JPH10256083A - Chip type composite electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the mounting density by forming a resistor part and a capacity part on a single chip substrate while juxtaposing in the direction substantially perpendicular to the direction of an electrode thereby collecting the resistor part and the capacity part in a small space. SOLUTION: A capacitor part 12 and a resistor part 13 are formed on the upper surface of a chip substrate 11 made of alumina ceramic while juxtaposing in the direction substantially perpendicular to the direction of an electrode and then they are connected in parallel. Subsequently, they are connected with end face electrodes 14, 14 for the purpose of external connection. The resistor part 13 is formed of a thin film resistor 24 which can be trimmed to have a specified resistance. I order to form a capacitor part 12 having a sufficient capacitance, one conductor 18, a high permittivity glass coating 22 and the other conductor 19 are laminated sequentially on the chip substrate 11 thus increasing the facing area of pole plates 20, 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a chip-type composite electronic component.

[0002]

2. Description of the Related Art Conventionally, when a terminal (hereinafter referred to as a terminal) of a circuit or a line for transmitting a digital signal is open or connected to a high impedance input part, the terminal is connected to a resistor. The capacitor is connected to the power supply or the ground via the capacitor, and the signal waveform is prevented from being disturbed due to reflection occurring at the same terminating end, thereby preventing malfunction.

[0003]

However, when a resistor or a capacitor is connected to the above-mentioned terminal portion, connecting a chip in which the resistor or the capacitor is individually formed requires a great deal of trouble and increases the cost. However, there has been a problem that the outer shape of the terminal portion becomes large and the mounting density decreases.

In addition, it is conceivable that the resistor and the capacitor are arranged in layers on a single chip substrate. In this case, however, a large parasitic capacitance is generated in the resistor.
In addition, it is difficult to reduce the variation in the parasitic capacitance, so that it is difficult to manufacture a uniform product.

[0005]

Therefore, according to the present invention, a chip type composite is characterized in that a resistance portion and a capacitance portion are formed on a single chip substrate in a juxtaposed state substantially orthogonal to the electrode direction. Electronic components will not be provided.

Further, the present invention has the following features.

The resistance part and the capacitance part are connected in parallel on the chip substrate.

The resistor portion is formed of a trimmable thin-film resistor formed on a chip substrate, and the capacitor portion is formed on the chip substrate by one of an electrode plate, a high dielectric glass film, and the other electrode. Layered in the order of the boards.

The high dielectric glass film is formed by repeating twice the steps of screen printing, drying and fixing, and firing the paste for forming the high dielectric glass film twice.

[0010] Both electrode plates of the capacitance unit are formed in a rectangular shape, and the longitudinal direction of each electrode plate is orthogonally arranged. A plurality of resistance units and capacitance units connected in series on the chip substrate are provided. Either the resistor or the capacitor,
Being installed on the chip substrate.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, for miniaturization, a resistor portion and a capacitor portion for attenuating reflection generated at a terminal portion are formed side by side on a single chip substrate.

Incidentally, it is conceivable to dispose the resistor section and the capacitor section in a layered manner on a single chip substrate. In this case, however, a large parasitic capacitance occurs in the resistor section. The large individual difference of the parasitic capacitance makes it difficult to manufacture a uniform product.

Further, in order to simplify the work of connecting to the terminating portion, the capacitance portion and the resistance portion are connected in parallel on the substrate.

Further, in order to adjust the resistance value of the resistance portion to a specified value, the resistance portion is formed of a thin film resistor that can be trimmed.

In order to form a capacitance portion having a sufficient capacitance, one conductor, a high-dielectric glass coating, and the other conductor are sequentially laminated on the chip substrate to increase the facing area of each electrode plate.

In order to prevent the occurrence of pinholes in the high dielectric glass film and the occurrence of a short circuit between the electrode plates, the high dielectric glass film forming paste is screen-printed, dried and fixed, and fired. The process of forming a glass film is repeated twice.

In order to obtain an accurate opposing area of each electrode plate, both electrode plates are formed in a rectangular shape, and the longitudinal direction of each electrode plate is arranged orthogonally. Minimize the change in

[0018]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a chip-type composite electronic component A1 according to a first embodiment of the present invention, and FIG. 2 shows an equivalent circuit thereof.
The chip-type composite electronic component A1 has a capacitance section 12 and a resistance section 13 on an upper surface of a chip substrate 11 made of alumina ceramics.
And these are arranged on the chip substrate 11 in a side-by-side state substantially orthogonal to the electrode direction. After that, these are connected in parallel and then the end face electrodes 14 and 14 for external connection are formed.
Connected to

Next, the manufacturing process and structure of the chip-type composite electronic component A1 of the present invention will be described with reference to FIGS. When manufacturing the chip-type composite electronic component A1, a large number of vertical and horizontal break grooves 15, 1
6 as many steps as possible on the upper surface of the aggregate substrate 17 on which the aggregate substrate 17 has been formed.
The substrate is divided into a number of chip substrates 11 along the lines 15 and 16.

First, as shown by hatching in FIG.
After screen printing and fixing by drying over the
The upper and lower conductors 18, 19 are formed by firing. In particular, the upper conductor 18
Is formed as one of the electrode plates 20 of the capacitance portion 12 by extending one end of the capacitor portion 12 into a rectangular shape extending downward and vertically.

Next, as shown by the hatching in FIG. 4, a paste for forming a high dielectric glass film is screen-printed on the upper surface of the one electrode plate 20 and dried and fixed. After forming the high dielectric glass coating 22, the high dielectric glass coating forming paste is screen printed again and dried and fixed, and then the high dielectric glass coating 22 is formed by firing. The process is repeated to prevent the occurrence of pinholes in the high dielectric glass coating 22, and to make the thickness of the high dielectric glass coating 22 uniform.

Next, as shown by hatching in FIG. 5, a paste for forming a conductor is screen-printed in a substantially L-shape over the conductor 19 having the high dielectric glass coating 22 and dried and fixed. Then, the other electrode plate 21 of the capacitance portion 12 is formed on the upper surface of the high dielectric glass film 22 in a rectangular shape extending in the left-right direction.

As described above, the other electrode plate 21 has a rectangular shape extending in the left-right direction as a part of the substantially L-shape, and the one electrode plate 20 has a rectangular shape extending in the vertical direction. As a result, the longitudinal directions of the two electrode plates 20 and 21 are orthogonal to each other with the high dielectric glass film 22 interposed therebetween.
20 and 21 can be made uniform, and together with the uniformity of the thickness of the high dielectric glass coating 22, the capacitance
Individual differences of 12 volumes can be reduced.

Next, as shown by hatching in FIG. 6, a paste for forming a protective glass film is screen-printed on the upper surface of the other electrode plate 21 and dried and fixed, and then the first protective glass film 23 is fired. The capacitor 12 is formed.

Next, as shown by hatching in FIG. 7, a paste for forming a thin film resistor is screen-printed, dried and fixed, and then fired to form a thin film resistor 24.

Next, as shown by hatching in FIG. 8, the resistance of the thin-film resistor 24 is adjusted to a specified value by laser trimming to form the resistor portion 13. In the drawing, reference numeral 25 denotes a substantially L-shaped trimming groove formed by trimming.

Next, as shown by the hatching in FIG. 9, a paste for forming a protective glass film is screen-printed on the upper surfaces of the resistor portion 13 and the capacitor portion 12 and dried and fixed. A coating 26 is formed.

Next, as shown by hatching in FIG.
An outermost protective film 27 is formed on the entire upper surface of the chip substrate 11 except for the portion in contact with the lateral break grooves 16. The outermost protective film 27 is formed by screen-printing a paste for forming a protective glass film and drying and fixing the paste in the same manner as described above, and then forming a protective glass film by baking or screen-printing a synthetic resin polymer. A resinous outermost protective film may be formed by curing the polymer.

Next, the collective substrate 17 is divided along the lateral break grooves 16 to form a bar-shaped collective substrate 17.

Next, as shown by hatching in FIG.
After the conductor forming paste is screen-printed and dried and fixed on the divided surface of the bar-shaped aggregate substrate 17 and the upper and lower surfaces of the aggregate substrate 17 in the vicinity of the divided surface, the end surface electrodes 14 and 14 are formed by firing.

Next, the bar-shaped collective substrate 17 is inserted into the vertical break grooves.
Divide into chips along 15

Next, as shown by hatching in FIG.
A chip type composite electronic component in which a resistance portion 13 and a capacitance portion 12 are connected in parallel on a single chip substrate 11 by forming nickel solder plating as external electrodes 28, 28 on the surfaces of the end surface electrodes 14, 14. Complete A1.

FIG. 13 shows a chip type composite electronic component A2 according to the second embodiment, and FIG. 14 shows an equivalent circuit thereof. The capacitance section 12 and the resistance section 13 are formed on the upper surface of the substrate 31, and both ends thereof are individually connected to the capacitance section end face electrodes 14c, 14c and the resistance section end face electrodes 14r, 14r.

In the collective substrate 37 used for the chip-type composite electronic component A2, a substantially rectangular short-circuit preventing hole 32 is formed on the lateral break groove 16 so as to form the capacitor end face electrodes 14c, 14c.
When the capacitor external electrodes 28c, 28c and the resistive end electrodes 28r, 28r are formed by plating on the surfaces of the resistive end electrodes 14r, 14r, respectively, they are prevented from being short-circuited by a bridge or the like. .

Then, as shown in FIGS. 15 to 24, the chip-type composite electronic component A2 is completed through substantially the same steps as in the first embodiment, but the chip-type composite electronic component of the second embodiment is completed. The component A2 has capacitance portion end face electrodes 14, 14 in which the capacitance portion 12 and the resistance portion 13 are disposed with the short-circuit prevention hole 32 interposed therebetween.
And upper and lower conductors 18c, 18r, 19c, 19
r are connected individually, and the capacitance section 12 and the resistance section 13
Are different from the first embodiment in that they are not connected on the chip substrate 31.

Next, a plurality of resistance portions 13 and capacitance portions 12 connected in series on the chip substrate 11 are provided.
FIGS. 25 to 32 show a state in which either the capacitor 13 or the capacitor 12 is provided on the chip substrate 11.

In FIG. 25, the resistance portion 13 and the capacitance portion 12 are respectively shown.
Are connected on the chip substrate 11 independently of each other, and the resistance section 13 and the capacitance section 12 are provided side by side.

In FIG. 26, the resistance portion 13 and the capacitance portion 12 are respectively shown.
Are connected in parallel at both ends of the circuit, and are arranged on the chip substrate 11, and the resistor 13 and the capacitor
There are 12 comrades.

In FIG. 27, two sets of resistance units 13 connected in series
And the capacitor unit 12 are arranged on the chip substrate in the reverse order to each other, and the respective resistor units 13 are connected at the terminating ends for the Thevenin terminating. In FIG. 28, a resistor 13 and a capacitor 12 connected in series are connected.
Is connected to the capacitance section 12 attached to the resistance section 13, so that the resistance section 13 and the capacitance section 12 are connected to each other, and used for an interface of a disk drive or the like.

In FIG. 29, two capacitance sections 12 connected in parallel to one resistance section 13 are connected, and the above-mentioned capacitance sections are provided side by side.

In addition to the above, there are connection examples shown in FIGS.

[0043]

According to the present invention, the following effects can be obtained.

According to the first aspect of the present invention, since the resistor and the capacitor are formed in parallel on a single chip substrate, the resistor and the capacitor for attenuating the reflection generated at the terminal end are formed. Parts can be reduced, the mounting density can be increased, and the parasitic capacitance generated between the resistance part and the capacitance part can be minimized to improve the reliability of the termination processing. be able to.

According to the second aspect of the present invention, the resistance section and the capacitance section are connected in parallel on the chip substrate, thereby simplifying the connection work with the termination section and the input section, thereby saving power. Can be.

According to the third aspect of the present invention, the resistance portion is
Along with being composed of a trimmable thin-film resistor formed on a chip substrate, the capacitor portion is formed on the chip substrate by laminating one conductor, a high dielectric glass coating, and the other conductor in this order, The resistance value of the resistance part can be adjusted to a specified value, and a product with small individual difference in resistance value can be manufactured.In addition, the opposing area of both plates of the capacitance part is increased, and it is enough to attenuate reflection. A capacitor portion having a capacitor can be formed.

According to the fourth aspect of the present invention, the step of forming the high dielectric glass film by screen printing, drying and fixing, and firing the paste for forming the high dielectric glass film is repeated twice. As a result, it is possible to prevent short-circuiting between the two electrode plates due to pinholes generated in the high-dielectric glass film and improve the reliability of the product, and to form a high-dielectric glass film of a required thickness. It is possible to reduce the individual difference in the film thickness of the conductive glass, and to form a capacitance portion having a small individual difference.

According to the fifth aspect of the present invention, since both the electrode plates are formed in a rectangular shape and the longitudinal directions of the respective electrode plates are arranged orthogonal to each other, even if the relative positions of the respective electrode plates are displaced from each other. In addition, it is possible to minimize the change in the opposing area of each electrode plate, and to form a capacitance part with an accurate capacitance.

According to the sixth aspect of the present invention, a plurality of resistor portions and capacitor portions connected in series on the chip substrate are provided, and at least one of the resistor portion and the capacitor portion is provided on the chip substrate. Thus, in a circuit in which a resistor section and a capacitor section are mixed on a chip substrate, it is possible to minimize the parasitic capacitance generated between the resistor section and the capacitor section.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip-type composite electronic component according to a first embodiment of the present invention.

FIG. 2 is an equivalent circuit diagram of the chip-type composite electronic component.

FIG. 3 is an explanatory view showing a step of forming the upper and lower conductors and one electrode plate.

FIG. 4 is an explanatory view showing a step of forming the high dielectric glass film.

FIG. 5 is an explanatory view showing the other electrode plate forming step.

FIG. 6 is an explanatory view showing a first protective glass film forming step.

FIG. 7 is an explanatory view showing the same thin-film resistor forming step.

FIG. 8 is an explanatory view showing the trimming step.

FIG. 9 is an explanatory view showing a second protective glass film forming step.

FIG. 10 is an explanatory view showing the outermost protective film forming step.

FIG. 11 is an explanatory view showing the same end face electrode forming step.

FIG. 12 is an explanatory view showing the external electrode forming step.

FIG. 13 is a perspective view of a chip-type composite electronic component according to a second embodiment of the present invention.

FIG. 14 is an equivalent circuit diagram of the chip-type composite electronic component.

FIG. 15 is an explanatory diagram showing a step of forming the upper and lower conductors and one electrode plate.

FIG. 16 is an explanatory view showing the same high dielectric glass film forming step.

FIG. 17 is an explanatory view showing the other electrode plate forming step.

FIG. 18 is an explanatory view showing a first protective glass film forming step.

FIG. 19 is an explanatory view showing the same thin film resistor forming step.

FIG. 20 is an explanatory view showing the same trimming step.

FIG. 21 is an explanatory view showing a second protective glass film forming step.

FIG. 22 is an explanatory view showing the outermost protective film forming step.

FIG. 23 is an explanatory view showing the same end face electrode forming step.

FIG. 24 is an explanatory diagram showing the external electrode forming step.

FIG. 25 is an explanatory diagram showing another example of connection between a resistance part and a capacitance part on a chip substrate.

FIG. 26 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 27 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 28 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 29 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 30 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 31 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

FIG. 32 is an explanatory diagram showing another example of connection between a resistor section and a capacitor section on a chip substrate.

[Explanation of symbols]

 A1 Chip-type composite electronic component 11 Chip substrate 12 Capacitance part 13 Resistance part 20 One electrode plate 21 The other electrode plate 22 High dielectric glass coating 24 Thin film resistor

Claims (6)

[Claims] 1. A chip-type composite electronic component wherein a resistance portion and a capacitance portion are formed on a single chip substrate in a state of being juxtaposed substantially orthogonal to an electrode direction. 2. The chip-type composite electronic component according to claim 1, wherein said resistance part and said capacitance part are connected in parallel on said chip substrate. 3. The resistance part is formed of a trimmable thin film resistor formed on a chip substrate, and the capacitance part is formed on the chip substrate by one of an electrode plate, a high dielectric glass film, and the other. The chip-type composite electronic component according to claim 1, wherein the components are stacked in the order of the electrode plates. 4. The high dielectric glass coating is screen-printed, dried and fixed with a paste for forming a high dielectric glass coating.
4. The chip-type composite electronic component according to claim 3, wherein the step of forming a high dielectric glass film by firing is repeated twice. 5. The chip-type composite electronic component according to claim 3, wherein both electrode plates of the capacitance unit are each formed in a rectangular shape, and the electrode plates are arranged with their longitudinal directions orthogonal to each other. 6. A chip comprising: a plurality of resistance parts and a plurality of capacitance parts connected in series on a chip substrate; and at least one of the resistance part and the capacitance part is provided side by side on the chip substrate. Type composite electronic components.