JPH10256788A - Electronic component attaching apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate mis-joint, or the like by providing a carrier for carrying a tray, mounting an electronic component to the electronic component holding position of an electronic component holder and holding the electronic component, without touching the tray to a solder joint thereby avoiding contamination of the solder joint or adhesion of dust thereto. SOLUTION: In an electronic component carrier, an electronic component 3 is mounted on a tray provided with a pair of arms 52 for holding the corner parts of the electronic component 3 which is thereby held, without touching a ball solder B being bonded to the bottom face thereof. Specifically, the pair of holding arms 52 are provided at a rectangular part 52a along the side face at the diagonal part of the electronic part 3, with a narrow step part 52b which abuts against the lower surface of the electronic component 3 which is thereby held by the step part 52b and the rectangular part 52a without rattling. According to the arrangement, contamination of the solder joint and the adhesion of dust thereto can be avoided, while preventing the generation of mis-joint and deterioration.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of an electronic component mounting apparatus for mounting an electronic component on a circuit board.

[0002]

2. Description of the Related Art In general, among such electronic component mounting devices, there are a circuit board holding device for holding a circuit board in a horizontal position, and an electronic component for holding an electronic component above the circuit board holding device.
In addition, there is a device including an electronic component holding device for lowering the held electronic component to a position above the circuit board, and a solder melting device for supplying hot air to the electronic component on the circuit board to melt the solder.

[0003]

By the way, in the electronic component mounting device, it is necessary to supply the electronic component to the electronic component holding device every time the electronic component is mounted. Since the electronic parts were directly supplied to the nozzle part by hand, it was not inferior to workability,
There was a possibility that the solder joints of the electronic components would be soiled. Therefore, it has been proposed to provide an electronic component transfer device that transfers a tray on which electronic components are placed to an electronic component holding position of the electronic component holding device. However, a conventional tray holds a bottom portion of the electronic component. Therefore, when a BGA-type electronic component having a solder joint on the bottom surface is mounted, dust in the tray adheres to the solder joint and there is a problem that a joining error or deterioration occurs. .

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve these problems in view of the above situation, and has a circuit board holding device for holding a circuit board in a horizontal posture. An electronic component holding device that holds an electronic component above the circuit board holding device and lowers the held electronic component to a position above the circuit board; and a solder that supplies hot air to the electronic component on the circuit board to melt the solder. An electronic component mounting device comprising: a melting device, wherein the electronic component mounting device is provided with an electronic component transfer device that transfers a tray on which the electronic component is mounted to an electronic component holding position of the electronic component holding device; The tray has a shape capable of holding an electronic component without coming into contact with a solder joint. That is, workability can be improved as compared with the case where the electronic component is directly supplied to the electronic component holding device, and the electronic component can be supplied without contacting the solder joint. It is possible to prevent contamination and adhesion of dust, thereby preventing the occurrence of bonding errors and deterioration. Further, the tray is provided with a pair of holding portions for holding diagonal portions of the electronic components, and the pair of holding portions is capable of adjusting its position in a diagonal direction according to the size of the electronic component to be placed. is there. That is, various electronic components having different sizes can be held while holding the electronic components without contacting the solder joint.

[0005]

Next, one embodiment of the present invention will be described with reference to the drawings. In the drawings, reference numeral 1 denotes a rework machine for attaching and detaching an electronic component 3 mounted on a circuit board 2, and the rework machine 1 includes a circuit board 2
A holding device 4 for holding the electronic component 3, an electronic component holding device 5 for holding the electronic component 3, a solder melting device 6 for melting the solder, an electronic component transfer device 7 for transferring the electronic component 3 to a holding position of the electronic component holding device 5, A positioning device 8 used in various positioning processes to be described later, a controller 9 for controlling each device, and the like are provided. Then, the reworking machine 1 of the present embodiment
Then, the mounting and dismounting of the BGA device, in which the fine ball solder B is previously bonded to the terminals arranged on the bottom surface of the component, are mainly performed on the printed circuit board on which the wiring pattern is pre-printed on the insulating substrate. Are as before.

The substrate holding device 4 includes a fixed table 10
A pair of front and rear X-direction guide rails 11 fixed upward and in the left-right direction, and a pair of left and right Y-directions guided by the pair of X-direction guide rails 11 so as to be slidable in the X direction (slidably in the left and right directions). The guide rail 12 includes a board holding table 13 and the like, which are guided by the pair of Y-direction guide rails 12 so as to be slidable in the Y-direction (slidable in the front-rear direction). That is, the circuit board 2 held in a horizontal posture on the board holding table 13 is moved along the guide rails 11 and 12 in the X-direction.
Although it is possible to displace in the Y direction, one of the pair of holding plates 14 and 15 for holding the end of the circuit board 2 in the Y direction on the board holding table 13 is provided.
Can be displaced in the Y direction based on the operation of the board size adjustment knob 16, so that various circuit boards 2 having different sizes can be held on the board holding table 13.

An X-direction fine adjustment mechanism 17X is provided between the fixed table 10 and the Y-direction guide rail 12. The X-direction fine adjustment mechanism 17X is
0, a fine adjustment screw shaft 17a rotatably provided in the X direction, a fine adjustment knob 17b integrally provided at one end of the fine adjustment screw shaft 17a, and a stay 17c on the Y direction guide rail 12 via a stay 17c. Fine adjustment bracket 17d integrally provided, fine adjustment bracket 17d
Plate 17e and a mesh release lever 17f supported so as to be able to swing up and down, and an elastic machine 17g for urging the mesh plate 17e and the mesh release lever 17f in the approaching direction with the fine adjustment screw shaft 17a sandwiched therebetween. ing. Since the engagement groove for engaging with the fine adjustment screw shaft 17a is formed on the lower surface of the engagement plate 17e, the X position of the substrate holding table 13 can be finely adjusted based on the operation of the fine adjustment knob 17b. However, when the mesh release lever 17f is pushed down,
The X position of the substrate holding table 13 can be roughly adjusted because the engagement plate 17e interlockingly linked via the pair of gears 17h swings upward to release the engagement with the fine adjustment screw shaft 17a. Has become. In addition, 17Y
Is a Y-direction fine adjustment mechanism configured between the Y-direction guide rail 12 and the substrate holding table 13. Since the Y-direction fine adjustment mechanism 17Y is configured in substantially the same manner as the X-direction fine adjustment mechanism 17X. , The same reference numerals as in the X-direction fine adjustment mechanism 17X are attached to the drawings, and detailed description is omitted.

Reference numeral 18 denotes a bottom heater mounted on the substrate holding table 13, and the bottom heater 18
Hot air that is pressure-fed through a heating device (not shown) is supplied to the bottom surface of the circuit board 2. That is, when the solder melting device 6 supplies hot air from above the circuit board 2 to melt the solder, the bottom heater 18 supplies hot air from below the circuit board 2 to accelerate the melting of the solder, To prevent the circuit board 2 from warping due to the heating of
The bottom heater 18 of the present embodiment includes a local heater section 18a for supplying hot air to the electronic component mounting position, and a full-surface heater section 18b for supplying hot air to the entire lower surface of the circuit board 2, and each of the heater sections 18a and 18b has On the other hand, it is configured to send hot air under pressure through independent heating devices, so that the heating temperature of the local heater section 18a and the entire heater section 18b can be adjusted independently.

On the other hand, the electronic component holding device 5 has a pickup pipe 20 having a pickup nozzle 19 at a lower end, a pickup bracket 21 for supporting the pickup pipe 20 in a vertical position, and a guide for vertically moving the pickup bracket 21. A pickup guide rail 22, a pickup screw shaft 24 screwed to a nut member 23 provided on the pickup bracket 21 side, a pickup elevating motor 25 for vertically moving the pickup bracket 21 up and down based on forward and reverse driving of the pickup screw shaft 24, and the like. It is configured. Since a pump (not shown) for supplying a negative pressure is connected to the pickup pipe 19, a negative pressure is supplied to the pickup pipe 20 when the pickup nozzle 19 is in contact with the electronic component 3. By doing so, the electronic component 3 can be sucked and held.
Reference numeral 26 denotes an origin detection sensor (magnetic sensor or the like) for detecting the origin position (upper limit position) of the pickup bracket 21.

Reference numeral 27 denotes a pickup boss provided between the pickup pipe 20 and the pickup bracket 21. The pickup boss 27 supports the pickup pipe 20 so that it cannot rotate around a vertical axis. The pickup pipe 20 is allowed to move up and down within the range, and the pickup pipe 20 is urged downward via an elastic machine (not shown). That is, when the pickup nozzle 19 comes into contact with the electronic component 3 during the downward drive of the pickup elevating motor 25, the pickup pipe 20 is retracted upward against the urging force of the ammunition, and this is provided on the pickup bracket 21. Contact detection sensor 29
And the motor drive is stopped.

By the way, the pickup boss 27
A pickup fine adjustment mechanism that is rotatably supported (around a vertical axis) with respect to the pickup bracket 21 via a bearing 30 and that adjusts the rotation angle between the pickup boss 27 and the pickup bracket 21. 3
Fine adjustments can be made based on the operation (1). That is, the fine adjustment screw shaft 33 screwed to the plate 32 on the pickup bracket 21 side so as to be able to advance and retreat in the left-right direction, the fine adjustment knob 34 integrally provided at one end of the fine adjustment screw shaft 33, and the pickup boss 27 are counterclockwise. In the pickup fine adjustment mechanism 31, which comprises a rotating device 35 that biases in the circumferential direction, a stopper 36 that contacts the other end of the fine adjustment screw shaft 33, and restricts the rotation of the pickup boss 27, the pickup boss It is possible to finely adjust the rotation angle of the pickup nozzle 19 that rotates integrally with 27 based on the advance / retreat operation of the fine adjustment screw shaft 33. Are independent of each other, even after the pickup nozzle 19 holds the electronic component 3, the rotation angle of the Thereby making it possible to fine-tune.

The solder melting device 6 includes a reflow boss 38 for supporting a reflow nozzle 37, a reflow bracket 41 for supporting the reflow boss 38 via a vertical position fine adjustment mechanism 39 and a stay 40, and a vertical movement of the reflow bracket 41. It comprises a reflow guide rail 42 for guiding freely, a reflow lifting cylinder 43 for raising and lowering the reflow bracket 41 up and down, and the like. When the reflow nozzle 37 is lowered to the holding position of the circuit board 2 and hot air (pressurized air heated to the solder melting temperature) is supplied to the reflow nozzle 37 through the reflow pipe 44, the solder melts. The electronic component 3 can be removed or attached, but the reflow nozzle 37 of the present embodiment is formed in a tubular shape so as to cover the side of the electronic component 3. , The thermal damage to the non-heat-resistant component can be avoided as much as possible.

The reflow nozzle 37 is rotatably supported (around a vertical axis) with respect to the reflow boss 38 via a bearing 45, and the rotation angle between the reflow nozzle 37 and the reflow boss 38 is adjusted. Fine adjustment can be performed based on the operation of the reflow fine adjustment mechanism 46 arranged between the two. That is, a fine adjustment screw shaft 47 screwed to the reflow boss 38 side to be able to advance and retreat in the left-right direction, a fine adjustment knob 48 integrally provided at one end of the fine adjustment screw shaft 47, and a reflow nozzle 37 are attached in a counterclockwise direction. Momentum 49, fine adjustment screw shaft 4
Reflow fine adjustment mechanism 4 including a stopper 50 for restricting the rotation of the reflow nozzle 37 by contacting the other end of the reflow nozzle 37
In 6, the rotation angle of the reflow 37 can be finely adjusted based on the advance / retreat operation of the fine adjustment screw shaft 47, but the reflow fine adjustment mechanism 46 is independent of the electronic component holding device 5. Therefore, even after the pickup nozzle 19 holds the electronic component 3, the reflow nozzle 3
7 can be finely adjusted independently.

The electronic component transport device 7 includes a tray 51 on which the electronic components 3 are placed, a tray guide rail (not shown) for guiding the tray 51 to be movable in the left and right directions, and It is composed of a tray moving cylinder (not shown) etc. for moving to
Since the tray 51 is provided with a pair of holding arms 52 for holding the diagonal portions of the electronic component 3, the electronic component 3 can be held without contacting the ball solder B bonded to the bottom surface of the electronic component 3. Is available. Incidentally, the holding arm 52 of the present embodiment has a narrow step portion 52b in contact with the lower surface of the electronic component 3 at a right angle portion 52a along the diagonal side surface of the electronic component 3, and the step portion 52b and The right angle portion 52a is formed so as to hold the electronic component 3 without play.

Further, on the tray 51, a pair of arm guide rails 53 for supporting a pair of holding arms 52 movably in a diagonal direction, and project from the base end of each holding arm 52 along the arm guide rail 52. A pair of racks 54, a pinion gear 55 that meshes with the pair of racks 54 at the same time, a size fine adjustment knob (not shown) that can rotate the pinion gear 55, and the like are provided. That is, since the pair of holding arms 54 simultaneously move in the approaching direction or the separating direction with the operation of the size fine adjustment knob, the size of the electronic component that can be held by the pair of holding arms 54 can be changed without changing the center position. It can be fine-tuned. In the present embodiment, the entire position of the tray 51 can be finely adjusted in the X and Y directions, and the electronic component 3 for the positioning device 8 is adjusted based on the fine adjustment operation.
Can be centered.

On the other hand, reference numeral 56 denotes an image reflecting device provided in the positioning device 8, and the image reflecting device 56 reflects an image taken in from an upper window 56a horizontally to one side, and downwardly. A half mirror 57 that horizontally reflects the image captured from the window 56b toward the other side,
The lower image reflected by the normal mirror 58 is transmitted through the half mirror 57 and the upper image is reflected upward by the normal mirror 58 that reflects the lower image reflected by the half mirror 57 again toward the half mirror 57. It is designed to polymerize on the image. Then, the upper image and the lower image synthesized in a superimposed state are photographed by a reflection image photographing device (CCD camera) 59, and the photographed image is enlarged and displayed on a positioning monitor 60. The centering of the component 3 and the positioning device 8, the positioning of the reflow nozzle 37 and the circuit board 2, the positioning of the electronic component 3 held by the pickup nozzle 19 and the circuit board 2, and the like can be performed easily and accurately. It has become.

The image reflecting device 56 is supported so as to be capable of moving forward and backward along the positioning guide rail 61, and is located below the set position of the tray 51 based on the expansion and contraction operation of the positioning moving cylinder 62. Movement control is performed to a positioning position, a second positioning position located between the reflow nozzle 37 (pickup nozzle 19) and the circuit board 2, a retreat position retracted to the left from the second positioning position, and the like. The reflection image photographing device 59 is integrally movably connected to the device 56, and the direction of the reflection image photographing device 59 is matched with the moving direction of the image reflecting device 56 and the image reflecting direction. That is, the reflection image photographing device 59
Can be retracted to the side integrally with the image reflecting device 56, so that the flux gas (pine resin) generated when the solder is melted is lower than that in which the reflected image photographing device 59 is fixed above the circuit board holding device 4. Gas) or hot gas (hot air), the space for the reciprocating movement of the reflection image photographing device 59 can be made as small as possible, and the mirror of the image reflection device 56 The number can be minimized.

A shutter 63 is provided between the second positioning position and the retracted position. The shutter 63 is supported movably up and down along a shutter guide rail (not shown). Opening / closing is controlled based on the expansion / contraction operation of an opening / closing cylinder (not shown). When the solder is not melted, the shutter 63 is opened to allow the movement of the image reflecting device 56 and the reflected image photographing device 59. However, when the solder is melted, the space between the image reflecting device 56 retracted to the retracted position and the reflow nozzle 37 is released. Is shielded by the shutter 63 so that the influence of the flux gas or the like on the image reflecting device 56 and the reflected image photographing device 59 can be further reduced.

The controller 9 is constituted by using a microcomputer, and has, on its input side, the origin detecting sensor 26 for detecting the position of the reflow nozzle 19, the contact detecting sensor 29, A reflow position detection sensor (not shown) that detects the position of the nozzle 37, a tray position detection sensor (not shown) that detects the position of the tray 51, and a reflection device position detection sensor that detects the position of the image reflection device 56 (FIG. Not shown), shutter 6
A shutter position detection sensor (not shown) for detecting the position of the third position; a next process switch 65 provided on the operation panel 64;
Are connected via an input interface, and on the output side, a pickup elevating motor 25 for controlling the movement of the pickup nozzle 19, a reflow elevating cylinder 43 for controlling the movement of the reflow nozzle 37, and a tray moving cylinder for controlling the movement of the tray 51. Positioning cylinder 62 for controlling movement of image reflecting device 56, shutter opening / closing cylinder for controlling opening / closing of shutter 63, local heater section 18a
A local heater relay (not shown) for switching hot air supply to the heater, a full-surface heater relay (not shown) for switching hot air supply to the entire heater section 18b, and a pickup relay (not shown) for switching negative pressure supply to the pickup nozzle 19 ), A reflow relay (not shown) for switching hot air supply to the reflow nozzle 37, an operation guide display panel (liquid crystal display) 66 provided on the operation panel 64, and the like are connected via an output interface. That is,
The controller 9 includes control routines such as “electronic component removal control” for executing the electronic component removal process stepwise and “electronic component attachment control” for performing the electronic component attachment process stepwise. ”And“ Electronic component mounting control ”will be described with reference to flowcharts.

The "electronic component removal control" is defined as 4
And the next process switch 6
The process is shifted to the next step based on the operation of step 5, but first, in "STEP 0" executed immediately after the start of "electronic component removal control", the pickup nozzle 19, the reflow nozzle 37, the tray 51 , The image reflecting device 56 and the shutter 63 are moved to the origin positions (elevated position, elevated position, set position, retracted position, open position), and the local heater relay, the full-surface heater relay, the pickup relay, and the reflow relay are maintained in the OFF state. Further, on the operation guide display panel 66, a message for requesting the setting of the circuit board 2 with respect to the circuit board holding device 4 is displayed.

In "STEP 1", the reflow nozzle 37 is moved to the focal position, the image reflecting device 56 is moved to the second positioning position, and the operation guide display panel 66 is provided with the reflow nozzle 37 A message for requesting positioning with the circuit board 2 (mounted electronic component 3) is displayed.

In "STEP 2", the image reflecting device 56 is moved to the retracted position and the pickup nozzle 19 and the reflow nozzle 37 are lowered to the substrate position. At this time, the shutter 63 is closed at a predetermined timing. It is made to let. Then, the pickup nozzle 19 and the reflow nozzle 37
When the electronic component 3 is determined to have moved down to the substrate position, hot air is supplied from the reflow nozzle 37 to the electronic component 3 for a predetermined time to melt the solder.
, And the held electronic component 3 is detached from the circuit board 2 with the raising operation of the pickup nozzle 19.

Further, in "STEP 3", a message indicating that the electronic component 3 is to be released is displayed on the operation guide display panel 66, and after a predetermined time, the pick-up relay is turned off and the electronic nozzle held by the pick-up nozzle 19 is held. The component 3 is released, and a series of electronic component removal steps is completed with this.

On the other hand, the "electronic part mounting control"
It is configured to perform the following steps, and is configured to shift to the next step based on the operation of the next step switch 65. First, in “STEP 10” executed immediately after the start of “electronic component mounting control” Moves the pickup nozzle 19, the reflow nozzle 37, the tray 51, the image reflecting device 56, and the shutter 63 to the origin positions (elevated position, elevated position, set position, retracted position, and open position), and also switches the local heater relay and the entire surface heater. The relay, the pickup relay, and the reflow relay are maintained in the OFF state, and the operation guide display panel 66 displays a message requesting the circuit board holding device 4 to set the circuit board 2 and a message requesting the tray 51 to set the electronic component 3. And are displayed.

In step 11, the image reflecting device 56 is moved to the first positioning position, and a message for requesting centering of the electronic component 3 with respect to the image reflecting device 56 is displayed on the operation guide display panel 66. It has become.

In "STEP 12", the reflow nozzle 37 is moved to the focal position, the image reflecting device 56 is moved to the second positioning position, and the operation guide display panel 66 is provided with the reflow nozzle 37 A message for requesting positioning with the circuit board 2 is displayed.

In step 13, the reflow nozzle 37 is retracted upward, and the tray 51 is retracted.
Is moved to a position below the pickup nozzle 19, and then the pickup nozzle 19 is lowered to the electronic component contact position to suck and hold the electronic component 3.
Is held, the pickup nozzle 19 is once raised to retract the tray 51, and the pickup nozzle 19 is lowered again to the focal position. Further, the electronic component 3 and the circuit board 2 are displayed on the operation guide display panel 66. Is displayed.

In step 14, the image reflecting device 56 is moved to the retracted position and the pickup nozzle 19 and the reflow nozzle 37 are lowered to the substrate position. At this time, the shutter 63 is closed at a predetermined timing. It is made to let. Then, the pickup nozzle 19 and the reflow nozzle 3
When it is determined that the nozzle 7 has moved down to the substrate position, hot air is supplied from the reflow nozzle 37 to the electronic component 3 for a predetermined time to melt the solder, and then the pickup nozzle 19 and the reflow nozzle 37 are raised to mount a series of electronic components. The process is terminated.

In the apparatus constructed as described above, between the electronic component 3 held by the pickup nozzle 19 and the circuit board 2 held by the board holding device 4, or between the reflow nozzle 37 and the circuit board 2 In addition, an image reflecting device 56 for reflecting the upper and lower images in the horizontal direction is disposed so as to be able to advance and retreat in the horizontal direction. The electronic component 3 and the circuit board 2 based on the display.
And the positioning of the reflow nozzle 37 and the circuit board 2. Since the reflection image photographing device 59 is integrally connected to the image reflection device 56, the reflection image photographing is performed when the solder is melted. The device 59 is connected to the image reflecting device 56
And can be retracted in the horizontal direction integrally. Therefore, the reflection image photographing device 5 is placed above the circuit board holding device 4.
9 as compared with the fixed arrangement of the reflection image photographing device 59.
Therefore, the influence of the flux gas or the hot gas can be reduced, and as a result, the life of the reflection image photographing device 59 can be extended by preventing the damage due to the flux gas or the like.

Further, since the direction of the reflection image photographing device 59 is made coincident with the moving direction of the image reflecting device 56 and the image reflecting direction, the space for moving the reflecting image photographing device 59 forward and backward can be made as small as possible. Without being allowed to do so, the number of mirror members constituting the image reflecting device 56 can be minimized.

An openable and closable shutter 63 is provided between the retracted position of the image reflecting device 56 and the solder melting position of the reflow nozzle 37 to shield gas generated when the solder is melted.
Is provided, the influence of the flux gas or the like on the reflection image photographing device 59 and the image reflection device 56 can be further reduced, and as a result, the reflection image photographing device 5
9, and the possibility that the image reflecting device 56 is damaged by the influence of the flux gas or the like can be further reduced.

Further, a tray 51 for transferring the electronic component 3 to the holding position of the pickup nozzle 19 is provided, and the tray 51 is formed in a shape capable of holding the electronic component 3 without contacting the ball solder B. The workability can be improved as compared with the case where the electronic component 3 is directly supplied to the nozzle 19 by hand, and it is possible to avoid the contamination of the ball solder B and the adhesion of dust, thereby causing a bonding error and deterioration. Can be prevented.

The tray 51 is constituted by a pair of holding arms 52 for holding the diagonal portions of the electronic component 3, and the pair of holding arms 52 are diagonally connected according to the size of the electronic component 3 to be placed. Since the position can be adjusted in the direction, the electronic component 3 can be held without contacting the ball solder B, and various electronic components 3 having different sizes can be placed.

The pickup nozzle 19 and the reflow nozzle 37 are rotatably supported around a vertical axis, respectively, and the nozzles 19 and 37 are operated based on the operation of the pickup fine adjustment mechanism 31 and the reflow fine adjustment mechanism 46. Can be independently fine-tuned, so that even after the pickup nozzle 19 holds the electronic component 3, the relative rotation angle between the held electronic component 3 and the reflow nozzle 37 can be adjusted. Will be possible. Therefore,
Accurate positioning at the stage of supplying the electronic component 3 to the pickup nozzle 19 is not required, so that workability can be improved, and the reflow nozzle 37 is set to a minimum size suitable for the size of the electronic component 3. Therefore, it is possible to cope with mounting electronic components on a high-density mounting board.

The present invention is, of course, not limited to the above-described embodiment. For example, the upper and lower windows 56a and 56b of the image reflecting device 56 may be opened and closed to shield gas generated during solder melting. It is also possible to provide a flexible shutter (not shown). In addition, in the case of such a configuration, the influence of the flux gas or the like on the image reflecting device 56 can be further reduced, so that the possibility that the image reflecting device 56 is damaged by the influence of the flux gas or the like is further reduced. Can be.

[Brief description of the drawings]

FIG. 1 is a front view of a rework machine.

FIG. 2 is a side view of the same.

FIG. 3 is a plan view of the same.

FIG. 4 is a plan view of the circuit board holding device.

FIG. 5 is a front view of the same.

FIG. 6 is a side view of the same.

FIG. 7A is a plan view of a main part of the above, and FIG. 7B is a front view of the main part of the same.

FIG. 8A is a plan view of a bottom heater, and FIG. 8B is a front view.

FIG. 9 is a front view of the electronic component holding device and the solder melting device.

FIG. 10A is a front view of a pickup fine adjustment mechanism,
(B) is a plan view.

FIG. 11 is a plan view of a reflow fine adjustment mechanism.

12A is a plan view of a main part of the tray, and FIG. 12B is a cross-sectional view of the main part.

FIG. 13 is a schematic front view showing each position of the image reflection device.

FIG. 14 is a block diagram showing input / output of a controller.

FIG. 15 is a flowchart of “electronic component removal control”.

FIG. 16 is a flowchart of “STEP 0”.

FIG. 17 is a flowchart of “STEP 1”.

FIG. 18 is a flowchart of “STEP 2”.

FIG. 19 is a flowchart of “STEP 3”.

FIG. 20 is a flowchart of “electronic component attachment control”.

FIG. 21 is a flowchart of “STEP 10”.

FIG. 22 is a flowchart of “STEP 11”.

FIG. 23 is a flowchart of “STEP 12”.

FIG. 24 is a flowchart of “STEP 13”.

FIG. 25 is a flowchart of “STEP 14”.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rework machine 2 Circuit board 3 Electronic component 4 Circuit board holding device 5 Electronic component holding device 6 Solder melting device 7 Electronic component conveying device 8 Positioning device 9 Controller 19 Pickup nozzle 31 Pickup fine adjustment mechanism 37 Reflow nozzle 46 Reflow fine adjustment mechanism 51 Tray 52 Holding arm 56 Image reflection device 59 Reflection image photographing device 60 Positioning monitor 63 Shutter 64 Operation panel 66 Operation guide display panel

Continued on the front page (72) Inventor Yuji Shimada 2-242 Taiseicho, Koshigaya-shi, Saitama Tomita Co., Ltd.

Claims (2)

[Claims] A circuit board holding device for holding a circuit board in a horizontal position, an electronic component holding device for holding an electronic component above the circuit board holding device, and lowering the held electronic component onto the circuit board. And a solder melting device for supplying hot air to the electronic components on the circuit board to melt the solder, wherein the electronic component holding device holds the tray on which the electronic components are placed. An electronic component mounting device provided with an electronic component transport device that transports the electronic component to an electronic component holding position of the device, and wherein the tray has a shape capable of holding an electronic component without contacting a solder joint. 2. The tray according to claim 1, further comprising: a pair of holding portions for holding diagonal portions of the electronic components, wherein the pair of holding portions are positioned diagonally in accordance with the size of the electronic components to be placed. Adjustable electronic component mounting device.