JPH10283932A - Inspecting method for shadow mask - Google Patents

Inspecting method for shadow mask

Info

Publication number
JPH10283932A
JPH10283932A JP8690397A JP8690397A JPH10283932A JP H10283932 A JPH10283932 A JP H10283932A JP 8690397 A JP8690397 A JP 8690397A JP 8690397 A JP8690397 A JP 8690397A JP H10283932 A JPH10283932 A JP H10283932A
Authority
JP
Japan
Prior art keywords
shadow mask
light
hole
inspection
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8690397A
Other languages
Japanese (ja)
Inventor
Kyuichi Yago
久一 谷郷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP8690397A priority Critical patent/JPH10283932A/en
Publication of JPH10283932A publication Critical patent/JPH10283932A/en
Pending legal-status Critical Current

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  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

PROBLEM TO BE SOLVED: To accurately inspect, by one time, the shapes of the through hole and recesses of a shadow mask, by measuring the shapes of the through hole and recesses based on light passed through the through hole, and light reflected from a shadow mask; and judging whether the shapes of the through hole and recesses are formed as desired shapes or not. SOLUTION: A through hole, small hole recesses, and a large hole are formed at given intervals on a shadow mask 1. Radiated light 12a, from a first light radiating means 8a, reaches one side surface side of the shadow mask, and radiated light 12a, irradiated to the through hole portion, passes through the through hole, becoming transmitted light 13; and the transmitted light 13 is picked up by a measuring means 9 provided on another side surface side of the shadow mask 1. Successively, radiated light 12b from a second light radiating means 8b reaches another side surface side of the shadow mask 1 too to be reflected, and this reflected light 14 is picked up by the measuring means 9 to be judged by a judging means 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、金属薄板に複数の
貫通孔が形成されたシャドウマスクを検査する方法に係
わり、特に、貫通孔の数が多く、貫通孔の径が小さい高
精細シャドウマスクを検査する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inspecting a shadow mask having a plurality of through holes formed in a thin metal plate, and more particularly to a high definition shadow mask having a large number of through holes and a small diameter of the through holes. The method for inspecting.

【0002】[0002]

【従来の技術】カラー受像管等に用いるシャドウマスク
は、金属薄板に複数の貫通孔を形成しているものであ
り、フォトエッチング法を用いて製造することが主流と
なっている。また、シャドウマスクは高精細化の要求が
高まっており、以下の図5に記す製造工程例に記すよう
に、シャドウマスクに形成する貫通孔を、一方の面に形
成した小孔凹部と、他方の面に形成した大孔凹部とによ
り形成することが主流となりつつある。
2. Description of the Related Art A shadow mask used for a color picture tube or the like has a plurality of through holes formed in a thin metal plate, and is mainly manufactured by a photo-etching method. In addition, there is an increasing demand for higher definition of the shadow mask, and as shown in the example of the manufacturing process shown in FIG. 5 below, a through hole formed in the shadow mask is formed into a small hole recess formed on one surface, and a through hole formed on the other surface. It is becoming the mainstream to form it by using a large hole recess formed on the surface.

【0003】すなわち、シャドウマスクとなる金属薄板
(シャドウマスク材6)の表面を脱脂、整面、洗浄処理
した後、その両面にフォトレジスト液を塗布乾燥して、
フォトレジスト膜2を形成する。次いで、所定のパター
ンを有する露光用マスクを介して、シャドウマスク材6
の一方の面に小孔像のネガパターンを、他方の面に大孔
像のネガパターンを露光する。その後、温水にて、未露
光未硬化のフォトレジスト膜を溶解する現像処理を行な
えば、図5(a)に示すように、開孔部よりシャドウマ
スク材6を露出した小孔レジスト膜2aと大孔レジスト膜
2bとを表裏に有する、シャドウマスク材6が得られる。
[0003] That is, after the surface of a metal sheet (shadow mask material 6) serving as a shadow mask is degreased, leveled, and cleaned, a photoresist solution is applied to both surfaces and dried.
A photoresist film 2 is formed. Next, the shadow mask material 6 is exposed through an exposure mask having a predetermined pattern.
Is exposed with a negative pattern of a small hole image on one side and a negative pattern of a large hole image on the other side. Thereafter, if a development process for dissolving the unexposed and uncured photoresist film with warm water is performed, as shown in FIG. 5A, the small-hole resist film 2a exposing the shadow mask material 6 from the opening is formed. Large resist film
2b is obtained on both sides.

【0004】その後、レジスト膜2に対して硬膜処理お
よびバーニング処理を施し、第一段階のエッチングを表
裏両面から行なう。エッチングの際、レジスト膜2より
露出したシャドウマスク材6部位に等方的にエッチング
がなされ、凹部が形成される。なお、本例の第一エッチ
ング工程では、図5(b)に示すように、エッチング進
度は、途中で止めている。
After that, a hardening process and a burning process are performed on the resist film 2, and a first stage etching is performed from both front and back surfaces. At the time of etching, the shadow mask material 6 exposed from the resist film 2 is isotropically etched to form a concave portion. In the first etching step of this example, as shown in FIG. 5B, the etching progress is stopped halfway.

【0005】次いで、シャドウマスク材6を水洗洗浄お
よび乾燥後、例えば光硬化型の樹脂をグラビアコート法
等により塗布後、樹脂に光照射を行うことで、図5
(c)に示すように、前段のエッチングで形成された小
孔凹部を完全に埋め尽くすエッチング防止層4を形成す
る。なお、エッチング防止層4の形成面は、小孔側であ
っても大孔側であっても、差し支えないが、多くの場
合、小孔側に形成される。
Next, the shadow mask material 6 is washed with water, washed and dried, and then, for example, a photocurable resin is applied by a gravure coating method or the like, and the resin is irradiated with light to obtain a light-cured resin as shown in FIG.
As shown in (c), an etching prevention layer 4 that completely fills the small hole recesses formed by the preceding etching is formed. The surface on which the etching prevention layer 4 is formed may be on the small hole side or on the large hole side, but is often formed on the small hole side.

【0006】続いて、図5(d)に示すように、大孔側
からのみシャドウマスク材6をエッチングする第二エッ
チング工程を行ない、大孔凹部3bを拡大することで、大
孔側から小孔凹部3aに貫通する貫通孔5を形成する。最
後に、エッチング防止層4およびレジスト膜2を剥膜除
去する剥膜工程を行い図5(e)を得た後、不要部の断
裁等を行いシャドウマスク1を得るものである。
Subsequently, as shown in FIG. 5D, a second etching step of etching the shadow mask material 6 only from the large hole side is performed, and the large hole concave portion 3b is enlarged, so that the small hole from the large hole side is reduced. A through hole 5 penetrating the hole recess 3a is formed. Finally, a stripping step of stripping and removing the etching prevention layer 4 and the resist film 2 is performed to obtain FIG. 5E, and then unnecessary portions are cut to obtain the shadow mask 1.

【0007】なお、上述した図5では、エッチング防止
層4を塗布形成する製造方法の例を記したが、エッチン
グ防止層4としてフィルム状の膜を貼り付ける、また
は、エッチング防止層4を用いずにシャドウマスクを製
造する方法もある。また、片面からのエッチングで貫通
孔5を形成する方法もある。
In FIG. 5 described above, an example of a manufacturing method of coating and forming the etching prevention layer 4 is described. However, a film-like film is attached as the etching prevention layer 4 or the etching prevention layer 4 is not used. There is also a method of manufacturing a shadow mask. There is also a method of forming the through-hole 5 by etching from one side.

【0008】上述した例に記したように、シャドウマス
クを製造した際、貫通孔5は、少なくともシャドウマス
ク1の一方の面に形成した凹部3で構成されているもの
であり、シャドウマスク1には、金属薄板を貫通した径
の小さい貫通孔5が、多数形成されている。
As described in the above-described example, when the shadow mask is manufactured, the through-hole 5 is constituted by at least the concave portion 3 formed on one surface of the shadow mask 1. Is formed with a large number of small-diameter through-holes 5 penetrating a thin metal plate.

【0009】シャドウマスク1をカラー受像管等に組み
込んだ際に、シャドウマスク1に形成された各貫通孔5
は、電子銃より発せられた電子線を正しくカラー受像管
の蛍光面に導く役目をしている。そのため、シャドウマ
スク1上に形成されるべき各貫通孔5の形状および開孔
径、さらに、凹部3の形状、特に凹部3の外周部の輪郭
形状および外周径は、シャドウマスク製造前の設計段階
において予め設定されており、その形状および径は、シ
ャドウマスクがカラー受像管等に組み込まれた際、カラ
ー受像管等が所望する性能を発揮できるよう設定されて
いる。
When the shadow mask 1 is installed in a color picture tube or the like, each through-hole 5 formed in the shadow mask 1 is formed.
Has a function to correctly guide an electron beam emitted from an electron gun to a fluorescent screen of a color picture tube. Therefore, the shape and the diameter of each through hole 5 to be formed on the shadow mask 1 and the shape of the concave portion 3, particularly the contour shape and the outer diameter of the outer peripheral portion of the concave portion 3 are determined in the design stage before the shadow mask is manufactured. The shape and diameter are set in advance so that when the shadow mask is incorporated in a color picture tube or the like, the color picture tube or the like can exhibit desired performance.

【0010】そのため、シャドウマスクの製造後に、形
成されたパターンが所望のものとなっているか否かの検
査を行うものである。シャドウマスク1には多数の貫通
孔5がパターンとして形成されており、肉眼による検査
では手間が掛かかるため、シャドウマスクの検査は、機
械を用い自動的に行う場合が多い。
Therefore, after manufacturing the shadow mask, an inspection is performed to determine whether or not the formed pattern is a desired pattern. Since a large number of through holes 5 are formed in the shadow mask 1 as a pattern, and the inspection with the naked eye takes time, the inspection of the shadow mask is often performed automatically using a machine.

【0011】すなわち、図4の例に示すように、光透過
性の、または、開口を有する枠状の検査台7上に載置し
たシャドウマスク1の検査部位に、例えば高周波蛍光灯
等の光照射手段8から光を照射し、検査部位に形成され
た貫通孔5を通過した光を、シャドウマスク1を間に介
し光照射手段8と反対面側に設けた、例えば固体撮像カ
メラ等の測定手段9で光像として受ける。次いで、この
光像を電気信号に変換後、電気信号を例えばコンピュー
タ等よりなる判定手段10で受け、判定手段10は貫通孔5
が所望される形状および孔径であるか否かを検査判定す
るものである。
That is, as shown in the example of FIG. 4, light such as a high-frequency fluorescent lamp or the like is applied to the inspection site of the shadow mask 1 placed on a light-transmissive or frame-shaped inspection table 7 having an opening. Light is emitted from the irradiating means 8, and the light passing through the through-hole 5 formed in the inspection site is measured by, for example, a solid-state imaging camera or the like provided on the side opposite to the light irradiating means 8 with the shadow mask 1 interposed therebetween It is received as a light image by the means 9. Next, after converting this light image into an electric signal, the electric signal is received by a judging means 10 composed of, for example, a computer or the like.
Is to determine whether or not has a desired shape and a desired hole diameter.

【0012】上述した自動検査機を用いた検査の際、一
定のパターンに従って配列された複数の貫通孔5を持つ
シャドウマスク1においては、比較検査法が一般的に用
いられているものである。すなわち、一定領域内の隣接
する複数の貫通孔5同志の形状比較を行うことで、他の
貫通孔5と異なる形状および孔径を持つ貫通孔5を不良
として抽出する方法である。これを、貫通孔5が形成さ
れたシャドウマスクの画像領域11に逐次行なうものであ
る。なお、検査部位を移動する場合、移動手段(図示せ
ず)により光照射手段8と測定手段9とを連動して別の
検査部位に移動させるか、または、光照射手段8と測定
手段9の位置を固定し、検査台7を移動手段(図示せ
ず)により移動させるものである。一連の検査、および
移動手段の作動は、例えば判定手段10により制御されて
いるものである。
At the time of inspection using the above-described automatic inspection machine, a comparative inspection method is generally used for the shadow mask 1 having a plurality of through holes 5 arranged according to a predetermined pattern. That is, by comparing the shapes of a plurality of adjacent through-holes 5 in a certain area, a through-hole 5 having a shape and a hole diameter different from those of the other through-holes 5 is extracted as a defect. This is sequentially performed on the image area 11 of the shadow mask in which the through holes 5 are formed. When moving the inspection site, the light irradiation unit 8 and the measurement unit 9 are moved to another inspection site in conjunction with each other by a moving unit (not shown), or the light irradiation unit 8 and the measurement unit 9 are moved. The position is fixed, and the inspection table 7 is moved by a moving means (not shown). The series of inspections and the operation of the moving means are controlled by, for example, the judging means 10.

【0013】上述した、貫通孔5の形状を検査する方法
では、凹部3の検査はできない。すなわち、凹部3は光
が遮断され影となる部位であるため、測定手段9では凹
部3を光像として検出できないためである。このため、
凹部3の形状検査にあたっては、別途、検査を行う必要
があるといえ、それに用いる検査手段も別に備える必要
があるものである。すなわち、上述した貫通孔の検査と
同様に、凹部の形状を光像として受け電気信号に変換す
る、例えば固体撮像カメラ等の測定手段、および、この
電気信号を受け、凹部3の形状、特に輪郭形状が所望さ
れる形状であるか否か検査判定する、例えばコンピュー
タ等よりなる判定手段を少なくとも有する検査手段が別
途必要となっていた。
In the above-described method for inspecting the shape of the through hole 5, the inspection of the concave portion 3 cannot be performed. That is, since the concave portion 3 is a portion where light is blocked and becomes a shadow, the measuring means 9 cannot detect the concave portion 3 as a light image. For this reason,
Inspection of the shape of the concave portion 3 may be performed separately, and it is necessary to additionally provide an inspection unit used for the inspection. That is, similarly to the inspection of the through-hole described above, a measuring unit such as a solid-state imaging camera that receives the shape of the concave portion as an optical image and converts it into an electric signal, and receives the electric signal, and receives the electric signal to form the concave portion 3, particularly, the contour Inspection means for inspecting and determining whether or not the shape is a desired shape, for example, having at least determination means including a computer or the like, is required separately.

【0014】しかるに、上述した検査手段は、シャドウ
マスクに形成した微細なパターンを検査対象とするため
精度が要求される等、非常に高価なものとなっている。
このため、貫通孔と凹部を検査するために二通りの検査
手段を設けることは、検査費用がかさみ、ひいてはシャ
ドウマスクの製造コストを引き上げる要因ともなりかね
ない。さらに、二回に分けて検査を行わなければならな
いため、検査に手間を要し、検査効率が悪いといえる。
However, the above-mentioned inspection means is very expensive, for example, it requires high accuracy in order to inspect a fine pattern formed on a shadow mask.
For this reason, providing two types of inspection means for inspecting the through hole and the concave portion increases the inspection cost, and may increase the manufacturing cost of the shadow mask. Furthermore, since the inspection must be performed twice, it takes time and labor to perform the inspection, and it can be said that the inspection efficiency is low.

【0015】[0015]

【発明が解決しようとする課題】本発明は、以上のよう
な問題に鑑みなされたものであり、シャドウマスクに形
成された貫通孔と凹部の形状検査を一度の検査で精度良
く行える検査方法を提供し、もって、検査費用の低減お
よび検査効率の向上を行うことを目的とするものであ
る。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an inspection method capable of accurately inspecting the shapes of through holes and recesses formed in a shadow mask by a single inspection. It is an object of the present invention to provide inspection and reduce inspection costs and improve inspection efficiency.

【0016】[0016]

【課題を解決するための手段】すなわち、本発明は、金
属薄板の少なくとも一方の面側に形成した凹部により構
成される貫通孔を複数穿孔したシャドウマスクの検査方
法であって、シャドウマスクの一方の面側よりシャドウ
マスクに光照射を行う第一の光照射手段と、シャドウマ
スクの他方の面側よりシャドウマスクに光照射を行う第
二の光照射手段と、前記第二の光照射手段側に位置し、
前記第一の光照射手段より照射され貫通孔を通過した光
および、前記第二の光照射手段より照射され、シャドウ
マスクより反射した光をもとに、貫通孔および凹部の形
状を測定する手段と、前記測定結果から、貫通孔および
凹部の形状が所望の形状となってるか否かを判定する手
段とを少なくとも具備することを特徴とするシャドウマ
スクの検査方法を提供することで、上記の課題を解決し
たものである。
That is, the present invention relates to a method of inspecting a shadow mask in which a plurality of through-holes formed by concave portions formed on at least one surface of a thin metal plate is provided. First light irradiating means for irradiating light to the shadow mask from the surface side of the second, second light irradiating means for irradiating light to the shadow mask from the other side of the shadow mask, and the second light irradiating means side Located in
Means for measuring the shape of the through-hole and the concave portion based on the light irradiated from the first light irradiation means and passing through the through-hole, and the light irradiated from the second light irradiation means and reflected from the shadow mask And a method for inspecting a shadow mask, comprising: at least means for judging whether or not the shapes of the through-holes and the concave portions have a desired shape from the measurement results. It is a solution to the problem.

【0017】[0017]

【発明の実施の形態】以下に、本発明のシャドウマスク
の検査方法の一実施例を模式的に示す図面に基づき、本
発明の実施の形態例につき説明を行う。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings schematically showing an embodiment of a shadow mask inspection method according to the present invention.

【0018】図1に示すように、本実施例のシャドウマ
スクの検査方法においては、光透過性の検査台(図示せ
ず)上に、大孔面側を上面にしてシャドウマスク1を載
置している。次いで、シャドウマスク1の一方の面側
(図1の例では下面側)に、従来行われていた貫通孔の
検査と同様に、光照射手段(以下、これを第一の光照射
手段8aと記す)を設けており、第一の光照射手段8aより
シャドウマスク1に光照射を行う(照射光 12a)。な
お、本実施例では、第一の光照射手段8aとして、高周波
蛍光灯(松下電器(株)製、商品名「スリムライン蛍光
灯 48型 FLR48T6W」)を用い、第一の光照
射手段8aとシャドウマスク1との間隔を50mm程度とした
ものである。
As shown in FIG. 1, in the shadow mask inspection method of this embodiment, the shadow mask 1 is placed on a light-transmitting inspection table (not shown) with the large hole side facing upward. doing. Next, on one surface side (lower surface side in the example of FIG. 1) of the shadow mask 1, similarly to the inspection of the through-hole which has been conventionally performed, a light irradiation unit (hereinafter, referred to as a first light irradiation unit 8 a) The shadow mask 1 is irradiated with light from the first light irradiation means 8a (irradiation light 12a). In this embodiment, a high-frequency fluorescent lamp (manufactured by Matsushita Electric Industrial Co., Ltd., trade name “Slimline fluorescent lamp 48 type FLR48T6W”) is used as the first light irradiating means 8a. The distance from the shadow mask 1 is about 50 mm.

【0019】次いで、本発明のシャドウマスクの検査方
法の特徴として、シャドウマスク1の他方の面側にも光
照射手段(以下、これを第二の光照射手段8bと記す)を
設けており(図1の例では上面側)、第二の光照射手段
8bからも、シャドウマスク1に光照射(照射光 12b)を
行うものである。
Next, as a feature of the shadow mask inspection method of the present invention, a light irradiating means (hereinafter referred to as a second light irradiating means 8b) is provided on the other surface side of the shadow mask 1 ( 1, the second light irradiation means
From 8b, the shadow mask 1 is irradiated with light (irradiation light 12b).

【0020】また、第二の光照射手段8bを設けたシャド
ウマスク1の面側に、例えば固体撮像カメラ等の測定手
段9を設け、後述するように、シャドウマスクの貫通孔
5を通過した通過光13、および、シャドウマスクより反
射した反射光14を光像として受けるものである。ちなみ
に、本実施例では、測定手段9としてCCDラインセン
サーカメラを用いたものである。
On the surface side of the shadow mask 1 provided with the second light irradiating means 8b, for example, a measuring means 9 such as a solid-state image pickup camera is provided. The light 13 and the reflected light 14 reflected from the shadow mask are received as a light image. Incidentally, in the present embodiment, a CCD line sensor camera is used as the measuring means 9.

【0021】次いで、例えばコンピュータ等よりなる判
定手段10を設けている。測定手段9で受けた光像は電気
信号に変換され、この電気信号を判定手段10で受ける。
判定手段10はこの電気信号をもとに、シャドウマスク1
に形成された貫通孔5の形状および、第二の光照射手段
8bを設けた面側の凹部3の形状が所望のものであるか否
かを判定するものである。
Next, a judging means 10 comprising, for example, a computer is provided. The light image received by the measuring means 9 is converted into an electric signal, and the electric signal is received by the judging means 10.
The judging means 10 determines the shadow mask 1 based on the electric signal.
Of the through-hole 5 formed in the hole and the second light irradiation means
This is for determining whether or not the shape of the concave portion 3 on the surface side provided with 8b is desired.

【0022】以下に図面を用い、さらに説明を行う。図
2は、シャドウマスク1の部分断面図であり、シャドウ
マスク1には、所定の間隔で貫通孔5および小孔凹部3
a、大孔3bが形成されている。光照射手段を上述した構
成とすることにより、シャドウマスクの一方の面側(図
2の例では下面側)には、第一の光照射手段8aからの照
射光 12aが届いており、貫通孔5部位に照射された照射
光 12aは、図2に示すように貫通孔5を通過し通過光13
となる。シャドウマスク1の他方の面側(図2の例では
上面側)に設けられた固体撮像カメラ等の測定手段9に
て、この通過光13を撮像するものである。次いで、シャ
ドウマスク1の他方の面側(図2の例では上面側)に
も、第二の光照射手段8bからの照射光 12bが届いてお
り、照射光 12bはシャドウマスク1表面にて反射される
ものである。この反射光14をも、上記の測定手段9にて
撮像するものである。
A further description will be given below with reference to the drawings. FIG. 2 is a partial sectional view of the shadow mask 1. The shadow mask 1 has through holes 5 and small hole recesses 3 at predetermined intervals.
a, a large hole 3b is formed. With the above-described configuration of the light irradiation unit, the irradiation light 12a from the first light irradiation unit 8a reaches one surface side (the lower surface side in the example of FIG. 2) of the shadow mask, The irradiation light 12a applied to the five portions passes through the through-hole 5 as shown in FIG.
Becomes The transmitted light 13 is imaged by measuring means 9 such as a solid-state imaging camera provided on the other surface side (the upper surface side in the example of FIG. 2) of the shadow mask 1. Next, the irradiation light 12b from the second light irradiation means 8b also reaches the other surface side (the upper surface side in the example of FIG. 2) of the shadow mask 1, and the irradiation light 12b is reflected by the surface of the shadow mask 1. Is what is done. This reflected light 14 is also imaged by the measuring means 9 described above.

【0023】ここで、凹部3以外の部位に照射された照
射光 12bは、略平坦なシャドウマスク1表面で略正反射
され反射光14となる。この反射光14は、図1に示すよう
に、上方に位置する固体撮像カメラ等の測定手段9に入
射する。しかるに、シャドウマスク1の凹部3および、
形状不良部位(図2中のX、Y部)に入射した照射光12
bは、入射した面がテーパー状であり角度をもっている
ため、斜め方向に反射するものである。すなわち、シャ
ドウマスクの凹部3および、形状不良となった凹部部位
(図2中のX、Y部)で反射した光は、斜め方向に反射
するため、上方に位置する測定手段9には入射しない。
なお、図2中のX、Y部の点線は、本来形成されるべき
所定の形状を示しており、また、図2中のZ部は、貫通
孔5が形状不良となった例を示し、Z部の点線は、本来
形成されるべき貫通孔の形状を示している。
Here, the irradiating light 12b applied to the portion other than the concave portion 3 is substantially specularly reflected on the substantially flat surface of the shadow mask 1 to become reflected light 14. As shown in FIG. 1, the reflected light 14 is incident on the measuring means 9 such as a solid-state imaging camera located above. However, the concave portion 3 of the shadow mask 1 and
Irradiation light 12 incident on the defective shape part (X and Y parts in FIG. 2)
“b” reflects obliquely because the incident surface is tapered and has an angle. That is, the light reflected by the concave portion 3 of the shadow mask and the concave portion (X and Y portions in FIG. 2) in which the shape is defective is reflected in an oblique direction, and does not enter the measuring means 9 located above. .
Note that the dotted lines of the X and Y portions in FIG. 2 indicate a predetermined shape to be originally formed, and the Z portion in FIG. 2 indicates an example in which the shape of the through hole 5 is defective. The dotted line in the Z portion indicates the shape of the through hole that should be originally formed.

【0024】図2の部分断面図部位を測定手段9にて撮
像することで得られた光像を電圧に直し、各部位より得
られた電圧値をもとに作成したグラフ図が図3である。
図3の例においては、測定手段9に光が入射した部位で
は電圧が高く、光が入射しなかった部位では電圧が低く
なっている。すなわち、図3中で電圧値がKの部位は、
測定手段9に光を反射しなかったシャドウマスク部位
(凹部)であり、また、電圧値がLの部位は、測定手段
9に光を反射した略平坦なシャドウマスク表面部位、さ
らに、電圧値がMの部位は、貫通孔部位を各々示すもの
である。なお、シャドウマスク表面部位の電圧値Lが、
貫通孔部位の電圧値Mよりも低くなっているのは、実施
例に用いたシャドウマスク表面の光反射率が低かったた
めである。
FIG. 3 is a graph showing a partial cross-sectional view of FIG. 2 in which a light image obtained by capturing an image by the measuring means 9 is converted into a voltage and the voltage is obtained from each part. is there.
In the example of FIG. 3, the voltage is high at a portion where light enters the measuring unit 9, and the voltage is low at a portion where light does not enter. That is, the portion where the voltage value is K in FIG.
The shadow mask portion (concave portion) that did not reflect light to the measuring means 9, the portion having a voltage value of L was a substantially flat shadow mask surface portion that reflected light to the measuring device 9, and the voltage value was L. The portions of M indicate through-hole portions, respectively. In addition, the voltage value L of the shadow mask surface portion is
The reason why the voltage value is lower than the voltage value M at the through-hole portion is that the light reflectance on the surface of the shadow mask used in the example was low.

【0025】ここで、図2中の形状不良の無い領域であ
るA部より得られた電圧変化を示す波形が図3のA部で
あり、図2の形状不良部位X、Y、Z部を含む領域より
得られたグラフ図部位が、各々図3のx、y、z部であ
る。
Here, the waveform showing the voltage change obtained from the portion A which is a region where there is no shape defect in FIG. 2 is the portion A in FIG. 3, and the shape defective portions X, Y and Z portions in FIG. The graph diagram parts obtained from the included region are the x, y, and z parts in FIG. 3, respectively.

【0026】図2の例に示す形状不良部位が無かった場
合、図3で得られるグラフ図は、図3中のAの波形が繰
り返されるものである。しかるに、図2には形状不良部
位(X、Y、Z部)が存在し、図3中のグラフ図におい
ては、形状不良部位(x、y、z部)を含む領域より得
られた波形は、所定の形状となった部位より得られた波
形Aと、形が異なるものである。
In the case where there is no defective shape portion shown in the example of FIG. 2, the graph obtained in FIG. 3 shows the waveform of A in FIG. 3 repeated. However, in FIG. 2, there are defective shape portions (X, Y, and Z portions), and in the graph of FIG. 3, the waveform obtained from the region including the defective shape portion (x, y, and z portions) is , The waveform is different from the waveform A obtained from the part having the predetermined shape.

【0027】判定手段10にて、上記のように波形の異な
った部位を検出することにより、シャドウマスクの形状
不良となった部位、すなわち、貫通孔および凹部の輪郭
形状が形状不良となった部位が検出できるものである。
なお、波形の異なる部位を検出する際、一定のパターン
に従って配列された複数の貫通孔5を持つシャドウマス
ク1においては、前述した(従来の技術)の項で記した
比較検査法を用いることが望ましい。
When the judging means 10 detects a portion having a different waveform as described above, a portion in which the shape of the shadow mask is defective, that is, a portion in which the contour shape of the through-hole and the concave portion is defective. Can be detected.
When detecting portions having different waveforms, in the shadow mask 1 having a plurality of through holes 5 arranged according to a predetermined pattern, it is possible to use the comparative inspection method described in the above section (prior art). desirable.

【0028】なお、本発明のシャドウマスクの検査方法
では、対とした第一および第二の光照射手段8の位置関
係は上下逆であっても構わない。しかし、シャドウマス
クをカラー受像管等に組み込む際、大孔凹部面側を電子
銃側に、また、小孔凹部面側を蛍光面側にして組み込む
ものであり、大孔凹部の輪郭形状が、電子線を正しく蛍
光面に導くうえで、重要であるといえる。このため、第
一の光照射手段8aをシャドウマスク1の小孔凹部3a側に
位置させ、第二の光照射手段8bをシャドウマスク1の大
孔凹部3b側に位置させて、大孔凹部3bの輪郭形状の検査
を行うことが望ましいといえる。
In the shadow mask inspection method of the present invention, the positional relationship between the pair of the first and second light irradiation means 8 may be upside down. However, when the shadow mask is incorporated into a color picture tube or the like, the large hole concave surface side is incorporated into the electron gun side, and the small hole concave surface side is incorporated into the fluorescent screen side. It can be said that it is important for correctly guiding the electron beam to the phosphor screen. Therefore, the first light irradiating means 8a is positioned on the side of the small hole recess 3a of the shadow mask 1, and the second light irradiating means 8b is positioned on the side of the large hole recess 3b of the shadow mask 1, and the large hole recess 3b It can be said that it is desirable to perform the inspection of the contour shape.

【0029】上述したように、本発明のシャドウマスク
の検査方法では、シャドウマスクから反射した光をも検
査に用いるものであり、反射光の強度が大きいほど望ま
しいといえる。なぜならば、測定手段9に入射する反射
光の光量が大きいほど、光が斜めに反射され暗部となる
凹部もしくは形状不良部と、光を正反射し光像となる平
坦面との相違が明確になり、凹部の外周形状が捉えやす
くなり、検査精度が上がるためである。
As described above, in the shadow mask inspection method of the present invention, the light reflected from the shadow mask is also used for the inspection, and it can be said that the higher the intensity of the reflected light, the more desirable. This is because, as the amount of reflected light incident on the measuring means 9 increases, the difference between a concave portion or a defective shape portion which becomes a dark portion due to oblique reflection of light and a flat surface which becomes a light image by regularly reflecting light becomes clearer. This is because the outer peripheral shape of the concave portion can be easily grasped, and the inspection accuracy increases.

【0030】しかるに、シャドウマスク表面の光反射率
は、例えば70%程度であり、シャドウマスクからの反射
の際に、反射光は減衰されるため光強度が落ち、凹部の
形状が明瞭に光像として捕らえられなくなる可能性があ
る。
However, the light reflectance on the surface of the shadow mask is, for example, about 70%. When the light is reflected from the shadow mask, the reflected light is attenuated, so that the light intensity is reduced and the shape of the concave portion is clearly formed. May not be caught.

【0031】このため本実施例では図1に示すように、
第二の光照射手段8bを、円筒状の発光部15を2本有する
略H字状の蛍光灯(松下電器(株)製、商品名「パルッ
ク蛍光灯 FHL6EX−N」)とし、また、発光部15
の間のスリット上に測定手段9を位置させ、CCDライ
ンセンサーカメラの長手方向とスリットの長手方向とを
略平行としたものである。
Therefore, in this embodiment, as shown in FIG.
The second light irradiating means 8b is a substantially H-shaped fluorescent lamp (trade name “Palook fluorescent lamp FHL6EX-N” manufactured by Matsushita Electric Industrial Co., Ltd.) having two cylindrical light emitting portions 15 and emits light. Part 15
The measurement means 9 is positioned on the slit between the two, and the longitudinal direction of the CCD line sensor camera and the longitudinal direction of the slit are substantially parallel.

【0032】第二の光照射手段8bを略H字状の蛍光灯、
すなわち発光部を2本とし、照射光量を増したことで、
シャドウマスク1への入射光量が増えるものである。入
射光量が増えた分、測定手段9に入射する反射光14の強
度も強くなり、凹部3の輪郭形状を明確に捉えることが
可能となる。さらに、略H字状の蛍光灯とすることで、
通過光13および反射光14が発光部15同志間のスリットを
通過することができ、光照射手段により光が遮断される
ことなく、測定手段9に到達できるものである。なお、
略H字状の蛍光灯とシャドウマスクとの距離は、シャド
ウマスク1への照射光量を強くするため、なるべく接近
させたほうが望ましい。ちなみに本実施例では、発光体
15とシャドウマスク1との距離を 5mm程度としたもので
ある。
A second H-shaped fluorescent lamp,
That is, by using two light emitting units and increasing the irradiation light amount,
The light quantity incident on the shadow mask 1 increases. As the amount of incident light increases, the intensity of the reflected light 14 incident on the measuring means 9 also increases, and the contour of the recess 3 can be clearly grasped. Furthermore, by using a substantially H-shaped fluorescent lamp,
The transmitted light 13 and the reflected light 14 can pass through the slit between the light emitting units 15 and can reach the measuring means 9 without being blocked by the light irradiating means. In addition,
It is desirable that the distance between the substantially H-shaped fluorescent lamp and the shadow mask be as close as possible in order to increase the amount of light applied to the shadow mask 1. By the way, in this embodiment, the luminous body
The distance between 15 and the shadow mask 1 is about 5 mm.

【0033】次いで、当然のことながら、測定手段9と
シャドウマスク1との間に第二の光照射手段8bを位置さ
せるのが望ましいといえる。なぜならば、第二の光照射
手段8bとシャドウマスク1との間に測定手段9を位置さ
せた場合、測定手段9が第二の光照射手段8bからの照射
光 12bを遮り、シャドウマスク1面に影が生じるため、
検査精度が悪くなるためである。ちなみに、本実施例で
は、測定手段9とシャドウマスク1との距離を 450mm程
度としている。しかし、測定手段9とシャドウマスク1
との距離はこれに限定されるものではなく、一度に検査
しようとするシャドウマスク1領域の広さ、測定手段9
の視野角、測定手段9のピント合わせの距離等に応じて
適宜設定することが望ましいといえる。
Next, as a matter of course, it can be said that it is desirable to position the second light irradiating means 8b between the measuring means 9 and the shadow mask 1. This is because, when the measuring means 9 is located between the second light irradiating means 8b and the shadow mask 1, the measuring means 9 blocks the irradiation light 12b from the second light irradiating means 8b, and Shadows appear on
This is because the inspection accuracy deteriorates. Incidentally, in this embodiment, the distance between the measuring means 9 and the shadow mask 1 is about 450 mm. However, the measuring means 9 and the shadow mask 1
Is not limited to this, and the size of the shadow mask 1 area to be inspected at a time, the measuring means 9
It can be said that it is desirable to appropriately set according to the viewing angle, the focusing distance of the measuring means 9 and the like.

【0034】なお、本発明の実施の形態は、上述した図
面および記述に限定されるものではなく、本発明の趣旨
に基づき種々の変形を行っても構わないことはいうまで
もない。例えば、シャドウマスクを載置する検査台を、
開口を有する枠状の検査台とし、シャドウマスクの外周
部が枠部を接触するよう、また、検査台の開口部がシャ
ドウマスクの被検査領域に位置するように、大孔面側を
下面にして検査台上にシャドウマスクを載置しても構わ
ない。この場合、第一の光照射手段8aをシャドウマスク
の上面側に、また、第二の光照射手段8bおよび測定手段
9をシャドウマスクの下面側に位置させることが望まし
い。
The embodiments of the present invention are not limited to the above-described drawings and description, and it goes without saying that various modifications may be made based on the spirit of the present invention. For example, an inspection table on which a shadow mask is placed,
With the frame-shaped inspection table having an opening, the large-hole side is set to the lower surface so that the outer periphery of the shadow mask contacts the frame, and the opening of the inspection table is located in the inspection area of the shadow mask. A shadow mask may be placed on the inspection table. In this case, it is desirable that the first light irradiating means 8a is located on the upper surface side of the shadow mask, and the second light irradiating means 8b and the measuring means 9 are located on the lower surface side of the shadow mask.

【0035】[0035]

【発明の効果】以上述べたように、本発明のシャドウマ
スクの検査方法では、貫通孔と凹部の形状検査を、一台
の検査手段を用い、一回の検査で精度良く行うことが可
能となる。このため、本発明のシャドウマスクの検査方
法は高価な検査手段を複数必要とせず、従来問題となっ
ていた点、すなわち、高価な検査手段を複数設けること
で検査費用がかさみ、ひいてはシャドウマスクの製造コ
ストを引き上げるという問題、および、二回に分けて検
査を行わなければならないため、検査に手間を要し、検
査効率が悪いという問題を解決したものであり、実用上
優れているといえる。
As described above, according to the shadow mask inspection method of the present invention, the shape inspection of the through-hole and the concave portion can be accurately performed by one inspection using one inspection means. Become. For this reason, the shadow mask inspection method of the present invention does not require a plurality of expensive inspection means, and has conventionally been a problem. That is, the provision of a plurality of expensive inspection means increases the inspection cost, and thus the shadow mask. This solves the problem of raising the manufacturing cost and the problem that the inspection must be performed in two separate steps, requiring a lot of time and labor for the inspection, and the efficiency of the inspection is poor.

【0036】[0036]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のシャドウマスクの検査方法の一実施例
の要部を示す説明図。
FIG. 1 is an explanatory view showing a main part of an embodiment of a shadow mask inspection method according to the present invention.

【図2】本発明のシャドウマスクの検査方法の一実施例
の要部を示す部分拡大図。
FIG. 2 is a partially enlarged view showing a main part of one embodiment of a shadow mask inspection method according to the present invention.

【図3】本発明のシャドウマスクの検査方法での不良部
位検出の一例を示すグラフ図。
FIG. 3 is a graph showing an example of defective portion detection in the shadow mask inspection method of the present invention.

【図4】従来のシャドウマスクの検査方法の一例を示す
説明図。
FIG. 4 is an explanatory view showing an example of a conventional shadow mask inspection method.

【図5】(a)〜(e)はシャドウマスクの製造方法の
一例を工程順に示す説明図。
5A to 5E are explanatory views showing an example of a method of manufacturing a shadow mask in the order of steps.

【符号の説明】[Explanation of symbols]

1 シャドウマスク 2 レジスト膜 3 凹部 4 エッチング防止層 5 貫通孔 6 シャドウマスク材 7 検査台 8 光照射手段 9 測定手段 10 判定手段 11 画像領域 12 照射光 13 通過光 14 反射光 15 発光部 REFERENCE SIGNS LIST 1 shadow mask 2 resist film 3 concave portion 4 etching prevention layer 5 through hole 6 shadow mask material 7 inspection table 8 light irradiation means 9 measurement means 10 determination means 11 image area 12 irradiation light 13 transmitted light 14 reflected light 15 light emitting section

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】金属薄板の少なくとも一方の面に形成した
凹部より構成される貫通孔を複数穿孔したシャドウマス
クの検査方法であって、シャドウマスクの一方の面側よ
りシャドウマスクに光照射を行う第一の光照射手段と、
シャドウマスクの他方の面側よりシャドウマスクに光照
射を行う第二の光照射手段と、前記第二の光照射手段側
に位置し、前記第一の光照射手段より照射され貫通孔を
通過した光および、前記第二の光照射手段より照射さ
れ、シャドウマスクから反射した光をもとに、貫通孔お
よび凹部の形状を測定する測定手段と、前記測定結果か
ら、貫通孔および凹部の形状が所望の形状となってるか
否かを判定する判定手段とを少なくとも具備することを
特徴とするシャドウマスクの検査方法。
An inspection method of a shadow mask in which a plurality of through-holes formed by concave portions formed on at least one surface of a metal thin plate is provided, wherein light is applied to the shadow mask from one surface side of the shadow mask. First light irradiation means,
The second light irradiating means for irradiating light to the shadow mask from the other surface side of the shadow mask, and located on the second light irradiating means side, passed through the through-hole irradiated by the first light irradiating means. Light and the measuring means for measuring the shape of the through hole and the concave portion based on the light irradiated from the second light irradiating device and reflected from the shadow mask, and the shape of the through hole and the concave portion are determined from the measurement result. A method for inspecting a shadow mask, comprising: at least a determining means for determining whether or not a desired shape is obtained.
JP8690397A 1997-04-04 1997-04-04 Inspecting method for shadow mask Pending JPH10283932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8690397A JPH10283932A (en) 1997-04-04 1997-04-04 Inspecting method for shadow mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8690397A JPH10283932A (en) 1997-04-04 1997-04-04 Inspecting method for shadow mask

Publications (1)

Publication Number Publication Date
JPH10283932A true JPH10283932A (en) 1998-10-23

Family

ID=13899807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8690397A Pending JPH10283932A (en) 1997-04-04 1997-04-04 Inspecting method for shadow mask

Country Status (1)

Country Link
JP (1) JPH10283932A (en)

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