JPH1025164A - Burning method of laminated ceramic electronic part - Google Patents

Burning method of laminated ceramic electronic part

Info

Publication number
JPH1025164A
JPH1025164A JP8178886A JP17888696A JPH1025164A JP H1025164 A JPH1025164 A JP H1025164A JP 8178886 A JP8178886 A JP 8178886A JP 17888696 A JP17888696 A JP 17888696A JP H1025164 A JPH1025164 A JP H1025164A
Authority
JP
Japan
Prior art keywords
firing
multilayer ceramic
sheath
temperature
ceramic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8178886A
Other languages
Japanese (ja)
Inventor
Iwao Ueno
巌 上野
Yasuo Wakahata
康男 若畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8178886A priority Critical patent/JPH1025164A/en
Publication of JPH1025164A publication Critical patent/JPH1025164A/en
Pending legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
  • Thermistors And Varistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for burning a laminated ceramic electronic part, capable of reducing the peeling or scratching of an outside electrode and burning many product having a uniform shape, color and characteristic by loading a specific laminated element for burning [an (a) element] in a rotatable sheath having a penetrating hole, burning under a non-oxidizing atmosphere with heating at a higher temperature than that of curing of the outside electrode paste and also starting the rotation of the sheath from a lower temperature than that of initiating the sintering of the (a) element. SOLUTION: This method for burning a laminated ceramic electronic part is to start the rotation of a sheath at 300-1000 deg.C, at a rotation speed of capable of avoiding the flying out of the laminated ceramic element for burning from a penetrating hole in the sheath with loading a similar powder in the sheath. A paste for an inside electrode and an outside electrode consists of a metal oxide (e.g.; NiO) as a main component. As to the burning process shown in the figure, 1-100ppm oxygen concentration is maintained in a range of just after the start of burning to 100-1200 deg.C, and the oxygen concentration is lowered to 10<-10> -10<-20> atm simultaneously with the beginning of the volume contraction due to the sintering of an (a) element to metallize the outside electrode.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば積層バリス
タ等の積層セラミック電子部品の焼成方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for firing a multilayer ceramic electronic component such as a multilayer varistor.

【0002】[0002]

【従来の技術】従来の積層セラミック電子部品の焼成方
法では、炉内の被焼成素子を回転させずに焼成してい
た。
2. Description of the Related Art In a conventional method for firing a multilayer ceramic electronic component, firing is performed without rotating an element to be fired in a furnace.

【0003】[0003]

【発明が解決しようとする課題】上記焼成方法では、サ
ヤ内に多量の被焼成素子を投入した場合、個々の被焼成
素子に伝わる熱や雰囲気が不均一となり、結果として焼
成後の特性にバラツキが生じやすいという問題点を有し
ていた。
In the above firing method, when a large number of elements to be fired are put into the sheath, the heat and atmosphere transmitted to the individual elements to be fired become non-uniform, and as a result, the characteristics after firing vary. However, there is a problem that the problem easily occurs.

【0004】そこで、本発明は、サヤを回転させること
で焼成中の個々の被焼成素子に伝わる熱履歴や雰囲気履
歴を均一とさせると共に、回転開始温度を規定すること
で、外部電極の不良を低減させ、常に均一な形状、色、
特性の積層セラミック電子部品を多量に提供することを
目的とするものである。
Accordingly, the present invention is to make the heat history and atmosphere history transmitted to each element to be fired during firing uniform by rotating the sheath, and to specify the rotation start temperature to prevent external electrode defects. Reduce, always uniform shape, color,
It is an object of the present invention to provide a large number of multilayer ceramic electronic components having characteristics.

【0005】[0005]

【課題を解決するための手段】この目的を達成するため
に本発明の積層セラミック電子部品の焼成方法は、内部
電極とセラミックシートとを積層した積層セラミック被
焼成素子に外部電極ペーストが塗布し、次に前記積層セ
ラミック被焼成素子を少なくとも1つの貫通孔を有する
回転可能なサヤ内に投入し、非酸化雰囲気中で焼成する
際、前記外部電極ペーストが硬化する温度よりも高温で
かつ前記積層セラミック被焼成素子が焼結を始める温度
よりも低温から前記サヤの回転を開始するものであり、
この方法によれば、外部電極の剥離やカスレなどの不良
が低減し、かつサヤが回転しているため均一な形状、
色、特性の積層セラミック電子部品を多量に焼成するこ
とが可能となり、上記目的が達成できる。
In order to achieve this object, a method for firing a multilayer ceramic electronic component according to the present invention comprises applying an external electrode paste to a multilayer ceramic fired element in which an internal electrode and a ceramic sheet are stacked. Next, the multilayer ceramic fired element is put into a rotatable sheath having at least one through-hole, and when fired in a non-oxidizing atmosphere, the temperature of the external electrode paste is higher than a temperature at which the external electrode paste is hardened and the multilayer ceramic fired element is fired. Starting the rotation of the sheath from a temperature lower than the temperature at which the element to be fired starts sintering,
According to this method, defects such as peeling and fraying of the external electrode are reduced, and since the sheath is rotating, a uniform shape,
It becomes possible to fire a large number of multilayer ceramic electronic components having different colors and characteristics, and the above object can be achieved.

【0006】[0006]

【発明の実施の形態】本発明の請求項1に記載の発明
は、内部電極とセラミックシートとを交互に積層した積
層セラミック被焼成素子に外部電極ペーストを塗布し、
次に前記積層セラミック被焼成素子を少なくとも一つの
貫通孔を有する回転可能なサヤ内に投入し、その後非酸
化雰囲気で前記積層セラミック被焼成素子を焼成する
際、前記外部電極ペーストが硬化する温度よりも高温で
かつ前記積層セラミック被焼成素子が焼結を始める温度
よりも低温から前記サヤの回転を開始する積層セラミッ
ク電子部品の焼成方法であり、外部電極の不良を低減
し、かつ均一な熱履歴、雰囲気履歴により常に均一な形
状、色、特性の積層セラミック電子部品を焼成すること
ができる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is to apply an external electrode paste to a laminated ceramic fired element in which internal electrodes and ceramic sheets are alternately laminated,
Next, the multilayer ceramic fired element is put into a rotatable sheath having at least one through hole, and then, when the multilayer ceramic fired element is fired in a non-oxidizing atmosphere, the temperature at which the external electrode paste is hardened is set. This is a firing method for a multilayer ceramic electronic component in which the rotation of the sheath is started at a high temperature and a temperature lower than the temperature at which the multilayer ceramic fired element starts sintering. In addition, a multilayer ceramic electronic component having a uniform shape, color, and characteristics can always be fired according to the atmosphere history.

【0007】請求項2に記載の発明は、サヤの回転開始
温度を、300℃〜1000℃の範囲とする請求項1に
記載の積層セラミック電子部品の焼成方法であり、外部
電極の不良を低減し、かつ均一な熱履歴、雰囲気履歴に
より常に均一な形状、色、特性の積層セラミック電子部
品を焼成することができる。
According to a second aspect of the present invention, there is provided the method for firing a multilayer ceramic electronic component according to the first aspect, wherein the rotation start temperature of the sheath is in a range of 300 ° C. to 1000 ° C., thereby reducing defects of external electrodes. In addition, a multilayer ceramic electronic component having a uniform shape, color, and characteristics can be constantly fired by uniform heat history and atmosphere history.

【0008】請求項3に記載の発明は、サヤの回転速度
を、このサヤの貫通孔から積層セラミック被焼成素子が
飛び出ない速さとする請求項1に記載の積層セラミック
電子部品の焼成方法であり、外部電極の不良を低減し、
かつ均一な熱履歴、雰囲気履歴により常に均一な形状、
色、特性の積層セラミック電子部品を焼成することがで
きる。
The invention according to claim 3 is the method for firing a multilayer ceramic electronic component according to claim 1, wherein the rotational speed of the sheath is such that the multilayer ceramic element to be fired does not jump out of the through hole of the sheath. , Reduce the failure of external electrodes,
With uniform heat history and atmosphere history, always uniform shape,
The multilayer ceramic electronic component having the color and characteristics can be fired.

【0009】請求項4に記載の発明は、サヤ内にとも粉
を混入させて焼成する請求項1に記載の積層セラミック
電子部品の焼成方法であり、外部電極同士のクッツキを
低減させるものであり、またサヤ内の積層セラミック被
焼成素子の回転をスムーズにすることができる。
According to a fourth aspect of the present invention, there is provided the method for firing a multilayer ceramic electronic component according to the first aspect of the present invention, wherein the powder is mixed into the sheath and fired to reduce the noise between the external electrodes. Also, the rotation of the multilayer ceramic fired element in the sheath can be made smooth.

【0010】請求項5に記載の発明は、積層セラミック
被焼成素子の内部電極及び外部電極ペーストは、金属酸
化物を主成分とする物質で形成されている請求項1に記
載の積層セラミック電子部品の焼成方法であり、非酸化
雰囲気中で焼成することにより金属酸化物が還元されて
金属化し、電極が形成されるものである。
According to a fifth aspect of the present invention, there is provided the multilayer ceramic electronic component according to the first aspect, wherein the internal electrode and the external electrode paste of the multilayer ceramic fired element are formed of a material containing a metal oxide as a main component. In the firing method, firing is performed in a non-oxidizing atmosphere to reduce the metal oxide and metallize it, thereby forming an electrode.

【0011】請求項6に記載の発明は、金属酸化物とし
てNiOを用いる請求項5に記載の積層セラミック電子
部品の焼成方法であり、非酸化雰囲気中で焼成すること
によりNiOが還元されて金属化し、Ni電極が形成さ
れるものである。
According to a sixth aspect of the present invention, there is provided the method for firing a multilayer ceramic electronic component according to the fifth aspect, wherein NiO is used as the metal oxide. And a Ni electrode is formed.

【0012】請求項7に記載の発明は、積層セラミック
被焼成素子が焼結を開始する温度より低い温度領域にお
ける第1の焼成雰囲気よりも、前記積層セラミック被焼
成素子が焼結を開始する温度よりも高い温度領域におけ
る第2の焼成雰囲気の方が酸素濃度が低い請求項1に記
載の積層セラミック電子部品の焼成方法であり、体積収
縮による積層セラミック被焼成素子内部のデラミネーシ
ョンや、電極切れを防止することが可能となる。
According to a seventh aspect of the present invention, the temperature at which the multilayer ceramic element starts sintering is lower than the first firing atmosphere in a temperature range lower than the temperature at which the multilayer ceramic element starts sintering. 2. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the second firing atmosphere in a higher temperature range has a lower oxygen concentration than the second firing atmosphere. Can be prevented.

【0013】請求項8に記載の発明は、第1の焼成雰囲
気と第2の焼成雰囲気との切り替え温度を、1000℃
〜1200℃の間で行う請求項7に記載の積層セラミッ
ク電子部品の焼成方法であり、体積収縮による積層セラ
ミック被焼成素子内部のデラミネーションや、電極切れ
を防止することが可能となる。
[0013] According to the present invention, the switching temperature between the first baking atmosphere and the second baking atmosphere is set at 1000 ° C.
The firing method of a multilayer ceramic electronic component according to claim 7, which is performed at a temperature of up to 1200 ° C., which can prevent delamination inside the multilayer ceramic element to be fired due to volume shrinkage and disconnection of an electrode.

【0014】請求項9に記載の発明は、第1の焼成雰囲
気の酸素濃度は、1〜100ppmで、第2の焼成雰囲気
の酸素濃度は、10-10〜10-20atmである請求項8に
記載の積層セラミック電子部品の焼成方法であり、体積
収縮による積層セラミック被焼成素子内部のデラミネー
ションや、電極切れを防止することが可能となる。
According to a ninth aspect of the present invention, the oxygen concentration in the first firing atmosphere is 1 to 100 ppm and the oxygen concentration in the second firing atmosphere is 10 -10 to 10 -20 atm. And firing of the multilayer ceramic electronic component due to volume shrinkage and disconnection of the electrodes can be prevented.

【0015】(実施の形態1)以下、本発明の第1の実
施の形態について、図面を用いて説明する。
Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

【0016】図3において、1は積層バリスタ素子で、
その内部には複数の内部電極2がセラミックシート1a
を挟んで互いに相対向するように設けられ、その両端に
は外部電極3が設けられている。セラミックシート1a
は、SrTiO3を主成分とし、副成分としてNb
25,Ta25,MnO2,SiO2などを添加して形成
したものである。また、内部電極2は、Niを主成分と
する金属でありNiOを主成分とし、副成分としてLi
2CO3を添加し、反応させて形成したものである。さら
に、外部電極3は、下層3aは、Niを主成とする金属
でありNiOを主成分とし、副成分としてLi2CO3
添加し、反応させて形成し、上層3bは、Ag,Ag−
Pbなどで形成したものである。
In FIG. 3, reference numeral 1 denotes a multilayer varistor element.
A plurality of internal electrodes 2 are provided inside the ceramic sheet 1a.
And external electrodes 3 are provided at both ends thereof. Ceramic sheet 1a
Is composed mainly of SrTiO 3 and Nb as a sub-component.
It is formed by adding 2 O 5 , Ta 2 O 5 , MnO 2 , SiO 2 and the like. The internal electrode 2 is a metal containing Ni as a main component, NiO as a main component, and Li as a subcomponent.
It is formed by adding 2 CO 3 and reacting. Further, the external electrode 3 is formed such that the lower layer 3a is a metal mainly composed of Ni, mainly composed of NiO, and Li 2 CO 3 is added and reacted as an auxiliary component, and the upper layer 3b is formed of Ag, Ag. −
It is formed of Pb or the like.

【0017】図4は製造工程を示し、(4)に示すごと
く原料の混合、仮焼、粉砕、スラリー化、シート成形に
よりセラミックシート1aを作製した。
FIG. 4 shows a manufacturing process. As shown in (4), a ceramic sheet 1a was produced by mixing raw materials, calcining, pulverizing, slurrying, and sheet forming.

【0018】次に、セラミックシート1aと内部電極2
とを積層(5)、切断(6)し積層体を得た。その後、
空気中で脱バイ・仮焼(7)し、さらに面取り(8)を
行った後、積層体の内部電極2の露出した端面にのみ、
下層3aとなるNi外部電極ペーストを塗布(9)し
た。
Next, the ceramic sheet 1a and the internal electrode 2
Were laminated (5) and cut (6) to obtain a laminate. afterwards,
After debubbling and calcining in air (7) and chamfering (8), only the exposed end face of the internal electrode 2 of the laminate is removed.
A Ni external electrode paste to be the lower layer 3a was applied (9).

【0019】その後、図2に示すように、外部電極の下
層3aを塗布した積層バリスタ素子1をアルミナ製で両
端面に貫通孔を有する円筒形のサヤ13に詰め込み、こ
の時、積層バリスタ素子1と同じ組成の粉末を焼成し、
粉砕した粉末を粉として混入させた。その後、このサヤ
13を回転可能なアルミナ製の管状炉14にセットし
て、図1に示す条件で非酸化雰囲気焼成(10)した。
Thereafter, as shown in FIG. 2, the laminated varistor element 1 coated with the lower layer 3a of the external electrode is packed in a cylindrical sheath 13 made of alumina and having through holes at both end surfaces. Baking powder of the same composition as
The ground powder was mixed as a powder. Thereafter, the sheath 13 was set in a rotatable tubular furnace 14 made of alumina and fired in a non-oxidizing atmosphere (10) under the conditions shown in FIG.

【0020】この時、管状炉14の内部は、サヤ13を
中心に置き、その両側に断熱材15を設置した。また、
雰囲気ガスは、流入口16から流入させ流出口17から
流出させた。
At this time, the inside of the tubular furnace 14 was placed around the sheath 13 and heat insulating materials 15 were placed on both sides thereof. Also,
Atmospheric gas flowed in from the inlet 16 and flowed out from the outlet 17.

【0021】この方法により、管状炉14内部での断熱
効果と、雰囲気ガスの安定性が得られ、結果として、再
現性よく焼成が可能となった。
According to this method, the heat insulating effect inside the tubular furnace 14 and the stability of the atmosphere gas are obtained, and as a result, the firing can be performed with good reproducibility.

【0022】焼成後、下層3aの上に、上層3bとなる
Ag外部電極ペーストを塗布(11)し、空気中でAg
焼付けと同時に積層バリスタ素子1の再酸化のため70
0〜900℃の温度範囲で加熱(12)し、図3に示す
積層バリスタ素子1を作製した。
After firing, an Ag external electrode paste to be the upper layer 3b is applied (11) on the lower layer 3a, and the Ag external electrode paste is applied in the air.
70 for re-oxidation of the multilayer varistor element 1 simultaneously with baking
The multilayer varistor element 1 shown in FIG. 3 was manufactured by heating (12) in a temperature range of 0 to 900 ° C.

【0023】なお、本実施の形態では、積層バリスタ素
子1の形状は、幅×長さ×高さ(W×L×T)が1.2
5×2.0×1.0(mm)の形状で、非酸化雰囲気焼成
時(10)の処理量を2〜5万個/バッチとした。
In this embodiment, the laminated varistor element 1 has a width × length × height (W × L × T) of 1.2.
The shape was 5 × 2.0 × 1.0 (mm), and the processing amount in firing in a non-oxidizing atmosphere (10) was 20,000 to 50,000 / batch.

【0024】実施の形態1より得られた積層バリスタ素
子1は、積層バリスタ素子1間での寸法や色ムラのバラ
ツキ、また電気特性のバラツキが非常に小さかった。さ
らに、下層3aのNi外部電極の剥離やカスレなどの不
良は発生しなかった。また、積層バリスタ素子1の内部
を観察したところ、デラミネーションやNi内部電極2
切れなどの不良も発見されなかった。
In the multilayer varistor element 1 obtained from the first embodiment, variations in dimensions, color unevenness, and electrical characteristics among the multilayer varistor elements 1 were very small. Further, no defect such as peeling of the Ni external electrode of the lower layer 3a and blurring occurred. When the inside of the multilayer varistor element 1 was observed, delamination and the Ni internal electrode 2 were observed.
No defects such as cuts were found.

【0025】本来、下層3aのNi外部電極を重視する
とサヤ13を回転させない状態即ち、静止した状態もし
くは、1000℃以上の高温で焼成すれば剥離やカスレ
のない良品が得られるが、焼成後の積層バリスタ素子1
の形状、色、特性のバラツキを重視するとサヤ13を回
転させた状態で焼成する方が、個々の被焼成素子に均一
な熱履歴、雰囲気履歴が起こる。
Originally, if the Ni external electrode of the lower layer 3a is emphasized, if the sheath 13 is not rotated, that is, it is stationary, or if it is baked at a high temperature of 1000 ° C. or more, a good product without peeling or fraying can be obtained. Multilayer varistor element 1
When importance is placed on the variation in the shape, color, and characteristics of the element, firing the element while the sheath 13 is rotated results in a uniform heat history and atmosphere history for each element to be fired.

【0026】従って、本実施の形態1のように、予め下
層3aのNi外部電極ペーストを塗布した積層バリスタ
素子1を多量に焼成する場合サヤ13の回転操作方法が
非常に重要となってくる。
Therefore, when the laminated varistor element 1 to which the Ni external electrode paste of the lower layer 3a is applied in advance is fired in a large amount as in the first embodiment, the method of rotating the sheath 13 becomes very important.

【0027】そこで、実施の形態1では、大きく分けて
2ケの改善対策を行うことで、前記問題を解決した。
Therefore, in the first embodiment, the above-mentioned problem was solved by roughly taking two improvement measures.

【0028】まず第1に、サヤ13の回転開始温度を3
00℃〜1000℃の範囲にすること、第2に、非酸化
雰囲気中の酸素濃度の切替えを1000℃〜1200℃
の範囲で実施することである。
First, the rotation start temperature of the sheath 13 is set to 3
Second, the switching of the oxygen concentration in the non-oxidizing atmosphere is performed at 1000 ° C. to 1200 ° C.
It is to be carried out within the range.

【0029】前者は、主に下層3aのNi外部電極の剥
離やカスレなどの不良、及び積層バリスタ素子1の形
状、色、特性のバラツキを低減させる作用をする。サヤ
13の回転開始温度が300℃未満の、まだ塗布した下
層3aのNi外部電極ペーストが硬化していない状態か
ら回転を開始すると、剥離したり、また積層バリスタ素
子1やサヤ13の内壁に付着しカスレてくる現象が発生
しやすい。逆に、サヤ13の回転開始温度を1000℃
よりも高温、つまり積層バリスタ素子1が焼結を開始す
る温度領域より開始すると、積層バリスタ素子1の収縮
率や還元率のバラツキが大きくなりやすい。
The former mainly serves to reduce defects such as peeling or fraying of the Ni external electrode of the lower layer 3a and variations in the shape, color and characteristics of the multilayer varistor element 1. When the rotation is started from a state in which the rotation start temperature of the sheath 13 is less than 300 ° C. and the applied Ni external electrode paste of the lower layer 3 a is not yet cured, the sheath is peeled off or adheres to the inner wall of the multilayer varistor element 1 or the sheath 13. The phenomenon of blurring is likely to occur. Conversely, the rotation start temperature of the sheath 13 is set to 1000 ° C.
If the temperature is higher than the temperature, that is, from the temperature range in which the multilayer varistor element 1 starts sintering, the variation in the shrinkage rate and the reduction rate of the multilayer varistor element 1 tends to increase.

【0030】また、後者の非酸化雰囲気中の酸素濃度の
切替えは、主に積層バリスタ素子1の内部構造デラミネ
ーションやNi内部電極2切れの低減に作用する。焼成
開始直後から1000℃〜1200℃までの領域では、
酸素濃度を1〜100ppm程度の非酸化雰囲気中で焼成
することにより、塗布したNi内部電極2のメタル化に
よる体積収縮を抑え、1000℃〜1200℃を超えた
領域即ち、積層バリスタ素子1の焼結による体積収縮が
起こりはじめると同時に、酸素濃度を10-10〜10-20
atmに低下しNi内部電極2及び下層3aのNi外部電
極をメタル化する。この方法を実施することで、デラミ
ネーションやNi内部電極2切れが低減できる。また、
サヤ13を回転させた後で酸素濃度を低くすることによ
り下層3aのNi外部電極の剥離を低減させる効果も同
時に有することができる。
Further, the latter switching of the oxygen concentration in the non-oxidizing atmosphere mainly affects the internal structural delamination of the multilayer varistor element 1 and the reduction of the Ni internal electrode 2 cut. Immediately after the start of firing, in the region from 1000 ° C to 1200 ° C,
By firing in a non-oxidizing atmosphere having an oxygen concentration of about 1 to 100 ppm, volume shrinkage due to metallization of the applied Ni internal electrode 2 is suppressed, and a region exceeding 1000 ° C. to 1200 ° C., that is, firing of the multilayer varistor element 1 is performed. At the same time as volume shrinkage due to sintering starts, the oxygen concentration is increased to 10 -10 to 10 -20.
It is reduced to atm, and the Ni internal electrode 2 and the Ni external electrode of the lower layer 3a are metallized. By performing this method, delamination and breakage of the Ni internal electrode 2 can be reduced. Also,
By lowering the oxygen concentration after the sheath 13 is rotated, the effect of reducing the exfoliation of the Ni external electrode of the lower layer 3a can be simultaneously obtained.

【0031】ここで、本発明による焼成方法において重
要だと考えられる事項について記載する。
Here, items considered to be important in the firing method according to the present invention will be described.

【0032】(1)下層3aのNi外部電極の剥離を防
ぐために、酸素濃度を低下するよりも低い温度領域か
ら、サヤ13の回転を開始することが望ましい。
(1) In order to prevent exfoliation of the Ni external electrode of the lower layer 3a, it is desirable to start the rotation of the sheath 13 from a temperature range lower than the oxygen concentration is lowered.

【0033】(2)回転数は1〜4r/minとするとサヤ
13での積層バリスタ素子1の回転がスムーズに起こり
やすい。
(2) When the number of rotations is 1 to 4 r / min, the rotation of the multilayer varistor element 1 at the sheath 13 tends to occur smoothly.

【0034】(3)非酸化雰囲気ガスが直接積層バリス
タ素子1に当たらない方が特性上安定する。
(3) Characteristics are more stable when the non-oxidizing atmosphere gas does not directly hit the multilayer varistor element 1.

【0035】(4)積層バリスタ素子1の投入量はサヤ
13の容積の1/3〜1/2ほどが最大でありこれ以上
増加させると、非酸化雰囲気ガスの流れが悪くなった
り、また、積層バリスタ素子1の回転が起こりにくくな
るという傾向にある。
(4) The maximum input amount of the multilayer varistor element 1 is about 1/3 to 1/2 of the volume of the sheath 13. If the input amount is further increased, the flow of the non-oxidizing atmosphere gas becomes worse, or There is a tendency that rotation of the multilayer varistor element 1 hardly occurs.

【0036】(5)下層3aのNi外部電極同士のクッ
ツキを防ぐため、とも粉を混入させると効果があり、こ
のとも粉は積層バリスタ素子1と同じ組成で、粒径が1
00〜500μmの比較的粗い粉がよい。
(5) Mixing powder is effective to prevent crackling between the Ni external electrodes of the lower layer 3a. This powder has the same composition as the laminated varistor element 1 and a particle size of 1
A relatively coarse powder of 00 to 500 μm is preferred.

【0037】(6)内部電極2、下層3aの外部電極の
電極ペーストとしてNiOを使用したが、非酸化雰囲気
焼成(10)でのメタル化による体積収縮を考慮すれ
ば、Niを出発ペーストにする方が良いと考えられる
が、セラミックシート1aとの接着性及び、添加したL
+イオンの効果(原子価制御)、製造コストなどを考
慮した結果、金属酸化物のNiOを使用する方が良い。
この時のNiOの平均粒径は0.7〜1.0μmが望ま
しい。
(6) Although NiO was used as the electrode paste for the internal electrodes 2 and the external electrodes of the lower layer 3a, Ni is used as a starting paste in consideration of volume shrinkage due to metallization in a non-oxidizing atmosphere firing (10). It is considered that the adhesiveness to the ceramic sheet 1a and the added L
As a result of considering the effect of i + ions (valence control), manufacturing cost, and the like, it is better to use NiO as a metal oxide.
At this time, the average particle diameter of NiO is desirably 0.7 to 1.0 μm.

【0038】なお、本実施の形態1において、積層バリ
スタ素子1を例にあげたが、本発明は、予め外部電極を
塗布した積層体で、非酸化雰囲気焼成するものなら、積
層コンデンサ、積層セラミスタなどの積層セラミック電
子部品の焼成方法にも応用できるものである。
In the first embodiment, the multilayer varistor element 1 has been described as an example. However, the present invention is not limited to a multilayer capacitor and a multilayer ceramic thermistor if the multilayer body is coated with external electrodes in advance and fired in a non-oxidizing atmosphere. The present invention can be applied to a firing method for a multilayer ceramic electronic component such as the above.

【0039】[0039]

【発明の効果】以上、本発明によれば外部電極ペースト
が塗布された積層セラミック被焼成素子を回転可能なサ
ヤ内に投入し、非酸化雰囲気中で焼成する際、外部電極
ペーストが硬化する温度よりも高温でサヤの回転を開始
することにより、外部電極の剥離やカスレなどの不良が
低減し、かつサヤが回転しているため均一な形状、色特
性の積層セラミック電子部品を多量に焼成することが可
能となる。
As described above, according to the present invention, the temperature at which the external electrode paste is hardened when the multilayer ceramic fired element coated with the external electrode paste is put into a rotatable sheath and fired in a non-oxidizing atmosphere. By starting rotation of the sheath at a higher temperature, defects such as exfoliation and fraying of external electrodes are reduced, and since the sheath is rotating, a large number of multilayer ceramic electronic components with uniform shape and color characteristics are fired. It becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態における焼成工程の説明
FIG. 1 is an explanatory view of a firing step according to an embodiment of the present invention.

【図2】本発明の一実施の形態におけるサヤ詰め方法を
示す断面図
FIG. 2 is a cross-sectional view showing a method of filling the sheath in one embodiment of the present invention.

【図3】本発明の一実施の形態における積層バリスタ素
子の断面図
FIG. 3 is a sectional view of a multilayer varistor element according to an embodiment of the present invention.

【図4】本発明の一実施の形態における積層バリスタ素
子の製造工程図
FIG. 4 is a manufacturing process diagram of the laminated varistor element in one embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 積層バリスタ素子 2 内部電極 3a 下層 13 サヤ DESCRIPTION OF SYMBOLS 1 Multilayer varistor element 2 Internal electrode 3a Lower layer 13 Saya

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // C04B 35/495 C04B 35/64 C B 35/00 J Continued on the front page (51) Int.Cl. 6 Identification number Office reference number FI Technical indication // C04B 35/495 C04B 35/64 CB 35/00 J

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 内部電極とセラミックシートとを交互に
積層した積層セラミック被焼成素子に外部電極ペースト
を塗布し、次に前記積層セラミック被焼成素子を少なく
とも一つの貫通孔を有する回転可能なサヤ内に投入し、
その後非酸化雰囲気で前記積層セラミック被焼成素子を
焼成する際、前記外部電極ペーストが硬化する温度より
も高温でかつ前記積層セラミック被焼成素子が焼結を始
める温度よりも低温から前記サヤの回転を開始する積層
セラミック電子部品の焼成方法。
An external electrode paste is applied to a multilayer ceramic fired element in which internal electrodes and ceramic sheets are alternately stacked, and then the multilayer ceramic fired element is placed in a rotatable sheath having at least one through hole. ,
Thereafter, when firing the multilayer ceramic fired element in a non-oxidizing atmosphere, the rotation of the sheath from a temperature higher than the temperature at which the external electrode paste hardens and lower than the temperature at which the multilayer ceramic fired element starts sintering. Starting method of firing multilayer ceramic electronic components.
【請求項2】 サヤの回転開始温度は、300℃〜10
00℃の範囲である請求項1に記載の積層セラミック電
子部品の焼成方法。
2. The rotation start temperature of the sheath is 300 ° C. to 10 ° C.
2. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the temperature is in the range of 00C.
【請求項3】 サヤの回転速度は、このサヤの貫通孔か
ら積層セラミック被焼成素子が飛び出ない速さとする請
求項1に記載の積層セラミック電子部品の焼成方法。
3. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the rotational speed of the sheath is such that the multilayer ceramic element to be fired does not protrude from the through hole of the sheath.
【請求項4】 サヤ内にとも粉を混入させて焼成する請
求項1に記載の積層セラミック電子部品の焼成方法。
4. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the powder is mixed into the sheath and fired.
【請求項5】 積層セラミック被焼成素子の内部電極及
び外部電極ペーストは、金属酸化物を主成分とする物質
で形成されている請求項1に記載の積層セラミック電子
部品の焼成方法。
5. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the internal electrode and the external electrode paste of the multilayer ceramic fired element are formed of a material containing a metal oxide as a main component.
【請求項6】 金属酸化物としてNiOを用いる請求項
5に記載の積層セラミック電子部品の焼成方法。
6. The method for firing a multilayer ceramic electronic component according to claim 5, wherein NiO is used as the metal oxide.
【請求項7】 積層セラミック被焼成素子が焼結を開始
する温度より低い温度領域における第1の焼成雰囲気よ
りも、前記積層セラミック被焼成素子が焼結を開始する
温度よりも高い温度領域における第2の焼成雰囲気の方
が酸素濃度が低い請求項1に記載の積層セラミック電子
部品の焼成方法。
7. A first firing atmosphere in a temperature range lower than a temperature at which the multilayer ceramic fired element starts sintering, and a first firing atmosphere in a temperature range higher than a temperature at which the multilayer ceramic fired element starts sintering. 2. The method for firing a multilayer ceramic electronic component according to claim 1, wherein the firing atmosphere of (2) has a lower oxygen concentration.
【請求項8】 第1の焼成雰囲気と第2の焼成雰囲気と
の切り替え温度は、1000℃〜1200℃の間である
請求項7に記載の積層セラミック電子部品の焼成方法。
8. The method for firing a multilayer ceramic electronic component according to claim 7, wherein the switching temperature between the first firing atmosphere and the second firing atmosphere is between 1000 ° C. and 1200 ° C.
【請求項9】 第1の焼成雰囲気の酸素濃度は、1〜1
00ppmで、第2の焼成雰囲気の酸素濃度は、10-10
10-20atmである請求項8に記載の積層セラミック電子
部品の焼成方法。
9. The oxygen concentration of the first firing atmosphere is 1 to 1
At 00 ppm, the oxygen concentration in the second firing atmosphere is 10 −10 to
The method for firing a multilayer ceramic electronic component according to claim 8, wherein the firing temperature is 10 -20 atm.
JP8178886A 1996-07-09 1996-07-09 Burning method of laminated ceramic electronic part Pending JPH1025164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8178886A JPH1025164A (en) 1996-07-09 1996-07-09 Burning method of laminated ceramic electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8178886A JPH1025164A (en) 1996-07-09 1996-07-09 Burning method of laminated ceramic electronic part

Publications (1)

Publication Number Publication Date
JPH1025164A true JPH1025164A (en) 1998-01-27

Family

ID=16056424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8178886A Pending JPH1025164A (en) 1996-07-09 1996-07-09 Burning method of laminated ceramic electronic part

Country Status (1)

Country Link
JP (1) JPH1025164A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355346B1 (en) * 2000-01-28 2002-10-11 한국과학기술연구원 Method of densification for oxide thick film
JP2013243281A (en) * 2012-05-22 2013-12-05 Murata Mfg Co Ltd Method for manufacturing multilayer semiconductor ceramic capacitor and multilayer semiconductor ceramic capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355346B1 (en) * 2000-01-28 2002-10-11 한국과학기술연구원 Method of densification for oxide thick film
JP2013243281A (en) * 2012-05-22 2013-12-05 Murata Mfg Co Ltd Method for manufacturing multilayer semiconductor ceramic capacitor and multilayer semiconductor ceramic capacitor

Similar Documents

Publication Publication Date Title
JP4200765B2 (en) Manufacturing method of multilayer ceramic electronic component
CN108461293A (en) A kind of manufacturing method of ceramic capacitor
JPH1070012A (en) Manufacture of varistor
JPH06302403A (en) Lamination type semiconductor ceramic element
JPH0684608A (en) Ceramic element
JPH1025164A (en) Burning method of laminated ceramic electronic part
JPH06151103A (en) Laminated semiconductor porcelain composition
JPH11340090A (en) Manufacture of grain boundary insulated multilayer ceramic capacitor
US5481428A (en) Process for manufacturing multilayer capacitors
JP3003564B2 (en) Method for firing ceramic electronic components
JP4513388B2 (en) Manufacturing method of multilayer ceramic electronic component
JP2003272906A (en) Ceramic element and manufacturing method of the same
JPH07114174B2 (en) Method for manufacturing laminated semiconductor porcelain electronic component
JP2011151250A (en) Electronic component and method of manufacturing electronic component
JP2002043105A (en) Zinc oxide varistor and method of manufacturing the same
JP4144080B2 (en) Multilayer semiconductor ceramic element
JPH0547508A (en) Laminated semiconductor porcelain and manufacture thereof
JPH04317302A (en) Positive temperature coefficient thermistor and manufacturing method thereof
JPH08222470A (en) Manufacture of grain boundary insulated laminated ceramic component
EP1288971B1 (en) Method of manufacturing zinc oxide varistor
JPH09115704A (en) Manufacture of electronic component
JPH02199023A (en) Production of oxide superconducting thick film
JPH10135008A (en) Manufacture of ceramic element
CN109285697A (en) A kind of manufacturing method of low stress ceramic capacitor
JPH06181108A (en) Semiconductor ceramic having positive resistance-temperature characteristic

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20040316