JPH10258376A - Method and device for detecting defective state in laser machining - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive an automatic or unmanned operation of laser machining by positioning a cutting part immediately below an image pickup unit after the implementation of laser cutting on a work, picking up the image of the cutting part, processing the image data with an image processor, and detecting a defective state in the machining of the work. SOLUTION: With a program started for detecting a defective state of laser machining, an image processor 49 arithmetically processes with CPU 123 a machining position image picked up by CCD camera 25, discriminating whether the machining state is superior cutting or defective machining. In the case of superior cutting with another machining to follow, similar discrimination is carried out for the next machining. If a defective machining is detected, discrimination is performed to find if it is a burning, gouging or totally uncut state, with a command outputted to an NC device 73 through I/O 129 so that machining conditions may be changed to improve the defective machining. As a result, the following machining is done under the changed machining conditions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for detecting a defective state of laser processing.

[0002]

2. Description of the Related Art The processing state in laser processing changes depending on the material and plate thickness of a workpiece, and the stochastic change is unpredictable even with the same material and plate thickness even if the processing shape is used. If the status is constantly monitored, the machine is stopped immediately when a processing failure occurs, the type or state of the processing failure is determined, and operations such as changing the processing conditions according to the situation are performed.
We take measures such as predicting the occurrence of some processing defects and setting a larger processing quantity for products.

[0003]

The above-mentioned change in the processing state occurs not only stochastically as described above, but also sometimes due to a change in factors such as deterioration of equipment used for processing. For example, processing defects may continue thereafter due to a change in factors such as the progress of dirt on the condenser lens. In such cases, it is necessary to take appropriate measures, because not only continuous processing defects occur on the product but also the failure of the processing machine itself, and the monitoring of the processing state by the operator should be stopped. Can not.

[0004] Further, when a processing failure occurs due to a change in the processing state, it is determined by the operator whether the processing failure is due to a change in the material or the plate thickness or a change in the processing shape. This is an obstacle to automation or unmanned laser processing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method and an apparatus for detecting a defective state of laser processing by a machine.

[0006]

According to a first aspect of the present invention, there is provided a method for detecting a defective state of a laser processing, wherein a laser cutting process is performed on a work, and the cut processing portion is placed directly below an imaging device. In this case, an image of the cutting section is taken, and image data of the cutting section is processed by an image processing device to detect a machining failure state of the work.

Therefore, the machining state changes irregularly depending on the material and the thickness of the workpiece, and also changes stochastically which cannot be predicted by the same material and the same thickness even by the machining shape. If the machine is constantly monitoring the machining state, the operator is released from the task of monitoring the machining state and can perform other tasks. In addition, the laser processing can be automated or unmanned.

According to a second aspect of the present invention, after performing a laser cutting process on a workpiece, the cutting portion is positioned immediately below an image pickup device, and the cutting portion is imaged. An image processing device processes the image data of the cutting part to detect a defective processing state of the work, and the processing conditions can be changed to improve the defective processing state according to the detected defective processing state. It is assumed that.

Therefore, it is not necessary for the operator to constantly monitor the machining state, determine the type or state of the machining defect, and change the machining conditions according to the situation, as in the related art.

According to a third aspect of the present invention, there is provided the laser processing failure state detecting method according to the first or second aspect, wherein an allowable value of the number of times of processing failure detection is set, and The gist is that the laser processing can be interrupted when the value exceeds the value.

[0011] Therefore, in the past, measures such as setting a large number of products to be processed in anticipation of occurrence of a certain degree of processing defects have been taken, but according to the present invention, it is necessary to carry out planned production quantitatively. Is possible.

According to a fourth aspect of the present invention, in the method for detecting a defective state of laser processing, the variation of the measurement data processed by the image processing apparatus is larger than a reference value. When the variation is less than the reference value, the average value of a plurality of measurements is calculated and calculated, and the average value is compared with the set value, and the average value is larger than the set value. When the average value is less than the set value, it is determined that the cutting is good, and when the average value is less than the set value, it is determined that the cutting is good.

[0013] Therefore, as in the prior art, the determination of a defective machining state is made quantitatively by a machine without visual observation by a human, so that there is no variation in the determination and accurate determination is possible.

According to a fifth aspect of the present invention, there is provided a method for detecting a defective state of laser processing, wherein the reference value of the variation can be arbitrarily set. .

Accordingly, it is possible to change the criterion for determining a processing defect in accordance with the processing accuracy required for the product, and it is possible to eliminate waste of producing a product of excessive quality.

According to a sixth aspect of the present invention, there is provided a laser processing failure state detecting apparatus, comprising: a CCD camera capable of capturing a processing state of a workpiece; an image memory for storing a processing state of the workpiece captured by the CCD camera; ROM that stores a failure state detection program and reference values
A RAM that is used when the laser processing failure state detection program is executed, a CPU that performs arithmetic processing on an image of the processing state of the workpiece that is captured by the laser processing failure state detection program, and determines the processing state;
If a processing defect is detected in U, the image processing apparatus comprises an I / O that outputs processing conditions for improving the processing defect to the NC device and receives a command signal from the NC device. It is assumed that.

Therefore, the processing state changes irregularly depending on the material and the plate thickness of the workpiece, and also changes stochastically which cannot be predicted by the same material and the same thickness even if the processing shape is used. If the machine constantly monitors the machining state, the operator is released from the task of monitoring the machining state and can perform other tasks. In addition, the laser processing can be automated or unmanned.

According to a seventh aspect of the present invention, there is provided a laser processing failure state detecting apparatus according to the sixth aspect, wherein an allowable value of the number of times of processing failure detection can be set, and The purpose is to output a command to interrupt the laser processing to the NC device when the error occurs.

Therefore, conventionally, the occurrence of a certain degree of processing failure has been predicted and the processing amount of the product has been set to a relatively large amount. However, according to the present invention, the planned production is quantitatively performed. Is possible.

In the laser processing defective state detecting device according to the present invention, in the laser processing defective state detecting device according to the present invention, the variation of the measurement data processed by the image processing device is a reference value. If the difference is less than the reference value, the average value of a plurality of measurements is calculated and calculated, and the average value is set by comparing the average value with the set value. When the value is larger than the value, it is determined that the processing is defective in the gouging state, and when the average value is less than the set value, it is determined that the cutting is good.

Therefore, as in the prior art, the determination of a defective machining state is made quantitatively by a machine without visual observation by a human, so that there is no variation in the determination and accurate determination can be made.

According to a ninth aspect of the present invention, there is provided the apparatus for detecting a defective state of laser processing, wherein the reference value of the variation can be arbitrarily set. .

Accordingly, it is possible to change the criterion for determining a processing defect in accordance with the processing accuracy required for the product, and it is possible to eliminate waste of producing a product of excessive quality.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view for explaining a relationship between a laser processing head portion of a laser processing machine using a laser processing failure state detection device according to the present invention and a workpiece. Referring to FIG. 1, a laser processing machine 1 includes a processing table (not shown) that is movable in an X-axis direction (a direction perpendicular to the paper surface in FIG. 1), and a work clamp 3 is mounted on the processing table. The work W to be machined, which is clamped by, is placed. An upper frame 5 of a portal shape is provided above the processing table so as to straddle the processing table.

A plurality of parallel guide rails 7 extending in the Y-axis direction (the left-right direction in FIG. 1) are laid on the front surface of the upper frame 5. A ball screw 9 extending in the Y-axis direction is provided between the guide rails 7, and a drive motor My is connected to one end of the ball screw 9, for example, to the right end in FIG. Along with
The other end of the ball screw 9, for example, the left end in FIG. 1 is rotatably supported by a bearing 13.

A Y-axis carriage 15 is provided via a nut member (not shown) screwed to the ball screw 9 and
The Y-axis carriage 15 is provided with a plurality of guide members (not shown).
It is to be guided along. Further, a laser processing head 17 is provided on the Y-axis carriage 15, and a nozzle 19 is provided below the laser processing head 17.

With the above configuration, when the drive motor My is driven, the ball screw 9 rotates and the Y-axis carriage 1
5 is moved in the Y-axis direction. Then, the Y-axis carriage 15 moves while being guided by the guide rail 7 via the guide member. Therefore, the work W clamped by the work clamp 3 moves in the X-axis direction and the laser processing head 17 moves in the Y-axis direction, and the laser processing head 17 is positioned at a desired position on the work W. The workpiece W is irradiated with a laser beam from the nozzle 19 provided at the lower part of the workpiece W to perform laser processing such as a round hole.

The Y-axis carriage 15 has, for example, an imaging device unit 2 near the right side of the laser processing head 17.
1 is provided. This imaging device unit 21
An imaging device unit case 23 is provided in the shaft carriage 15, and a CCD camera 25 as an image capturing camera is provided in the imaging device unit case 23. , UV filter 29 are provided. The CCD
The camera 25 is, for example, a camera that captures an image of a round hole or a groove width, the lens unit 27 adjusts the aperture and focus, and the UV filter 29 is connected to the lens unit 27 and the CC.
This protects the D camera 25 from ultraviolet rays.

In the imaging device unit case 23,
An air cylinder 31 is provided, and a piston rod 33 is mounted below the air cylinder 31. The lower end of the piston rod 33 has a ring light 3
5 is attached. A work holder 41 is provided at the lower end of the support member 37 via a spring 39. A relay terminal block 43 is provided in the imaging device unit case 23. The relay terminal block 43 is a limit switch for the air cylinder 31 and a relay terminal block for the ring illumination 35. A purge solenoid 45 and an air cylinder solenoid 47 are provided on the upper right side of the upper frame 5.

An image processing device 49 for processing an image of the image pickup device 21 is shown in FIGS. 2A, 2B, 2C,
This is shown in (D). In FIG. 2, the image processing device 49 includes a power switch 51, a power display LED 53,
CCD camera connection cable 55, NC connection cable 5
7, a power cable 59 and a fan 61 are provided.
FIG. 3 is a system configuration diagram of an electric system of the imaging device unit 21. In FIG. 3, the image processing device 49 and the NC high power board 63 are connected by a cable 65. The relay terminal block 43 and the NC high power board 63 are connected by a relay cable 67. The purging solenoid 45, the air cylinder solenoid 47 and the NC high power board 63 are connected to solenoid cables 69 and 71, respectively. NC device 73 and image processing device 49
Are connected by the NC connection cable 57.

The relay terminal block 43 and the ring illumination 35 are connected by an illumination cable 75, and the upper and lower limit switches 77 and 79 of the air cylinder 39 and the relay terminal block 43 are connected by switch cables 81 and 83. Connected. Also, the monitor television 85 and the image processing device 4
9 is connected by a monitor cable 87.

FIG. 4 shows a system configuration diagram of the air system of the imaging device unit 21. In FIG. 4, the upper and lower cylinder chambers of the air cylinder 31 are located. For example, one ends of pipes 89 and 91 are connected,
The other ends of the pipes 89 and 91 are connected to the back side of the air cylinder solenoid 47. One end of a pipe 93 is connected to the front side of the solenoid 47 for the air cylinder, and the other end of the pipe 93 is connected to an air three-point set 9.
5 union tee 97. Further, one end of a pipe 99 is connected to the front side of the purge solenoid 45, and the other end of the pipe 99 is connected to a branch elbow 101 of the three-point air set 95. One end of a pipe 103 is connected to the back side of the purge solenoid 45, and the other end of the pipe 103 is connected to a ring-shaped hole 105 for air purge formed in the work holder 41.

With the above configuration, the N shown in FIGS.
By operating the C device 73 and controlling the image processing device 49 via the NC high power board 63, the surface of the processed part of the processed workpiece is imaged by the CCD camera 25. Also, NC
The ring illumination 35 is turned on via the high-power board 63 and the relay terminal block 43 to illuminate the surface of the work, and the upper and lower limit switches 77 and 79 of the air cylinder 39 are turned on.
N, OFF. Further, a solenoid 45 for purging and a solenoid 4 for air cylinder are connected via an NC high power board 63.
7 is turned ON and OFF.

In FIG. 4, when the compressed air is supplied to the upper cylinder chamber of the air cylinder 31 through the air cylinder solenoid 47 and the pipe 89 via the pipe 93 via the union tee 97 of the air three-point set 95,
Since the piston rod 33 moves down, the work holder 41 also moves down, and the work W is pressed by the work holder 41 from above. The compressed air passes through the union tee 97 of the three-point air set 95, passes through the pipe 93 through the solenoid 47 for the air cylinder, passes through the pipe 91, and passes through the air cylinder 31.
Is supplied to the lower cylinder chamber of the piston rod 3
3 rises, and the work presser 41 also rises.

Further, if a dust collector (not shown) is operated while the work W is being pressed from above by the work presser 41, dust or the like on the work W is sucked from the hole 103 formed with the work presser 41. The dust is collected by the dust collector through the pipe 101, the purge solenoid 45, the pipe 97, and the air three-piece set 95, and the work W is cleaned cleanly.

FIGS. 5 and 6 show a flowchart of a method for detecting a defective state of laser processing according to the present invention. Hereinafter, based on this flowchart, a method of measuring a straight cut portion or a round hole formed in the work W and detecting a processing failure state will be described. First, as a preparation, a slit width for good cutting is set in step S1. Then, when a command is issued to the machining state monitoring star, a machining monitoring program is executed (step S2). In step S3, the monitoring position on the work is moved and positioned to a position immediately below the CCD camera 25.

In the next step S4, the work W is pressed and fixed by the work holder 41 and the ring light 35 is turned on. Then, in step S5, the CCD camera 25
Captures the processing position of the workpiece W, performs image processing on the captured image data in the image processing device 49, and outputs the processed image data to the NC device 73.

In step S6, the work holder 41 is raised, and the ring illumination 35 is turned off. In step S7, it is determined whether the monitoring of the processing state is the slit monitoring. If it is a slit monitor, the process proceeds to step S8, and if not, the process proceeds to step S9. When it comes to step S8, it is the case of slit monitoring, so it is determined whether or not a slit has been detected in step S8. If a slit is not detected, it indicates that the work W has not been cut, and thus it is determined in step S19 that the processing is defective (3) in the scored state.

If a slit is detected in the condition determination in step S8, the slit width is changed a plurality of times in step S10 to perform measurement. In the condition determination step S9, it is determined whether or not a round hole is detected. If a round hole is detected, the radius measurement of the round hole is repeated several times in step S10 by changing the position. carry out. If a round hole cannot be detected in step S9, it means that the work W has not been cut, and thus it is determined in step S19 that there is a processing defect (3) in the scored state. Preferably, the number of measurements is at least three times.

Next, in step S11, the amount of unevenness in the upper portion of the cut surface is measured, and the variation in the measured value is calculated and calculated in the next step S12. The amount of unevenness in the upper part of the cut surface is obtained by calculating the position coordinates in the Z-axis direction (not shown) in the direction orthogonal to the XY axes in which the focal position of the CCD camera 25 is aligned with the surface of the convex portion. It can be detected as a difference from the distance from the surface of the work W.

Next, in step S13, the magnitude of the variation in the measured values is determined. The magnitude of the variation is determined based on a variation reference value set based on a preset cutting accuracy. If the variation of the measured value is larger than the reference value in step S13, step S1
In 4 it is determined that the burnout is defective (1). If the variation of the measured values is less than the reference value in step S14, the average value of the measured values is calculated and obtained (step S15).

Next, the average value obtained in step S15 is compared with the set value, and when the average value is larger than the set value,
It is determined that the processing is defective (2) in the gouging state (step S17). If the average value obtained in step S15 is less than the set value, it is determined that the cutting is good (step S1).
8). The set value in step S16 is
At the time of slit detection, it is the slit width at the time of good cutting, and at the time of round hole detection and unevenness detection, it means the indicated value specified in the program.

In steps S14, S17, and S19, when it is determined that the processing is defective in the burning state, the processing failure in the gouging state, and the processing failure in the scored state, respectively, all of the processing is performed in step S2.
At 0, it is determined whether or not the number of processing failures is equal to or more than an allowable value. When the number of processing failures is equal to or more than the allowable value, an alarm of the processing failure is displayed on the monitor television 85 and the display of the NC unit 73, and the laser processing is interrupted. .

If the number of processing failures is less than the allowable value in step S20, it is determined in step S21 whether or not there is the next processing. If there is another processing, the processing proceeds to step S22. The next processing is performed after changing the laser cutting processing conditions so that the processing conditions are improved corresponding to the type of processing failure (step S23). After the next machining is performed, the process returns to the machining monitoring main step S3, and the machining monitoring program is continued. If there is no next machining in step S21, the machining monitoring program ends.

If it is determined in step S18 that the cutting is good, the following processing is performed (step S21).
Then, the process returns to the main step S3 for processing monitoring, and the processing monitoring program is continued.

The imaging device 21 and the image processing device 49 are used.
In the laser processing fault condition detection method
The command lines that make up the system are described as follows. "G141A
5I J E Q K ; ”Means the argument of the command line
The taste shows the following contents. G141A5: Processing monitoring status
Mode, I: monitoring position X coordinate, J: monitoring position Y coordinate,
E: reference value of unevenness state at the top of cutting position, Q: monitoring shape finger
Yes, but Q1 slit monitoring, default is round hole monitoring, R:
Hole radius (mm), K: allowable number of times of processing failure.

Next, an example of the machining state monitoring program is as follows. G141A5K3; (setting of the allowable number of processing failures); G141A5I @ J @ E1Q1; (monitoring the processing state of the slit); G141A5I @ J @ E
2R2; (Monitoring of drilling condition of 4 mm diameter hole). Note that △△
Indicates an appropriate numerical value.

Next, with reference to FIGS. 7 and 8, a description will be given of a shape that can be monitored, a position that can be monitored, and a position that cannot be monitored in the processing defect state detection method of the present invention. In the processing failure state detection method of the present invention, the round hole, the straight cut portion and the slit are monitored, and holes other than the round hole are not monitored.

Referring to FIG. 7, as an example of laser cutting, a polygonal product P having three round holes 111, one square hole 113 and two V-shaped slits 115 is shown. An example of cutting from a work W (or a base material) is shown. Among the polygonal products P, those that can be monitored are, as also shown in an enlarged manner in FIG. 8, a round hole 111 at a monitoring position A and a position outside the monitoring position A, and a linear cutting portion at a monitoring position B. And the slit 115 at the monitoring position C. On the other hand, a square hole 113 at the monitoring position D, a corner of a straight cut portion at which the product side falls as at the monitoring position E, and a corner which is not linearly connected to both ends of the visual field to be monitored as at the monitoring position F are monitored. Not applicable.

FIG. 9 shows the configuration of the laser processing failure state detecting device 121. The laser processing failure state detection device 121 includes a CCD camera 25 as the image capturing camera, an image processing device 49 for processing an image captured by the CCD camera 25, and laser processing failure state information processed by the image processing device 49. The NC device 7 for controlling the processing conditions of the work W and the movement positioning of the work W based on the
3 and the like. Note that the CCD camera 25 may be fixed and the work W may be moved in the X and Y directions with respect to the CCD camera 25.

The image processing device 49 includes the image memory 12
1, CPU 123, ROM 125, RAM 127, I /
O (input / output device) 129. Image memory 1
The C 21 input via the cable 55 is
A digital signal from the CD camera 25 is stored.
The ROM 125 stores a laser processing failure state detection program, a reference value, and the like in accordance with the algorithm described with reference to FIGS. RAM 127
Is a temporary memory used when executing the program.

The I / O (input / output device) 129 is connected to a data bus 131 of the image processing device 49 and an input / output device (not shown) inside the NC device 73.
It serves to transmit a start signal from the device 73 and a data signal to the NC device 73. The I / O 129 is connected to a relay (not shown) of the ring light 35,
Turning on or off the ring light 35 is controlled by the CPU 123 of the image processing device 49. The NC device 73 controls the movement and positioning of the processing table, the laser processing head 17 and the CCD camera 25 of the laser processing machine 1, and controls the air cylinder solenoid 47 to move the work holder 41 up and down. Also control.

In the above configuration, if the laser processing defect state detection program according to the algorithm shown in FIGS. 5 and 6 is operated, the image processing device 49 becomes the CCD camera 25.
Performs an arithmetic process on the image of the processing position in the CPU 123 to determine whether the processing state is good cutting or poor processing, and when the cutting is good and there is the next processing, the next processing is performed. In the same manner, it is determined whether or not the processing is good cutting or processing failure.

If a processing defect is detected, it is determined whether the state of the processing defect is a burning state, a gouging state, or not cut at all, and the processing conditions for improving the processing defect are determined. The I /
A command is output to the NC device 73 via O129.
Then, the next processing is performed under the changed processing conditions. If the allowable number of processing failures is specified by a program, the laser processing failure state detection program is executed until the allowable number of processing failures is exceeded.

The CPU 123 outputs an instruction to turn on the ring illumination 35 to the NC device 73 via the I / O 129 when the processing section of the work W is imaged, thereby turning on the ring illumination 35 and the air cylinder solenoid. 47 to output a command to drive the workpiece presser 4
Activate 1 The NC device 73 drives the drive motor Mx of a work positioning device (not shown) to position the work W at an arbitrary position in the X-axis direction, and drives the drive motor My of the Y-axis carriage 15 to move the CC to the CC.
The D camera 25 can be positioned at any position in the Y-axis direction. Therefore, by appropriately driving the drive motors My and Mx, the processed portion of the work W can be positioned immediately below the CCD camera 25.

[0056]

As will be understood from the above description of the embodiment, according to the first aspect of the present invention, the machining state is constantly monitored by the machine. It will be released and you will be able to perform other tasks. In addition, it becomes possible to automate or unmanned laser processing.

According to the second aspect of the present invention, the operator always monitors the machining state, judges the type or state of the machining defect, and changes the machining conditions according to the situation, as in the related art. There is no need to carry out.

According to the third aspect of the invention, it is not necessary to predict the occurrence of a certain degree of processing failure and set a larger processing quantity of the product as in the prior art.
It is possible to carry out planned production quantitatively.

According to the fourth aspect of the present invention, the determination of a defective machining state is made quantitatively by a machine without visual observation by a human, so that there is no variation in the determination, and accurate determination can be made. It is possible to produce products of uniform quality.

According to the fifth aspect of the present invention, it is possible to change the criterion of processing failure in accordance with the processing precision required for the product, and it is possible to eliminate waste of producing a product of excessive quality.

According to the sixth aspect of the present invention, since the machine constantly monitors the machining state, the operator is released from the task of monitoring the machining state and can perform other tasks. In addition, it becomes possible to automate or unmanned laser processing.

According to the seventh aspect of the present invention, a countermeasure such as setting a large number of products to be processed in anticipation of occurrence of a certain degree of processing defects has conventionally been taken. It is possible to perform planned production in an efficient manner.

According to the eighth aspect of the present invention, the determination of a defective machining state is made quantitatively by a machine without visual observation by a human, so that there is no variation in the determination, and accurate determination becomes possible. Can produce products of high quality.

According to the ninth aspect of the present invention, it is possible to change the criterion for processing defects in accordance with the processing accuracy required for the product, and it is possible to eliminate waste of producing an excessively high quality product.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a relationship between a laser processing head portion and a work of a laser processing machine using a laser processing failure state detection device according to the present invention.

FIGS. 2A and 2B are external views of an image processing apparatus of the laser processing failure state detection apparatus, wherein FIG. 2A is a plan view of the image processing apparatus, FIG. 2B is a front view, FIG. (D)
Is a left side view.

FIG. 3 is a system configuration diagram of an electric system of an imaging device unit of the laser processing failure state detection device.

FIG. 4 is a system configuration diagram of an air system of an imaging device unit of the laser processing failure state detection device.

FIG. 5 is a flowchart of a laser processing failure state detection method according to the present invention.

FIG. 6 is a flowchart of a laser processing failure state detection method according to the present invention.

FIG. 7 is an explanatory view of a shape that can be monitored, a position that can be monitored, and a position that cannot be monitored in the laser processing failure state detection method according to the present invention.

FIG. 8 is an enlarged explanatory view of the monitorable shape, the monitorable position, and the impossible position in FIG. 7;

FIG. 9 is a view for explaining an embodiment of a laser processing failure state detection device according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Laser processing machine 3 Work clamp 5 Upper frame 7 Guide rail 9 Ball screw 13 Bearing 15 Y-axis carriage 17 Laser processing head 19 Nozzle 21 Imager unit 23 Imager unit case 25 CCD camera 27 Lens unit 29 UV filter 31 Air cylinder 33 Piston rod 35 Ring illumination 37 Support member 39 Spring 41 Work holder 43 Relay terminal block 45, 47 Solenoid 49 Image processing device 51 Power switch 53 Power display LED 55, 57, 59, 65, 69, 71, 75, 81, 8
3, 87 Cable 61 Fan 63 NC high power board 67 Relay cable 73 NC device 77, 79 Limit switch 85 Monitor television 89, 91, 93, 99, 103 Piping 95 Air 3 point set 97 Union tea 101 Elbow 105 hole 121 Image memory 123 CPU 125 ROM 127 RAM 129 I / O (input / output device) 131 Data bus Mx drive motor My drive motor W Work

Claims (9)

[Claims] After performing a laser cutting process on a workpiece, the cutting portion is positioned immediately below an imaging device, an image of the cutting portion is taken, and image data of the cutting portion is processed by an image processing device. And detecting a defective processing state of the workpiece. 2. After performing a laser cutting process on a work, the cutting portion is positioned immediately below an imaging device, the cutting portion is imaged, and image data of the cutting portion is processed by an image processing device. A method for detecting a defective processing state of a work, and changing the processing conditions to processing conditions for improving the defective processing state in accordance with the detected defective processing state. 3. The laser processing according to claim 1, wherein an allowable value of the number of times of detection of the processing failure is set, and the laser processing can be interrupted when the allowable value is exceeded. Defective state detection method. 4. When the variation of the measurement data processed by the image processing apparatus is larger than a reference value, it is determined that the burning state is defective, and when the variation is less than the reference value, an average value of a plurality of measurements is taken. Computed and determined, when the average value is larger than the set value by comparing the average value and the set value, it is determined to be a machining failure in the gouging state, and when the average value is less than the set value, it is determined to be good cutting. The method for detecting a defective state of laser processing according to claim 1, wherein the method is characterized in that: 5. The method according to claim 4, wherein a reference value of the variation can be set arbitrarily. 6. A CCD camera capable of imaging a processing state of a workpiece, an image memory storing a processing state of the workpiece captured by the CCD camera, and an RO storing a laser processing failure state detection program and a reference value.
M, a RAM used when the laser processing defect state detection program is executed, and a CPU for performing arithmetic processing on the image of the imaged processing state of the workpiece by the laser processing defect state detection program to determine a processing state; C
When a processing defect is detected in the PU, the image processing apparatus comprises an I / O for outputting a processing condition for improving the processing defect to the NC device and receiving a command signal from the NC device. Laser processing failure state detection device. 7. The apparatus according to claim 6, wherein an allowable value of the number of times of detection of the processing failure can be set, and a command to interrupt the laser processing when the allowable value is exceeded is output to the NC device. Laser processing failure state detection device. 8. When the variation of the measurement data processed by the image processing device is larger than a reference value, it is determined that the burning state is defective, and when the variation is less than the reference value, an average value of a plurality of measurements is taken. Computed and determined, when the average value is larger than the set value by comparing the average value and the set value, it is determined to be a machining failure in the gouging state, and when the average value is less than the set value, it is determined to be good cutting. The laser processing failure state detecting device according to claim 6 or 7, wherein 9. The apparatus according to claim 8, wherein a reference value of the variation can be set arbitrarily.