JPH10258512A - Manufacture of liquid jet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve yield for products by a method wherein element substrates each having discharge energy generating elements are directly arranged on a base plate and the element substrates in plural numbers are arranged quickly and precisely with correction for improper positioning or the like of the element substrates made executable on the base plate. SOLUTION: An element substrate 1 having lined discharge energy generating elements 1a is carried by a collet finger 14 to a position above a base plate 2 and placed directly on the upside of the base plate, and positioning in the direction of X-axis is made with the front laterals of the element substrate 1 butted against a reference plane 10a of a butting reference plate 10 while positioning in the direction of Y-axis is made with the element substrate 1 moved to a specified position in the direction of Y-axis, being placed between both sides in the direction of X-axis and pressed at its lateral face with a lateral pressing body 12, and with its position determined by a position detecting means 13. Then, the element substrates 1 in plural number are arranged successively on the surface of the base plate 2 and stuck to the base plate for fixation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid jet recording head used in a liquid jet recording apparatus or the like.
In particular, the present invention relates to a method for manufacturing a liquid jet recording head in which a plurality of element substrates on which a plurality of ejection energy generating elements are formed are arranged on a base plate.

[0002]

2. Description of the Related Art A liquid jet recording head used in a liquid jet recording apparatus or the like includes an element substrate (heater board) in which a plurality of ejection energy generating elements (for example, electrothermal conversion elements) are formed at predetermined intervals. A top plate formed with a plurality of discharge ports for discharging liquid such as ink and a plurality of flow grooves communicating with each of the discharge ports, and the discharge energy generating element and the discharge ports and the flow grooves are accurately positioned. The element substrate and the top plate are combined and joined in the aligned state, and the ejection energy is applied to the liquid in the flow channel by the ejection energy generating element, whereby the liquid is ejected from the ejection port as droplets to perform print recording. It is configured as follows. An ejection energy generating element (for example, an electrothermal conversion element) is formed on the element substrate (heater board) with a predetermined high precision by using an ultra-precision etching technique. By using precision processing means, the discharge port plate provided on the front surface of the top plate is processed and formed with predetermined high precision.

In a liquid jet recording head, it is desired to use a multi-nozzle with a longer length in order to improve a printing speed of a recording apparatus.
It tends to be longer like 8 nozzles.
A long liquid jet recording head as shown in FIG. 5 is used.

[0004] This kind of long liquid jet recording head uses an element substrate 40 on which a plurality of ejection energy generating elements 41 are formed by an ultra-precision etching technique as described above, and a base plate made of a material such as metal or ceramic. A plurality of ejection orifices 49 for ejecting ink and a plurality of ink flow channels (not shown) communicating with each of the ejection orifices 49 are formed on the (base) 42 by accurately positioning and arranging a plurality of them on the base. It is manufactured by joining a long top plate 48 having the same. Note that a wiring board 44 is adhered and adhered to the base plate 42 in the same manner as the element substrate 40, and the signal / power supply pads 45 on the wiring board 44 have a predetermined positional relationship with the power pads 43 on the element substrate 40. The pads 43 and 45 are connected to each other, and the wiring board 44 is provided with a connector 46 for supplying an external printing signal and driving power.

In the method of manufacturing such a long liquid jet recording head, one of the steps requires a step of arranging a plurality of element substrates on a base plate.
For example, it is performed by a method shown in FIG.
In an assembling apparatus or the like, a base plate positioning pin 33 and a clamping means 34 are provided on the reference base 31, and the base plate 32 is provided with these positioning pins 33.
And a predetermined number of element substrates 30 are temporarily positioned on the temporary mounting table 35 by suction or temporary positioning pins or the like. In order to transport the element substrate 30 from the temporary placing table 35 to the base plate 32, a finger 36 having a clamp mechanism on a high-precision stage is provided movably on the reference table 31. The finger 36 directly abuts the suction surface thereof on the surface of the element substrate 30 placed on the temporary placing table 35 to hold the element substrate 30 by suction, and moves the element substrate 30 by moving the high precision stage. From the base plate 32 to a predetermined position. At the time of the transfer, the clamp position of the element substrate 30 is read in a non-contact manner using the image processing device 37 or the like, and is moved to a prescribed position from the base plate reference to correct the amount of displacement of the clamp position of the element substrate 30. The element substrates 30 are placed and arranged at the bonding positions on the upper surface of the base plate 32. By repeating such operations sequentially, a predetermined number of element substrates 30 are arranged, and a predetermined number of element substrates 30 are bonded and fixed at predetermined positions on the base plate 32.

[0006]

However, in the above-mentioned prior art, a finger for sucking and holding the upper surface of the element substrate is used for transporting and bonding the element substrate, and the suction surface of the finger is used. Is directly in contact with the upper surface of the element substrate, and the upper surface of the element substrate is damaged due to burrs on the suction surface or bites of dust, and the wiring pattern of the element substrate is damaged. The head causes a defect such as ink ejection failure, and the position and state of the element substrate are positioned with high precision in the finger clamp state, but the parallelism and the planar state of the surface of the base plate on which the element substrate is arranged are poor In such a case, when the element substrate comes into contact with the upper surface of the base plate, a displacement of the element substrate occurs,
There was a variation in the alignment accuracy, and a defect such as a parallel position shift and a tilt shift in the arrangement direction of the ejection energy generating elements and the ink ejection direction occurred.

In view of the above, the present invention has been made in view of the above-mentioned unsolved problems of the prior art, and has an element substrate having an ejection energy generating element directly arranged on a base plate, and the element substrate having the element on the base plate. It is an object of the present invention to provide a method of manufacturing a liquid jet recording head which can correct a positional deviation or the like and can quickly and accurately arrange a plurality of element substrates.

[0008]

In order to achieve the above object, a method of manufacturing a liquid jet recording head according to the present invention is directed to a method for manufacturing a liquid jet recording head, comprising the steps of: Arranged on the base plate in the direction of the ejection energy generating element rows, a combination of a long top plate having a plurality of liquid flow paths respectively connected to the discharge port row and the discharge port row on the base plate, the discharge port row and the In a method for manufacturing a liquid jet recording head in which a discharge energy generating element row is aligned and formed by joining, the element substrate having the discharge energy generating element row is supplied and arranged on the base plate. The device is directly placed, and the front side surface of the element substrate is pressed against the reference surface of the reference plate disposed opposite to the base plate. In this state, the element substrate is moved to a predetermined position in the direction of the row of ejection energy generating elements by pressing the lateral side of the element substrate and positioned, and then the element substrate is bonded and fixed to the base plate. It is characterized by doing.

In the method of manufacturing a liquid jet recording head according to the present invention, a pyramid-shaped suction finger which can be conveyed without contacting the pattern surface of the element substrate is used as a means for conveying and supplying the element substrate. Preferably, further, at the time of positioning in the discharge energy generating element column direction, the position of the element substrate is measured in a non-contact manner while moving the element substrate in the discharge energy generating element column direction, and the element substrate is positioned at a predetermined position. When reaching, it is preferable to stop the movement of the element substrate and fix the position,
Further, it is preferable to move the element substrate while applying vibration to the base plate when the element substrate is moved in the direction of the ejection energy generating element row.

In the method of manufacturing a liquid jet recording head according to the present invention, in order to fix the element substrate to the base plate, an adhesive is applied to the base plate before supplying the element substrate to the base plate. Alternatively, an adhesive may be applied around the element substrate after the positioning of the element substrate, or an adhesive may be applied to the back surface of the element substrate immediately before placing the element substrate on the base plate. Can be.

[0011]

According to the present invention, a plurality of element substrates each having an ejection energy generating element array for ejecting liquid from an ejection port are arranged on a base plate in the direction of the ejection energy generating element array. In a method for manufacturing a liquid jet recording head in which a long top plate having a plurality of liquid flow paths respectively connected to a discharge port array is combined and formed, when an element substrate having a discharge energy generating element row is supplied and arranged on a base plate, Then, the element substrate is directly placed on the upper surface of the base plate, and the front side of the element substrate is pressed against the reference surface of the abutting reference plate disposed opposite to the base plate to perform positioning in the ink ejection direction. It is moved to a predetermined position in the direction of the row of ejection energy generating elements by pressing the side and positioned. The board is arranged by bonding and fixing it to the base plate. Positioning for correction can be performed while checking the position of the element substrate on the upper surface of the base plate. The displacement of the element substrate and the variation in the arrangement accuracy caused by the influence are prevented. Also, by using the abutting reference plate for positioning in the ink discharge direction, the positioning operation of the element substrate can be performed quickly, and the positioning in the discharge energy generating element row direction is performed in a vibrating state. The position accuracy of the element substrate can be improved, and the alignment tact can be shortened.

Further, as a means for transporting and supplying the element substrate to the upper surface of the base plate, a pyramidal suction finger which can be suction-held and transported without contacting the pattern surface of the element substrate can be used. The product yield can be improved without damaging the wiring pattern.

The supply of the adhesive for bonding the element substrate to the base plate can be performed in various modes.

[0014]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view for explaining an embodiment of the present invention. FIG. 1A schematically shows a state in which element substrates are arranged on a base plate which is positioned and clamped on a reference stand of an assembling apparatus. It is a perspective view shown in FIG.
FIG. 4 is a side view schematically showing a part of the collet finger in a cutaway manner.

The base plate 2 is positioned and clamped on a reference base 16 of an assembling apparatus by a positioning clamp means (not shown) or the like, and adhesive coating grooves 4, 4.
Are provided, and the adhesive 3 is applied to these adhesive application grooves 4, 4,.... The reference board 16 has the X
An abutment reference plate 10 in the X-axis direction that regulates the position in the axial direction (ink ejection direction) is arranged via the jig mounting base 10b so as to face the positioning-clamped base plate 2, and the abutment reference plate 10 Reference plane 1
0 a contacts the front side surface of the element substrate 1 to position the element substrate 1. A striking body 11, which is provided to extend and contract in the X-axis direction for striking and pressing the element substrate 1 against the reference surface 10 a of the striking reference plate 10, is provided to face the striking reference plate 10. In order to press and move the element substrate 1 in the Y-axis direction (discharge energy generating element row direction), there is provided a Y-axis direction lateral pressing body 12 which abuts and moves on the lateral side surface of the element substrate 1. Above the reference table 16, there is provided a position detecting means 13 such as an image processing method for detecting the position of the element substrate 1 (for example, the position of a reference pattern preset on the element substrate 1). . Further, as means for transporting and supplying the element substrate 1 to the upper surface of the base plate 2, there is provided a pyramid-shaped collet 15 which can abut on the periphery of the element substrate 1 and suck and hold the element substrate 1 without damaging the surface of the element substrate 1. The collet finger 14 sucks and holds the element substrate 1 preliminarily positioned on a temporary placing table (not shown) and transports the element substrate 1 to a predetermined position on the base plate 2.

Next, an example of a procedure for arranging the element substrates by the apparatus having the above-described configuration will be described. The base plate 2 is positioned and clamped on the reference table 16 of the assembling apparatus by a positioning clamp means (not shown). .
Adhesive application grooves 4, 4 provided in base plate 2
.. Are coated with the adhesive 3 in advance. On the other hand, the element substrates 1 arranged on the base plate 2 are provisionally positioned in advance on a temporary placing table (not shown).
Is sucked onto the suction surface of the pyramid-shaped collet 15 of the collet finger 14 and conveyed, and is temporarily placed and pressed near a predetermined position on the upper surface of the base plate 2. Thereafter, the collet finger 14 releases the suction action and retracts above the temporary placing table in preparation for the next transport of the element substrate. Then, the abutment body 11 is operated to abut the element substrate 1 temporarily placed on the base plate 2 against the reference plate 10 side and press the element substrate 1 against the reference plate 10 side. Press to position. Subsequently, the lateral pressing body 12 is operated. The lateral pressing body 12 is formed by the reference surface 10a of the abutting reference plate 10 and the abutting body 11
As a result, the element substrate 1 is brought into contact with the lateral side surface of the element substrate 1 sandwiched from both sides in the X-axis direction, and the element substrate 1 is moved in the Y-axis direction. At this time, the position of the preset reference pattern of the element substrate 1 is read by the image processing method by the position detecting means 13 based on the image processing method or the like disposed above, and the reference pattern reaches a predetermined position. Sometimes
The pressing of the lateral pressing body 12 is stopped to stop the movement of the element substrate 1 in the Y-axis direction, and the element substrate 1 is positioned. In addition,
When the element substrate 1 is moved in the Y-axis direction by the lateral pressing body 12, vibration is applied to the base plate 2 using a vibration generator such as a piezoelectric element, so that the movement in the Y-axis direction is controlled with a light pressing force. Thus, the element substrate can be positioned with stable movement accuracy. According to such a procedure, the plurality of element substrates 1 can be sequentially and accurately arranged on the upper surface of the base plate 2.

The adhesive 3 is cured by irradiating ultraviolet light from above the element substrate 1, and the plurality of element substrates 1 are bonded and fixed on the base plate 2.

After the plurality of element substrates 1 are fixed on the base plate 2 as shown in FIG. 5, a discharge port array and a plurality of liquid flow paths respectively communicating with the discharge port rows are formed on the base plate 2 as shown in FIG. Is assembled, and the ejection port array of the top plate and the ejection energy generating element row of the element substrate are aligned and joined to form a liquid jet recording head.

As described above, the element substrate 1 is temporarily placed directly on the upper surface of the base plate 2 and the surface of the base plate 2 is arranged in a plane state, and the element substrate 1 is moved in the X-axis direction (ink ejection direction) and the Y-axis direction ( By moving the element substrate 1 in a non-contact manner, positioning the element substrate 1 in a non-contact manner, and bonding and fixing the element substrate 1 in the discharge energy generating element column direction, high-precision alignment positioning can be achieved. In addition, it is possible to perform correction while directly confirming the position of the element substrate 1 in the posture state of the upper surface of the base plate 2, and to eliminate the positional deviation caused when the element substrate 1 is mounted on the upper surface of the base plate 2. This improves the positional accuracy, ensures the stability of production, and further improves the yield.

Conventionally, as shown in FIG. 4, the alignment of the element substrate is performed at the time of sucking and transporting the element substrate by the finger. However, in the present invention, the collet finger for sucking and transporting the element substrate is moved by the finger. Only the function is used, and the function of positioning the element substrate is performed on the surface of the base plate.As a member for sucking and transporting the element substrate, the element substrate is sucked and held without contacting the periphery of the element substrate and damaging the surface of the element substrate. A pyramidal collet that can be used can be employed.

Next, a modification of the method of manufacturing a liquid jet recording head according to the present invention for applying an adhesive will be described with reference to FIG. In the above-described embodiment, the adhesive 3 is applied to the base plate 2 before arranging the element substrates 1 on the base plate 2. However, the adhesive is applied after the element substrate 1 is positioned on the base plate 2. You can also

In FIG. 2, an application groove 4a for forming a portion to which the adhesive 3 is applied according to the shape of the element substrate 1 and an adhesive introduction part 4b communicating with the application groove 4a are previously provided on the upper surface of the base plate 2. In advance, after positioning the element substrate 1 in the same manner as in the above-described embodiment, the adhesive introduction unit 4 positioned at the rear end of the element substrate 1 using the adhesive application unit 5.
By supplying the adhesive 3 to b, the adhesive 3 flows along the application groove 4a and adheres the element substrate 1. After that, the adhesive 3 is cured by irradiation with ultraviolet light, and the element substrate 1 is bonded and fixed.

Another modified example of the application of the adhesive in the method of manufacturing a liquid jet recording head according to the present invention will be described with reference to FIG. In each of the above-described embodiments, the adhesive 3 is applied to the base plate 2 side. However, in this example, the adhesive 3 is applied to the back surface of the element substrate 1 and pressed against the surface of the base plate 2. The positioning in the axial direction and the Y-axis direction is performed, and the sticking is performed.

In FIG. 3, an adhesive applying means 5a for applying an adhesive is provided in the course of transporting the element substrate 1 from the temporary placing table to the base plate 2 by the collet fingers.
Is provided. Element substrate 1 sucked and held by collet fingers and transferred to the upper surface of base plate 2
The adhesive 3 is applied to the rear surface of the element substrate 1 at a plurality of locations (four locations in FIG. 3) by the adhesive application means 5a. Then, the element substrate 1 is pressed near the positioning position on the upper surface of the base plate 2, and in that state, the array positioning in the X-axis direction and the Y-axis direction is performed in the same manner as in the above-described embodiment. Is fixed by curing.

It is preferable to use a silicone-based adhesive having a small curing shrinkage as an adhesive to prevent the positional accuracy of the element substrate 1 from being shifted during curing.

As described above, in the present invention, the element substrate is temporarily placed directly on the upper surface of the base plate, and the element substrate is moved in the X-axis direction and the Y-axis direction according to the planar state of the surface of the base plate. The position of the element substrate is measured in a non-contact manner, and when the position reaches a predetermined position, the movement is stopped, positioned, and fixed by bonding, so that high-precision alignment positioning can be achieved. In addition, it is possible to perform correction while directly confirming the position of the element substrate in the posture state of the upper surface of the base plate, thereby improving position accuracy and securing production stability, and further, as a member for sucking and conveying the element substrate, It is possible to use a pyramid-shaped collet finger that can hold the element substrate by suction without being damaged by contacting the periphery of the element substrate, and the surface of the element substrate is not scratched at all, thereby reducing the yield. Improvement can be achieved.

It should be noted that the present invention has an excellent effect particularly in a so-called ink jet recording type recording head and recording apparatus in which a flying droplet is formed by utilizing thermal energy in a liquid jet recording type and recording is performed. To bring.

The typical configuration and principle are described in, for example, US Pat. Nos. 4,723,129 and 4,740.
No. 796, and the present invention is preferably performed using these basic principles. This recording method can be applied to both on-demand type and continuous type.

A brief description of this recording method is as follows. A driving circuit discharges a sheet holding a recording liquid (ink) or an electrothermal transducer which is a discharge energy generating element arranged corresponding to a liquid flow path. Supplying a signal, that is, the recording liquid (ink) exceeds the nucleate boiling phenomenon in accordance with the recording information,
By applying at least one drive signal to provide a rapid temperature rise that causes a film boiling phenomenon,
Thermal energy is generated, causing film boiling on the heat-acting surface of the recording head. As described above, since bubbles corresponding to the drive signal applied to the electrothermal converter from the recording liquid (ink) can be formed one-to-one, it is particularly effective for an on-demand type recording method. The recording liquid (ink) is ejected through an ejection port by the growth and contraction of the bubble to form at least one droplet. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are immediately and appropriately performed, and therefore, the ejection of the recording liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable. As the pulse-shaped drive signal, US Pat.
Those described in 463359 and 4345262 are suitable. In addition, U.S. Pat.
By employing the conditions described in the specification of Japanese Patent No. 124, even better recording can be performed.

As the configuration of the recording head, a configuration combining a discharge port, a liquid flow path, and an electrothermal converter as disclosed in each of the above-mentioned specifications (linear liquid flow path or right-angled liquid flow path)
In addition, the present invention is also effective in a device having a configuration in which a heat acting portion is arranged in a bent region as disclosed in US Pat. No. 4,558,333 and US Pat. No. 4,459,600. .

In addition, JP-A-59-123670 discloses a configuration in which a common slit is used as a discharge port of an electrothermal converter for a plurality of electrothermal converters, or absorbs pressure waves of thermal energy. The present invention is also effective in a device having a configuration based on JP-A-59-138461, which discloses a configuration in which an opening corresponds to a discharge portion.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of a recording medium on which a recording apparatus can record. The full line head may be a full line configuration by combining a plurality of recording heads as disclosed in the above specification, or may be a single full line recording head formed integrally.

In addition, the print head is replaceable with a print head of a replaceable chip type, which can be electrically connected to the main body of the apparatus or supplied with ink from the main body of the apparatus, or is integrated with the print head itself. The present invention is also effective when a cartridge-type recording head provided in a fixed manner is used.

It is preferable to add recovery means for the recording head and auxiliary auxiliary means because the recording apparatus can be further stabilized. To be more specific, capping means, cleaning means, pressurizing or suction means, preheating means using an electrothermal transducer or another heating element, or a combination thereof, for recording head, recording It is also effective to add a preliminary ejection mode means for performing another ejection to perform stable printing.

Further, the recording mode of the recording apparatus is not limited to a mode for recording only a mainstream color such as black, but may be a mode in which the recording head is integrally formed or a combination of a plurality of recording heads. However, the present invention is extremely effective for an apparatus provided with at least one of multiple colors of different colors or full color by mixing colors.

In the above description, the ink is described as a liquid. However, an ink which solidifies at room temperature or lower and which becomes soft or liquid at room temperature, or which is generally used in ink jet printing. It may be softened or liquid in a temperature range of 30 ° C. or more and 70 ° C. or less, which is a temperature range for temperature adjustment. That is,
It is sufficient that the ink is in a liquid state when the use recording signal is applied. In addition, the temperature rise due to thermal energy can be positively prevented by using it as energy for changing the state of the ink from a solid state to a liquid state, or the ink that solidifies in a standing state to prevent evaporation of the ink can be used. In any case, thermal energy such as one in which ink is liquefied and ejected as an ink liquid by application in accordance with a recording signal of thermal energy, or one which already starts to solidify when reaching a recording medium, etc. It is also possible to use an ink that liquefies for the first time. In such a case, as described in JP-A-54-56847 or JP-A-60-71260, the ink is held in a liquid state or a solid state in the concave portion or through hole of the porous sheet. It is good also as a form which opposes an electrothermal transducer. The most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, the form of the ink jet recording apparatus includes a form used for an image output terminal of an information processing apparatus such as a computer, a copying apparatus combined with a reader or the like, and a form of a facsimile apparatus having a transmission / reception function. It may be taken.

[0039]

As described above, according to the present invention,
The following effects can be obtained.

(1) In the prior art, the positional displacement of the array occurs when the element substrate comes into contact with the upper surface of the base plate, resulting in poor positional accuracy, and subsequent positional correction could not be performed. Is possible to directly correct the position of the element substrate while checking the position of the element substrate directly on the upper surface of the base plate.This makes it possible to significantly improve positional accuracy, secure production stability, and improve yield. Connect.

(2) By using a mechanical abutment standard as a positioning method in the X-axis direction (ink ejection direction), it is possible to reduce unevenness in the arrangement steps in the X-axis direction and further increase the speed of the positioning operation. And shorten tact time.

(3) As a method of moving the arrangement position in the Y-axis direction (in the direction of the row of ejection energy generating elements), vibration is applied while the element substrate is sandwiched from both sides by the butting reference plate and the butting body. The movement in the Y-axis direction can be controlled by a light pressing force, so that the accuracy of stopping the movement of the element substrate and the accuracy of the position are improved, and the tact time for alignment can be shortened.

(4) Conventionally, the upper surface of the element substrate is suctioned to provide a function of transport and alignment. However, in the present invention, the finger for attracting and transporting the element substrate has only a transport function. The positioning of the element substrate is performed on the surface of the base plate, and as a member for sucking and transporting the element substrate, a pyramid that can abut the element substrate and adsorb and hold the element substrate without damaging the surface of the element substrate. The collet finger method can be employed, and the surface of the element substrate is not damaged at all, and the yield can be improved.

(5) Further, a long liquid jet recording head having a desired width can be manufactured with high accuracy, and the yield can be improved and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an embodiment of the present invention;
FIG. 3A is a perspective view schematically illustrating a state in which element substrates are arranged on a base plate that is positioned and clamped on a reference base of an assembling apparatus, and FIG. It is a side view which shows typically.

FIG. 2 is a schematic diagram illustrating a modification example of the application of the adhesive of the present invention, and illustrates a mode in which an adhesive is applied after arranging element substrates on a base plate.

FIG. 3 is a schematic diagram illustrating another modification example of the application of the adhesive of the present invention, and illustrates a mode in which the adhesive is applied to the back surface of the element substrate immediately before the element substrate is arranged on the base plate.

FIG. 4 is a schematic perspective view for explaining a conventional method of arranging a plurality of element substrates on a base plate in a method of manufacturing a long liquid jet recording head.

FIG. 5 is a schematic perspective view showing a configuration of a long liquid jet recording head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Element board (heater board) 1a Discharge energy generating element 2 Base plate 3 Adhesive 4, 4a (adhesive) application groove 5, 5a Adhesive applying means 10 Butt reference plate 10b Jig mounting base 11 Butt body 12 Lateral pressing Body 13 Position detecting means 14 Collet finger 15 Pyramid collet 16 Reference table 40 Element substrate 41 Discharge energy generating element 42 Base plate 44 Wiring board 48 Top plate 49 Discharge port

Continuing on the front page (72) Inventor Kimiyuki Hayashizaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Hisashi Fukai 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Takayuki Ono 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Masayoshi Okawa 3-30-2, Shimomaruko 3-chome, Ota-ku, Tokyo Canon Inc.

Claims (7)

[Claims] A plurality of element substrates each having an ejection energy generating element array for ejecting liquid from an ejection port are arranged on a base plate in the direction of the ejection energy generating element array, and the ejection port array and the ejection port are arranged on the base plate. A method for manufacturing a liquid jet recording head, comprising: combining a long top plate having a plurality of liquid flow paths respectively connected to a row, and aligning and forming the discharge port row and the discharge energy generating element row to form a joint. When the element substrate having the generator element array is supplied and arranged on the base plate, the element substrate is directly placed on the upper surface of the base plate, and the front side surface of the element substrate is placed on a reference surface of a reference plate arranged opposite to the base plate. Is pressed to determine the ejection direction, and in this state, the ejection energy is Positioning moved to a predetermined position of ghee generating element column, method of manufacturing a liquid jet recording head, characterized in that arranged subsequent to the element substrate is bonded to the base plate. 2. A method for transporting and temporarily placing an element substrate on an upper surface of a base plate by using a pyramidal suction finger capable of being transported without contacting a pattern surface of the element substrate. 2. The method for manufacturing a liquid jet recording head according to claim 1, wherein: 3. The positioning of the element substrate in a non-contact manner while moving the element substrate in the direction of the discharge energy generating element row by pressing a lateral side surface when positioning the element substrate in the direction of the discharge energy generating element row. 3. The method according to claim 1, further comprising: stopping the movement of the element substrate when it reaches a predetermined position, and positioning and fixing the element substrate. 4. The liquid jet recording according to claim 1, wherein the element substrate is moved while applying vibration to the base plate when the element substrate is moved in the direction of the row of ejection energy generating elements. Head manufacturing method. 5. The method according to claim 1, wherein an adhesive is applied to the base plate before the element substrate is supplied to the base plate in order to bond and fix the element substrate to the base plate. A method for manufacturing a liquid jet recording head according to claim 1. 6. The device according to claim 1, wherein an adhesive is applied to the periphery of the element substrate after the positioning of the element substrate in order to adhere and fix the element substrate to the base plate. Of manufacturing a liquid jet recording head. 7. An adhesive is applied to the back surface of the element substrate just before the element substrate is mounted on the base plate in order to adhere and fix the element substrate to the base plate. 5. The method for manufacturing a liquid jet recording head according to claim 1, wherein the liquid ejecting recording head is bonded and fixed by bonding.