能となる。 According to the present invention, since use of the wood fiber board obtained by bisecting the thickness direction as a surface layer by a slicer or the like relatively thick thick wood fiber board which can be inexpensively and readily available from the market, wood it is possible to reduce the cost ratio of the wood fiber board to the substrate, by the amount of use of a thin wood fiber board, it is possible to increase the thickness of the wood substrate, with excellent and high mechanical strength in surface smoothness it is possible to manufacture a wood composite board at low cost. また、木質繊維板と木質基材との間での剥離強さの低下のような接着不良を招くこともない。 Moreover, nor lead to adhesion failure such as decrease in peel strength between the wood fiber board and wood substrates. さらに、得られた木質複合板には通常の方法により突板貼りや塗工等による表面化粧層を設けることにより、クラックの発生もない表面が平坦な化粧板が作られる。 Further, the obtained wood composite board by conventional methods providing the surface decorative layer according to veneer bonding and coating, etc., even without surface crack generation is made flat veneer.

【0015】 [0015]

【実施例】以下、本発明を実施例により説明する。 BRIEF DESCRIPTION by the present invention through examples.

【0016】〔実施例1〕厚さ2.7mmのMDF1 [0016] [Example 1] thickness 2.7mm MDF1
を、図1、図2に示す形式のスライサー10によって、 And by Figure 1, the form slicer 10 shown in FIG. 2,
厚さ1.35mmのものに二分割した。 Of thickness 1.35mm things were divided into two parts. 二分割したMD Bisected the MD
F1a、1bをその分割面が表面側となるようにして(すなわち、反転させた状態で)、厚さ9.3mmの針葉樹合板2の両面に次の条件で熱圧により貼り合わせて、厚さ12mmの木質複合板を製造した。 F1a, as the divided surface 1b is surface side (i.e., in a state of being inverted), bonded by thermal pressure under the following conditions on both sides of softwood plywood 2 thickness 9.3 mm, a thickness It was prepared wood composite board of 12 mm.

【0017】貼合わせ条件 接着剤 :尿素樹脂系接着剤 接着剤塗布 :ロールコーター 接着剤塗布量:14g/尺2圧締 :平板プレス 圧締圧 :8kgf/cm 2圧締温度 :120℃ 圧締時間 :90秒 The laminating conditions adhesives: Urea resin adhesive adhesive coating: roll coater adhesive coating weight: 14 g / scale 2 pressing: flat press pressing pressure: 8 kgf / cm 2 clamping Temperature: 120 ° C. clamping time: 90 seconds

【0018】なお、スライサー10は、図1、図2に示すように、固定基台11と、該固定基台11の表面との距離を変更固定可能な状態で固定基台11に取り付けた平板状の刃物12と、送られてくる被分割物を固定基台11の表面に圧接状態で刃物12に送り込むための上下のロール13、13と、分割後の被分割物を送りだす送りロール14とから構成されており、その前後に被分割物を搬送するためのコンベア20、21とを配置している。 [0018] Incidentally, slicer 10, FIG. 1, as shown in FIG. 2, the fixed base 11, and a distance capable of changing the fixed state between the surface of the solid Sadamoto base 11 attached to the fixed base 11 flat and Jo of blade 12, the upper and lower rolls 13, 13 for feeding the cutter 12 at pressure contact on the surface of the sent to come the split was fixed base 11, a feed roll 14 for feeding the object to be divided product after division are composed of, it is disposed a conveyor 20, 21 for conveying the divided object before and after.

【0019】この例において、厚さ2.7mmのMDF [0019] In this example, a thickness of 2.7mm MDF
1はコンベア20上をスライサー10に向けて移送され、スライサー10のロール13、13により刃物12 1 is transported toward the conveyor 20 on to the slicer 10, blades 12 by a roll 13, 13 of the slicer 10
に向けて送り込まれる。 It is fed toward. 刃物12はスライサー10の固定基台11の表面と1.35mmの距離にセットされており、MDFは厚さ1.35mmに二分割される。 Blade 12 is set to a distance of the surface and 1.35mm of the fixed base 11 of the slicer 10, MDF is bisected in the thickness 1.35mm. 二分割された2枚のMDF1a、1bはコンベア21により搬出される。 Bisected two MDF1a, 1b is unloaded by the conveyor 21. この2枚のMDF1a、1bをその二分割した分割面が表面側となるようにして基材(針葉樹合板)2に貼り付けることにより、複合板が製造される。 The two MDF1a, divided surfaces obtained by the bisecting 1b is by attaching two substrates in such a manner that the surface side (softwood plywood), the composite plate is produced.

【0020】〔比較例1〕厚さ6.6mmの針葉樹合板の表裏面に実施例1で用いたMDFを二分割せずに実施例1と同じ方法で貼り合わせて、厚さ12mmの木質複合板を製造した。 The bonded in Comparative Example 1 thickness 6.6mm same manner as in Example 1 on the front and back surfaces without MDF not bisected used in Example 1 of coniferous plywood, with a thickness of 12mm wood composites to produce a plate.

【0021】〔比較例2〕分割された2枚のMDF1 [0021] [Comparative Example 2] of the two divided MDF1
a、1bをそのスライサーによる分割面を針葉樹合板2 a, 1b softwood plywood 2 divided surface by the slicer
側に向けて貼り合わせた以外は、実施例1と同様にして厚さ12mmの木質複合板を製造した。 Except that laminated toward the side, to produce a wood composite board having a thickness of 12mm in the same manner as in Example 1.

【0022】〔実施例2〕厚さ3.0mmのMDFを、 [0022] The MDF [Example 2] thickness 3.0mm,
同様のスライサーによって、厚さ1.5mmのものに二分割した。 By a similar slicer it was divided into two parts having a thickness of 1.5 mm. 二分割したMDFをその分割面が表面側となるようにして、厚さ13.5mmのOSBの片面に次の条件で冷圧により貼り合わせて、厚さ15mmの木質複合板を製造した。 And two divided MDF to the division surface is the surface side, bonded by cold pressure under the following conditions on one side of the OSB thickness 13.5 mm, to produce a wood composite board having a thickness of 15 mm.

【0023】貼合わせ条件 接着剤 :株式会社コニシ製、ハネムーン接着剤(接着主剤;変性スチレン・ブタジエン共重合接着剤、プライマー;グリオキザール) 接着剤塗布 :ロールコーター プライマー塗布 :エアースプレー 接着剤塗布量 :14g/尺2プライマー塗布量:4g/尺2圧締 :平板プレス 圧締圧 :5kgf/cm 2圧締時間 :30秒 The laminating conditions Adhesive: Co. Konishi Ltd., honeymoon adhesive (adhesive base material; modified styrene-butadiene copolymer adhesive, primer; glyoxal) adhesive coating: roll coater Primer coating: air spray adhesive application weight: 14 g / scale 2 primer coating weight: 4g / scale 2 pressing: flat press pressing pressure: 5 kgf / cm 2 pressing time: 30 seconds

【0024】〔比較例3〕厚さ12.3mmのOSBの片面に、実施例2で用いたMDFを二分割せずに実施例2と同じ方法で貼り合わせて、厚さ15mmの木質複合板を製造した。 [0024] one surface of OSB of Comparative Example 3 thickness 12.3 mm, bonded by the same method as in Example 2 the MDF used in Example 2 without bisection, wood composite plate having a thickness of 15mm It was prepared.

【0025】〔比較例4〕分割された2枚のMDF1 [0025] Comparative Example 4 two divided MDF1
a、1bをそのスライサーによる分割面を針葉樹合板2 a, 1b softwood plywood 2 divided surface by the slicer
側に向けて貼り合わせた以外は、実施例2と同様にして厚さ15mmの木質複合板を製造した。 Except that laminated toward the side, to produce a wood composite board having a thickness of 15mm in the same manner as in Example 2.

【0026】〔評価方法〕 実施例品1、2及び比較例品1、2、3、4について、JISK5400による衝撃試験(デュポン衝撃試験)を行った。 [0026] For [Evaluation Method] Example Product 1, 2 and comparative examples 1, 2, 3, 4, was subjected to impact test according to JIS K5400 (DuPont impact test). すなわち、先端部の半径6.35mmの撃ち型と受け台を配置し、試験片の表面を上向きにして撃ち型が試験片の衝撃点にくるようにして試験片を挟み、質量500gの重りを高さ300mmから撃ち型の上に落とした。 That is, the base receiving the shot type of radius 6.35mm tip portion is disposed, the surface of the test piece type shoot in the upwards so as to come to an impact point of the specimen sandwiched specimens, the weight of mass 500g It dropped on top of the shot type from a height of 300mm. その結果を表1に示す。 The results are shown in Table 1.

【0027】実施例品1、2及び比較例品1、2、 [0027] Example Product 1, 2 and comparative examples 1 and 2,
3、4について、MDF側表面に、適宜研磨し平滑化した後、従来法によって、0.23mmのオーク突板を貼り、従来法によりウレタン塗装を行った。 For 3,4, the MDF surface, after appropriately polished and smoothed, by a conventional method, paste the oak veneer of 0.23 mm, was urethane by conventional methods. その後、80 After that, 80
℃で2時間放置した後、−20℃で2時間放置することを2回繰り返す寒熱繰り返しB試験を10サイクル繰り返し、化粧層のクラックの発生を目視した、その結果を表1に示す。 After standing 2 hours at ° C., for 2 hours cold heat repeating B test to repeat twice to stand at -20 ° C. was repeated 10 cycles was visually cracking of the decorative layer, and the results are shown in Table 1.

【0028】実施例品1、2及び比較例品1、2、 [0028] Example Product 1, 2 and comparative examples 1 and 2,
3、4について、先端にキャスターが付いたアームを該キャスターが試験片表面に一定圧で圧接した状態で所定回数往復運動させ、その後の合板(基材)とMDFとの剥離の有無を目視観察した。 For 3, 4 arms with casters tip by a predetermined number of times reciprocated in a state in which the caster is pressed at a constant pressure on the specimen surface, visually observed the presence or absence of peeling subsequent plywood and (base) and MDF did. その結果を表1に示す。 The results are shown in Table 1.

【0029】製造した木質複合板を3'×6'の大きさに換算して材料費を比較した。 The comparison material cost in terms of wood composite board manufactured to a size of 3 '× 6'. ただし、比較例1の場合のMDFの材料費を1とし、実施例1、2及び比較例3についてはその比率で表した。 However, the material cost of the MDF in Comparative Example 1 and 1, for Examples 1 and 2 and Comparative Example 3 was represented by the ratio. その値を表2に示す。 Their values ​​are given in Table 2.

【0030】 [0030]

【表1】 [Table 1]

【0031】 [0031]

【表2】 [Table 2]

【0032】〔考察〕表1に示すように、実施例1と比較例1、2の製品及び実施例2と比較例3、4の製品とで、衝撃試験はほぼ同じ結果を示しており、また、寒熱繰り返しB試験によるクラック発生本数も同じであり、 [0032] DISCUSSION] As shown in Table 1, in the products of Comparative Examples 3 and 4 with the product and Example 2 of Comparative Example 1 as in Example 1, impact tests shows substantially the same result, Moreover, the same also cracking number by cold heat repeating B test,
実施例のものと比較例のものとで得られた木質複合板の機械的強度や表面安定性はほぼ同じである。 Mechanical strength and surface stability of the wood composite board obtained in those of comparative example with those of example are almost the same. しかし、比較例2及び比較例4では、スライサーによる分割面を接着面として貼り合わせたために、基材との間に剥離が生じている。 However, in Comparative Example 2 and Comparative Example 4, because bonding the divided surfaces by slicer as an adhesive surface, peeling occurs between the base material.

【0033】また、実施例1及び2の製品はおいては、 Further, the at products of Examples 1 and 2,
市販のMDFを二分割して用いているために、製造コストが比較例品(比較例1、3)と比較して、それぞれほぼ2割程度低減しており、本発明による木質複合板及びその製造方法の優位性を示している。 Due to the use and bisected commercial MDF, compared production cost comparative examples (Comparative Examples 1 and 3), has been reduced substantially by about 20% each, wood composite plate and according to the invention It shows the superiority of the manufacturing process.

【0034】 [0034]

【発明の効果】本発明によれば、ほぼ同じ物性値と表面特性を示す木質複合板を低いコストで得ることができる。 According to the present invention, it is possible to obtain a wood composite board showing approximately the same physical properties and surface properties at low cost. また、同じ厚みの木質複合板を得るのに、木質繊維板部分(表面層部分)が薄くなるために、木質基材を厚くすることができ、強度の高い木質複合板が得られる。 Further, to obtain a wood composite board of the same thickness, for wood fiber board portion (surface layer portion) is reduced, it is possible to thicken the wood substrate, high strength wood composite board can be obtained.
また、木質繊維板と木質基材との剥離性が低下することもないく安定した木質複合板が得られる。 Moreover, there is no Ku stable wood composite board that peeling of the wood fiber board and wood substrate is reduced is obtained.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明による木質複合板の製造過程を説明する図。 Diagram for explaining a manufacturing process of wood composite board according to the invention; FIG.

【図2】スライサー本体を拡大して示す斜視図。 Figure 2 is a perspective view showing an enlarged slicer body.

【符号の説明】 DESCRIPTION OF SYMBOLS

1…木質繊維板(MDF)、1a、1b…二分割された木質繊維板、2…木質基材、10…スライサー、11… 1 ... wood fiber board (MDF), 1a, 1b ... bisected wood fiber board, 2 ... wood substrate, 10 ... slicer, 11 ...
固定基台、12…平板状の刃物、13…ローラ、20、 Fixed base, 12 ... plate-shaped blade, 13 ... roller, 20,
21…コンベア。 21 ... conveyor.

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 木質基材の片面又は両面に、木質繊維板をスライサー等を用いて厚さ方向に2分割したものを、 On one or both sides according to claim 1] wood substrate, those of the wood fiber board is divided into two in the thickness direction by a slicer or the like,
    その分割面側を表面側として接着積層してなることを特徴とする木質複合板。 Wood composite board, characterized in that formed by adhesively laminated the division surface side as the surface side.
  2. 【請求項2】 木質繊維板が中質繊維板であることを特徴する請求項1記載の木質複合板。 2. A wood composite board according to claim 1 wherein wherein the wood fiber board is medium density fiberboard.
  3. 【請求項3】 木質繊維板をスライサー等を用いて厚さ方向に2分割し、該2分割された木質繊維板を、その分割面側が表面側となるようにして木質基材の片面又は両面に接着積層することを特徴とする木質複合板の製造方法。 3. A wood fiber board is divided into two in the thickness direction by a slicer or the like, one or both sides of the two divided wood fiber board, wood substrate as the division surface is the surface side production method of the wood composite board, which comprises adhesively laminated to.
  4. 【請求項4】 木質繊維板が中質繊維板であることを特徴する請求項3記載の木質複合板の製造方法。 4. The process for producing wood composite board according to claim 3 wherein the wherein the wood fiber board is medium density fiberboard.
JP9716197A 1997-04-15 1997-04-15 Woody composition board and its manufacture Pending JPH10286805A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publications (1)

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005522605A (en) * 2002-04-08 2005-07-28 ベーリンゲ、イノベイション、アクチボラグVaelinge Innovation Ab Floor board flooring
JP2013082088A (en) * 2011-10-06 2013-05-09 Consult:Kk Decorative plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005522605A (en) * 2002-04-08 2005-07-28 ベーリンゲ、イノベイション、アクチボラグVaelinge Innovation Ab Floor board flooring
JP2013082088A (en) * 2011-10-06 2013-05-09 Consult:Kk Decorative plate

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