JPH10249577A - Soldering cream - Google Patents

Soldering cream

Info

Publication number
JPH10249577A
JPH10249577A JP9074398A JP7439897A JPH10249577A JP H10249577 A JPH10249577 A JP H10249577A JP 9074398 A JP9074398 A JP 9074398A JP 7439897 A JP7439897 A JP 7439897A JP H10249577 A JPH10249577 A JP H10249577A
Authority
JP
Japan
Prior art keywords
flux
parts
solder cream
hydroxystearic acid
castor oil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9074398A
Other languages
Japanese (ja)
Inventor
Tetsuo Nishimura
哲郎 西村
Masazumi Kusuki
正澄 楠木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SUPERIA SHIYA KK
Original Assignee
NIPPON SUPERIA SHIYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SUPERIA SHIYA KK filed Critical NIPPON SUPERIA SHIYA KK
Priority to JP9074398A priority Critical patent/JPH10249577A/en
Publication of JPH10249577A publication Critical patent/JPH10249577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a soldering cream that enables high density mounting. SOLUTION: A thixotropy agent is made from hydrofined castor oil and bisamide composed of 12-hydroxystearic acid and diamine, with these mixed under a desirable combination ratio, quantity and conditions, constituting a flux in which no coarse filler is caused and in which a strong thixotropic character is contained, creating a superior coating property with a fine solder power dispersed in the flux, and thereby producing a soldering cream free of shear drop and oxidation. One example of a desirable combination ratio is the flux in which 3 to 10 parts of thixotropy agent are contained in 100 parts of flux. In addition, the thixotropy agent is prepared in such weight % as 1 hydroxystearic acid against 0.3-1.0 bisamide.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】本発明は、高密度実装に対応
することができるハンダクリームに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder cream capable of coping with high-density mounting.

【0002】[0002]

【発明が解決しようとする課題】ハンダクリームは、ロ
ジン類、活性剤、チクソ付与剤ならびにその他の添加剤
を溶剤に溶解して作成したフラックスに、ハンダ粉末を
分散させたものであり、スクリーン印刷やディスペンサ
ー吐出によって印刷もしくは塗布されて使用される。従
ってハンダクリームには良好な印刷特性や吐出特性、お
よびそれによって塗布されたものがダレたり滲んだりし
ないことが強く要求され、ハンダクリーム中のチクソ剤
やその他の添加物の微細な析出によるフィラー効果を有
効に利用してきた。
The solder cream is prepared by dispersing a solder powder in a flux prepared by dissolving a rosin, an activator, a thixotropic agent and other additives in a solvent. Or printed or applied by dispenser discharge. Therefore, it is strongly required that the solder cream has good printing characteristics and ejection characteristics, and that the applied material does not sag or bleed, and the filler effect due to fine precipitation of the thixotropic agent and other additives in the solder cream. Has been used effectively.

【0003】しかし、基板実装とともにハンダクリーム
塗布パターンも微細化し、高密度化してくると、従来有
効に利用してきたチクソ剤や添加物の析出フィラーが細
目パターンに対して相対的に粗大障害物化し、有効な塗
布結果を得ることができなくなってきた。同じ理由に対
応するために、ハンダ粉が微細化したことが、さらにハ
ンダクリームとしてのチクソ性の低下、粘度や稠度の変
化に伴う印刷特性や吐出特性の大幅な変化をもたらし、
結果としての不具合の発生に加えて、ダレや滲みもます
ます起こりやすくなった。このような現状の課題に鑑み
て、高密度実装の進展に適切に対応するために、ハンダ
クリームの早急な改良が必要となっている。
However, as the solder cream application pattern becomes finer and denser as the substrate is mounted, the thixotropic agent and additive deposited fillers which have been used effectively become coarse obstacles relatively to the fine pattern. However, effective application results cannot be obtained. In order to respond to the same reason, the fineness of the solder powder further reduced the thixotropic properties of the solder cream, and caused a significant change in printing characteristics and ejection characteristics with changes in viscosity and consistency,
In addition to the resulting failures, sagging and bleeding became more likely. In view of such current problems, urgent improvement of solder cream is required in order to appropriately cope with the progress of high-density packaging.

【0004】ところで、ヒマシ油及びその誘導体は強力
なチクソ剤として知られている。各種高級脂肪酸とジア
ミンとのビスアミド類も同様である。従ってこれらは単
独もしくは併用でフラックスにもしばしば用いられてき
た。これらは共にフラックスを構成するロジン、溶剤と
は比較的相溶性に乏しく、系に均一に配合しにくいの
で、配合時にはその融点に近い温度で系に溶解させてい
る。そしてこれらをチクソ剤として採用した場合には、
本来、強力な水素結合を形成する性質のため、高温溶融
状態から常温に冷却される過程において、チクソ剤同士
が寄り集まってコロニーを形成してフィラー状に析出し
ていた。特に融点の高いものほどこの傾向が顕著で、配
合されたチクソ剤のかなりの部分は溶剤、溶質を抱き込
んだネットワーク形成以外にフィラー析出に消費されて
しまうから、期待すべきチクソ性も不十分で、得られた
フラックスは液性流動を示してしまう。さらに、このよ
うな問題を補うためにチクソ剤を増やした場合には、フ
ラックスの粘度、稠度がいたずらに増加する傾向にあっ
た。しかし荒いハンダ粉にも助けられて、ICのリード
ピッチが0.5mm以上のピッチであっても、一応の対
応は可能であった。
[0004] Castor oil and its derivatives are known as powerful thixotropic agents. The same applies to bisamides of various higher fatty acids and diamines. Therefore, these have often been used alone or in combination as fluxes. Both are relatively poor in compatibility with the rosin and the solvent constituting the flux and are difficult to uniformly blend into the system. Therefore, they are dissolved in the system at a temperature close to the melting point at the time of blending. And when these are adopted as thixotropic agents,
Originally, due to the property of forming strong hydrogen bonds, in the process of cooling from a high-temperature molten state to room temperature, thixotropic agents gathered together to form colonies and precipitated out as fillers. In particular, the higher the melting point, the more the tendency is remarkable, and a considerable part of the compounded thixo agent is consumed for filler precipitation other than formation of a network containing a solvent and a solute. Thus, the obtained flux shows a liquid flow. Further, when the thixotropic agent is increased to compensate for such a problem, the viscosity and consistency of the flux tend to increase unnecessarily. However, with the aid of rough solder powder, even if the lead pitch of the IC was 0.5 mm or more, it was possible to respond tentatively.

【0005】ところが、最近の高密度実装はリードピッ
チ0.5mm程度では不足であり、さらに細かいピッチ
に対応するハンダ付けが要求されている。
However, in recent high-density mounting, a lead pitch of about 0.5 mm is insufficient, and soldering corresponding to a finer pitch is required.

【0006】本発明は、上述した現状の課題に対応する
もので、現状よりもさらに密度の高い実装を可能とする
ハンダクリームを提供することを目的とする。
An object of the present invention is to provide a solder cream which can be mounted at a higher density than the current situation.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明では水添ヒマシ油と、12−ヒドロキシステ
アリン酸とジアミンとのビスアミドとをチクソ剤とし、
これらを好ましい比率の組み合わせ、量及び条件にて配
合し、粗大なフィラーが生じることなく、しかも強力な
チクソ性を有するフラックスを構成し、これに微細ハン
ダ粉を分散させて優れた塗布性能とし、ダレ、滲みがな
いハンダクリームとしたものである。
In order to achieve the above object, in the present invention, hydrogenated castor oil and a bisamide of 12-hydroxystearic acid and a diamine are used as thixotropic agents,
Combining these in a preferred ratio combination, amount and conditions, without generating coarse fillers, and constituting a flux having strong thixotropy, dispersing fine solder powder into it to achieve excellent coating performance, This is a solder cream with no dripping or bleeding.

【0008】上記好ましい比率の組み合わせの一例とし
ては、チクソ剤が、フラックス100部中3〜10部配
合されているフラックスを用いることがある。又、水添
ヒマシ油1に対してビスアミドが0.3〜1.0の重量
比で配合することもある。
As an example of a combination of the above preferable ratios, there is a case where a flux containing 3 to 10 parts of a thixotropic agent in 100 parts of a flux is used. Bisamide may be blended in a weight ratio of 0.3 to 1.0 with respect to 1 hydrogenated castor oil.

【0009】ヒマシ油誘導体、各種アミド類のうち、不
飽和脂肪酸系は融点が低く、ハンダクリームの低温ダレ
特性が悪いため、好ましくない。水添ヒマシ油とアミド
類、そのうちでも側鎖に水酸基を有する高級脂肪酸、と
りわけ12−ヒドロキシステアリン酸のジアミンとのビ
スアミドが良好であるが、それぞれ単独ではフラックス
のチクソ性は十分ではなく、そのうえフィラー状の析出
が多い。特に後者はその傾向が顕著である。ところが、
両者を好ましい比率で併用すると、この析出が大幅に軽
減し、しかも析出形態が細かくなってチクソ性も大いに
向上することがわかった。併用がチクソ剤の結晶化を阻
害した結果と推測される。このようにして得られたフラ
ックスを用いたハンダクリームはリードピッチ0.3m
m以下のはんだ付けにも対応することができる。
Among castor oil derivatives and various amides, unsaturated fatty acids are not preferred because they have a low melting point and the low-temperature dripping properties of solder cream are poor. Hydrogenated castor oil and amides, among which higher fatty acids having a hydroxyl group in the side chain, especially bisamides with diamine of 12-hydroxystearic acid are good, but the thixotropy of the flux alone is not sufficient, and the filler There are many precipitations. In particular, the latter is remarkable. However,
It has been found that when both are used in a preferable ratio, the precipitation is greatly reduced, and the morphology of the precipitation is fine, and the thixotropy is also greatly improved. It is presumed that the combined use inhibited the crystallization of the thixotropic agent. The solder cream using the flux thus obtained has a lead pitch of 0.3 m.
m or less.

【0010】ビスアミドではメチレン、エチレン、ヘキ
サメチレン、およびキシリレンの各ビスアミド(以下、
総称してビスアミドという)が工業的実用性において有
用である。水添ヒマシ油は軟化点の高いものがよく、少
なくとも70度C以上、好ましくは完全水添ヒマシ油が
望ましい。フラックス100重量部に対して、チクソ剤
の配合量は3〜10重量部が適当である。それ以下では
チクソ性が不足し、それ以上では粘度が過剰であるうえ
に、好ましくない稠度が発現し、かつ粗大なフィラーも
発生しやすくなるからである。
Bisamides include methylene, ethylene, hexamethylene, and xylylene bisamides (hereinafter, referred to as "bisamides").
(Collectively referred to as bisamides) are useful in industrial practicality. The hydrogenated castor oil preferably has a high softening point, and is preferably at least 70 ° C. or higher, and more preferably completely hydrogenated castor oil. An appropriate amount of the thixotropic agent is 3 to 10 parts by weight with respect to 100 parts by weight of the flux. If it is lower than this, the thixotropy is insufficient, and if it is higher than that, the viscosity is excessive, undesired consistency is developed, and coarse fillers are easily generated.

【0011】水添ヒマシ油とビスアミドの比率は重量比
で1:0.3〜1:1が良好である。ビスアミドが0.
3以下であると稠度不足のためにハンダクリームの印刷
ローリング性が劣るなど、塗布性能に不具合が生じる。
1.0以上では稠度が出過ぎて版抜けが悪くなったり、
粗大フィラーの析出が増すなどのために、塗布性能が劣
化する。本発明においてフラックスを製造するときは、
予めロジンその他チクソ剤以外の組成を均一に混合溶解
した溶液にチクソ剤を微粉にしたうえで均一に分散混合
し、その後、加熱撹拌するという条件が必要になる。チ
クソ剤は予め微粉、望ましくは50ミクロン以下にして
均一に分散混合する。なお、チクソ剤を分散混合した後
は、望ましくは常温まで撹拌しながら冷却する。
The ratio of hydrogenated castor oil to bisamide is preferably 1: 0.3 to 1: 1 by weight. Bisamide is 0.
If it is less than 3, the coating performance will be poor, such as poor solder roll printing rollability due to insufficient consistency.
If it is more than 1.0, the consistency will be too high and the printing will be poor,
The coating performance is degraded, for example, due to increased precipitation of coarse filler. When producing a flux in the present invention,
It is necessary to finely disperse the thixotropic agent in a solution in which a composition other than rosin and other components other than the thixotropic agent is uniformly mixed and dissolved in advance, uniformly disperse and mix the mixture, and then heat and stir. The thixotropic agent is made into fine powder, preferably 50 μm or less in advance, and is uniformly dispersed and mixed. After the thixotropic agent is dispersed and mixed, the mixture is desirably cooled to room temperature with stirring.

【0012】0.3ミリピッチの細目パターンに対応す
るには、ハンダ粉も50ミクロン以下、好ましくは40
ミクロン以下がよい。このハンダ粉を85〜92重量%
と、本発明で開示したフラックス15〜8重量%を混練
したハンダクリームは、細目パターンの印刷塗布および
吐出塗布に対していずれも極めて良好に対応することが
できる。
In order to correspond to a fine pattern of 0.3 mm pitch, the solder powder should be 50 μm or less, preferably 40 μm or less.
Submicron is better. 85-92% by weight of this solder powder
In addition, the solder cream kneaded with 15 to 8% by weight of the flux disclosed in the present invention can cope extremely well with print application and discharge application of fine patterns.

【0013】[0013]

【実施例】【Example】

(実施例1)重合ロジン55.5部、ジエチレングリコ
ールモノヘキシルエーテル19部、ジエチレングリコー
ルモノブチルエーテル19部、ジエチルアミン臭化水素
酸塩0.5部を120℃で均一に溶解する。常温まで冷
却したところで、N,N’−エチレンビス12−ヒドロ
キシステアリン酸アミド2.5部と水添ヒマシ油3.5
部の微粉末混合物をママコが発生しないように均一に混
合した後、撹拌しながら昇温し、次いで常温まで冷却し
た。このようにして得られたフラックスは、チクソ剤そ
の他の粗大な析出がない滑らかなゲル状物で高いチクソ
性を示す。このフラックス10部と35ミクロン以下の
ハンダ粉末90部を混練して得たハンダクリームは、高
いチクソ性を有し、0.3ミリピッチの細目パターン印
刷で極めて優れた印刷性を示し、得られた塗布物にダレ
や滲みの発生はなかった。
(Example 1) 55.5 parts of polymerized rosin, 19 parts of diethylene glycol monohexyl ether, 19 parts of diethylene glycol monobutyl ether, and 0.5 part of diethylamine hydrobromide are uniformly dissolved at 120 ° C. After cooling to room temperature, 2.5 parts of N, N'-ethylenebis-12-hydroxystearic acid amide and hydrogenated castor oil 3.5
The fine powder mixture was uniformly mixed so as not to cause mamako, and then heated with stirring, and then cooled to room temperature. The flux obtained in this way is a smooth gel-like substance without a thixotropic agent or other coarse precipitates and exhibits high thixotropy. A solder cream obtained by kneading 10 parts of this flux and 90 parts of a solder powder of 35 μm or less has high thixotropy and exhibits extremely excellent printability in fine pattern printing of 0.3 mm pitch. There was no sagging or bleeding on the coated material.

【0014】(実施例2〜5)アミドを実施例1のもの
からN,N’−メチレンビス12−ヒドロキシステアリ
ン酸アミド(実施例2)、N,N’−ブチレンビス12
−ヒドロキシステアリン酸アミド(実施例3)、N,
N’−ヘキサメチレンビス12−ヒドロキシステアリン
酸アミド(実施例4)、N,N’−キシリレンビス12
−ヒドロキシステアリン酸アミド(実施例5)に置換し
たほかの成分は実施例1と同様で構成し、同じ条件で実
験を行った。その結果、得られたハンダクリームは実施
例1とほぼ同様の性質を示した。
(Examples 2 to 5) N, N'-methylenebis-12-hydroxystearic acid amide (Example 2), N, N'-butylenebis12
-Hydroxystearic acid amide (Example 3), N,
N'-hexamethylenebis-12-hydroxystearic acid amide (Example 4), N, N'-xylylenebis12
Other components substituted by -hydroxystearic acid amide (Example 5) were constituted in the same manner as in Example 1, and an experiment was conducted under the same conditions. As a result, the obtained solder cream showed almost the same properties as in Example 1.

【0015】(実施例6)重合ロジン58.5部、ジエ
チレングリコールモノヘキシルエーテル19部、ジエチ
レングリコールモノブチルエーテル19部、ジエチルア
ミン臭化水素酸塩0.5部の均一溶解液にN,N’−エ
チレンビス12−ヒドロキシステアリン酸アミド1.5
部と水添ヒマシ油1.5部の均一混合粉末を常温でママ
コがないように分散した後、撹拌しながら昇温し、次い
で撹拌しながら常温まで冷却した。このようにして得ら
れたフラックス13部に対して35ミクロン以下のハン
ダ粉末87部を混練してハンダクリームを得た。このハ
ンダクリームは、0.2ミリ径の針穴から安定して吐出
され、塗布物にダレは見られなかった。
Example 6 A homogeneous solution of 58.5 parts of polymerized rosin, 19 parts of diethylene glycol monohexyl ether, 19 parts of diethylene glycol monobutyl ether and 0.5 part of diethylamine hydrobromide was added to a homogeneous solution of N, N'-ethylenebis. 12-hydroxystearic acid amide 1.5
Parts and 1.5 parts of hydrogenated castor oil were dispersed at room temperature in such a manner that no mamako was formed, the temperature was increased while stirring, and then cooled to room temperature with stirring. To 13 parts of the flux thus obtained, 87 parts of solder powder having a size of 35 μm or less were kneaded to obtain a solder cream. The solder cream was stably discharged from a 0.2 mm diameter needle hole, and no dripping was observed in the applied material.

【0016】(実施例7)重合ロジン48.5部、ジエ
チレングリコールモノヘキシルエーテル20.5部、ジ
エチレングリコールモノブチルエーテル20.5部、ジ
エチルアミン臭化水素酸塩0.5部の均一混合溶液に、
N,N’−エチレンビス12−ヒドロキシステアリン酸
アミド3部と水添ヒマシ油7部の微粉末混合物を常温で
ママコがないように均一に分散混合し、撹拌しながら昇
温し、次いで撹拌しながら常温まで冷却した。このよう
にして得られたフラックス10部と35ミクロン以下の
ハンダ粉末90部を混練してハンダクリームを得た。こ
のハンダクリームは、0.3ミリピッチの細目パターン
印刷に良好な結果を示した。
Example 7 A homogeneous mixed solution of 48.5 parts of polymerized rosin, 20.5 parts of diethylene glycol monohexyl ether, 20.5 parts of diethylene glycol monobutyl ether, and 0.5 part of diethylamine hydrobromide was prepared.
A fine powder mixture of 3 parts of N, N'-ethylenebis-12-hydroxystearic acid amide and 7 parts of hydrogenated castor oil is uniformly dispersed and mixed at room temperature without mamaco, and the mixture is heated while stirring, and then stirred. While cooling to room temperature. 10 parts of the flux thus obtained and 90 parts of solder powder having a diameter of 35 μm or less were kneaded to obtain a solder cream. This solder cream showed good results for printing a fine pattern of 0.3 mm pitch.

【0017】(比較例1)N,N’−エチレンビス12
−ヒドロキシステアリン酸アミドを3.5部、水添ヒマ
シ油を2.5部とし、その他は実施例1と同様の配合と
してハンダクリームを得た。このハンダクリームは稠度
過剰で版抜けが悪く、0.3ミリピッチの印刷を行った
が十分な効果を得ることができなかった。
Comparative Example 1 N, N'-ethylenebis12
The same procedure as in Example 1 was repeated except for using 3.5 parts of hydroxystearic acid amide and 2.5 parts of hydrogenated castor oil to obtain a solder cream. This solder cream had excessive consistency and poor printing, and printing at a pitch of 0.3 mm failed to obtain a sufficient effect.

【0018】(比較例2)N,N’−エチレンビス12
−ヒドロキシステアリン酸アミドを1部、水添ヒマシ油
を1部とし、重合ロジンを59.5部とした他は実施例
6と同様の組成でハンダクリームを得た。このハンダク
リームは、吐出が不安定で、塗布物のダレも大きかっ
た。
Comparative Example 2 N, N'-ethylenebis12
A solder cream was obtained in the same composition as in Example 6, except that 1 part of hydroxystearic acid amide, 1 part of hydrogenated castor oil and 59.5 parts of polymerized rosin were used. This solder cream had unstable ejection and dripping of the applied matter was large.

【0019】(比較例3)N,N’−エチレンビス12
−ヒドロキシステアリン酸アミドと水添ヒマシ油の比率
が3:7である混合微粉末を12部とし、重合ロジンを
46.5部とした他は実施例7と同様の組成でハンダク
リームを得た。このハンダクリームでは、フラックスに
粗大なチクソ剤の析出が目立ち、ハンダクリーム自体も
滑らかさを欠いていた。そして、0.3ミリピッチの印
刷をしたところ、不安定な結果しか示さなかった。
Comparative Example 3 N, N'-ethylenebis12
-A solder cream was obtained with the same composition as in Example 7 except that the mixed fine powder having a ratio of hydroxystearic acid amide to hydrogenated castor oil of 3: 7 was 12 parts, and the polymerized rosin was 46.5 parts. . In this solder cream, coarse thixotropic agents were noticeably precipitated in the flux, and the solder cream itself lacked smoothness. When printing was performed at 0.3 mm pitch, only unstable results were shown.

【0020】以上の結果を、まとめて表1に示すThe above results are summarized in Table 1.

【表1】 [Table 1]

【0021】[0021]

【発明の効果】本発明の範囲におけるように、水添ヒマ
シ油と、12−ヒドロキシステアリン酸と、ジアミンと
のジスアミドの適切な比率、配合量および配合条件のも
とに製造されたフラックスを用いることによって、微細
なハンダ粉を用いた場合でも良好な塗布特性を得ること
ができた。従って、最近要求されている0.3ミリピッ
チの細目パターンへの対応も可能であり、基板実装の高
密度化を図ることができるようになった。
As in the scope of the present invention, use is made of a flux produced under appropriate ratios, amounts and conditions of disamide of hydrogenated castor oil, 12-hydroxystearic acid and diamine. As a result, good coating characteristics could be obtained even when using fine solder powder. Therefore, it is possible to cope with a fine pattern of 0.3 mm pitch, which is required recently, and it is possible to increase the density of the substrate mounting.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】少なくともロジン類、活性剤、溶剤および
チクソ付与剤からなるフラックスとハンダ粉で構成され
るハンダクリームにおいて、チクソ剤が水添ヒマシ油
と、12−ヒドロキシステアリン酸とジアミンとのビス
アミドの併用であるフラックスを用いたハンダクリー
ム。
1. A solder cream comprising a flux comprising at least a rosin, an activator, a solvent and a thixotropic agent and a solder powder, wherein the thixotropic agent is hydrogenated castor oil, bisamide of 12-hydroxystearic acid and diamine. Solder cream using flux which is used in combination.
【請求項2】チクソ剤が、フラックス100重量部中3
〜10重量部配合されているフラックスを用いた請求項
1記載のハンダクリーム。
2. The method according to claim 1, wherein the thixotropic agent is used in an amount of 3 parts by weight per 100 parts by weight of the flux.
The solder cream according to claim 1, wherein a flux is used in an amount of 10 to 10 parts by weight.
【請求項3】水添ヒマシ油1に対してビスアミドが重量
比で0.3〜1.0である請求項1記載のハンダクリー
ム。
3. The solder cream according to claim 1, wherein the weight ratio of bisamide to hydrogenated castor oil is 0.3 to 1.0.
JP9074398A 1997-03-10 1997-03-10 Soldering cream Pending JPH10249577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9074398A JPH10249577A (en) 1997-03-10 1997-03-10 Soldering cream

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9074398A JPH10249577A (en) 1997-03-10 1997-03-10 Soldering cream

Publications (1)

Publication Number Publication Date
JPH10249577A true JPH10249577A (en) 1998-09-22

Family

ID=13546052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9074398A Pending JPH10249577A (en) 1997-03-10 1997-03-10 Soldering cream

Country Status (1)

Country Link
JP (1) JPH10249577A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001347395A (en) * 2000-06-07 2001-12-18 Showa Denko Kk Flux for solder paste and its production method
JP2002263884A (en) * 2001-03-09 2002-09-17 Showa Denko Kk Soldering flux and solder paste
CN100425385C (en) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 Leadless solder paste and its preparation method
JP2009104930A (en) * 2007-10-24 2009-05-14 Panasonic Corp Conductive paste and package using this
WO2012042926A1 (en) * 2010-09-29 2012-04-05 株式会社弘輝 Soldering paste and flux
WO2015022719A1 (en) * 2013-08-12 2015-02-19 千住金属工業株式会社 Flux, solder paste and soldered joint
CN105290647A (en) * 2015-11-13 2016-02-03 北京达博长城锡焊料有限公司 Organic scaling powder for frequency conversion refrigerator welding materials and preparing method
WO2020153418A1 (en) * 2019-01-24 2020-07-30 株式会社弘輝 Flux and solder paste
WO2022270499A1 (en) 2021-06-24 2022-12-29 千住金属工業株式会社 Flux and solder paste

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4485652B2 (en) * 2000-06-07 2010-06-23 昭和電工株式会社 Manufacturing method of flux for solder paste
JP2001347395A (en) * 2000-06-07 2001-12-18 Showa Denko Kk Flux for solder paste and its production method
JP2002263884A (en) * 2001-03-09 2002-09-17 Showa Denko Kk Soldering flux and solder paste
CN100425385C (en) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 Leadless solder paste and its preparation method
JP2009104930A (en) * 2007-10-24 2009-05-14 Panasonic Corp Conductive paste and package using this
US9421646B2 (en) 2010-09-29 2016-08-23 Koki Company Limited Soldering paste and flux
WO2012042926A1 (en) * 2010-09-29 2012-04-05 株式会社弘輝 Soldering paste and flux
JP2012071337A (en) * 2010-09-29 2012-04-12 Koki:Kk Soldering paste and flux
CN103124614A (en) * 2010-09-29 2013-05-29 株式会社弘辉 Soldering paste and flux
WO2015022719A1 (en) * 2013-08-12 2015-02-19 千住金属工業株式会社 Flux, solder paste and soldered joint
US10160064B2 (en) 2013-08-12 2018-12-25 Senju Metal Industry Co., Ltd. Flux, solder paste and solder joint
CN105290647A (en) * 2015-11-13 2016-02-03 北京达博长城锡焊料有限公司 Organic scaling powder for frequency conversion refrigerator welding materials and preparing method
WO2020153418A1 (en) * 2019-01-24 2020-07-30 株式会社弘輝 Flux and solder paste
JP2020116611A (en) * 2019-01-24 2020-08-06 株式会社弘輝 Flux and solder paste
US11975411B2 (en) 2019-01-24 2024-05-07 Koki Company Limited Flux and solder paste
WO2022270499A1 (en) 2021-06-24 2022-12-29 千住金属工業株式会社 Flux and solder paste

Similar Documents

Publication Publication Date Title
JP7183313B2 (en) Solder alloy and solder powder
CA1319310C (en) Fusible powdered metal paste
JP3306007B2 (en) Solder material
JPH10249577A (en) Soldering cream
USRE32309E (en) Fusible powdered metal paste
JP5445717B2 (en) flux
CN112719694B (en) Soldering flux composition, preparation method of soldering flux composition, gold-tin soldering paste for spray printing and preparation method of gold-tin soldering paste
JPH07119273B2 (en) Method for producing epoxy resin composition
US4557767A (en) Fusible powdered metal paste
JP5273443B2 (en) Method for forming minute solder bump and solder paste
JP2004074267A (en) Bonding material and its manufacturing method, bonding material feeding method, and electronic circuit substrate
JPH0454555B2 (en)
JP7202336B2 (en) Solder composition and method for manufacturing electronic substrate
JP2007260776A (en) Gold tin alloy solder paste and method of manufacturing substrate loaded with electronic component using the solder paste
JP3648697B2 (en) Solder paste composition, method for producing printed wiring board having solder pads, and method for producing electronic component mounting circuit board
JPH0464799B2 (en)
JPH0726191A (en) Organic vehicle for electronic composition
JPH0929480A (en) Solder paste
CA1235049A (en) Paste vehicle for fusible powdered metal paste
JP3369196B2 (en) Flux composition
EP0140344A2 (en) Paste vehicle for fusible powdered metal paste
JP4106504B2 (en) Cream solder and cream solder flux
CN104289827A (en) Soldering flux and soldering paste
JP4212141B2 (en) Flux and cream solder
JP7478173B2 (en) Flux composition and solder composition

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R370 Written measure of declining of transfer procedure

Free format text: JAPANESE INTERMEDIATE CODE: R370

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees