JPH10247819A - Antenna element and manufacture therefor - Google Patents

Antenna element and manufacture therefor

Info

Publication number
JPH10247819A
JPH10247819A JP6744397A JP6744397A JPH10247819A JP H10247819 A JPH10247819 A JP H10247819A JP 6744397 A JP6744397 A JP 6744397A JP 6744397 A JP6744397 A JP 6744397A JP H10247819 A JPH10247819 A JP H10247819A
Authority
JP
Japan
Prior art keywords
sheet
resin sheet
antenna element
sheet member
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6744397A
Other languages
Japanese (ja)
Inventor
Kiyotaka Kumaki
清高 熊木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Industries Corp
Original Assignee
Kojima Press Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kojima Press Industry Co Ltd filed Critical Kojima Press Industry Co Ltd
Priority to JP6744397A priority Critical patent/JPH10247819A/en
Publication of JPH10247819A publication Critical patent/JPH10247819A/en
Pending legal-status Critical Current

Links

Landscapes

  • Position Fixing By Use Of Radio Waves (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an antenna element at a low cost which withstands shocks and is easily to assemble and to provide a manufacturing method of the antenna element easily manufactured and assembled at a low cost. SOLUTION: A copper foil 5 (radiation conductor element) is inserted between a 1st resin film sheet 1 and a 2nd resin film sheet 2, so that its extension part 6 extends outwards to form a 1st sheet member S1. A copper foil 7 (ground conductor) is inserted between a 3rd resin film sheet 3 and a 4th resin film sheet 4 to form a 2nd sheet member S2. The 2nd sheet member is placed to the 1st sheet member at a prescribed distance. A synthetic resin material, melt- stuck to the 1st to 4th resin sheets, is packed between the 1st sheet member and the 2nd sheet member to form a dielectric layer 8. Then a circuit element CT is adhered to the copper foil 7, the extended part 6 is folded and a tip 6a is connected to a circuit element.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、アンテナ素子及び
その製造方法に関し、特にGPS用アンテナに好適なア
ンテナ素子及びその製造方法に係る。
The present invention relates to an antenna element and a method of manufacturing the same, and more particularly, to an antenna element suitable for a GPS antenna and a method of manufacturing the same.

【0002】[0002]

【従来の技術】近時、グローバルポジショニングシステ
ム(GPS)が注目されており、これに適用される種々
のアンテナが提案されている。例えば、特公昭60−4
0203号公報に開示されたマイクロストリップアンテ
ナが利用されるが、市販のアンテナ素子は図9に示すよ
うに構成されている。即ち、セラミック製の誘電体層2
8の両面に銀ペーストが蒸着され、放射導体素子25と
接地導体27が形成されている。そして、これらを所定
の間隙を隔てて貫通するように給電ピン26が配置さ
れ、その一端部26aが放射導体素子25に半田SDに
よって接合されている。更に、接地導体27に回路素子
CTが接合され、給電ピン26の他端部26bが回路素
子CT内の低雑音増幅回路(図示せず)に接続されてい
る。尚、回路素子CTは同軸ケーブルCBを介して受信
機RCに接続される。
2. Description of the Related Art Recently, a global positioning system (GPS) has attracted attention, and various antennas applied to the system have been proposed. For example, Japanese Patent Publication No. 60-4
A microstrip antenna disclosed in Japanese Patent Publication No. 0203 is used, and a commercially available antenna element is configured as shown in FIG. That is, the dielectric layer 2 made of ceramic
The silver paste is vapor-deposited on both surfaces of 8 to form a radiation conductor element 25 and a ground conductor 27. A power supply pin 26 is disposed so as to penetrate these with a predetermined gap therebetween, and one end 26 a of the power supply pin 26 is joined to the radiation conductor element 25 by solder SD. Further, the circuit element CT is joined to the ground conductor 27, and the other end 26b of the power supply pin 26 is connected to a low noise amplifier circuit (not shown) in the circuit element CT. The circuit element CT is connected to the receiver RC via the coaxial cable CB.

【0003】[0003]

【発明が解決しようとする課題】図9に記載のアンテナ
素子は、セラミック製の誘電体層28の両面に銀ペース
トが蒸着された後、給電ピン26を挿通する孔が誘電体
層28に穿設される。このため、誘電体層28が割れや
すく加工が困難であり、製品としても衝撃に弱いという
難点がある。しかも、銀ペーストの蒸着には専用の機械
設備が必要であり、作業も容易ではない。また、給電ピ
ン26の配置、接合が容易ではなく、組付けも困難であ
る。このように、製造、組付が困難で製造コストが高い
というだけでなく、製品としてのアンテナ素子も脆弱
で、高価なものとなる。
In the antenna element shown in FIG. 9, after silver paste is vapor-deposited on both surfaces of a ceramic dielectric layer 28, holes through which feed pins 26 are inserted are formed in the dielectric layer 28. Is established. For this reason, the dielectric layer 28 is easily cracked and difficult to process, and the product is weak against impact. In addition, the deposition of silver paste requires special machinery and equipment, and the work is not easy. In addition, the arrangement and joining of the power supply pins 26 are not easy, and assembly is also difficult. As described above, not only is manufacturing and assembly difficult and the manufacturing cost is high, but also the antenna element as a product is fragile and expensive.

【0004】そこで、本発明は、安価で衝撃に強く、組
付が容易なアンテナ素子を提供することを課題とする。
また、容易且つ安価に製造、組付を行ない得るアンテナ
素子の製造方法を提供することを課題とする。
Accordingly, an object of the present invention is to provide an antenna element that is inexpensive, resistant to impact, and easy to assemble.
It is another object of the present invention to provide a method for manufacturing an antenna element that can be easily and inexpensively manufactured and assembled.

【0005】[0005]

【課題を解決するための手段】上記の課題を解決するた
め、本発明のアンテナ素子は、請求項1に記載のよう
に、延出部を有する放射導体素子と、該放射導体素子を
フィルム状の第1の樹脂シートと第2の樹脂シートの間
に配置し、前記延出部が前記第1の樹脂シート及び第2
の樹脂シートから外方に延出するように挟持したシート
部材と、該シート部材の一側面に接合する樹脂材料の誘
電体層とを備え、前記放射導体素子の前記延出部を前記
誘電体層側に折曲するように構成したものである。
According to a first aspect of the present invention, there is provided an antenna element according to the present invention, comprising: a radiating conductor element having an extension; Is disposed between the first resin sheet and the second resin sheet, and the extending portion is provided between the first resin sheet and the second resin sheet.
A sheet member sandwiched so as to extend outward from the resin sheet, and a dielectric layer of a resin material bonded to one side surface of the sheet member, wherein the extending portion of the radiation conductor element is formed of the dielectric material. It is configured to bend to the layer side.

【0006】また、請求項1に係るアンテナ素子の製造
方法として、請求項2に記載のように、各々に凹部を有
する第1及び第2の金型を接合して所定のモールド室を
形成し、該モールド室内でアンテナ素子を形成するアン
テナ素子の製造方法において、延出部を有する放射導体
素子を、フィルム状の第1の樹脂シートと第2の樹脂シ
ートの間に配置し、前記放射導体素子の延出部が前記第
1の樹脂シート及び第2の樹脂シートから外方に延出す
るように挟持してシート部材を形成し、少なくとも該シ
ート部材を前記第1の金型の凹部内に収容し、前記放射
導体素子の延出部のみが前記第1及び第2の金型に密着
するように前記第1及び第2の金型を接合し、前記シー
ト部材と前記第2の金型の凹部底面との間に郭成される
空間に、前記第1及び第2の樹脂シートと相互に溶着可
能な合成樹脂材料を充填して誘電体層を形成した後、前
記放射導体素子の延出部を前記誘電体層側に折曲するこ
とが望ましい。
According to a first aspect of the present invention, there is provided a method for manufacturing an antenna element, wherein a first and a second molds each having a concave portion are joined to form a predetermined mold chamber. In the method of manufacturing an antenna element for forming an antenna element in the mold chamber, a radiating conductor element having an extending portion is disposed between a first resin sheet and a second resin sheet in a film shape, A sheet member is formed by sandwiching the extending portion of the element so as to extend outward from the first resin sheet and the second resin sheet, and at least the sheet member is formed in a recess of the first mold. And the first and second molds are joined so that only the extending portion of the radiation conductor element is in close contact with the first and second molds, and the sheet member and the second mold are joined. In the space defined between the mold and the bottom surface of the concave portion, the first Beauty filled with weldable synthetic resin material to the second resin sheet and cross After forming the dielectric layer, it is desirable to bend the extending portion of the radiating conductor element to the dielectric layer side.

【0007】[0007]

【発明の実施の形態】以下、本発明の望ましい実施形態
を図面を参照して説明する。図1及び図2は本発明のア
ンテナ素子の一実施形態に係り、合成樹脂材料によって
フィルム状に形成した第1の樹脂シート1と第2の樹脂
シート2の間に放射導体素子たる銅箔5が挟持され、接
着剤によって密着接合されて本発明のシート部材たる第
1のシート部材S1が構成されている。銅箔5は、図1
に2点鎖線で示し図2に実線で示すように、延出部6が
一体的に延出形成されており、後述の組付け後、図1に
実線で示すように折曲されて給電路に供される。
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIGS. 1 and 2 relate to an embodiment of an antenna element according to the present invention, in which a copper foil 5 as a radiation conductor element is provided between a first resin sheet 1 and a second resin sheet 2 formed in a film shape from a synthetic resin material. Are sandwiched and tightly joined by an adhesive to form a first sheet member S1 which is a sheet member of the present invention. The copper foil 5 is shown in FIG.
The extended portion 6 is integrally formed as shown by a two-dot chain line and a solid line in FIG. 2, and is folded as shown by a solid line in FIG. To be served.

【0008】また、第1のシート部材S1に対して所定
距離隔てて第2のシート部材S2が配置されている。こ
の第2のシート部材S2も合成樹脂材料によってフィル
ム状に形成した第3の樹脂シート3と第4の樹脂シート
4との間に、接地導体たる銅箔7が挟持され、接着剤に
よって密着接合されて成る。
Further, a second sheet member S2 is arranged at a predetermined distance from the first sheet member S1. This second sheet member S2 is also sandwiched between a third resin sheet 3 and a fourth resin sheet 4 which are formed in a film shape from a synthetic resin material, and a copper foil 7 serving as a ground conductor is tightly joined by an adhesive. Become composed.

【0009】そして、第1のシート部材S1と第2のシ
ート部材S2の間に、誘電体層8が形成されている。こ
の誘電体層8と第1乃至第4の樹脂シート1乃至4は相
互に溶着可能な合成樹脂材料によって、後述する方法で
一体的に形成されている。尚、第4の樹脂シート4に
は、回路素子CTを配置する孔4aが形成されており、
回路素子CTが銅箔7に接合され、回路素子CT内の接
地部(図示せず)と銅箔7が接続されている。
[0010] A dielectric layer 8 is formed between the first sheet member S1 and the second sheet member S2. The dielectric layer 8 and the first to fourth resin sheets 1 to 4 are integrally formed of a synthetic resin material which can be welded to each other by a method described later. The fourth resin sheet 4 has a hole 4a for disposing the circuit element CT.
The circuit element CT is bonded to the copper foil 7, and a grounding portion (not shown) in the circuit element CT is connected to the copper foil 7.

【0010】上記の構成になるアンテナ素子ATに接合
される回路素子CTは、低雑音増幅回路(図示せず)を
有し、これに延出部6の先端6aが接続されると共に、
図1に示すように、同軸ケーブルCBによって受信機R
Cに接続され、GPSアンテナが構成される。而して、
アンテナ素子ATで受信された電波は回路素子CT内の
低雑音増幅回路(図示せず)で増幅され、同軸ケーブル
CBを介して受信機RCに供給される。
The circuit element CT joined to the antenna element AT having the above configuration has a low-noise amplifier circuit (not shown), to which the tip 6a of the extension 6 is connected.
As shown in FIG. 1, the receiver R is connected by a coaxial cable CB.
C to form a GPS antenna. Thus,
The radio wave received by the antenna element AT is amplified by a low-noise amplifier (not shown) in the circuit element CT and supplied to the receiver RC via the coaxial cable CB.

【0011】上記のアンテナ素子ATの製造方法につい
て説明すると、図3に示すように第1及び第2の金型M
1,M2が用意され、これらには夫々凹部M1c,M2
cが形成されている。そして、以下の(1)乃至(7)
の工程に従ってアンテナ素子ATが製造される。先ず、
予め(1)第1の樹脂シート1と第2の樹脂シート2と
の間に銅箔5を挟持した状態で接着剤によって密着接合
し、第1のシート部材S1を形成する。このとき、延出
部6は第1の樹脂シート1及び第2の樹脂シート2の外
方に延出している。また、(2)第3の樹脂シート3と
第4の樹脂シート4との間に銅箔7を挟持した状態で接
着剤によって密着接合し、第2のシート部材S2を形成
する。
The method of manufacturing the above-described antenna element AT will be described. First, as shown in FIG.
1 and M2, which are respectively provided with concave portions M1c and M2.
c is formed. Then, the following (1) to (7)
The antenna element AT is manufactured according to the steps described above. First,
(1) The first resin sheet 1 and the second resin sheet 2 are tightly bonded with an adhesive in a state where the copper foil 5 is sandwiched between the first resin sheet 1 and the second resin sheet 2 to form a first sheet member S1. At this time, the extension 6 extends outside the first resin sheet 1 and the second resin sheet 2. In addition, (2) the second resin sheet 3 is bonded to the third resin sheet 3 and the fourth resin sheet 4 with an adhesive in a state where the copper foil 7 is sandwiched between the third resin sheet 3 and the fourth resin sheet 4 to form the second sheet member S2.

【0012】次に、(3)図3に示すように、第1のシ
ート部材S1を第1の金型M1の凹部M1c内に収容
し、第2のシート部材S2を第2の金型M2の凹部M2
c内に収容する。そして、(4)銅箔5の延出部6のみ
が第1及び第2の金型M1,M2の対向面M1a,M2
aに挟持されて密着するように、換言すれば、第2の樹
脂シート2と第3の樹脂シート3との間に空隙が形成さ
れるように、第1の金型M1と第2の金型M2を接合
し、図4に示す状態としモールド室MDを郭成する。
Next, (3) as shown in FIG. 3, the first sheet member S1 is accommodated in the recess M1c of the first mold M1, and the second sheet member S2 is accommodated in the second mold M2. Recess M2
housed in c. (4) Only the extending portion 6 of the copper foil 5 has the opposing surfaces M1a, M2 of the first and second molds M1, M2.
a, so that a gap is formed between the second resin sheet 2 and the third resin sheet 3, the first mold M1 and the second mold The mold M2 is joined, and the mold chamber MD is formed as shown in FIG.

【0013】この状態で、(5)モールド室MD内の第
1のシート部材S1と第2のシート部材S2との間に、
第1乃至第4の樹脂シート1乃至第4と相互に溶着可能
な樹脂材料を射出して図1に示す誘電体層8を形成す
る。このとき、延出部6は第1及び第2の金型M1,M
2の両者に密着し、これらとの間には空隙が形成されて
いないので、延出部6に樹脂材料が付着することはな
い。これに対し、第2及び第3の樹脂シート2,3と誘
電体層8は相互に溶着され、強固に接合される。(6)
誘電体層8が固化した後、図5に示すように第1の金型
M1と第2の金型M2を後退させ、成形品たるアンテナ
素子ATを取り出す。そして、(7)図1に示すように
アンテナ素子ATに回路素子CTを取付け、銅箔5の延
出部6を誘電体層8側に折曲し(図1の2点鎖線の状態
から実線の状態とし)、回路素子CTの低雑音増幅回路
(図示せず)に接続する。これにより、延出部6は給電
路として機能し得る。
In this state, (5) between the first sheet member S1 and the second sheet member S2 in the mold chamber MD,
A resin material that can be mutually welded to the first to fourth resin sheets 1 to 4 is injected to form the dielectric layer 8 shown in FIG. At this time, the extension portion 6 includes the first and second molds M1 and M
2 and no gap is formed between them, so that the resin material does not adhere to the extension 6. On the other hand, the second and third resin sheets 2 and 3 and the dielectric layer 8 are welded to each other and firmly joined. (6)
After the dielectric layer 8 is solidified, the first mold M1 and the second mold M2 are retracted as shown in FIG. 5, and the molded antenna element AT is taken out. Then, (7) the circuit element CT is attached to the antenna element AT as shown in FIG. 1, and the extension 6 of the copper foil 5 is bent toward the dielectric layer 8 (from the state of the two-dot chain line in FIG. 1 to the solid line). ), And connected to a low noise amplifier circuit (not shown) of the circuit element CT. Thereby, the extension part 6 can function as a power supply path.

【0014】而して、上記の方法によれば、従来の放射
導体素子の銀ペーストの蒸着等を必要とせず、また給電
ピンの挿入及び固定時の孔明け、半田付け等の加工も必
要とすることなく、合成樹脂の射出成形とその後の延出
部6の折曲加工によって容易に製造、組付を行なうこと
ができる。
According to the above-mentioned method, the conventional radiation conductor element does not require deposition of silver paste or the like, and also requires processing such as drilling and soldering when inserting and fixing the power supply pin. Without this, the production and assembly can be easily performed by injection molding of the synthetic resin and subsequent bending of the extension portion 6.

【0015】図6は本発明の一実施形態のアンテナ素子
ATを自動車のインストルメントパネルPNに埋設した
状態を示すもので、アンテナ素子ATをインサート成形
することによりビス等が不要となり、良好な組付性が得
られる。
FIG. 6 shows a state in which the antenna element AT according to one embodiment of the present invention is embedded in an instrument panel PN of an automobile. Stickiness is obtained.

【0016】上記の実施形態は、例えば、自動車のナビ
ゲーションシステム用の周波数(1.75GHz)に好
適であるが、本発明は、これに限定されるものではな
く、以下に説明する実施形態を包含する。即ち、一般的
には、アース側の放射導体素子は、受信側の放射導体素
子より大きいことが要求されるが、高速道路料金徴収シ
ステム用の周波数(5.8GHz)のように高い周波数
を受信するアンテナ素子の場合は銅箔(後述する図7に
15で示す)の面積が比較的小さくすむため、回路素子
CT内の接地部(図示せず)より小さく形成できる場合
がある。このような場合には、前述の第2のシート部材
S2を省略することが可能となり、図7に示すように構
成することができる。
The above embodiment is suitable, for example, for a frequency (1.75 GHz) for an automobile navigation system, but the present invention is not limited to this, and includes the embodiments described below. I do. That is, in general, the radiation conductor element on the ground side is required to be larger than the radiation conductor element on the reception side, but a higher frequency such as a frequency (5.8 GHz) for an expressway toll collection system is received. In the case of such an antenna element, since the area of the copper foil (indicated by 15 in FIG. 7 to be described later) is relatively small, it may be possible to form the antenna element smaller than the ground portion (not shown) in the circuit element CT. In such a case, the above-mentioned second sheet member S2 can be omitted, and can be configured as shown in FIG.

【0017】図7のアンテナ素子AT2は、第1の樹脂
シート11と第2の樹脂シート12との間に銅箔15を
介装し、延出部16が外方に延出した状態で接着剤によ
って密着接合すると共に、延出部16を含む部分を予め
折曲した状態で誘電体層18を形成したものである。
尚、図7においてはアンテナ素子AT2、第1の樹脂シ
ート11、第2の樹脂シート12、銅箔15、延出部1
6、誘電体層18は図1のアンテナ素子AT、第1の樹
脂シート1、第2の樹脂シート2、銅箔5、延出部6、
誘電体層8に夫々対応しており、その他の構成は図1の
実施形態と同様である。
The antenna element AT2 shown in FIG. 7 has a copper foil 15 interposed between the first resin sheet 11 and the second resin sheet 12, and is bonded in a state in which the extension 16 extends outward. The dielectric layer 18 is formed in a state in which the portion including the extending portion 16 is bent in advance while being tightly joined by an agent.
In FIG. 7, the antenna element AT2, the first resin sheet 11, the second resin sheet 12, the copper foil 15, the extension 1
6, the dielectric layer 18 is the antenna element AT of FIG. 1, the first resin sheet 1, the second resin sheet 2, the copper foil 5, the extension 6,
The other structures correspond to the dielectric layers 8, and the other configurations are the same as those of the embodiment of FIG.

【0018】次に、図7のアンテナ素子AT2の製造方
法について説明すると、図8に示すように第1及び第2
の金型M11,M12が用意され、これらには夫々凹部
M11c,M12cが形成されている。そして、以下の
(1)乃至(6)の工程に従ってアンテナ素子AT2が
製造される。先ず、予め延出部16が折曲形成された銅
箔15を、(1)第1の樹脂シート11と第2の樹脂シ
ート12との間に挟持した状態で接着剤によって密着接
合し、シート部材S11を形成する。次に、(2)図8
に示すように、シート部材S11を第1の金型M11の
凹部M11c内に収容する。そして、(3)銅箔15の
延出部16のみが第1及び第2の金型M1,M2の両者
に密着するように第1及び第2の金型M11,M12を
接合し、モールド室(図示省略)を郭成する。
Next, a method of manufacturing the antenna element AT2 shown in FIG. 7 will be described. First, as shown in FIG.
Are prepared, and concave portions M11c and M12c are respectively formed in these molds M11 and M12. Then, the antenna element AT2 is manufactured according to the following steps (1) to (6). First, the copper foil 15 having the bent portion 16 formed in advance is tightly joined with an adhesive while sandwiching the copper foil 15 between the first resin sheet 11 and the second resin sheet 12 (1). The member S11 is formed. Next, (2) FIG.
As shown in (5), the sheet member S11 is housed in the recess M11c of the first mold M11. Then, (3) the first and second molds M11 and M12 are joined so that only the extending portion 16 of the copper foil 15 is in close contact with both the first and second molds M1 and M2, and the molding chamber is formed. (Not shown).

【0019】この状態で、(4)モールド室内のシート
部材S11と第2の金型M12の凹部12cの底面との
間に、第1及び第2の樹脂シート11,12と相互に溶
着可能な合成樹脂材料を射出して図7に示す誘電体層1
8を形成する。(5)誘電体層18が固化した後、第1
の金型M11と第2の金型M12を後退させ、成形品た
るアンテナ素子AT2を取り出す。そして、(6)図7
に示すようにアンテナ素子ATに回路素子CTを取付
け、銅箔15の延出部16を回路素子CTの低雑音増幅
回路(図示せず)に接続する。
In this state, (4) the first and second resin sheets 11 and 12 can be mutually welded between the sheet member S11 in the mold chamber and the bottom surface of the concave portion 12c of the second mold M12. The dielectric layer 1 shown in FIG.
8 is formed. (5) After the dielectric layer 18 has solidified, the first
The mold M11 and the second mold M12 are retracted, and the antenna element AT2 as a molded product is taken out. And (6) FIG.
The circuit element CT is attached to the antenna element AT as shown in (1), and the extension 16 of the copper foil 15 is connected to a low noise amplifier circuit (not shown) of the circuit element CT.

【0020】尚、上記の実施形態においては、何れも延
出部6,16は夫々一本のみを設けることとしている
が、複数本設けることとしてもよい。また、誘電体層
8,18は中実に限らず、ハニカム形状や中空形状とし
てもよい。このように誘電体層8,18の形状を変更す
ることによって、誘電率や誘電正接を調整することがで
きる。
In the above embodiment, each of the extending portions 6 and 16 is provided with only one, but a plurality of extending portions may be provided. Further, the dielectric layers 8 and 18 are not limited to solid, and may have a honeycomb shape or a hollow shape. By changing the shape of the dielectric layers 8 and 18 as described above, the dielectric constant and the dielectric loss tangent can be adjusted.

【0021】[0021]

【発明の効果】本発明は上述のように構成されているの
で以下に記載する効果を奏する。即ち、本発明のアンテ
ナ素子は、請求項1に記載のように、延出部を有する放
射導体素子をフィルム状の第1の樹脂シートと第2の樹
脂シートの間に配置し、延出部が第1の樹脂シート及び
第2の樹脂シートから外方に延出するように挟持したシ
ート部材と、このシート部材の一側面に接合する樹脂材
料の誘電体層とを備え、放射導体素子の延出部を誘電体
層側に折曲するように構成されているので、従来の給電
ピンは不要であり、製造、組付が容易で、安価で衝撃に
強いアンテナ素子とすることができる。
Since the present invention is configured as described above, the following effects can be obtained. That is, according to the antenna element of the present invention, the radiating conductor element having the extension is disposed between the first resin sheet and the second resin sheet in the form of a film. Comprises a sheet member sandwiched so as to extend outward from the first resin sheet and the second resin sheet, and a dielectric layer of a resin material bonded to one side surface of the sheet member. Since the extension portion is configured to be bent toward the dielectric layer side, a conventional power supply pin is unnecessary, and it is easy to manufacture and assemble, and it is possible to provide an inexpensive and impact-resistant antenna element.

【0022】また、本発明のアンテナ素子の製造方法
は、請求項3に記載のように、延出部を有する放射導体
素子を、フィルム状の第1の樹脂シートと第2の樹脂シ
ートの間に配置し、放射導体素子の延出部が第1の樹脂
シート及び第2の樹脂シートから外方に延出するように
挟持してシート部材を形成し、少なくともシート部材を
第1の金型の凹部内に収容し、放射導体素子の延出部の
みが第1及び第2の金型に密着するように第1及び第2
の金型を接合し、シート部材と第2の金型の凹部底面と
の間に郭成される空間に、第1及び第2の樹脂シートと
相互に溶着可能な合成樹脂材料を充填して誘電体層を形
成した後、放射導体素子の延出部を誘電体層側に折曲す
ることとしているので、従来方法における誘電体層に対
する銀ペーストの蒸着や、給電ピン挿通孔の穿設は不要
となり、製造、組付作業が容易であり、コストを大幅に
低減することができる。
According to a third aspect of the present invention, in the method for manufacturing an antenna element, the radiating conductor element having the extending portion is disposed between the first resin sheet and the second resin sheet. And a sheet member is sandwiched between the first resin sheet and the second resin sheet so that the extension of the radiation conductor element extends outward from the first resin sheet and the second resin sheet. In the first and second molds so that only the extending portion of the radiation conductor element is in close contact with the first and second molds.
And filling a space defined between the sheet member and the bottom surface of the concave portion of the second mold with a synthetic resin material that can be mutually welded to the first and second resin sheets. After the dielectric layer is formed, the extension of the radiation conductor element is bent toward the dielectric layer, so that the silver paste is deposited on the dielectric layer and the feed pin insertion hole is formed in the conventional method. It becomes unnecessary, the manufacturing and assembling operations are easy, and the cost can be greatly reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態に係るアンテナ素子の断面
図である。
FIG. 1 is a sectional view of an antenna element according to an embodiment of the present invention.

【図2】本発明の一実施形態に係るアンテナ素子の平面
図である。
FIG. 2 is a plan view of an antenna element according to one embodiment of the present invention.

【図3】本発明の一実施形態のアンテナ素子を製造する
工程を示す断面図である。
FIG. 3 is a cross-sectional view showing a step of manufacturing the antenna element according to one embodiment of the present invention.

【図4】本発明の一実施形態のアンテナ素子を製造する
工程を示す断面図である。
FIG. 4 is a cross-sectional view showing a step of manufacturing the antenna element according to one embodiment of the present invention.

【図5】本発明の一実施形態のアンテナ素子を製造する
工程を示す断面図である。
FIG. 5 is a cross-sectional view showing a step of manufacturing the antenna element according to one embodiment of the present invention.

【図6】本発明の一実施形態のアンテナ素子を自動車の
インストルメントパネルに埋設した状態を示す断面図で
ある。
FIG. 6 is a sectional view showing a state in which the antenna element according to the embodiment of the present invention is embedded in an instrument panel of an automobile.

【図7】本発明の他の実施形態に係るアンテナ素子の断
面図である。
FIG. 7 is a cross-sectional view of an antenna element according to another embodiment of the present invention.

【図8】本発明の他の実施形態のアンテナ素子を製造す
る工程を示す断面図である。
FIG. 8 is a cross-sectional view showing a step of manufacturing an antenna element according to another embodiment of the present invention.

【図9】従来のアンテナ素子の断面図である。FIG. 9 is a sectional view of a conventional antenna element.

【符号の説明】[Explanation of symbols]

S1 第1のシート部材 S2 第2のシート部材 S11 シート部材 1,11 第1の樹脂シート 2,12 第2の樹脂シート 3 第3の樹脂シート 4 第4の樹脂シート 5,15 銅箔(放射導体素子) 6,16 延出部 7 銅箔(接地導体) 8,18 誘電体層 CT 回路素子 AT,AT2 アンテナ素子 CT 回路素子 CB 同軸ケーブル RC 受信機 S1 First sheet member S2 Second sheet member S11 Sheet member 1,11 First resin sheet 2,12 Second resin sheet 3 Third resin sheet 4 Fourth resin sheet 5,15 Copper foil (radiation 6, 16 Extension 7 Copper foil (ground conductor) 8, 18 Dielectric layer CT circuit element AT, AT2 Antenna element CT circuit element CB Coaxial cable RC receiver

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 延出部を有する放射導体素子と、該放射
導体素子をフィルム状の第1の樹脂シートと第2の樹脂
シートの間に配置し、前記延出部が前記第1の樹脂シー
ト及び第2の樹脂シートから外方に延出するように挟持
したシート部材と、該シート部材の一側面に接合する樹
脂材料の誘電体層とを備え、前記放射導体素子の前記延
出部を前記誘電体層側に折曲するように構成したことを
特徴とするアンテナ素子。
A radiating conductor element having an extending portion, and the radiating conductor element is disposed between a first resin sheet and a second resin sheet in the form of a film, and the extending portion is formed of the first resin sheet. A sheet member sandwiched so as to extend outward from the sheet and the second resin sheet; and a dielectric layer of a resin material bonded to one side surface of the sheet member; Is bent toward the dielectric layer side.
【請求項2】 各々に凹部を有する第1及び第2の金型
を接合して所定のモールド室を形成し、該モールド室内
でアンテナ素子を形成するアンテナ素子の製造方法にお
いて、延出部を有する放射導体素子を、フィルム状の第
1の樹脂シートと第2の樹脂シートの間に配置し、前記
放射導体素子の延出部が前記第1の樹脂シート及び第2
の樹脂シートから外方に延出するように挟持してシート
部材を形成し、少なくとも該シート部材を前記第1の金
型の凹部内に収容し、前記放射導体素子の延出部のみが
前記第1及び第2の金型に密着するように前記第1及び
第2の金型を接合し、前記シート部材と前記第2の金型
の凹部底面との間に郭成される空間に、前記第1及び第
2の樹脂シートと相互に溶着可能な合成樹脂材料を充填
して誘電体層を形成した後、前記放射導体素子の延出部
を前記誘電体層側に折曲することを特徴とするアンテナ
素子の製造方法。
2. A method of manufacturing an antenna element, comprising joining a first mold and a second mold each having a recess to form a predetermined mold chamber and forming an antenna element in the mold chamber. The radiation conductor element is disposed between the first resin sheet and the second resin sheet in the form of a film, and the extension of the radiation conductor element is formed between the first resin sheet and the second resin sheet.
A sheet member is formed by sandwiching the resin member so as to extend outward from the resin sheet, and at least the sheet member is accommodated in a concave portion of the first mold, and only the extending portion of the radiation conductor element is formed. The first and second molds are joined so as to be in close contact with the first and second molds, and a space defined between the sheet member and the bottom surface of the concave portion of the second mold is provided. Forming a dielectric layer by filling a synthetic resin material that can be welded to the first and second resin sheets with each other, and then bending an extending portion of the radiation conductor element toward the dielectric layer. A method for manufacturing an antenna element.
JP6744397A 1997-03-04 1997-03-04 Antenna element and manufacture therefor Pending JPH10247819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6744397A JPH10247819A (en) 1997-03-04 1997-03-04 Antenna element and manufacture therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6744397A JPH10247819A (en) 1997-03-04 1997-03-04 Antenna element and manufacture therefor

Publications (1)

Publication Number Publication Date
JPH10247819A true JPH10247819A (en) 1998-09-14

Family

ID=13345086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6744397A Pending JPH10247819A (en) 1997-03-04 1997-03-04 Antenna element and manufacture therefor

Country Status (1)

Country Link
JP (1) JPH10247819A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223109A (en) * 2001-01-25 2002-08-09 Furukawa Electric Co Ltd:The Chip antenna and its manufacturing method
JP2006080609A (en) * 2004-09-07 2006-03-23 Otsuka Chemical Co Ltd Planar antenna
JP2012205245A (en) * 2011-03-28 2012-10-22 Mitsubishi Electric Corp Method of manufacturing short patch antenna device
EP2529913A1 (en) * 2010-01-26 2012-12-05 Nissha Printing Co., Ltd. Injection-molded and simultaneously decorated article with antenna and production method thereof, and power feeding structure of housing with antenna

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223109A (en) * 2001-01-25 2002-08-09 Furukawa Electric Co Ltd:The Chip antenna and its manufacturing method
JP4531994B2 (en) * 2001-01-25 2010-08-25 古河電気工業株式会社 Chip antenna and manufacturing method thereof
JP2006080609A (en) * 2004-09-07 2006-03-23 Otsuka Chemical Co Ltd Planar antenna
EP2529913A1 (en) * 2010-01-26 2012-12-05 Nissha Printing Co., Ltd. Injection-molded and simultaneously decorated article with antenna and production method thereof, and power feeding structure of housing with antenna
EP2529913A4 (en) * 2010-01-26 2013-12-04 Nissha Printing Injection-molded and simultaneously decorated article with antenna and production method thereof, and power feeding structure of housing with antenna
JP2012205245A (en) * 2011-03-28 2012-10-22 Mitsubishi Electric Corp Method of manufacturing short patch antenna device

Similar Documents

Publication Publication Date Title
US7468709B2 (en) Method for mounting a radiator in a radio device and a radio device
US20090015509A1 (en) Carrier system for a high-frequency antenna and method for its manufacture
CN101297610B (en) Bending-type rigid printed wiring board and process for producing the same
US6356245B2 (en) Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
EP1481440B1 (en) Phased array antenna having patch antenna elements with enhanced parasitic antenna element performance at millimeter wavelength radio frequency signals
US20120097428A1 (en) Signal line path and manufacturing method therefor
US6903541B2 (en) Film-based microwave and millimeter-wave circuits and sensors
CN101488493B (en) Package for electronic component and method for manufacturing the same
JP2007535168A (en) Melt bonded assembly with leads
JP7166226B2 (en) Antenna device and manufacturing method
JPH10247819A (en) Antenna element and manufacture therefor
JP3983986B2 (en) Electronic laminate assembly
US20060285301A1 (en) Method for making a pre-laminated inlet
JPH10173435A (en) Antenna element and manufacture thereof
US11664567B2 (en) Hollow waveguide assembly formed by affixing first and second substrates to form a cavity therein and having a conductive layer covering the cavity
JP3192699B2 (en) Microstrip antenna and method of manufacturing the same
JP4277790B2 (en) High frequency glass antenna device for automobile
JPH10322126A (en) Assembling structure for planar antenna
JP2001237276A (en) Semiconductor device
JPH04349704A (en) Antenna
JP2004320431A (en) Flat antenna equipment
WO2005041352A1 (en) Device with integrated antenna for encapsulation of radio electronics and a method for fabrication of such devices
JP3442450B2 (en) Planar antenna type radio circuit
WO2020177849A1 (en) A unibody for an electronic device
JP2002076720A (en) High frequency coaxial line connection structure