JPH10256707A - Resin wiring board and manufacture therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately provide wiring patterns, without the reductions in the heights of the outer peripheral wiring patterns caused by their polishings, in a resin wiring board having desired wiring patterns on a core board. SOLUTION: On each principal surface of a core board 2, there are formed both desired wiring patterns 8 with a resin layer formed therebetween and thereon, which is scheduled to be so polished and removed thereafter, that at least resin layers 13 are left therebetween and the top surfaces of the wiring patterns 8 are exposed to the outside and dummy patterns 9 with the heights nearly equal to the wiring patterns 8 which are so provided in the peripheries of the wiring patterns, as being separated by predetermined spaces from the wiring patterns 8 such that the heights of the patterns 8 are made nearly equal to the patterns 9 in the case of the foregoing polishing. A resin wiring board 10 is obtained by the foregoing polishing, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin wiring board having a wiring pattern provided on a substrate, a resin wiring board having a desired number of wiring patterns provided on the wiring board via a resin layer, and The present invention relates to a method for manufacturing the wiring board.

[0002]

2. Description of the Related Art Generally, a resin wiring board 100 on which various electric circuits are formed or electronic components are mounted is shown in FIG.
As shown in (B), a wiring pattern 106 is provided on both surfaces 103 of a core substrate 102 made of a synthetic resin reinforced by mixing glass fibers. To obtain this wiring board 100, as shown in FIG.
Are coated with a copper thin film having a thickness of about 25 μm (not shown) on both surfaces 103 and penetrate through holes 104 at predetermined positions. Furthermore, electroless copper plating is applied to both surfaces and the inside of the through hole 104, and the whole is covered with a copper film. Then, a resist agent (not shown) is applied on the copper film, and is exposed and developed to form an etching resist of a required pattern. Form. When this copper film is etched, a wiring pattern 106 on both surfaces 103 remaining protected by the etching resist and a cylindrical conductive portion 108 in the through hole 104 are formed. This cylindrical conductive portion 10
8 conducts between the wiring patterns 106 on both surfaces 103. The etching resist is removed thereafter.

The above-mentioned resin wiring board 100 has both surfaces 10
Since the wiring pattern 106 and the through-hole 104 are formed on the substrate 3, irregularities are formed. Therefore, the wiring pattern 106
It is necessary to fill the gap or the through hole 104 with a resin to eliminate the unevenness and to flatten the surface. For this reason, FIG.
As shown in FIG. 1, an epoxy resin layer 110 serving as an insulating layer is entirely coated on both surfaces 103.
A convex portion 112 corresponding to the thickness of each wiring pattern 106 is formed above the wiring pattern 106. Further, since the same resin is filled in the through hole 104 and the upper and lower openings thereof in advance and are covered in a convex shape, the cylindrical conductive portions 108 are formed.
A similar convex portion 112 is formed above. Next, the resin layer 110 on the wiring pattern 106 is polished and removed, leaving the resin layer 110 between the wiring patterns 106. That is, the resin layer 1 is temporarily moved to the same height as the upper surface of the wiring pattern 106.
In order to remove 10, the cylindrical grindstone 114 is moved in the horizontal direction while rotating as shown to polish. In this example, both upper and lower surfaces are polished.

As shown in FIG. 8B, the upper surface of each wiring pattern 106 is exposed, and a flat surface 116 in which the resin layer 110 remains between them is formed by the above polishing.
However, among the wiring patterns 106 on each surface 103,
In the right and left end wiring patterns (polishing start end pattern and polishing end end pattern) 106a in the figure, the outer edge portion is shaved during the above polishing, so-called sagging D is formed, and the thickness may vary. . As shown in FIG. 8 (C), the cylindrical grindstone 114 also moves while bending in the direction perpendicular to the polishing progress direction during the polishing, so that the wiring at the end in the perpendicular direction (axial direction) is formed. The pattern (axial end pattern) 106b is similarly cut to form a sag D. The wiring pattern 106a, 1 at the end
The sagging D of 06b may deteriorate the performance and quality of the wiring board 100 in some cases.

On the other hand, as shown in FIG.
Even when the resin layer 110 is thickly coated on both surfaces of the pattern 02, the convex portions 112 are formed above the respective patterns 106 in the same manner as described above. In order to flatten the convex portion 112 while leaving a resin layer having a predetermined thickness on the wiring pattern 106, as shown in FIG. ) To polish the resin layer 110. However, the resin layer 110 can be formed only thinly at the end of the core substrate 102 without the wiring pattern 106, and there is a step corresponding to the thickness of the wiring pattern 106. An inclined portion K is formed near the upper side of 106c. When the grindstone 114 comes into contact with the inclined portion K, as shown in FIG. 9C, the resin layer 110 is located above the wiring pattern 106c located at the end on the surface 103.
Is formed on the surface of the substrate. If the sagging d is extremely large, the wiring pattern 106c may be exposed. In addition, when the sagging d is present, when a new wiring pattern is formed on the upper surface, the shape accuracy of the pattern at the end is reduced, and an accurate wiring pattern may not be obtained.

[0006]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and has a wiring pattern or an accurate wiring pattern having no or less sagging D or d above it. It is an object of the present invention to provide a resin wiring board and a method for manufacturing the same.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has been made with the idea of disposing a dummy pattern at a predetermined distance from a wiring pattern. That is, the resin wiring board of the present invention has a wiring pattern on at least one main plane of the wiring board, forms a resin layer between the wiring patterns and on the wiring pattern, and then forms a resin layer between at least the wiring patterns. A wiring board which is to be polished and removed from the resin layer so as to leave a layer and expose an upper surface of the wiring pattern, wherein a dummy pattern having substantially the same height as the wiring pattern is formed on a main plane. Wherein the dummy pattern is disposed at a predetermined interval from the wiring pattern so as to be polished in series before and after the polishing.

Further, another resin wiring board of the present invention has a wiring pattern on at least one main plane of the wiring board, forms a resin layer on the wiring pattern, and then forms a resin layer above the wiring pattern. A wiring board that is to be polished to remove excess resin while leaving a resin layer of a predetermined thickness, and a dummy pattern having a height at least the same as or higher than the wiring pattern is formed on a main plane. Have
This dummy pattern is arranged at a predetermined distance from the wiring pattern so that the resin layer formed thereon is polished in series before and after the polishing of the resin above the wiring pattern. Features.

In the present specification, the main plane always refers to the outermost surface of the resin wiring board. Furthermore, the dummy pattern is not used in the final product in order to reduce the size of the resin wiring board, and is usually removed from the product, for example, by cutting it off. In addition, the dummy pattern may be a resin wiring board disposed at a position such that when the resin formed on the wiring pattern is polished, the resin on the dummy pattern is also polished and removed substantially simultaneously. included. With the above configuration, the sagging D and d are formed intensively at or above the edge of the dummy pattern, so that it is difficult to form the sagging on the pattern edge of the wiring pattern and the resin layer above the wiring pattern. Can be obtained.

[0010] Further, a resin wiring substrate in which the dummy pattern is disposed in a direction substantially perpendicular to and / or substantially parallel to the direction in which the polishing proceeds can be provided. In a conventional resin wiring substrate without a dummy pattern, the wiring pattern 106a and the like receive concentrated pressure of an abrasive such as a grindstone at the start and end of polishing, but the dummy pattern is substantially perpendicular to the direction of polishing. When arranged in the direction, the dummy pattern receives the pressure of the abrasive instead of the wiring pattern. Therefore, even if sagging D or the like occurs in the dummy pattern, sagging D or the like does not occur in the wiring pattern. On the other hand, if the dummy pattern is disposed in a direction substantially parallel to the direction in which the polishing proceeds, the dummy pattern spaced a predetermined distance from the wiring pattern is intensively polished even if the abrasive itself is bent. In addition to protecting the pattern, the dummy pattern itself also functions as a guide in the direction of movement of the abrasive.

Further, the dummy pattern includes a resin wiring board, wherein a dummy pattern is provided around the wiring pattern at a predetermined distance from the wiring pattern. With this configuration, the sagging D and the like can be eliminated or reduced by merely arranging the dummy pattern around the desired wiring pattern without any change.
Dummy patterns provided around the wiring pattern include not only a form surrounding the entire wiring pattern in a frame shape, but also a form in which one linear pattern is provided above and below and right and left of a rectangular wiring pattern area, In the case of a linear pattern, a form in which the pattern is intermittently arranged along the longitudinal direction is also included.

In short, the dummy pattern is disposed at a predetermined distance from the outer peripheral edge of the wiring pattern, and is disposed at a position where the sagging D or the like is eliminated. When the upper surface of the wiring pattern is exposed, the thickness of the dummy pattern is preferably substantially the same as the height of the wiring pattern. On the other hand, when the resin layer is left above the wiring pattern, the height may be the same, but if the resin layer is slightly thicker than the wiring pattern,
The surface of the resin layer left above the wiring pattern can be more easily flattened, and can also function as a guide for the height of the abrasive during polishing.

In a wiring board having at least a plurality of resin layers, wiring patterns are provided on at least one main plane and on the inner resin layer, and dummy patterns respectively corresponding to the wiring patterns are provided at predetermined intervals. May be provided as a resin wiring board. With this configuration, it is possible to provide a resin wiring board in which a plurality of wiring patterns are accurately three-dimensionally arranged in the thickness direction of the board. When the thickness of each of the wiring pattern and the dummy pattern is, for example, about 20 to 30 μm and the width of the dummy pattern is about 5 mm, the distance between the wiring pattern and the dummy pattern is 10 mm.
mm or less, more preferably 8 mm or less. With such an interval, a wiring board in which the sagging D or the like is not present in the wiring pattern at the end (outside) or is significantly reduced can be obtained.

In addition, in order to obtain the above-described wiring board, a method of manufacturing a resin wiring board in which the wiring pattern and the dummy pattern are simultaneously formed by photolithography or plating can be used. According to such a method, a dummy pattern can be formed without increasing the number of steps. Further, before and after the covering step of forming the resin layer on the main plane of the wiring substrate and the polishing of the resin layer on the wiring pattern, the upper surface of the dummy pattern or the resin layer above the dummy pattern is polished. A polishing step of polishing and removing the resin while leaving a resin layer of a predetermined thickness between the wiring patterns or between the wiring patterns and above the wiring patterns. . According to such a manufacturing method, a wiring board having an accurate wiring pattern can be provided according to a required amount without increasing the number of steps.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 relates to a manufacturing process of a resin wiring board 1 according to one embodiment of the present invention. FIG. 1A is a cross-sectional view showing a state in which a copper thin film 4 is coated on both surfaces of a core substrate 2 made of a bismaleimide triazine resin (glass-BT resin material) reinforced by combining a glass fiber cloth. . Next, as shown in FIG. 1B, through holes 5 are made to pass through predetermined positions of the core substrate 2. Further, as shown in FIG.
Electroless copper plating is applied to both surfaces and inside the through holes 5, and the whole is covered with a copper film 6. Then, an etching resist (photosensitive resin) 7 is coated on the entire upper surface of the copper film 6, and by exposure and development, an etching resist 7 'having a required pattern is formed as shown in FIG. Next, by immersing this in a predetermined etching solution, as shown in FIG.
A wiring pattern 8 having a thickness of about 25 μm on both surfaces 3 made of the copper film 6 remaining protected by the resist 7 ′, a dummy pattern 9 at a predetermined interval on the outer periphery of the wiring pattern 8, and the through hole 5 are formed. The resin wiring board 1 on which the penetrating cylindrical conductive portion 8 'is formed is obtained.

The dummy pattern 9 is made of the same copper as the wiring pattern 8 and has substantially the same height. When the entire area of the wiring pattern 8 is substantially rectangular in plan view, the dummy pattern 9 is arranged in a rectangular frame shape along all four sides thereof and at a predetermined interval of about several mm. However, as will be described later, the wiring pattern 8 may also be disposed on a pair of linear patterns parallel to at least two opposing sides. The wiring pattern 8 and the dummy pattern 9 are desirably arranged symmetrically on both surfaces of the core substrate 2, but may be arranged only on at least one surface. The cylindrical conductive portions 8 ′ conduct the wiring patterns 8 on both surfaces of the core substrate 2.

FIG. 2 relates to a manufacturing process of the resin wiring board 10 of the present invention. FIG. 2A shows the wiring board 1, and as shown in FIG.
Non-photosensitive epoxy resin layer 12 to be an insulating layer on top
Is applied and coated. Prior to this, the same resin layer 12 is applied to the conductive portion 8 'of the through hole 5 and both openings thereof to fill the inside of the conductive portion 8'. Then, the protrusions 14 are respectively formed on the surface of the resin layer 12 above the wiring patterns 8, the dummy patterns 9, and the conductive portions 8 '.
In order to obtain a substrate product of a type that exposes the upper surface of the wiring pattern 8, it is necessary to remove the protrusions 14 together with the upper layer side of each resin layer 12.

Therefore, as shown in FIG. 3A, a roll-shaped abrasive 1 having elasticity is formed on the surface of the wiring board 1.
6 is horizontally moved leftward in the figure to polish. in this case,
First, the abrasive 16 starts to be cut from the right end side of the resin layer 12 on the upper surface of the wiring board 1, but as shown in FIG. 3B, the resin layer 12 closer to the right end than the right dummy pattern 9 is almost removed. You. Next, the abrasive 16 is placed on the right dummy pattern 9.
Abut. Then, since the dummy pattern 9 is harder than the resin layer 12, the downward pressure of the abrasive 16 is intensively received instead of the wiring pattern 8, and the resin layer 12 in front thereof is also protected. For this reason, the polishing material 16 cuts the portion of the dummy pattern 9 on the outer side of the upper surface over the entire length to form the sagging D, and passes over the dummy pattern 9.

Next, the abrasive 16 proceeds between the right dummy pattern 9 and the right outer wiring pattern 8a to polish the resin layer 12. At this time, as shown in FIG. 3 (C), the abrasive 16 is made of a hard dummy pattern 9 and a wiring pattern 8a.
However, since the pressure on the wiring pattern 8a is reduced, no sagging D occurs in the pattern 8a. Further, a resin layer 13 whose upper surface is slightly depressed remains between the dummy pattern 9 and the right outer wiring pattern 8a. Abrasive 16
Similarly, no sagging D occurs in each of the inner wiring patterns 8 with the movement of the resin layer 13, and the resin layer 13 is also provided between the wiring patterns 8.
Remains. In addition, the wiring pattern 8a and the wiring pattern 8 and the interval between the wiring patterns 8 are the same as the dummy pattern 9 and the wiring pattern 8a.
Is set to be smaller than the distance between them, the resin layer 13 remaining between them has a substantially flat surface with almost no concave upper surface. Then, when the abrasive 16 exceeds the wiring pattern 8b on the left outside and reaches the dummy pattern 9 on the left, the abrasive 16 concentrates the pressure on the dummy pattern 9 so that a portion outside the upper surface thereof is cut off over the entire length to form a sag D. After that, as shown in FIG. 3D, most of the resin layer 12 on the left end side is removed.

FIG. 4 (A) shows the polishing step of FIG. 3 from a right angle direction. The surface of the roll-shaped abrasive 16 is slightly deformed due to its elasticity, and the whole is bent along the rotation axis. Therefore, as shown in FIG. The pair of dummy patterns 9 arranged in
The pressure of the abrasive 16 is intensively received instead of c and 8d. For this reason, the outer portion of the upper surface of each dummy pattern 9 is scraped off to cause sagging D. The upper portion of the outer wiring patterns 8c and 8d spaced apart from this by a predetermined distance and the inner wiring pattern 8 located therebetween. Is protected. At the same time, the resin layer 13 remains between the dummy pattern 9 and the wiring patterns 8c and 8d, between the wiring patterns 8c and 8d and the wiring pattern 8, and between the wiring patterns 8. The result of this polishing is the cross-sectional view shown in FIG. The resin layer 12 on the lower surface side of the substrate 1 is similarly polished to obtain a resin wiring board 10 shown in FIG. 2C. The substrate 10 is usually used by cutting off portions including the surrounding dummy patterns 9 along each chain line in the drawing.

According to the wiring board 10, each of the surrounding dummy patterns 9 receives the pressure of the abrasive 16 in a concentrated manner to form a sag D, and the wiring patterns 8a to 8a to be provided therebetween.
8d, the entire wiring 8 is protected, so that a wiring pattern 8 having a cross section substantially as designed can be formed on at least one of the main surfaces, has a flat surface almost at the same level as the upper surface thereof, and a portion of the surrounding dummy pattern 9 Only by cutting off, a highly accurate wiring board can be obtained. In addition, the conductive portion 8 '
Required wiring patterns 8 on both front and back main surfaces using
Can also be formed. Further, since the upper surfaces of the wiring pattern 8 and the resin layer 13 are flat surfaces of the same level,
A new resin layer can be applied to the upper surface of the wiring pattern 8 with the upper surface thereof flattened. The copper film 6 is coated above the new resin layer, and an etching resist 7 is applied to the upper surface. A three-dimensional circuit consisting of two or more wiring patterns in the vertical direction by laminating different wiring patterns by conducting exposure and development, etching the copper film 6, and conducting the upper and lower wiring patterns through vias. Can also be easily formed.

Next, a different form of resin wiring board will be described with reference to FIG. It is to be noted that the same reference numerals or the same reference numerals are used for the same elements and parts as described above.
2A shows a cross-sectional view similar to FIG. 2B, and shows a thickly applied etching resist (hereinafter simply referred to as a resin layer 12 ').
) Is formed, and on the upper surface thereof, a convex portion 14 is formed at a position corresponding to the lower wiring pattern 8 and the dummy pattern 9 '. The thickness of the dummy pattern 9 'is
It is desirable that the thickness be slightly larger than the wiring pattern 8 in advance.
The resin layer 1 having a certain thickness is formed on the upper surface of the wiring pattern 8.
In order to flatten the surface while leaving 2 ', as shown in FIG. 5B, the abrasive 16 is moved to the left as shown by the arrow in the figure while maintaining a constant level.

The abrasive 16 starts to cut the resin layer 12 'by a predetermined thickness from the right end side and reaches the vicinity of the inclined portion K above the right dummy pattern 9'. Then, since the dummy pattern 9 'is present, the contact surface of the abrasive 16 is elastically deformed while concentrating the pressure on the resin layer 12' above the dummy pattern 9 ', and then tries to pass above the dummy pattern 9'. .
As a result, as shown in the figure, a sag d inclined to the right is formed in the relevant portion of the resin layer 12 '. Next, the abrasive 16
Are the dummy pattern 9 'and the right outer wiring pattern 8
e, and the resin layer 12 'in that portion is scraped. However, since both the dummy pattern 9' and the wiring pattern 8e are present, the upper surface of the resin layer 12 'between them is slightly dented. A substantially flat polished surface is formed.

Further, while the upper portion of the wiring pattern 8e is being shaved, the resin layer 1 between the wiring pattern 8 and the adjacent inner wiring pattern 8 is cut.
2 'is removed, but the distance between the wiring pattern 8e and the wiring pattern 8 and the distance between the wiring patterns 8 are smaller than the distance between the dummy pattern 9' and the wiring pattern 8e. A flat polished surface with only a thickness of That is, since the dummy pattern 9 'forms a projection together with the wiring patterns 8e and 8, the thickness of the resin layer 12' above them is made constant, and the resin layer 1 having a flat surface is formed.
It plays the role of getting 2 '. The same polishing is repeated, and the abrasive 16 that has passed above the left outer wiring pattern 8f becomes the resin layer 1 above the left dummy pattern 9 '.
After forming a sag d in the opposite direction also on 2 ', the resin layer 12' on the left end side is polished and the process is completed. As a result of performing such polishing on both surfaces, an overall flat surface 1 as shown in FIG.
A wiring board 20 having nine resin layers 12 'is obtained. This substrate 20 is also used by cutting off a portion including each surrounding dummy pattern 9 'along each one-dot chain line in the figure.

According to the wiring board 20, a resin wiring board having the wiring pattern 8 on at least one main plane and covering the wiring pattern 8 with the resin layer 12 ′ on the flat surface 19 can be provided. Also, if the thickness of the dummy pattern 9 'is made thicker by the thickness of the resin layer 12' to be left than the wiring pattern 8, when the resin layer 12 'is applied, the resin layer surrounded by each dummy pattern 9' The surface of 12 'can be made relatively flat. Further, since the dummy pattern 9 ′ parallel to the moving direction of the abrasive 16 functions also as a guide for the height of the abrasive 16, the resin layer 1 on the flat surface 19 is formed.
2 'is formed more easily.

Further, when the above-mentioned wiring board 20 is used, it becomes easy to apply a new resin layer flat on the surface 19 of the resin layer 12 ', and the copper film 6 is coated on the new resin layer. Further, by coating an etching resist on the upper surface, exposing and developing and etching the copper film 6, different wiring patterns are laminated, and the upper and lower wiring patterns are electrically connected to each other through vias. It is also possible to form a three-dimensional circuit composed of wiring patterns of layers. When another wiring pattern is laminated on this different wiring pattern, a convex portion similar to the convex portion 14 is formed on the surface of the resin layer applied prior to this. Also, the same dummy pattern as described above is provided. Then, when the same polishing as described above is performed, the sagging d can be concentrated above the dummy pattern, and the surface of the resin layer therebetween can be flattened.

A substrate having a plurality of wiring patterns will be described with reference to FIG. FIG. 3A shows the wiring board 10.
A new epoxy-based photosensitive resin layer 13 ′ is applied on the wiring pattern 8 forming the flat upper surface and the resin layer 13 therebetween, and is exposed and developed to form a via hole 8 in a predetermined position. 6B, and then dried, a cross-section as shown in FIG. 6B is obtained, and the upper surface of the resin layer 13 'becomes flat. After coating the entire surface of the film and further applying an etching resist (not shown) on the upper surface of the copper film, exposing and developing, etching, and then removing the resist, FIG.
As shown in (C), different wiring patterns 22 can be formed on the resin layer 13 '. At this time, if a dummy pattern 21 is formed around the wiring pattern 22 at a predetermined interval at the same time, it is advantageous when another wiring pattern is provided above these. In addition, vias 23 are interposed at predetermined positions between the wiring patterns 8 and 22, and both are electrically connected to each other.

In order to further laminate another wiring pattern above the wiring pattern 22 of FIG.
The application of the resin layer and the step of polishing and removing the resin layer by a predetermined thickness shown in FIG.
2 and the like, and a new resin layer having a flat surface can be formed. By repeating the application of the resin layer 13 'and the like, the coating of the copper film or the etching resist, the exposure / development, and the etching, as shown in FIG. 6D, the desired number of wiring patterns 8, 22, 24, 26,28 are laminated,
It is possible to obtain the resin wiring board 30 having the vias 23 for conducting these, and having the dummy patterns 9, 21, 25, 27, 29 arranged around each pattern. This wiring board 30 is also used as a product of a resin wiring board having a three-dimensional circuit by cutting off the peripheral portion including the dummy pattern 9 and the like at each one-dot chain line in the figure.

Here, the wiring board of the present invention and a conventional one will be concretely compared. The sagging D of the outer wiring pattern 8a when the wiring board 10 of FIG. 2C is obtained by polishing from the state shown in FIG.
The height of the sagging D of the outer wiring pattern 106a when the wiring substrate 100 shown in FIG. 8B was obtained by polishing the one without the dummy pattern of FIG. Each of the core substrates 2 and 102 is made of a glass-BT resin material, and has a length of 330 mm, a width of 250 mm, and a thickness of 0.1 mm.
A 6 mm one was used. Each of the wiring patterns 8 and 106 is made of copper, has a thickness of 25 μm, and a width of 2 mm. In the example of the present invention, a dummy pattern 9 having the same thickness as the pattern 8 and a width of 5 mm is arranged in a rectangular frame shape at intervals of several types around the wiring pattern 8. Further, after filling the through holes 5 and the like with resin in advance, epoxy resin layers 12, 110 having the same thickness were applied over the wiring patterns 8, 106, and dried to prepare a required number of dried resin layers.

On the other hand, the polishing conditions were as follows: a belt sander was used as a polishing machine, and a polishing belt (width 650 mm, inner circumference 1700 m) having # 600 alumina particles on the surface as a polishing material was used.
m) was used. Rubber contact roll on the polishing side
(Having a diameter of 150 mm and a rubber hardness of 40 degrees), and the pressing amount of the polishing belt was set at a height of 50 μm above the core substrates 2 and 102. After the polishing, all the wiring substrates 10 and 100 were cut, and the amount of reduction in the thickness of each of the outer wiring patterns 8a and 106a was measured with an optical microscope. In the case of the example of the present invention, the height of each sagging D, which is the above-described reduction amount, is divided into cases where the moving direction of the polishing belt and the dummy pattern 9 are parallel to a right angle, and the case of the conventional example is also divided along this. The results are shown in Table 1 (the unit of the interval is mm and the unit of the amount of reduction in thickness is μm).

[0031]

[Table 1]

As shown in Table 1, in the case of the present invention, the smaller the distance between the wiring pattern 8a and the dummy pattern 9 is, the smaller and more effective the sag D is. It can be seen that the effect of disposing the pattern 9 is reduced. In other words, as the distance between the dummy pattern 9 and the wiring pattern 8a is reduced, the dummy pattern 9 receives the pressure from the polishing belt in a concentrated manner and protects the outer wiring pattern 8a. It is easily understood that the pressure due to the polishing belt is easily received, and the dripping D is formed. By the way, at some intervals of 10 mm in the perpendicular direction and at intervals of 8 mm in the parallel direction, some of the effects were inferior to those of the conventional example, but the average values showed the effect of the invention example.

Next, the height of the sagging d of the outer wiring pattern 8e when the wiring board 20 shown in FIG. 5C is obtained by polishing from the state shown in FIG. The height of the sagging d of the outer wiring pattern 106c when the wiring substrate shown in FIG. 9C was obtained by polishing the substrate without the dummy pattern shown in FIG. Both core substrates 2 and 102 have the same material and dimensions as described above. The wiring patterns 8, 106 and the dummy pattern 9 'were the same as described above, and the resin layers 12', 110 were applied slightly thicker than the above. Polishing conditions were as follows: A grinder with a surface roughness of # 600 was used as a roll-shaped grindstone (150 mm in diameter,
A length of 610 mm) was set, and the pressing amount of the grindstone was set to a height of 150 μm above the core substrates 2 and 102. After the polishing, the amount of reduction in the thickness of the resin layers 12 'and 110 immediately above the outer wiring patterns 8e and 106c, that is, the height of the sag d was measured in the same manner as described above. Table 2 shows the results. The unit of each numerical value in Table 2 is the same as in Table 1.

[0034]

[Table 2]

From Table 2, it can be seen that in the example of the present invention, in the perpendicular direction, the smaller the distance between the wiring pattern 8e and the dummy pattern 9 ', the more d
Is small and effective, but as the interval increases, the sag d increases, and the effect of disposing the dummy pattern 9 'decreases. However, in the parallel direction, since the roll-shaped grindstone is hard and its bending in the axial direction is small, there is a case where it is the same as that of the conventional example.However, if an interval of at least 10 mm is provided, the effect of the present invention can be obtained. It is also understood that it is possible. From the above results, in order to obtain the effect of the present invention under the above conditions, it is easily understood that the distance between the wiring pattern and the dummy pattern is set to 10 mm or less, preferably 8 mm or less, and more preferably 2.7 mm or less.

FIG. 7A shows a state in which a wiring board similar to the wiring board 1 is viewed in a plan view, and a predetermined space is provided around a rectangular area 42 on the core substrate 40 on which a wiring pattern is formed. Although a rectangular dummy pattern 44 similar to the area 42 is provided, the form of the dummy pattern is not limited to this. For example, in FIG. 7B, four linear dummy patterns 54 are arranged in parallel at predetermined intervals along each side of a rectangular area 52 on which a wiring pattern on the core substrate 50 is formed. Show things. According to the dummy pattern 54, the sagging D and d can be eliminated or reduced while saving each corner portion of the dummy pattern 44.

As shown in FIG. 7C, the core substrate 6
Only a pair of linear dummy patterns 64 may be arranged in parallel at predetermined intervals along both sides of the rectangular area 62 on which the wiring pattern on 0 is formed. Such a dummy pattern 64 may be provided only along the side where the sagging D and d may occur in the internal wiring pattern, and is effective in the case of such a type of wiring board. Further, as shown in FIG. 7D, a rectangular area 7 on which a wiring pattern is formed on the core substrate 70 is formed.
2, a pair of linear dummy patterns 74 are arranged in parallel at predetermined intervals along the upper and lower sides,
Short dummy pattern 7 along both sides of area 72
6 shows a case where a plurality of 6 are arranged via a gap 78. The dummy pattern 76 is arranged along the side of the wiring pattern closer to the outside where the sagging D and d may occur, and the gap 78 is formed to face the portion where there is no such wiring pattern. The effect can be obtained more efficiently.

In the above description, the area in which the wiring pattern is formed is rectangular. However, even when a pattern area having a regular polygon or a peculiar plane shape is provided, each of the above-mentioned areas is provided at a predetermined interval around the pattern area. It is also easy to apply a dummy pattern of the form. In this case, in addition to the combination of linear shapes,
For example, a curved or circular dummy pattern may be used. Also, the width dimension in the same dummy pattern can be made partially thicker or thinner along its length direction according to the frequency at which the sagging D and d occur. In some cases, a plurality of dummy patterns can be provided along the entire length or partially along the same side of the wiring pattern. Further, when there is a large gap without a wiring pattern inside one pattern area, it is also possible to dispose a dummy pattern at an appropriate position in the gap.

FIG. 7 (E) is a plan view of a different resin wiring board 80, in which rectangular pattern areas 82 having four wiring patterns formed on a core substrate 81 are arranged in parallel and symmetrically with each other. A rectangular dummy pattern 84 is provided at a predetermined interval around each area 82. In addition, near the four corners of the core substrate 81, positioning marks 86 for processing are arranged. The plurality of pattern areas 82 and the corresponding dummy patterns 8
The use of the wiring substrate 80 having No. 4 enables the polishing to be performed simultaneously and continuously on a large number of wiring patterns at one time, and the coating of the resin layer can be performed in the same manner. The efficiency of the coating process can be increased.

The present invention is not limited to the embodiments described above. In addition to the glass-BT resin material used in the above-described embodiment, a glass-epoxy material, a glass-PPE material, a composite resin material such as paper-epoxy, or an epoxy, BT resin, polyimide, PPE
May be used. Further, the dummy pattern and the wiring pattern are not limited to the above-mentioned copper, but Ni and its alloy (Ni
-P, Ni-B, Ni-Cu-P), Co and its alloys (Co
-P, Co-B, Co-Ni-P), Sn and its alloys (Sn
-Pb, Sn-Pb-Pd), Au, Ag, Pd, Pt, R
h, Ru, etc. and any of their alloys can be used. Furthermore, the dummy pattern may be formed simultaneously with the wiring pattern from the same copper film or the like on the wiring board, but may be formed separately from the wiring pattern, and the method of forming the dummy pattern is not limited to the photolithography technique. It may be formed by masking the shape and directly plating, or by spraying or vapor deposition.

[0041]

As described above, the resin wiring board of the present invention described above has no dripping D or the like due to polishing at the end of the wiring pattern or can significantly reduce the height of the dripping D or the like. It becomes possible to obtain a pattern. Further, according to the method of claim 5, it is possible to obtain a resin wiring substrate having a resin layer having a flat surface at the same level as or above the upper surface of the wiring pattern.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views showing steps for manufacturing a wiring board according to one embodiment of the present invention, and FIG. 1E is a cross-sectional view of the obtained wiring board.

2 (A) and 2 (B) are cross-sectional views showing respective steps for manufacturing a wiring board of a different form, and FIG. 2 (C) is a cross-sectional view of the obtained wiring board.

FIG. 3A is a schematic diagram showing a polishing step between FIGS. 2B to 2C, and FIGS. 3B to 3D are partial cross-sectional views showing the polishing process.

4A is a schematic view showing the polishing step in FIG. 2B from a different angle, and FIG. 4B is a cross-sectional view showing the polished wiring substrate.

FIGS. 5A to 5C are cross-sectional views showing respective steps for manufacturing a wiring board of a different form.

6 (A) to 6 (C) are cross-sectional views showing respective steps for manufacturing a wiring board of a further different form, and FIG. 6 (D) is a cross-sectional view of the obtained wiring board.

FIG. 7 (A) is a plan view of a wiring board similar to FIG. 1 (E),
(B) to (E) are plan views of wiring boards having different forms.

FIGS. 8A to 8C are cross-sectional views showing steps of a conventional method for manufacturing a wiring board.

FIGS. 9A to 9C are cross-sectional views showing steps of a conventional manufacturing method for obtaining another wiring board.

[Explanation of symbols]

1,10,20,30,80 .................. Resin wiring board 8,22,24,26,28 ..................... Wiring pattern 9,9 ', 21,25,27 , 29,44,54,64,74,76,84 ... Dummy pattern 12,12 ', 13,13' ... Resin layer

[Table 1]

[Table 2]

Claims (5)

[Claims] A wiring pattern formed on at least one main plane of the wiring board; forming a resin layer between the wiring patterns and on the wiring pattern; and then leaving at least the resin layer between the wiring patterns. A wiring substrate on which the resin layer is to be polished and removed so that the upper surface of the wiring pattern is exposed, the dummy having a dummy pattern having substantially the same height as the wiring pattern on a main plane; A resin wiring board, wherein the pattern is disposed at a predetermined interval from the wiring pattern so that the pattern is polished in series before and after the polishing. 2. A wiring board having a wiring pattern on at least one main plane of the wiring board, forming a resin layer on the wiring pattern, and then leaving an excess resin layer of a predetermined thickness above the wiring pattern. A wiring substrate on which resin is to be polished and removed, having a dummy pattern having a height at least equal to or higher than the wiring pattern on a main plane, wherein the dummy pattern is formed above the wiring pattern. Wherein the resin layer is disposed at a predetermined interval from the wiring pattern so as to be polished successively before and after the resin above the wiring pattern is polished. 3. The dummy pattern is provided at a position such that when the resin formed on the wiring pattern is polished, the resin on the dummy pattern is also polished substantially simultaneously. The resin wiring board according to claim 1 or 2, wherein 4. The resin wiring board according to claim 1, wherein the dummy pattern is disposed around the wiring pattern at a predetermined interval. 5. The method for manufacturing a resin wiring board according to claim 1, wherein: a step of forming the resin layer on a main plane of the wiring board; By polishing the resin layer above or above the dummy pattern in series before and after the polishing of the resin layer, a resin layer of a predetermined thickness is left between the wiring patterns or between the wiring patterns and above the wiring pattern. And a polishing step of polishing and removing the resin.