JPH1027993A - Arranged electronic device chip feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an arranged electronic device chip feeder for feeding electronic device chips while arranging efficiently by preventing the electronic device chips from being jammed in front of an arranging path without requiring any air source. SOLUTION: An inner ring member 51 being rotary driven oppositely to the carrying direction from an arranging path 14 to a carrier has tubular outer circumferential part provided with a port 53 for introducing an electronic device chip 1 from a feeding path on the bulk case side and then delivering the electronic device chip 1 to the carrier on the arranging path 14 side. A protrusion 54 for arranging the electronic device chip 1 in a predetermined direction and passing only the led-out electronic device chip 1 to the arranging path 14 is provided integrally on the outer circumferential surface of the inner ring member 51 at the inlet to the arranging path 14. A subchamber 17 for temporarily storing the electronic device chip 1 delivered to the arranging path 14 is provided in front of the inlet to the arranging path 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component chip aligning and supplying device for supplying electronic component chips to a chip mounter.

[0002]

2. Description of the Related Art In a chip mounter for mounting an electronic component chip on a printed circuit board, for example, a chute type component supply device for supplying the electronic component chip from a bulk case containing an electronic component chip such as a resistor or a capacitor is used. Japanese Patent Application Laid-Open No. 1-272200 discloses a technique for arranging electronic component chips by air suction as such a chute type component supply apparatus. Japanese Unexamined Patent Publication No. Hei 2-92000 discloses a technique for stirring electronic component chips by blowing air, and Japanese Unexamined Patent Publication No. Heisei 5-92000 discloses a technique for providing a movable block for an alignment passage and aligning the electronic components according to the thickness of the electronic component chips. -338
No. 769, each of which is known. Also, a technique for preventing and overlapping electronic component chips by air blowing and aligning them is known from Japanese Patent Application Laid-Open No. 7-86795.

[0003]

However, the above-mentioned technology has a disadvantage that an air source is required, and the above-mentioned technology has a disadvantage that electronic components supplied from a bulk case in a random posture are not provided. No measures are taken for efficiently aligning the chips without clogging in front of the alignment passage. In this regard, according to the above-described technique, clogging of the electronic component chip in front of the alignment passage by blowing air can be prevented, but there is a disadvantage that an air source is required.

Accordingly, an object of the present invention is to provide an electronic component chip aligning / supplying device which can prevent the electronic component chips from being clogged in front of the aligning passage and can efficiently align and supply them without using an air source. To provide.

[0005]

In order to solve the above-mentioned problems, the invention according to claim 1 is, for example, a supply path formed on an outer frame or the like and supplying an electronic component chip such as a resistor or a capacitor from a bulk case. And an alignment path for guiding the electronic component chips in an aligned state from the supply path to, for example, a transport device by a transport belt or the like to the chip mounter side, the electronic component chip alignment and supply apparatus comprising: Having an outlet and an inlet for the alignment passage inside, and introducing the electronic component chip from the supply passage to the inside, and leading it to the alignment passage side, for example, at a side surface portion of an outer frame, Stirring the electronic component chips such as a circular recess formed in the outer frame to align the electronic component chips in a predetermined direction,
For example, the present invention is characterized in that a storage chamber including a circular concave portion formed in an outer frame, for example, has a built-in stirring and alignment member such as a spring member.

[0006] Here, the bulk case is used to store a large number of electronic component chips in a bulk shape, the shape and structure are arbitrary, and the supply path from the bulk case is, for example, an external one. It is formed on an appropriate member such as a frame, and its shape and structure are also arbitrary. Furthermore, examples of the electronic component chip include a resistor and a capacitor, but other electronic components are of course included. In addition, the state in which the electronic component chips are aligned in a predetermined direction refers to, for example, a state in which a rectangular electronic component chip is set upright in the longitudinal direction, but may be in another state. In addition, as a transfer device, for example, a transfer belt to the chip mounter side is typical, but another structure may be used, and an alignment passage is provided for aligning electronic component chips in the above-described predetermined direction. It is transported in a state, and is formed on an appropriate member such as an outer frame, for example, and its shape, structure, and the like are arbitrary. As the agitation alignment member, for example, a spring member arranged in the circumferential direction of the disk member can be cited, but it is needless to say that another configuration may be used.

[0007] As described above, the electronic component chips are introduced into the supply passage from the bulk case through the outlet, and the electronic component chips are agitated in order to guide the electronic component chips into the inlet of the alignment passage for leading to the transfer device. The electronic component chip aligning / supplying device includes a storage chamber containing a stirring alignment member for aligning the electronic component chips in a predetermined direction, so that when the electronic component chips are agitated by the stirring alignment member and led out to the inlet of the alignment passage. In addition, at the inlet of the alignment passage, an electronic component chip to be led out can be aligned in a predetermined direction for passing through the alignment passage. Therefore, it is not necessary to use an air source, and it is possible to prevent clogging of the electronic component chips before the alignment passage, so that the electronic component chips can be efficiently aligned and supplied.

According to a second aspect of the present invention, there is provided the electronic component chip aligning and feeding apparatus according to the first aspect, wherein the stirring and aligning member is formed of an elastic member that can be elastically deformed. . For example, as the elastic member,
Although a spring member is typical, a member having another elasticity such as rubber may be used.

As described above, since the stirring and aligning member according to the first aspect is an electronic component chip aligning and feeding device formed of an elastic member capable of elastic deformation, there is no fear that the electronic component chip is damaged by the stirring and aligning member.

According to a third aspect of the present invention, there is provided the electronic component chip aligning and supplying apparatus according to the first aspect, wherein the stirring and aligning member includes the electronic component chip inside the electronic component chip through the supply path.
For example, a guide groove for introducing into the inlet of the alignment passage after being introduced into a circular recess or the like formed on the outer frame is provided on the end surface. An inner ring member having a bottomed cylindrical shape or the like, which is driven to rotate in a direction opposite to the direction of conveyance to the conveyance device. Here, the inner ring member has, for example, a cylindrical shape with a bottom, and the lead-out groove is formed radially on an end face of the cylindrical portion. However, these may have other shapes.

As described above, the inner ring member having the guide groove on the end face for introducing the electronic component chip into the inside from the supply path from the bulk case and then leading the chip to the alignment passage for leading to the transfer device. Is an electronic component chip aligning and feeding device provided with a stirring and aligning member formed by the above, so that when the internal electronic component chip is led out to the alignment passage side by a lead groove provided on the end face of the inner ring member, the electronic component chip to be led out Can be aligned in a predetermined direction for passing through the alignment passage. Therefore, it is not necessary to use an air source, and it is possible to prevent clogging of the electronic component chips before the alignment passage, so that the electronic component chips can be efficiently aligned and supplied.

According to a fourth aspect of the present invention, there is provided the electronic component chip aligning and feeding device according to the third aspect, wherein an inner peripheral surface of the inner race member has a large diameter at the end surface side having the lead-out groove. It is characterized by a configuration formed in a frustoconical shape.

As described above, since the inner peripheral surface of the inner race member according to the third aspect is an electronic component chip alignment and supply device formed in a truncated conical shape having a large diameter on the end surface side having the lead-out groove, the inner race member has The internal electronic component chip can be guided to the end face side by its own weight and centrifugal force due to rotation along the frusto-conical shape of the inner peripheral surface of the inner ring member, and can be efficiently led out from the lead groove.

The invention described in claim 5 is the first invention.
4. The electronic component chip aligning and feeding device according to claim 1, wherein the stirring and aligning member introduces the electronic component chip into the inside, for example, a circular recess formed in an outer frame from the supply path, and then guides the electronic component chip to the alignment passage side. Having an outlet for forming a cylindrical end face, for example, an inner ring member having a bottomed cylindrical shape or the like, and integrally provided on the outer peripheral surface of the inner ring member by integral formation or the like,
At the entrance to the alignment passage, the electronic component chips are aligned in a predetermined direction, and a protrusion such as a gear shape for allowing only the aligned electronic component chips to pass through the alignment passage. It is characterized by the configuration provided. Here, the inner ring member has, for example, a cylindrical shape with a bottom, and as the outlet, a plurality of cutout shapes are formed on the end face of the cylindrical portion, but these may have other shapes. As the projection, a gear-shaped projection formed on the outer peripheral surface of the cylindrical portion except for the outlet is representative,
Other shapes may be used.

As described above, the electronic component chip is introduced from the supply path from the bulk case to the inside, and then is led out to the alignment passage side for leading to the transport device. On the outer peripheral surface of the inner ring member, the electronic component chips are aligned in a predetermined direction at the entrance to the alignment passage, and a protrusion for allowing only the electronic component chips in the aligned state to pass through the alignment passage. Since it is an electronic component chip alignment supply device provided integrally, when the internal electronic component chip is led out to the alignment passage side from the outlet provided on the cylindrical end surface of the inner ring member, at the entrance to the alignment passage. The electronic component chips can be tilted by the projections integrally provided on the outer peripheral surface of the inner ring member, and can be aligned in a predetermined direction for passing the electronic component chips through the alignment passage. Therefore, it is not necessary to use an air source, and it is possible to prevent clogging of the electronic component chips before the alignment passage, so that the electronic component chips can be efficiently aligned and supplied.

According to a sixth aspect of the present invention, there is provided the electronic component chip aligning / supplying device according to the fifth aspect, wherein the internal electronic component chip is agitated on the inner peripheral surface of the inner ring member. It is characterized in that a stirring alignment member for leading to the passage is integrally provided on the rear side in the rotation direction of the outlet. For example, as a stirring alignment member,
A blade member may be used, but may have another shape.

As described above, on the inner peripheral surface of the inner ring member according to the fifth aspect, the agitating alignment member for agitating the internal electronic component chip and leading it to the alignment passage side is provided on the rear side in the rotation direction of the outlet. Since the electronic component chip alignment supply device is provided integrally with the inner ring member, the internal electronic component chip is agitated by the agitating alignment member integrally provided on the inner peripheral surface of the inner ring member on the rear side in the rotation direction of the outlet. It can be efficiently led out to the alignment passage side.

Further, the invention according to claim 7 is based on claim 1.
7. The electronic component chip aligning / supplying device according to any one of claims 1 to 6, wherein the electronic component chip led out to the aligning passage is temporarily provided in front of the entrance to the aligning passage. It is characterized by a configuration in which a sub-room for storing is provided. Here, as the sub-chamber, at the entrance to the alignment passage, an electronic component chip that is flipped off by the stirring alignment member of the rotating member, the projection of the inner ring member, or the like because it is not aligned in a predetermined direction. Any room may be used as long as the room has a predetermined space sufficient for temporarily storing it.

In this way, the electronic component chips led out to the alignment passage are temporarily stored in front of the entrance to the alignment passage according to any one of claims 1 to 6. Since the sub-chamber is provided with an electronic component chip alignment supply device, it is led out to the alignment passage side and at the entrance thereof,
Since the electronic component chips are not aligned in the predetermined direction, the electronic component chips that are flipped off by the stirring alignment member of the rotating member or the protrusion of the inner ring member can be temporarily stored in the sub chamber. In addition, since the electronic component chips can be stored in the sub-chamber, the alignment efficiency is improved.

The invention described in claim 8 is the first invention.
8. The electronic component chip aligning and feeding device according to claim 1, wherein said stirring and aligning member is rotatably driven by a drive source of said transport device. For example, as a drive source of the transport device, a motor that drives the transport belt to rotate may be used, and the stirring and alignment member may be rotated by driving the belt from the motor.

As described above, the stirring and aligning member according to any one of claims 1 to 7 is an electronic component chip aligning and feeding device that is driven to rotate by the drive source of the transfer device. A dedicated drive source is not required for rotation, and the stirring and alignment member can be rotationally driven by the drive source in accordance with the drive of the transfer device. Therefore, the drive control of the stirring and alignment member corresponding to the transport device can be easily performed.

According to a ninth aspect of the present invention, there is provided the electronic component chip aligning / supplying device according to the first aspect, wherein the inlet of the aligning passage for guiding the electronic component chip in the storage chamber to the transport device is provided. , And is provided at a position higher than the outlet of the supply path from the bulk case.

As described above, the introduction port of the alignment passage for guiding the electronic component chips in the storage chamber according to the first aspect to the transfer device is provided at a position higher than the outlet of the supply path from the bulk case. Since it is a component chip alignment supply device, the electronic component chips introduced into the storage chamber from the outlet of the supply path from the bulk case are surely stirred by the stirring alignment member, and then the stirring is performed at the inlet of the alignment passage at a higher position. Can be derived.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component chip aligning and feeding apparatus according to the present invention will be described below with reference to FIGS.

<First Embodiment> First, FIG. 1 is a schematic front view showing an electronic component chip aligning and feeding apparatus as an example to which the present invention is applied, together with a transport apparatus, and FIG. FIG. 3 is a perspective view showing an embodiment of the present invention, in which a main part is cut away, and FIG. 3 is a longitudinal sectional side view showing an internal structure of the alignment part. FIG. 4 is an enlarged view showing the retreating behavior of the stirring and aligning member with respect to the electronic component chip in the first embodiment, and FIG. 5 is a view showing the fall of the electronic component chip at the inlet of the alignment passage by the stirring and aligning member. It is the enlarged view shown. 1 to 5, 1 is an electronic component chip, 2 is a suction nozzle, 3 is a transport device, 4 is a transport belt, 5 and 6 are rotating wheels, 10 is an electronic component chip alignment and supply device, and 11 is an outer frame. , 12 is a bulk case, 13 is a supply path, 14 is an alignment path, 15 is an alignment section, 1
6 is a storage chamber, 17 is a sub-chamber, 21 is a rotating member, 22 is a stirring and aligning member, 23 is a power transmission belt, 24 and 25 are rotating wheels, and 26 is a belt tensioner.

As shown in FIG. 1, the electronic component chip 1
Are suction-held by a suction nozzle 2 of a chip mounter (not shown) and are mounted at predetermined positions on a printed board (not shown), and are, for example, resistors and capacitors. The electronic component chip 1 is transported by the transport device 3 to a pickup position by the suction nozzle 2. In the illustrated example, the transporting device 3 includes an endless transport belt 4 for mounting and transporting the electronic component chips 1 aligned by the electronic component chip aligning and supplying device 10 and a plurality of the transport belts 4 (in the illustrated example, wound). One pair of rotating wheels 5, 6
And a driving source such as a motor (not shown) for outputting a rotational driving force to one of the rotating wheels 5 and 6.

The electronic component chip aligning / supplying device 10 includes a bulk case 12 in which a large number of electronic component chips 1 are accommodated on the upper portion of the outer frame 11, and is inclined downward from the bottom of the bulk case 12 to form the outer frame 11. A supply path 13 extending to an intermediate portion is provided. An alignment passage 14 extending obliquely downward and facing one end of the conveyor belt 4 is formed in a lower portion of the outer frame 11 from a middle portion thereof. Outlet 13a at the bottom of 13
Faces the alignment portion 15 provided in the middle portion of the outer frame 11. In addition, the introduction port 14 a to the alignment passage 14 is connected to the supply passage 1.
3 is provided at a position higher than the outlet 13a.
As shown in FIGS. 2 and 3, the alignment unit 15 forms a storage chamber 16 formed by a circular recess penetrating the outer frame 11,
A sub-chamber 17 continuous with the storage chamber 16 is formed on the front side of the outer frame 11, and these storage chamber 16 and the sub-chamber 17 are connected to the outer frame 1.
1 is closed by a lid 18 from the front side. Here, the sub chamber 17 is formed on the upper side opposite to the alignment passage 14 with the storage chamber 16 interposed therebetween, has the same width as the alignment passage 14 with respect to the storage chamber 16, and has the minimum width of the electronic component chip 1. Communicates with

A rotating member 21 for closing the storage chamber 16 is provided on the back side of the outer frame 11. The rotating member 21 is provided with a plurality of sliding members (in the illustrated example, radially in contact with the inner peripheral surface of the storage chamber 16). A number of stirring alignment members 22 at equal intervals)
Are provided. The rotating member 21 is a disk-shaped member, and is rotatably driven by a power transmission belt 23 driven by rotation taken out of the transfer device 3. That is, the power transmission belt 23 is wound around the rotating wheel 24 provided coaxially with the one rotating wheel 6 of the transfer device 3 and the rotating wheel 25 provided coaxially on the back side of the rotating member 21. A belt tensioner 26 is provided. The power transmission belt 23 causes the rotating member 21 to rotate in the direction of arrow B in FIG. 1, that is, the transport direction of the electronic component chips 1 in the alignment passage 14 (the transport direction of the transport device 3 in FIG. (See the direction of arrow A).

The stirring and aligning member 22 provided on the rotating member 21 rotating in this manner is formed of an elastic member, that is, a spring member in this embodiment, and is arranged in the rotation direction indicated by the arrow B. Curved part 2 with a shape that is delayed
2a, the lid 1 facing the opening toward the sub-chamber 17 side.
8 has an inclined portion 22b that slides on the portion 8. In the electronic component chip alignment and supply device 10 described above, the inlet from the supply path 13 to the storage chamber 16 opens at the lower part of the storage chamber 16 as shown in FIGS. The supply amount of the electronic component chip 1 to be introduced into the device is limited. In addition, the inclination angle of the alignment passage 14 is about 45 ° or more, and in this embodiment, the alignment passage 14 has a rectangular shape as shown in FIGS. The cross-sectional shape and dimensions are set so that the component chip 1 is passed only in a state where the component chip 1 stands upright in the longitudinal direction.

According to the electronic component chip aligning / supplying device 10 having the above-described configuration, the aligning unit 15 includes the transport device 3
When the rotating member 21 rotates via a power transmission belt 23 synchronized with the rotating member 21, the stirring and aligning members 22, 22, 22,... Formed by the spring members provided on the rotating member 21 rotate while sliding on the inner peripheral surface of the storage chamber 16. Therefore, the supply path 1
A large number of electronic component chips 1, 1, 1,.
Is agitated and drawn out to the sub chamber 17. And
From the sub-chamber 17, the aligned electronic component chips 1, ie,
Only the electronic component chips 1 in the state of standing upright in the longitudinal direction are sequentially sent to the transport device 3 through the alignment passage 14.

Here, the stirring alignment member 2 in the storage chamber 16
Electronic component chips 1,1,1,2,2,22,22, ...
When stirring and leading out to the sub chamber 17, the stirring alignment member 2
Reference numeral 2 denotes a curved portion 22a having a shape delayed with respect to the rotation direction (see the direction of the arrow B), so that the electronic component chip 1 to be stirred can be easily sent to the opening side to the sub chamber 17. . Therefore, the lead-out of the electronic component chip 1 from the storage chamber 16 to the sub-chamber 17 is promoted. Also, the stirring alignment member 2
2 is formed by a spring member, for example, as shown in FIG. 4, when the electronic component chip 1 is sandwiched between the lid 18 and the curved portion 22a,
There is no worry that the electronic component chip 1 may be retracted by its elasticity to retreat and break the electronic component chip 1.

At the entrance from the sub-chamber 17 to the alignment passage 14, for example, as shown in FIGS.
When the electronic component chip 1 is standing in a vertically long state, it is elongated in the longitudinal direction by the inclined portion 22b of the tip of the stirring alignment member 22 which rotates in the direction opposite to the feeding direction in the alignment passage 14 (see the direction of arrow B). Electronic component chip 1 standing
Is knocked down toward the sub-chamber 17. Therefore, alignment passage 1
4 can be prevented from being clogged by the electronic component chip 1, and the electronic component chip 1
Are easily aligned, that is, the electronic component chip 1 is placed sideways in the longitudinal direction, and the alignment chip 1
It will be sent through 4.

As described above, the clogging of the electronic component chips 1 at the entrance of the alignment passage 14 can be prevented without using a conventional air source. As a result, the electronic component chips 1 are efficiently aligned and conveyed. It can be supplied to the device 3. In the embodiment, the driving of the rotating member 21 is commonly performed by the driving source of the transport device 3. However, the rotating member 21 is driven by a motor as a dedicated driving source separately from the transport device 3. You may comprise so that it may drive corresponding to the conveyance apparatus 3.

<Second Embodiment> FIG. 6 shows a second embodiment of the alignment section shown in FIG. 1 and is an enlarged front view showing the inside of a main part, and FIG. Fig. 3 shows the inner ring member in a single item state, in which (a) is a perspective view and (b) is a central longitudinal side view. 6 and 7, 11 is an outer frame, 14 is an alignment passage, 16 is a storage room, 17
Is a sub chamber, 31 is an inner ring member (stirring alignment member), 32
Is an inner peripheral surface of a conical shape, and 33 is an outlet groove. Note that portions not shown are the same as those in the first embodiment described above, and thus description thereof will be omitted.

In the second embodiment, a bottomed cylindrical inner ring member 31 serving as a stirring alignment member is rotatably incorporated into the storage chamber 16 defined by the circular recess of the outer frame 11 in the alignment section 15. In. That is, the inner ring member 31 has a frusto-conical inner peripheral surface 32 having a small diameter on the bottom side inner periphery of the cylindrical portion and a large diameter on the open portion side inner periphery. A large number of lead grooves 33, 33, 33,
... is formed. The lead-out groove 33 passes the electronic component chip 1 along its longitudinal direction, and is specifically formed to be uniformly inclined. The above inner ring member 31
Similarly to the first embodiment described above, as shown in the direction of arrow B in FIG. The electronic component chip 1 is rotationally driven in a direction opposite to the transport direction.

According to the electronic component chip aligning / supplying apparatus 10 having the above-described configuration, the transporting device 3
When the inner ring member 31 rotates via the power transmission belt 23 synchronized with the inner ring member 31, a large number of electronic component chips 1, 1, 1,. Guided to the end face side along the peripheral surface 32,
.. Through the outlet grooves 33, 33, 33,.
7 is derived. Then, from the sub-chamber 17, only the electronic component chips 1 in the aligned state erected in the longitudinal direction from the sub-chamber 17 pass through the alignment passage 14 to the transport device 3 as in the first embodiment. It is sent one after another.

Here, at the entrance from the sub-chamber 17 to the alignment passage 14, for example, when the electronic component chip 1 is standing vertically long, it is rotated in the direction opposite to the feeding direction in the alignment passage 14 (arrow). Due to the uneven shape on the outer peripheral surface side of the lead-out grooves 33, 33, 33,... On the end surface of the inner ring member 31 (see the direction B), the vertically long electronic component chip 1 is tilted toward the sub-chamber 17. Go being. Therefore, similarly to the above-described first embodiment, clogging of the entrance of the alignment passage 14 with the electronic component chip 1 can be prevented, and the electronic component chip 1 is easily aligned in the sub chamber 17. In other words, the electronic component chip 1 is fed from the entrance through the alignment passage 14 in a state of standing upright in the longitudinal direction.

As described above, according to the second embodiment, similarly to the above-described first embodiment, the electron at the entrance of the alignment passage 14 can be formed without using a conventional air source. The clogging of the component chips 1 can be prevented, and as a result, the electronic component chips 1 can be efficiently aligned and supplied to the transfer device 3. In the second embodiment, the driving of the inner race member 31 is commonly performed by the drive source of the transfer device 3. However, the inner race member 31 is driven by a motor as a dedicated drive source separately from the transfer device 3. 31 may be configured to be driven corresponding to the transport device 3 as in the first embodiment described above.

<Third Embodiment> FIG. 8 shows a third embodiment of the alignment section in FIG. 1 and is an enlarged front view showing the inside of the main part, and FIG. 8A and 8B show a cross-sectional structure of the inner ring member. FIG. 9A is a cross-sectional view taken along the line AA of FIG. 8, and FIG. FIG. 10 is a perspective view showing the inner race member in a single item state. FIG. 11 is a main part front view showing the fall of the electronic component chip at the entrance of the alignment passage by the inner ring member. 8 to 11, 11 is an outer frame,
14 is an alignment passage, 16 is a storage room, 17 is a sub room, 4
1 is an inner ring member, 42 is a conical inner peripheral surface, 43 is an outlet,
44 is a protrusion, and 45 is a stirring alignment member. Note that portions not shown are the same as those in the first embodiment described above, and thus description thereof will be omitted.

In the third embodiment, the alignment section 15 has the same structure as the second embodiment described above.
A cylindrical inner ring member 41 having a bottom and constituting a stirring alignment member is rotatably incorporated in the storage chamber 16 formed by the circular concave portion of the outer frame 11. That is, similarly to the above-described second embodiment, the inner ring member 41 has a frusto-conical inner shape with a small diameter on the bottom side inner periphery and a large diameter on the open side inner periphery of the cylindrical portion. It has a surface 42, and a pair of diametrically opposed outlets 43, 43 are formed in a notch shape that is diametrically opened and opened to the end face on the large-diameter opening portion side. The outlet 43 is provided, for example, in a range where the central angle is about 50 °. On the open side of the cylindrical portion of the inner ring member 41, projections 44, 44, 44,... In the form of gears are formed except for the pair of outlets 43. The protrusions 44, 44, 44,... Formed by the gear shape also constitute a stirring alignment member together with the inner ring member 41. Further, inside the inner ring member 41, a stirring alignment member 45 made of a plate material is formed at an end on the rotation side rear side with respect to the outlet 43.

According to the electronic component chip aligning / supplying apparatus 10 having the above-described configuration, the aligning section 15 uses the transport device 3
When the inner race member 41 rotates via the power transmission belt 23 synchronized with the inner race member 41, a number of electronic component chips 1, 1, 1,. The agitation alignment members 45, 4 are guided to the end surface side along the peripheral surface 42, and formed by plate members formed at the rear end in the rotation direction with respect to the outlets 43, 43 of the end surface.
5 through the outlets 43, 43 and the sub-chamber 1
7 is derived. Then, from the sub-chamber 17, only the electronic component chips 1 in the aligned state erected in the longitudinal direction from the sub-chamber 17 pass through the alignment passage 14 to the transport device 3 as in the first embodiment. It is sent one after another.

Here, for example, when the electronic component chip 1 stands vertically long at the entrance from the sub-chamber 17 to the alignment passage 14, as shown in FIG. 8 and FIG.
The gear-shaped projections 44, 44, 44,... On the outer peripheral surface of the cylindrical portion of the inner ring member 41 which rotate in the direction opposite to the feed direction in the alignment passage 14 (see the direction of arrow B) stand in a vertically long state. The electronic component chip 1 is moved down to the sub-chamber 17. Therefore, similarly to the first embodiment, the electronic component chip 1 at the entrance of the alignment passage 14 is provided.
Can be prevented, and in the sub-chamber 17,
The electronic component chips 1 are likely to be aligned, that is, the electronic component chips 1 are sent from the entrance portion through the alignment passages 14 in a state of standing upright in the longitudinal direction.

As described above, according to the third embodiment, similarly to the above-described first embodiment, the electron at the entrance of the alignment passage 14 can be formed without using a conventional air source. The clogging of the component chips 1 can be prevented, and as a result, the electronic component chips 1 can be efficiently aligned and supplied to the transfer device 3. In the third embodiment, the driving of the inner race member 41 is commonly performed by the drive source of the transport device 3. However, the inner race member 41 is driven separately from the transport device 3 by a motor as a dedicated drive source. 41 may be configured to be driven corresponding to the transport device 3 as in the first embodiment described above.

<Fourth Embodiment> FIG. 12 shows a fourth embodiment of the alignment section shown in FIG. 1 and is an enlarged front view showing the inside of a main part. In FIG. 12, 11 is an outer frame, 14 is an alignment passage, 16 is a storage room, 17
Is a sub-chamber, 51 is an inner ring member, 52 is a conical inner peripheral surface, 53 is an outlet, 54 is a projection, and 55 is a stirring alignment member. Note that portions not shown are the same as those in the first embodiment described above, and thus description thereof will be omitted.

In the fourth embodiment, the aligning section 15 has the same structure as the third embodiment described above.
A cylindrical inner ring member 51 having a bottom and constituting a stirring and aligning member is rotatably incorporated in the storage chamber 16 formed by the circular concave portion of the outer frame 11, and the inner ring member 51 is the third embodiment described above. It is almost the same as the one. That is, the inner ring member 51 has a frusto-conical conical inner periphery in which the bottom inner periphery of the cylindrical portion has a smaller diameter and the inner periphery of the open portion has a larger diameter, in substantially the same manner as in the third embodiment described above. A surface 52 is provided on the large-diameter side opening portion side in three pairs diametrically opposed to each other.
Are formed in a notched shape that penetrates in the diameter direction and that is open to the end face. On the open side of the cylindrical portion of the inner ring member 51, the six outlets 5 are provided.
Except for the portions 3, 53, 53,..., The protrusions 54, 54, 54,. The protrusions 54, 54, 54,... Formed by this gear shape together with the inner ring member 51 constitute a stirring alignment member. Further, inside the inner ring member 51, a stirring alignment member 55 made of a plate material is formed at an end on the rear side in the rotation direction with respect to the outlet 53.

According to the electronic component chip aligning / supplying device 10 having the above configuration, the transporting device 3
When the inner ring member 51 rotates via the power transmission belt 23 synchronized with the inner ring member 51, a large number of electronic component chips 1, 1, 1,. Are guided to the end face side along the peripheral surface 52, and the agitation alignment members 55, 55, 55, made of a plate material formed at the rear end in the rotation direction with respect to the outlets 53, 53, 53,. , And are successively led out to the sub-chamber 17 through the six outlets 53, 53, 53,. Then, from the sub-chamber 17, only the electronic component chips 1 in the aligned state erected in the longitudinal direction from the sub-chamber 17 pass through the alignment passage 14 to the transport device 3 as in the first embodiment. It is sent one after another.

Here, when the electronic component chip 1 stands in a vertically long state at the entrance from the sub-chamber 17 to the alignment passage 14, for example, as in the third embodiment described above, the electronic component chip 1 is aligned. The gear-shaped projections 54, 54, 54,... On the outer peripheral surface of the cylindrical portion of the inner ring member 51 that rotate in the direction opposite to the feed direction in the passage 14 (see the direction of arrow B) stand in a vertically long state. The electronic component chip 1 is lowered toward the sub-chamber 17. Therefore, similarly to the above-described first embodiment, clogging of the entrance of the alignment passage 14 with the electronic component chip 1 can be prevented, and the electronic component chip 1 is easily aligned in the sub chamber 17. That is,
Electronic component chip 1 in a state of standing upright in the longitudinal direction
From the inlet through the alignment passage 14.

As described above, according to the fourth embodiment, similarly to the above-described first embodiment, the electron at the entrance of the alignment passage 14 can be obtained without using a conventional air source. The clogging of the component chips 1 can be prevented, and as a result, the electronic component chips 1 can be efficiently aligned and supplied to the transfer device 3. In the fourth embodiment as well, the inner ring member 51 is commonly driven by the drive source of the transfer device 3. However, the inner ring member 51 is driven separately from the transfer device 3 by a motor as a dedicated drive source. 51 may be configured to be driven corresponding to the transport device 3 in the same manner as in the first embodiment described above.

In each of the above embodiments,
As a state of alignment of the electronic component chips in a predetermined direction, a rectangular electronic component chip was set upright in the longitudinal direction, but the present invention is not limited to this, and the electronic component chip was laid down sideways. It is good also as a state. In addition, it goes without saying that specific detailed structures and the like can be appropriately changed.

[0050]

As described above, according to the electronic component chip aligning and feeding device according to the first aspect of the present invention, when the electronic component chips in the storage chamber are agitated by the agitating and aligning member and guided to the alignment passage side. At the inlet of the alignment passage, the electronic component chips to be led out can be aligned in a predetermined direction for passing through the alignment passage. Therefore, clogging of the electronic component chips in front of the alignment passage can be prevented without using an air source as in the related art, so that the electronic component chips can be efficiently aligned and supplied.

According to the electronic component chip aligning / supplying device according to the second aspect of the present invention, since it is a stirring and aligning member made of an elastic member which can be elastically deformed, in addition to the effects obtained by the first aspect of the present invention, In addition, there is an advantage that there is no fear of damaging the electronic component chip by the stirring and alignment member.

Further, according to the electronic component chip aligning and feeding device according to the third aspect of the present invention, the lead-out provided on the end face of the electronic component chip aligning and feeding device is rotated by the inner ring member in the direction opposite to the conveying direction from the aligning passage to the conveying device. When the internal electronic component chip is led out to the alignment path side by the groove, the electronic component chip to be led can be aligned in a predetermined direction for passing through the alignment path. Therefore, clogging of the electronic component chips in front of the alignment passage can be prevented without using an air source as in the related art, so that the electronic component chips can be efficiently aligned and supplied.

According to the electronic component chip aligning and feeding device according to the fourth aspect of the present invention, since the end surface side having the lead-out groove is an inner ring member having a frustoconical inner peripheral surface having a large diameter, In addition to the effects obtained by the invention according to claim 3, the internal electronic component chip is guided to the end face side by its own weight and centrifugal force due to rotation along the frusto-conical shape of the inner peripheral surface, and is efficiently led out from the outlet groove. The advantage is that it can be done.

According to the electronic component chip aligning and feeding device according to the fifth aspect of the present invention, the cylindrical outer peripheral portion is rotated by the inner ring member in a direction opposite to the conveying direction from the aligning passage to the conveying device. When the internal electronic component chip is led out to the alignment passage side from the lead-out port, the electronic component chip is knocked down by the protrusion integrally provided on the outer peripheral surface of the inner ring member at the entrance to the alignment passage, The electronic component chips can be aligned in a predetermined direction for passing through the alignment passage. Therefore, clogging of the electronic component chips in front of the alignment passage can be prevented without using an air source as in the related art, so that the electronic component chips can be efficiently aligned and supplied.

According to the electronic component chip aligning / supplying device according to the sixth aspect of the present invention, the agitating and aligning member for agitating the internal electronic component chip to be led out to the alignment passage is provided in the rotation direction of the outlet. Because the inner ring member is provided integrally on the rear side, in addition to the effects obtained by the invention according to claim 5, the agitation alignment member provided integrally on the inner peripheral surface on the rear side in the rotation direction of the outlet port, The advantage is obtained that the internal electronic component chips can be agitated and efficiently guided to the alignment passage side.

Further, according to the electronic component chip aligning / supplying device according to the seventh aspect of the present invention, the sub chamber for temporarily storing the electronic component chips led out to the alignment passage side is provided.
Since it is provided on the near side of the entrance to the alignment passage, in addition to the effect obtained by the invention according to any one of claims 1 to 6, it is led out to the alignment passage side and at the entrance,
Since they are not aligned in the predetermined direction, electronic component chips that are flipped off by the stirring alignment member of the rotating member or the projection of the inner ring member can be temporarily stored in the sub chamber, and By storing the electronic component chips in the sub-chamber, there is an advantage that the efficiency of alignment can be increased.

According to the electronic component chip aligning / supplying device according to the eighth aspect of the present invention, the rotating member or the inner ring member is rotationally driven by the driving source of the transport device. In addition to the effects obtained by the invention according to any one of the above, a dedicated driving source is not required for rotating the rotating member or the inner ring member, and the rotating member or the inner ring member is rotated by the driving source corresponding to the driving of the transport device. Therefore, there is an advantage that the driving control of the rotating member or the inner ring member corresponding to the transfer device can be easily performed.

According to the electronic component chip aligning and feeding device according to the ninth aspect of the present invention, the inlet of the aligning passage for guiding the electronic component chips inside the storage chamber to the transfer device is the outlet of the supply passage from the bulk case. Since it is provided at a higher position, in addition to the effect obtained by the invention of claim 1, the electronic component chips introduced into the storage chamber from the outlet of the supply path from the bulk case are reliably stirred by the stirring alignment member. Then, there is obtained an advantage that it can be led out to the inlet of the alignment passage at a higher position.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing an electronic component chip aligning and feeding device as an example to which the present invention is applied, together with a transport device.

FIG. 2 is a perspective view showing a first embodiment of the alignment section of FIG. 1, with a main part cut away.

FIG. 3 is a vertical sectional side view showing an internal structure of an alignment unit according to the first embodiment.

FIG. 4 is an enlarged view showing a retreating behavior of the electronic component chip by the stirring and aligning member according to the first embodiment.

FIG. 5 is an enlarged view showing a fall of an electronic component chip at an alignment passage entrance portion by a stirring alignment member according to the first embodiment.

FIG. 6 is a front view showing a second embodiment of the alignment section in FIG. 1 and showing the inside of a main part in an enlarged manner.

FIG. 7 shows the inner ring member of FIG. 6 in a single item state,
(A) is a perspective view, (b) is a central longitudinal side view.

FIG. 8 is a front view showing a third embodiment of the alignment section in FIG. 1 and showing the inside of a main part in an enlarged manner.

9 shows a cross-sectional structure of the inner race member of FIG. 8,
FIG. 9A is a cross-sectional view taken along the line AA of FIG. 8, and FIG. 9B is a cross-sectional view taken along the line BB of FIG.

FIG. 10 is a perspective view showing the inner race member of FIG. 8 in a single item state.

FIG. 11 is a main part front view showing a fall of an electronic component chip at an alignment passage entrance portion by an inner ring member in a third embodiment.

FIG. 12 is a front view showing a fourth embodiment of the alignment section in FIG. 1, showing the inside of a main part in an enlarged manner.

DESCRIPTION OF REFERENCE NUMERALS 1 electronic component chip 2 suction nozzle 3 transport device 4 transport belt 10 electronic component chip alignment and supply device 11 outer frame 12 bulk case 13 supply path 14 alignment passage 15 alignment unit 16 storage chamber 17 sub chamber 21 rotating member 22 Stirring alignment member (elastic member) 23 Power transmission belt 31 Inner ring member 32 Conical inner peripheral surface 33 Outlet groove 41 Inner ring member 42 Conical inner peripheral surface 43 Outlet port 44 Protrusion 45 Stirring alignment member 51 Inner ring member 52 Conical inner periphery Surface 53 Outlet 54 Projection 55 Stirring alignment member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuji Toshige 8-2-1 Kokuryo-cho, Chofu-shi, Tokyo Inside Juke Corporation (72) Inventor Hironobu Sato 1601 Sakai, Atsugi-shi, Kanagawa Prefecture Atsugi Mitsumi Electric Co., Ltd. In-house (72) Inventor Makoto Kitazume 1601 Sakai, Atsugi-shi, Kanagawa Pref.

Claims (9)

[Claims] 1. An electronic component chip alignment and supply device comprising: a supply path through which electronic component chips are supplied from a bulk case; and an alignment path that guides the electronic component chips in an aligned state from the supply path to a transport device. The electronic component chip has an outlet for the supply path and an inlet for the alignment path inside, and introduces the electronic component chip from the supply path to the inside, and leads the electronic component chip to the alignment path side. An electronic component chip alignment and supply device, comprising: a storage chamber containing a stirring alignment member that agitates and aligns the electronic component chips in a predetermined direction. 2. The agitation and alignment member is formed of an elastic member capable of elastic deformation.
An electronic component chip aligning and feeding device according to claim 1. 3. The agitating and aligning member is formed by an inner ring member having an outlet groove on an end face for introducing the electronic component chip into the inside from the supply path and then leading out the electronic component chip toward the alignment path. The electronic component chip alignment and supply device according to claim 1, wherein: 4. An electronic component chip alignment supply according to claim 3, wherein an inner peripheral surface of said inner race member is formed in a truncated conical shape having a large diameter at said end surface side having said lead-out groove. apparatus. 5. An inner ring member having a lead-out port on a cylindrical end surface for introducing the electronic component chip into the inside from the supply path and then leading the chip to the alignment path side. The electronic component chips are integrally provided on the outer peripheral surface of the inner ring member, and at the entrance to the alignment passage, the electronic component chips are aligned in a predetermined direction, and only the electronic component chips in the aligned state are passed through the alignment passage. 2. The electronic component chip alignment and supply device according to claim 1, further comprising: a protrusion for causing the electronic component chip to be aligned. 6. An agitating alignment member for agitating the internal electronic component chip and leading it to the alignment passage side on an inner peripheral surface of the inner race member is integrally formed on a rear side in the rotation direction of the outlet. 6. The electronic component chip aligning and feeding device according to claim 5, wherein the electronic component chip aligning and feeding device is provided. 7. A sub-chamber for temporarily storing the electronic component chips led out to the alignment passage side is provided on the front side of the entrance to the alignment passage. 7. The electronic component chip alignment and supply device according to claim 1, wherein: 8. The electronic component chip aligning and feeding device according to claim 1, wherein the stirring and aligning member is rotationally driven by a driving source of the transfer device. 9. An introduction port of the alignment passage for guiding an electronic component chip in the storage chamber to the transport device is provided at a position higher than an outlet of the supply passage from the bulk case. The electronic component chip alignment and supply device according to claim 1.