JPH10314966A - Optical diagnostic method and device for laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To early detect the deterioration degree of a lens and mirror and to prevent machining defects by making a slit in a work, measuring its narrowest cut width and the focal reference position by means of an image processor, and comparing the measurement with the initial record of a new lens or mirror. SOLUTION: Plural slits are made on a work W by the irradiation of a laser beam, with the focal position variously changed, from a laser machining head 17 equipped with a condensing lens which is provided in the Y-axis carriage 15 of a laser beam machine 1 and which is adjustable in the focal position. These slits are positioned immediately below an image pickup device unit 21 and held with a work holder 41, with the image data of each slit cut width taken in by means of an image pickup camera 25. Simultaneously, a focal position in the narrowest slit cut width is detected by an image processor, with the position made the focal reference position of the condensing lens of the laser machining head 17, stored in an NC device together with the measurement of the slit cut width, and compared with the preset initial data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for diagnosing an optical system such as a condenser lens and a mirror in a laser beam machine and a composite machine thereof.

[0002]

2. Description of the Related Art Conventionally, in a laser beam machine and its multifunction machine, deterioration, wear, change in position, and change in angle of a condenser lens, a folding mirror, and a mirror in an oscillator are all expressed as changes in a machining state. . Therefore, if the processed state deteriorates and the processed product exceeds the allowable range as a product, the mirror or lens often has a cause. However, since adjustment and cleaning of the mirror and lens require time and effort, processing has been continued by an easy method such as changing processing conditions.

[0003] Furthermore, the condition of the mirrors and lenses deteriorates,
If the adjustment could not be completed by changing the processing conditions, the processing was interrupted and the lens and mirror were adjusted.

[0004]

In the above-described conventional laser beam machine and its multifunction machine, when the laser beam is processed on the work, the processing state changes.
Since the countermeasure is implemented after the machining state has changed enough to be judged by the operator, there is a problem in that if the countermeasure is not taken by an easy method, that is, by changing the machining condition, etc., it will not be enough.

[0005] Further, if the deterioration state of the mirror or lens considerably progresses, cleaning cannot be performed and replacement is often required, and there is a problem in shortening the life of the mirror or lens.

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical system diagnosis method and apparatus for a laser beam machine which knows a change in the state of a lens, a mirror, or the like before judging an abnormality in machining and reduces a machining failure rate. Is to do.

[0007]

According to a first aspect of the present invention, there is provided a method for diagnosing an optical system in a laser beam machine according to the present invention, comprising: a condenser lens provided on a Y-axis carriage and having a focus position adjustable. The laser processing head provided with the laser beam irradiates the workpiece with the laser beam while changing the focal position variously to perform a plurality of slit processing on the workpiece, and then, the processed plurality of slits are provided in the Y-axis carriage. Position it directly below the imaging device unit,
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. The image data was sent to the image processing apparatus to measure the respective cutting width, the focal position at the narrowest cutting width of the measured cutting width as the focus reference position of the condenser lens, this measured The measurement data of the narrowest cutting width and focus reference position is taken into the NC device,
The apparatus is characterized in that the measured data is compared with preset initial data.

Therefore, a laser beam is irradiated on the work by changing the focal position of the condenser lens from the laser processing head provided on the Y-axis carriage, and a plurality of slits are formed on the work. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. The measured focus reference position and the measured data of the narrowest cutting width are taken into the comparing means of the NC device, and are compared with preset initial data stored in the memory, so that a condenser lens, a mirror, etc. Of the optical system is diagnosed.

According to a second aspect of the present invention, there is provided a method for diagnosing an optical system in a laser beam machine, the method comprising:
After performing a plurality of slits on the work by irradiating the work with a laser beam by changing the focus position variously from a laser processing head having a focusing lens whose focal position is adjustable, the processed plurality of slits are formed. Positioning the slit immediately below the imaging device unit provided in the Y-axis carriage, turning on the ring illumination in the imaging device unit, lowering the work holder in the imaging device unit to hold the work, and then holding the imaging device unit The image capturing camera in the camera captures the image data of the cutting width in each slit and measures each of the cutting widths to which the image data is sent to the image processing apparatus, and determines the narrowest one of the measured cutting widths. The focus position in the width is set as the focus reference position of the condenser lens, and this measurement is periodically performed on the same work. Measurement data of the narrowest cutting width and the focus reference position are taken into the NC device, and each measurement data is compared with the preset initial data stored in the memory in the NC device. It is characterized in that it is determined whether or not the set change amount at the time of the occurrence of the processing failure is approached.

Therefore, a laser beam is irradiated on the work by changing the focal position of the condenser lens from the laser processing head provided on the Y-axis carriage, and a plurality of slits are formed on the work. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. This measurement is periodically performed on the same work. Each time, the measurement data of the narrowest cutting width and the focus reference position is taken into the comparing means of the NC device, and the preset initial data stored in the memory is stored. Is compared to Then, the compared change amount and the set change amount at the time of the occurrence of the processing failure are taken into the judging means and compared and judged, and the progress of the deterioration of the condenser lens, the mirror and the like is diagnosed.

According to a third aspect of the present invention, there is provided a method for diagnosing an optical system in a laser beam machine, the method comprising:
After performing a plurality of slits on the work by irradiating the work with a laser beam by changing the focus position variously from a laser processing head having a focusing lens whose focal position is adjustable, the processed plurality of slits are formed. Positioning the slit immediately below the imaging device unit provided in the Y-axis carriage, turning on the ring illumination in the imaging device unit, lowering the work holder in the imaging device unit to hold the work, and then holding the imaging device unit The image capturing camera in the camera captures the image data of the cutting width in each slit and measures each of the cutting widths to which the image data is sent to the image processing apparatus, and determines the narrowest one of the measured cutting widths. The focus position in the width is defined as the focus reference position of the condensing lens, and this measurement is performed on the same workpiece with different output conditions. In performed, the difference in the measured focus reference position, is characterized in comparing the difference between the initial data set in advance.

Therefore, a laser beam is irradiated on the work by changing the focal position of the condenser lens from the laser processing head provided on the Y-axis carriage, and a plurality of slits are formed on the work. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. This measurement is performed on the same workpiece under different processing conditions with different outputs, and the difference between the measured focus reference and the difference between the preset initial data is taken into the comparing means of the NC device and compared, and the light is collected by the condenser lens. The progress of the mirror deterioration is diagnosed.

According to a fourth aspect of the present invention, there is provided an optical system diagnostic method for a laser beam machine according to the first, second, or third aspect of the present invention, wherein a plurality of slits are formed on a workpiece before a plurality of slits are processed. The system is characterized in that the system is heated by the laser beam.

Therefore, by providing a warm-up time for the optical system during piercing before slitting or between the piercing and slitting of the work, the optical system is heated by the laser beam, so that the start and end of each slit are cut. Since the amount of change is smaller than before, the measurement of the minimum cutting width and the focal position can be accurately performed. As a result, diagnosis of the optical system is performed accurately and easily.

According to a fifth aspect of the present invention, there is provided a method for diagnosing an optical system in a laser beam machine, wherein a laser beam is provided on a Y-axis carriage and provided with a focusing lens whose focal position is adjustable. Irradiating a laser beam to the workpiece to warm the optical system before performing a plurality of slit processing on the workpiece, and then performing the slit processing, and then imaging the processed plurality of slits provided on the Y-axis carriage. Position it directly below the device unit,
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. The image data was sent to the image processing apparatus to measure the respective cutting width, the focal position at the narrowest cutting width of the measured cutting width as the focus reference position of the condenser lens, this measured The present invention is characterized in that the focus reference position is compared with the focus reference position before warm-up is performed, and the difference is taken into the NC device, and the NC device diagnoses the deterioration state of the optical system.

Therefore, the focus reference position before and after warming up the optical system is measured, and the difference is taken into the NC unit and compared with a preset allowable range, so that the diagnosis of the deterioration state of the optical system can be performed accurately. And easily done.

According to a sixth aspect of the present invention, there is provided an optical system diagnostic apparatus for a laser processing machine, comprising: a laser processing head provided on a Y-axis carriage movable in the Y-axis direction and having a focusing lens whose focal position can be adjusted. An imaging device unit provided in the Y-axis carriage, having a vertically movable ring illumination and a work holder, and having an image capturing camera, and capturing image data captured by the image capturing camera to perform image processing. Image processing device, and the difference between the focus reference position processed and measured by this image processing device and the narrowest cutting width measurement data or focus reference position, and preset initial data stored in the memory. Or NC having comparison means for comparing with a difference in initial data
Device.

Therefore, by using the optical system diagnostic apparatus in the laser processing machine according to claim 6,
An optical system diagnosis method in 2, 3, 4, or 5 laser processing machines is performed.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 4, a laser processing machine 1 has a processing table which is movable in an X-axis direction (not shown) (a direction perpendicular to the plane of FIG. 4).
A work W to be processed clamped by the work clamp 3 is placed on this processing table. Above the processing table, an upper frame 5 of a portal shape is provided across the processing table.

On the front surface of the upper frame 5, a plurality of parallel guide rails 7 extending in the Y-axis direction (left-right direction in FIG. 4) are laid. A ball screw 9 extending in the Y-axis direction is provided between the guide rails 7.
A drive motor 11 is connected to one end of the ball screw 9, for example, the right end in FIG. 4, and the other end of the ball screw 9, for example, the left end in FIG.

A Y-axis carriage 15 is provided via a nut member (not shown) screwed to the ball screw 9 and a plurality of guide members (not shown) are provided on the Y-axis carriage 15. A guide member is guided along the guide rail 7. Also,
The Y-axis carriage 15 is provided with a laser processing head 17, and a nozzle 19 is provided below the laser processing head 17.

With the above configuration, when the drive motor 11 is driven, the ball screw 9 is rotated, so that the Y-axis carriage 15 is moved in the Y-axis direction. Y axis carriage 15
Is moved, the Y-axis carriage 15 is guided by the guide rail 7 via the guide member and moves smoothly.

Therefore, the work W clamped by the work clamp 3 is moved in the X-axis direction and the laser processing head 17 is moved in the Y-axis direction, whereby the laser processing head 17 is positioned at a desired position on the work W, A laser beam is emitted from the nozzle 19 provided at the lower part of the processing head 17 toward the work W, and the work W is subjected to laser processing such as a round hole or a slit.

An image pickup unit 21 is provided in the Y-axis carriage 15, for example, near the right side of the laser processing head 17. As the imaging device unit 21, an imaging device unit case 23 is provided on the Y-axis carriage 15. A CCD camera 25 as an image capturing camera is provided in the imaging device unit case 23, and a lens unit 27 and a UV filter 29 are provided below the CCD camera 25 in this order.

The CCD camera 25 is, for example, a camera for picking up an image of a round hole or a slit. The lens unit 27 adjusts the aperture and the focus. The UV filter 29 protects the lens unit 27 and the CCD camera 25.

An air cylinder 31 is provided in the imaging device unit case 23.
A piston rod 33 is attached to a lower portion of the first rod 1. A support member 37 provided with a ring light 35 is attached to a lower end of the piston rod 33. This support member 3
The work holder 41 is provided at the lower end of 7 via a spring 39.
Is provided. Also, the imaging device unit case 23
A relay terminal block 43 is provided in the air cylinder 3.
1 is a relay terminal block of the LS (Limit Switch) and the ring illumination 35. A purge solenoid 45 and an air cylinder solenoid 47 are provided on the upper right side of the upper frame 5.

A controller 49 as an image processing device for controlling the image pickup device unit 21 is shown in FIG.
(A), (B), (C) and (D) are shown. FIG.
5A to 5D, the controller 49 includes a power switch 51, a power display LED 53, a CCD camera connection cable 55, an NC connection cable 57, a power cable 59, and an intake fan 61.

FIG. 6 shows a system configuration diagram of an electric system of the image pickup device unit 21. In FIG. 6, the controller 49 and an NC high power board 63 as an NC device are connected by a controller power cable 65. The relay terminal block 43 and the NC high power board 63 are connected by a relay cable 67. The purge solenoid 45, the air cylinder solenoid 47, and the NC high power board 63 are connected to solenoid cables 69, 71, respectively. NC high power board 63 and the controller 4
9 is connected by the NC connection cable 57.
Moreover, the NC operation panel 73 and the NC high power board 63 are connected.

The relay terminal block 43 and the ring illumination 35 are connected by an illumination cable 75. The upper and lower limit switches 77, 79 of the air cylinder 31 and the relay terminal block 43 are connected by switch cables 81, 83. Also, the monitor television 85 and the controller 49
Are connected by a monitor cable 87. Further, the controller 49 and the CCD camera 25 are connected by a CCD camera connection cable 55.

FIG. 7 shows a system configuration diagram of the air system of the image pickup device unit 21. In FIG. 7, for example, φ
6 are connected to one ends of the pipes 89 and 91, and the other ends of the pipes 89 and 91 are connected to the back of the air cylinder solenoid 47. One end of a pipe 93 made of, for example, φ8 is connected to the front of the air cylinder solenoid 47, and the other end of the pipe 93 is connected to a union tee 97 of an air three-piece set 95. Further, one end of a pipe 99 is connected to the front side of the purge solenoid 45, and the other end of the pipe 99 is connected to a branch elbow 101 of a three-point air set 95. On the back of the purge solenoid 45, for example, a pipe 10 made of φ6
3 is connected to the other end of the pipe 103,
The workpiece presser 41 is connected to a ring hole 105 formed as a purge air hole.

With the above configuration, the NC operation panel 73 is operated based on FIG. 6 and the controller 49 is controlled via the NC high-power panel 63 to thereby form a round hole or a slit in the work W processed by the CCD camera 25. Is imaged. Also,
Ring illumination 35 via NC high power board 63 and relay terminal block 43
Lights up, the surface of the work W is illuminated, and the upper and lower limit switches 77 and 79 of the air cylinder 31 are turned off.
N, OFF. Further, the solenoid 45 for purge and the solenoid 47 for air cylinder are turned ON and OFF via the NC high power board 63.

Referring to FIG. 7, compressed air is supplied to the upper cylinder chamber of the air cylinder 31 via the solenoid 47 for the air cylinder and the pipe 89 via the pipe 93 via the union tee 97 of the three-point air set 95. Then, since the piston rod 33 descends, the work holder 41 also descends, and the work W is pressed by the work holder 41 from above. In addition, compressed air is passed through the union tee 97 of the three-point air set 95 and the piping
7. When the air is supplied to the lower cylinder chamber of the air cylinder 31 via the pipe 91, the piston rod 33 is raised, and the work holder 41 is also raised.

When a dust collector (not shown) is operated in a state where the work W is pressed from above by the work holder 41, dust and the like on the work W are sucked from the ring holes 105 formed in the work holder 41. Pipe 103,
The dust is collected by the dust collector through the purge solenoid 45, the pipe 99, and the air three-piece set 95, and the work W is cleaned cleanly. Alternatively, the work W can be cleanly cleaned by injecting air from the ring hole 105.

As shown in FIG. 8, the laser processing head 17 is provided with a processing head main body 107, and a nozzle 19 for jetting an assist gas to the work W is provided below the processing head main body 107. It has. A lens holder 111 having a condensing lens 109 is provided in the processing head main body 107. The lens holder 111 is a lower end portion of a vertical adjustment cylinder 113 supported by the processing head main body 107 so as to be vertically adjustable. It is suitably attached to.

A nut member 115 rotatably supported only on the machining head main body 107 is screwed on the upper part of the vertical adjusting cylinder 113 so as to be relatively movable up and down. A worm 119 rotatably supported by the machining head main body 107 is engaged with a worm gear 117 provided integrally with the worm gear 117. The worm 119 is appropriately connected to a servo motor 123 having an encoder 121. The servo motor 123 is connected to the NC high power board 63 as an NC device, and the encoder 121 is connected to the controller 49 as an image processing device.

With the above configuration, when the servo motor 121 is driven, the worm gear 1
17 is rotated, and the nut member 115 and the vertical adjustment cylinder 113 are rotated.
By moving the lens holder 111 in the vertical direction through the lens, the position of the condenser lens 109 can be adjusted in the vertical direction. Therefore, when the servo motor 123 is driven by the command from the NC high power board 63 and the position of the condenser lens 109 is adjusted up and down, the position of the condenser lens 109 is detected by the encoder 121 and taken into the controller 49. .

When irradiating a laser beam from the laser processing head 17 toward the work W to perform laser processing on the work W such as a slit or a round hole, the condensing lens 109 is used.
Is required to be adjusted to an optimum focal position according to the material and the thickness of the work W.

In order to check whether the focal position of the condenser lens 109 has been adjusted to the optimal focal position, the focal position measured by the controller 49 using the image pickup device unit 21 is provided on the NC strong electric board 63. This is performed by the automatic focus reference position correction function.

That is, the automatic focus reference position correcting function is a function of automatically correcting the focus reference position in conjunction with the position adjusting device of the condenser lens 109. The focus reference position is a value serving as a reference for the focus position on the processing condition screen. In practice, the position of the condenser lens 109 at which the surface of the work W coincides with the focal position of the condenser beam is called the focus reference position.

Therefore, the cutting width when the work W is cut becomes narrowest when the focal position coincides with the surface of the work W.
09 is changed while changing the position of 09, the cutting width is imaged by the image capturing camera 25, and the controller 4
9, the position of the condenser lens 109 where the slit cutting width becomes the narrowest is automatically corrected as a focus reference position.

For example, a work W suitable for the work clamp 3
(The work W is optimally a thin plate that can be processed with a wide focus variation range. For example, SPCC 1.2 m
m is used). Next, the NC focus processing program is called and the laser processing head 17 is moved to the X position of the work W.
This operation is performed by manually moving the apparatus to a location where 80 × Y50 can be processed and starting a processing program.

During the piercing process before slitting the workpiece W or between the piercing process and the slitting process, a high-power laser beam is output with an optical system warm-up time, and the temperature of the optical system is made constant. When the slit processing is performed,
The amount of change between the start and end of cutting of each slit is smaller than before, and the width of each slit can be obtained accurately.

For example, if the position movement amount of the condenser lens 107 is 0.5 mm and the focus reference position before correction is 8.0 mm, the condenser lens 107 is moved to cut the slit as shown in FIG. Is performed. In FIG. 3, nine slits are cut, the amount of change in the start and end of each slit width is reduced, and the slit width is measured using the imaging device unit 21 in a stable state after warming up. Is done. As a result, the minimum cutting width and the focus position can be accurately selected.

The image processing apparatus (controller)
The measured data of the narrowest cutting width and the focus reference position measured at 49 are, as shown in FIG.
This is taken into comparison means 125 provided in the high-power board 63. The NC device 63 includes a memory 127.

Therefore, the measurement performed by the image processing device 49 is performed on the same work W, and the narrowest cutting width and the focus reference position are taken into the comparing means 125. Further, since the memory 127 stores initial data immediately after the initial adjustment of the lens or mirror with a new one, the initial data is taken into the comparing means 125 and compared with the measured data. As a result, it is possible to diagnose the progress of the deterioration of the lens and the mirror. Further, by comparing the initial data and the measurement data when the cutting failure occurs, the lens and the mirror can be maintained before the cutting failure occurs.

The measurement performed by the image processing device 49 is performed under the same work W with different output conditions, for example, a low output process condition and a high output process condition. 125. Further, since the difference of the initial data immediately after the adjustment of the initial lens or mirror is new is taken into the memory 127, the difference of the initial data is taken into the comparing means 123 so that the comparison is made. It is possible to diagnose the progress of the deterioration. By comparing the measured data at the time of the cutting failure and the difference between the initial data on a regular basis,
Maintenance of lenses and mirrors can be performed before a cutting failure occurs.

The deterioration of the optical system is caused by a change in the focus reference position. That is, the focus reference positions before and after warming up when the optical system is warmed up with a laser beam before performing the slit processing are measured, and the difference is taken into the NC device 63, and the tolerance is stored in the memory 127 in advance. By comparing with the value, it is possible to accurately and easily diagnose the deterioration state of the optical system.

The measurement operation will be described with reference to the flowchart of FIG. 1. In step S1, a detection start command is issued, and in step S2, the CCD camera 25 of the imaging device unit 21 is positioned just above the slit. In step S3, the ring illumination 35 is turned on and the work holder 41 is lowered to hold the work W. Step S
After the image data at the slit cutting width is picked up by the CCD camera 25 at step 4, the controller 49 at step S5.
The image data is captured and processed.

In step S6, the ring light 35 is turned off and the work holder 41 is raised. Step S7
The cutting width measured in is stored. Next, it is determined whether or not the number of slits has become nine. If the number has not become nine, the process returns to step S2 and is repeated. When the number of slits becomes nine, the narrowest cutting width is selected from among the measured cutting widths in step S9, and the condenser lens 107 is moved to a focus reference position corresponding to the cut width. The focus position adjustment ends.

Next, in step S10, the focus reference position is taken into the comparing means 125 of the NC high-power board 63 of the NC unit, and in step S11, the data is compared with the initial data stored in the memory 127, and the condensing lens and the mirror are compared. Diagnosis of a deterioration situation such as is performed.

The measurement of the narrowest cutting width and the focus reference position corresponding to this cutting width are periodically performed on the same work W, and the measured data and the initial collection stored in the memory 127 in advance are measured. By taking the initial data immediately after the adjustment of the optical lens or the mirror as new and taking it into the comparing means 125 and comparing the data, it is possible to diagnose the progress of the deterioration of the condenser lens or the mirror. In addition, the above-mentioned measurement data at the time of the occurrence of the cutting failure is set, and the measured set value is compared with the measurement data which is periodically measured.
By making the comparison in 5, maintenance of the condenser lens and the mirror can be performed before a cutting failure occurs. Therefore, processing defects can be reduced.

The above-mentioned measurement is performed under low-power processing conditions and high-power processing conditions, and the difference between the focal positions is compared with the initial data immediately after adjusting the initial condenser lens or mirror with a new one by the comparison means 125. This makes it possible to diagnose the progress of deterioration of the condenser lens and the mirror. In addition, by setting the measurement data at the time of the occurrence of the cutting failure, and comparing the measured set value with the measurement data that is periodically measured by the comparing means 125, Maintenance of the condenser lens and mirror can be performed. Therefore, processing defects can be reduced.

The present invention is not limited to the above-described embodiment, but can be embodied in other forms by making appropriate changes. Although the laser machine has been described, the multifunction machine can also be used.

[0054]

As will be understood from the above embodiments, according to the first and sixth aspects of the present invention, the focal position of the condenser lens can be varied from the laser processing head provided on the Y-axis carriage. The workpiece is irradiated with the laser beam while being changed, and a plurality of slits are formed on the workpiece. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. The measured focus reference position and the measured data of the narrowest cutting width are taken into the comparing means of the NC device, and are compared with preset initial data stored in a memory in advance, so that a condensing lens and a mirror are obtained. It is possible to diagnose the state of deterioration of the optical system such as.

According to the second and sixth aspects of the present invention, the laser beam is radiated onto the work by changing the focal position of the condenser lens from the laser processing head provided on the Y-axis carriage, thereby forming a plurality of slits on the work. Is performed. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. This measurement is periodically performed on the same work. Each time, the measurement data of the narrowest cutting width and the focus reference position is taken into the comparing means of the NC device, and the preset initial data stored in the memory is stored. Is compared to Then, the compared change amount and the set change when the processing failure occurs are taken into the judging means and compared and judged, so that it is possible to diagnose the progress of deterioration of the condenser lens, the mirror and the like. Thus, processing defects can be reduced.

According to the third and sixth aspects of the present invention, the laser beam is radiated to the work by changing the focal position of the condensing lens from the laser processing head provided on the Y-axis carriage so that a plurality of slits are formed on the work. Is performed. The plurality of processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage, and the ring illumination is turned on and the work holder is lowered to hold the work. Then, the image capturing camera captures the image data of the cutting width in each slit and sends the image data to the image processing apparatus. The image processing apparatus measures each cutting width, and accurately determines the focus position at the narrowest cutting width among the measured cutting widths as the focus reference position of the condenser lens. This measurement is performed on the same workpiece under different processing conditions with different outputs, and the difference between the measured focus reference and the difference between the preset initial data is taken into the comparing means of the NC device and compared, and the light is collected by the condenser lens. Thus, the degree of deterioration of the mirror can be diagnosed. Thus, processing defects can be reduced.

According to the fourth and sixth aspects of the present invention, the optical system is warmed up by a laser beam by providing an optical system warm-up time to the workpiece during piercing before slitting or between piercing and slitting. Since the amount of change between the start and end of each slit is smaller than in the past, the minimum cut width and the focal position can be measured accurately. As a result, diagnosis of the optical system can be performed accurately and easily.

According to the fifth and sixth aspects of the present invention, the focus reference position before and after warming up the optical system is measured, and the difference is taken into the NC unit and compared with a preset allowable value. Diagnosis of the deterioration state of the optical system can be performed accurately and easily.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating the operation of the present invention.

FIG. 2 is a configuration block diagram illustrating the present invention.

FIG. 3 is an explanatory diagram for performing slit processing on a work when checking a focal position.

FIG. 4 is an explanatory diagram illustrating a laser processing machine according to the present invention.

5A is a plan view of the controller, FIG. 5B is a front view in FIG. 5A, FIG. 5C is a right side view in FIG. 5A, and FIG. 5D is a left side view in FIG.

FIG. 6 is a system configuration diagram of an electric system.

FIG. 7 is a system configuration diagram of an air system.

FIG. 8 is an explanatory diagram for moving a condenser lens in a laser processing head up and down.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser processing machine 3 Work clamp 15 Y-axis carriage 17 Laser processing head 21 Imaging device unit 23 Imaging device unit case 25 CCD camera (camera for image capture) 31 Air cylinder 35 Ring illumination 41 Work holder 49 Controller (Image processing device) 63 NC high power board (arithmetic processing unit) 73 NC operation panel 107 Condensing lens 125 Comparison means 127 Memory

Claims (6)

[Claims] 1. A laser processing head provided on a Y-axis carriage and provided with a condenser lens capable of adjusting a focal position, irradiating a laser beam to the work by changing the focal position variously, and forming a plurality of slits on the work. After processing, the processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage,
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. The image data was sent to the image processing apparatus to measure the respective cutting width, the focal position at the narrowest cutting width of the measured cutting width as the focus reference position of the condenser lens, this measured The measurement data of the narrowest cutting width and focus reference position is taken into the NC device,
An optical system diagnosis method for a laser beam machine, wherein the measurement data is compared with preset initial data in an apparatus. 2. A laser processing head provided on a Y-axis carriage and having a focusing lens capable of adjusting a focal position, irradiating a laser beam onto the work by changing the focal position variously, and forming a plurality of slits on the work. After processing, the processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage,
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. The cutting width at which the image data was sent to the image processing apparatus was measured, and the focal position at the narrowest cutting width among the measured cutting widths was used as the focus reference position of the condensing lens. Each time, the measurement data of the narrowest cutting width and the focus reference position is taken into the NC device, and each of the measurement data and the preset initial data stored in the memory are stored in the memory. And determining whether the amount of change has approached the amount of change set when a machining defect occurred. Optical system diagnostic method in processing machines. 3. A plurality of slits are formed on a work by irradiating a work with a laser beam from a laser processing head provided on a Y-axis carriage and having a focusing lens capable of adjusting a focus position by changing the focus position variously. After processing, the processed slits are positioned immediately below the imaging device unit provided in the Y-axis carriage,
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. Image data is sent to the image processing device to measure the respective cutting width, the focus position in the narrowest cutting width of the measured cutting width as the focus reference position of the condenser lens, this measurement, An optical system diagnostic method for a laser beam machine, wherein the method is performed under the same work under different processing conditions, and a difference between the measured focus reference position and a difference between preset initial data are compared. 4. The method of diagnosing an optical system in a laser processing machine according to claim 1, wherein the warming of the optical system is performed by the laser beam before a plurality of slits are formed on the workpiece. 5. A laser processing head provided on a Y-axis carriage and provided with a focusing lens capable of adjusting a focal position, irradiating a laser beam onto the work by changing the focal position variously, and forming a plurality of slits on the work. Warm the optical system before performing the processing, and then perform slit processing, and then position the processed plurality of slits directly below the imaging device unit provided in the Y-axis carriage.
The ring illumination in the image pickup device unit is turned on and the work press in the image pickup device unit is lowered to hold the work, and then the image capturing camera in the image pickup device unit captures the image data of the cutting width in each of the slits. The image data was sent to the image processing apparatus to measure the respective cutting width, the focal position at the narrowest cutting width of the measured cutting width as the focus reference position of the condenser lens, this measured An optical system diagnosis in a laser beam machine, wherein a comparison is made between a focus reference position and a focus reference position before warm-up is performed, and the difference is taken into an NC device to diagnose a deterioration state of an optical system in the NC device. Method. 6. A laser processing head provided on a Y-axis carriage movable in the Y-axis direction and provided with a condenser lens whose focal position can be adjusted, and a ring provided on the Y-axis carriage and movable up and down. An imaging device unit having illumination and a work holder and having an image capturing camera; an image processing device which captures image data captured by the image capturing camera and performs image processing; and an image processing device which processes and measures the image data. The difference between the focus reference position and the measurement data of the narrowest cutting width or the focus reference position,
An NC device having a comparing unit for comparing with preset initial data stored in the memory or a difference between the initial data,
An optical system diagnostic device for a laser beam machine, comprising: