JPH10247467A - Sample holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To observe the cross section most suitable for the observation of the deposition state while applying deposition to the surface of a sample with an electron microscope by providing a prescribed holder outer tube, a sample holding member, a vapor deposition material, and a vapor deposition material heating device. SOLUTION: This sample holder F supported by a holder support member is provided with a cylindrical holder outer tube 11 penetrating a holder support hole. The outer end section of an inner end side holder 13 is inserted into the inner end section on the inside of the holder outer tube 11. A vertically penetrating sample holding member storage hole storing a sample holding member 26 is formed at the inner end section of the inner end side holder 13. A heating wire 42 made of a tungsten wire wound with a vapor deposition material 43 is supported at this portion, and the material 43 is heated and evaporated by heating current feeding lead wires 46a, 46b. A deposited face is kept in the parallel state with the passage of an electron beam, and the deposition state can be observed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sample holder for holding a sample in a path of an electron beam emitted from an electron beam source (electron gun) of an electron microscope apparatus for performing a microscopic analysis operation on the sample, and more particularly to a sample surface. The present invention relates to a sample holder capable of observing a process in which a deposition material is deposited on a sample.

[0002]

2. Description of the Related Art Conventionally, the following technique (J01) is known as a technique for observing a material deposited on a sample surface while performing vacuum deposition on the sample surface in an electron microscope. (J01) Technique shown in FIGS. 9 to 12 FIG. 9 is a sectional view of a conventional general transmission electron microscope. FIG. 10 is an enlarged view of a main part of FIG. FIG. 11 is an explanatory view of a transmission electron microscope in which the portion shown in FIG. 10 is modified so that the material deposited on the sample surface can be observed while performing vacuum deposition on the sample surface in the electron microscope. FIG. 12 is a diagram for explaining the operation of the transmission electron microscope shown in FIG. 9 and 10, the electron microscope 01
Has a case (lens barrel) 02 whose inside is kept in a vacuum, and an electron gun 03 is provided at the upper end of the case 02. A fluorescent plate 04 for observation and an observation window 06 are provided at the lower end of the case 02. An electron beam converging lens 07 is arranged below the electron gun 03, and an objective lens 08 is arranged above the fluorescent screen 04. The objective lens 08 has an objective lens pole piece (magnetic pole member) 08a. A sample chamber R and a gonio stage G as a sample mounting section are provided between the electron beam converging lens 07 and the objective lens 08. Goniometer stage G
A cylindrical holder support member 0 having a holder support hole 09a
9. The cylindrical holder support member 09 includes:
The direction of the shaft is supported by the spherical bearing of the gonio stage G so as to be adjustable. The sample holder H (see FIG. 10) is supported by the holder support member 09. The sample S is held on the inner end (front) side of the sample holder H. A sample positioning member P having a positioning member Pa at the distal end is disposed at a position facing the distal end (front) of the sample holder H. The positioning member Pa is provided in the sample chamber R,
A member for abutting on the tip (front) side of the sample holder H to position the sample holder H in the front-rear direction.

When observing the material deposited on the sample surface while performing vacuum deposition on the sample surface in the electron microscope using the general transmission electron microscope shown in FIGS. 9 and 10, FIG. , Components of the standard configuration electron microscope shown in FIG. 10 (for example, members around the sample chamber R, the objective lens 0).
8. It was necessary to change the configuration of the objective lens pole piece (magnetic pole member) 08a) and the like so that the vapor deposition source 010 could be attached as shown in FIG.

[0004]

As described above, changing the configuration of the components of the electron microscope is wasteful of cost, time, etc., and is uneconomical. The sample deposition (deposition of the deposition material on the sample surface) in the electron microscope is shown in FIG.
As shown in FIG. 2, vapor deposition was performed from a direction A having an angle (30 ° or more) inclined with respect to the sample surface Sa perpendicular to the electron beam B. For this reason, cross-section observation (observation from a direction parallel to the interface) most suitable for observation of the vapor deposition state of the surface Sa of the sample S (interface observation) was impossible. Therefore,
The process of vapor deposition (thin film formation process) of the vapor deposition material on the sample surface, the behavior of the surface and atomic clusters (cluster of multiple atoms),
It was difficult to observe the interface structure and the like in detail.

[0005] The present invention has been made in view of the above circumstances and has the following content as an object. (O01) To enable cross-sectional observation (observation from a direction parallel to the interface) most suitable for observation of the vapor deposition state (interface observation) while performing vapor deposition on the sample surface using an electron microscope.

[0006]

Next, the present invention devised to solve the above-mentioned problems will be described. The elements of the present invention are used to facilitate correspondence with the elements of the embodiments described later. , The reference numerals of the elements of the embodiment are enclosed in parentheses. The reason why the present invention is described in correspondence with the reference numerals of the embodiments described below is to facilitate understanding of the present invention and not to limit the scope of the present invention to the embodiments.

According to the present invention, there is provided a sample holder according to the present invention, which has the following requirements. (A01) An electron beam (B) emitted from an electron gun (3).
Electron microscope arranged so as to surround the outside of the hallway (1)
A holder outer cylinder (1) slidably supported along a holder axial direction intersecting the passage of the electron beam (B) by a cylindrical holder mounting member (9) penetrating the lens barrel (2).
1), (A02) a sample holder that is supported by the holder outer cylinder (11) and holds the sample (S) with the surface (Sb) on which the sample (S) is deposited being parallel to the path of the electron beam (B). Member (2
6), (A03) a vapor deposition material (43) supported by the holder outer cylinder (11) and arranged at a position facing the surface (Sb) to be vapor deposited of the sample (S), (A04) the vapor deposition material ( 4
3) A vapor deposition material heating device (J) for heating to vapor-deposit on the surface to be vapor-deposited (Sb).

[0008] The sample holding member (26), the evaporation material (4)
3) and the vapor deposition material heating device (J) can be directly supported by the holder outer cylinder (11), and can be supported by the holder outer cylinder (11) via another supporting member. Is possible.

(Operation) Next, the operation of the present invention having the above-described features will be described. In the sample holder having the above-described features, the holder outer cylinder (11) is arranged so as to surround the outside of the passage of the electron beam (B) emitted from the electron gun (3). The electron beam (B) is slidably supported along a holder axial direction intersecting the passage of the electron beam (B) by a cylindrical holder mounting member (9) penetrating through 2). The sample holding member (26) supported by the holder outer cylinder (11) includes:
The sample (S) is held with the surface (Sb) of the sample (S) to be deposited being parallel to the path of the electron beam (B). An evaporation material (43) arranged at a position facing the surface (Sb) to be evaporated of the sample (S) is supported by the holder outer cylinder (11).

The vapor deposition material heating device (J) heats the vapor deposition material (43) and deposits the surface (Sb) of the sample (S).
Is deposited. Since the vapor deposition material (43) adheres so as to increase its thickness in a direction perpendicular to the surface (Sb) to be vapor-deposited, the path of the electron beam (B) is observable for observing the vapor deposition process.
Must be parallel to b). In the present invention, since the deposition surface (Sb) is held in a state parallel to the path of the electron beam (B), the deposition state of the deposition surface (Sb) can be observed. Further, a structure in which the sample holding member (26), the vapor deposition material (43), the vapor deposition material heating device (J), and the like are directly supported by the holder outer cylinder (11), or the holder outer cylinder (11) has another structure. In any case of the configuration in which the vapor deposition material (43) is vapor-deposited, the surface (Sb) on which the vapor deposition material (43) is vapor-deposited is held in a state parallel to the path of the electron beam (B). The state of vapor deposition on the surface to be vapor-deposited (Sb) can be observed.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

Next, an example (embodiment) of a sample holder according to the present invention will be described with reference to the drawings, but the present invention is not limited to the following example. In order to facilitate understanding of the following description, coordinate axes X, Y, and Z that are orthogonal to each other are defined in the drawings, and the arrow X direction is forward, the arrow Y direction is left, and the arrow Z direction is upward. And
In this case, the direction opposite to the X direction (−X direction) is backward, the direction opposite to the Y direction (−Y direction) is rightward, and the direction opposite to the Z direction (−Z direction) is downward. In addition, the front-back direction or the X-axis direction including the X direction and the -X direction, the left-right direction or the Y-axis direction including the Y direction and the -Y direction, the vertical direction including the Z direction and the -Z direction, or Let's call it the Z-axis direction. Furthermore, in the figure, those with “•” in “「 ”mean the arrow pointing from the back of the paper to the front, and those with“ x ”in“ ○ ”from the table on the paper It shall mean an arrow pointing to the back.

(Embodiment) FIG. 1 is an enlarged view of a main part showing a state in which an embodiment of a sample holder of the present invention is mounted on a goniometer stage for mounting a sample holder of an electron microscope. 2 is an overall explanatory view of the sample holder shown in FIG. 1, FIG. 2A is a plan view, FIG. 2B is an explanatory view of electric wiring, and FIG. 2C is FIG.
2 is a partial cross-sectional view as viewed from the arrow IIC. FIG.
FIG. 3 is an enlarged view of an elliptical portion indicated by an arrow III of A. FIG.
4A is a plan view of the sample holder shown in FIG. 2, FIG. 4A is a plan view, and FIG. 4B is a longitudinal sectional view of FIG. 4A.
It is a line sectional view. FIG. 5 is a perspective view of the tungsten rod supporting member shown in FIG. FIG. 6 shows VI-VI of FIG. 4A.
It is a line sectional view. FIG. 7 is a perspective view of the sample holding member shown in FIG. FIG. 8 is an operation explanatory view of the first embodiment.

The electron microscope 1 shown in FIG. 1 is the same as the electron microscope 01 shown in FIGS.
Elements similar to those indicated by R and G are provided. In the description of the drawings, the same components as those shown in FIGS. 9 and 10 are denoted by the same reference numerals used in FIGS. Detailed description is omitted. In FIG. 1, a gonio stage G as a sample holder mounting portion is provided above a electron gun 3 and an objective lens 8 in a case (lens tube) 2 in which the inside of the electron microscope 1 is kept in a vacuum. . The gonio stage G has a cylindrical holder support member (holder mounting member) 9 having a holder support hole 9a. The cylindrical holder support member 9
Is supported by a spherical bearing of the gonio stage G such that the direction of the shaft can be adjusted.

2 and 3, a sample holder F supported by the holder support member 9 is a cylindrical holder outer cylinder 11 penetrating the holder support hole 9a (see FIG. 2).
have. The inner end of the holder outer cylinder 11 (the case 2)
A ring-shaped O-ring accommodating groove for accommodating the O-ring 12 shown in FIG. 2C and FIG. The O-ring 12 is a member that presses against the inner side surface of the holder support hole 9a (see FIG. 1) and hermetically blocks the front of the O-ring 12 from the rear atmosphere. In FIG.
A large-diameter portion 11a having a female screw is formed on the inner peripheral surface of the inner end of the holder outer cylinder 11, and a small-diameter portion 11b is formed on a rear portion (-X side portion) of the large-diameter portion 11a. A step 11c is formed at the connection between the large diameter portion 11a and the small diameter portion 11b.

An outer end (rear end) of a stainless steel inner end holder 13 is inserted into an inner end (left end in FIG. 2) of the holder outer cylinder 11. The outer end portion (rear end portion) of the inner end side holder 13 has a cylindrical shape, and a ring-shaped large diameter portion 13a and a male screw portion 13b are formed on the outer peripheral portion. The ring-shaped large diameter portion 13a is inserted to a position where it comes into contact with the step portion 11c. An outer end portion (−X side portion) of the inner end side holder 13 relative to the ring-shaped large diameter portion 13 a is fitted with a small diameter portion 11 b of the holder outer cylinder 11. A ring-shaped O-ring groove for accommodating the O-ring 14 is formed on the outer peripheral surface of the fitting portion. The O-ring 14 is a member that presses against the inner side surface of the holder outer cylinder 11 and hermetically blocks the front of the O-ring 14 from the rear atmosphere.

A large-diameter portion 11a having a female screw at the inner end of the holder outer cylinder 11, and a small-diameter portion in front of the ring-shaped large-diameter portion 13a of the inner-end holder 13 inserted into the large-diameter portion. The cylindrical connecting member 17 is screwed with the male screw portion 13b. The inner end side holder 13 and the outer cylinder 11 are connected by the cylindrical connecting member 17. The inner end side holder 13 is provided with the cylindrical connecting member 17.
As shown in FIGS. 2A and 2C, the upper part and the lower part of the front part of the front end of FIG. 3 (see FIG. 3) are cut flat, and the left side (Y side) and the right side (−Y).
(See FIG. 6).

In FIG. 4, a positioning ball 18 is bonded to the inner end (front end) of the inner end side holder 13. The positioning ball 18 is a member for positioning the inner end holder 13 in the front-rear direction. When the inner end holder 13 is inserted forward from the rear side of the gonio stage G in FIG. And a member that comes into contact with the positioning member Pa of the sample positioning member P. In FIG. 4, a sample holding member receiving hole 21 penetrating vertically is formed at the inner end of the inner end holder 13. Sample holding member receiving hole 2
A concave portion 23 having a lower wall portion 22 is formed on the rear side of 1. A cable insertion hole 24 is formed in the inner end side holder 13 behind the rear end of the recess 23. Therefore, the concave portion 23 is connected to the cable insertion hole 24 at the rear end. A sample holding member 26 is housed in the sample holding member housing hole 21. Sample holding member 26
The left and right (Y-axis direction) side faces are supported by the inner end side holder 13 by screws 27, 27 so that the rotational position around the left and right axes can be adjusted.

In FIG. 7, the sample holding member 26 is
The supported portions 28, 28 having the recesses 28a with which the screws 27, 27 abut, are connected to the front (X-direction) side surfaces of the supported portions 28, 28, which are lower in height than the supported portions 28, 28 and which are lower. And a sample mounting part 31 formed at the same height as the connecting part 29 and formed on the opposed sides of the supported parts 28 and 28. The sample mounting part 3
A sample S having a surface Sb to be deposited is placed on 1. Further, each rear side (−X direction) of the sample holding plate 33 is fixed to the sample mounting portion 31 by a fixing screw 32. The sample S is held by the sample holder 3 by the sample holding plate 33.
1 and is fixed. The deposition surface Sb of the fixed sample S intersects with the holder axis in the inner end side holder 13.

In FIG. 4, the surface Sb to be deposited of the sample S is shown.
A tungsten rod supporting member 34 made of a heat-resistant insulating member is fixed to the lower wall portion 22 of the inner end side holder 13 by a fixing screw 36 at the rear (−X direction).
In FIG. 5, the tungsten rod supporting member 34 is a substantially rectangular parallelepiped member, and a fixing screw through hole 37 penetrating the lower surface is formed at the center of the upper surface. Conductive wire fixing screw holes 38 are formed on both sides (in the Y-axis direction). In each of the conductive wire fixing screw holes 38, a conductive cylindrical member 39 having a female screw formed on the inner peripheral surface is embedded. 4 and 5,
The front (X side) surface of the tungsten rod support member 34 is a surface S on which the sample S is to be deposited in the inner end side holder 13.
b (see FIG. 4A). Tungsten rods 41, 41 are fitted to the front surface, and are supported by a tungsten rod support member. Tungsten rod 41, 4
The supported portion (−X side portion) of the conductive cylindrical member 3
9 and comes into contact with the conductive cylindrical member 39. A notch 41a for heating wire support (see FIG. 5) is formed on the tip end side of each tungsten rod 41 extending toward the surface Sb to be deposited of the sample S. A heating wire 42 made of a tungsten wire is supported by the heating wire supporting cut 41a. A vapor deposition material 43 is wound around the heating wire 42.

The conductor fixing screw 4 screwed into the conductive cylindrical member 39 embedded in the conductor fixing screw holes 38, 38.
4, 44 (see FIGS. 4A and 6), the conducting wires 46a and 46b of the heating current supply cable 46 are fixed to the upper surface of the tungsten rod support member 34. The conductors 46a, 46b
Is supplied from the conductive cylindrical member 39 to which the lead wire fixing screws 44 and 44 are screwed, through the tungsten rod 41 that comes into contact with the conductive cylindrical member 39, and the tip side of the tungsten rod 41. The heating wire 42 is supplied to the heating wire 42, and the heating wire 42 generates heat to heat the deposition material 43. The conductor fixing screws 44, 4
The head of the wire 4 is lifted from the upper surface of the tungsten rod supporting member 34 by the winding of the wires 46a, 46b around the wires 44, 44.
Even when the tip of 4 does not directly contact the tungsten rods 41, 41, the conductive wires 46a, 46b, the tungsten rod 41, and the heating wire 42 can be conducted through the respective conductive cylindrical members 39. A vapor deposition material heating device J (see FIGS. 4 and 6) is composed of the components indicated by the reference numerals 34 to 46.

In FIG. 4, the heating current supply cable 46 is composed of a cable fixing member 47 and a pair of screws 48 which are separated from each other before and after (in the X-axis direction) to be screwed with the cable fixing member 47 (see FIG. 4A)
Thus, the inner holder 13 is fixed to the lower wall portion 22. The heating current supply cable 46 is composed of conductive wires 46a, 4
6b and a shielded wire 46c covering the periphery of the conductive wires 46a and 46b. In FIG. 2, the heating current supply cable 46 passes through the cable insertion hole 24 (see FIGS. 3 and 4B) of the inner end side holder 13 from the inner end side to the outer end side. Conducting wires 49a and 49b for supplying heating current are provided at the outer end of the inner end side holder 13 (see FIGS. 2B and 3).
Is fixed. The insulator 49 hermetically shuts off the inside of the front inner end holder 13 of the insulator 49 and the inside of the rear holder outer cylinder 11, and the inner side of the inner end holder 13 and the inside of the holder outer cylinder 11. Is a component having a function of enabling electrical connection between the components.

The conductor 4 of the heating current supply cable 46
6a and 46b are connected to the inner ends of the heating current supply conducting wires 49a and 49b, and the shield wire 46c is grounded via the inner holder 13 body. FIG.
In the figure, a current supply cable 51 is disposed inside the holder outer cylinder 11 behind the insulator 49 so as to extend toward the rear end of the holder outer cylinder 11. 2B and 3, the current supply cable 51 has current supply lines 51a, 51b and the like whose periphery is covered with a covering insulating material, like the heating current supply cable 46.

In FIG. 2, a circular plate 52 is connected to the outer end of the holder outer cylinder 11. A cable fixing member 53 for fixing and supporting the current supply cable 51 is fixed to the rear side surface of the circular plate 52.
Further, a cylindrical case 54 that covers the outer ends of the cable fixing member 53 and the current supply cable 51 is fixed to the circular plate 52. An external connection terminal 56 is supported on the rear side surface of the cylindrical case 54, and the current supply lines 51 a and 51 b of the current supply cable 51 are connected to a front end of the external connection terminal. . A power cable 57 (see FIG. 2C) connected to a power source (not shown) is provided at the rear end of the external connection terminal 56.
The detachable cable terminal 57a is detachable.

(Operation of the Embodiment) In FIG.
The position of the deposition surface Sb (thickness: about 50 nm) is opposed to the heating wire 42 of the tungsten rod support member 34,
The sample S is placed on the sample mounting portions 31 of the sample holding member 26.
Is placed. 4 and 7, the sample holding plate 33 is pressed from the upper surface of the mounted sample S, and the sample S is fixed to the sample mounting portions 31, 31. A vapor deposition material 43 is wound around the heating wire 42. By rotating the sample holding member 26 around the left-right axis of the inner end side holder 13,
Is adjusted to intersect perpendicularly with the holder axis. In this state, the sample holder F is mounted in the holder support hole 9a of the gonio stage G. At this time, the deposition surface Sb intersects perpendicularly with the holder axis in the sample holder F, that is, the deposition surface Sb is held in a state substantially parallel to the electron beam passage intersecting with the holder axis. I have. The sample holder F supported by the holder supporting hole 9a of the gonio stage G is slid along the axis of the holder outer cylinder 11 (holder axis) or rotated around the holder axis, or a cylinder supporting the sample holder F. Of the sample holder F by rotating the holder support member 9 having a spherical shape by the spherical bearing of the goniometer stage G.
The observation position of the surface Sb can be adjusted by adjusting the direction of the holder axis.

After adjusting the observation position of the deposition surface Sb, a current is supplied from a power supply (not shown) while observing the deposition surface Sb, and the heating wire 42 is heated to evaporate the deposition material 43. As shown in FIG. 8, the evaporated material is evaporated on the surface Sb of the sample S to be evaporated. At this time, since the deposition surface Sb is parallel to the path of the electron beam B, a deposition material (indicated by dots in FIG. 8) deposited in the holder axis direction of the deposition surface Sb is applied to the electron parallel to the deposition surface Sb. Line B
Penetrates, and cross-section observation (observation from a direction parallel to the interface) most suitable for observation of the vapor deposition state (interface observation) becomes possible.
If a TV camera is mounted on the electron microscope 1, the sample holder F of the present invention enables continuous observation of the process of forming the interface in a cross section at an atomic level spatial resolution. In particular, the interface in the epitaxial growth process (a process in which another substance attached to the surface of the base material crystal grows in a fixed orientation relationship on the surface of the base material crystal), which has a dominant role in the semiconductor device manufacturing process. The analysis of the structural change of is possible. In addition, experiments and observations on various physical phenomena such as adsorption, nucleation, and thin film formation of a surface structure and a deposited substance thereon can be performed.

(Modifications) Although the embodiments of the present invention have been described in detail, the present invention is not limited to the above-described embodiments, but falls within the scope of the present invention described in the appended claims. Thus, various changes can be made. Modified embodiments of the present invention will be exemplified below.

(H01) The sample holding member 26 is rotatably supported by the inner end side holder 13 with the screws 27, 27, but other supporting methods can be adopted. (H02) The sample holding member 26 can adopt a configuration for heating the sample S. In this case, it is possible to observe the process of forming the interface with respect to the temperature of the sample. (H03) In this embodiment, the case where the vapor deposition material 43 is wound around the heating wire 42 and heated is exemplified, but a configuration in which the vapor deposition material is placed on a member for heating the vapor deposition material such as a flat heating element is possible. . (H04) The sample holder F of the present invention can be mounted on a charged particle beam device other than the transmission electron microscope.

[0028]

The sample holder of the present invention described above has the following effects. (E01) It is possible to perform cross-sectional observation (observation from a direction parallel to the interface) most suitable for observing the state of vapor deposition (interface observation) while performing vapor deposition on the sample surface using an electron microscope.

[Brief description of the drawings]

FIG. 1 is an enlarged view of a main part showing a state in which an embodiment of a sample holder of the present invention is mounted on a goniostage for mounting a sample holder of an electron microscope.

2 is an overall explanatory view of the sample holder shown in FIG. 1, FIG. 2A is a plan view, FIG. 2B is an explanatory view of electric wiring,
FIG. 2C is a partial cross-sectional view as viewed from the arrow IIC in FIG. 2A.

FIG. 3 is an enlarged view of an elliptical portion indicated by an arrow III in FIG. 2A.

4 is an explanatory view of a main part of the sample holder shown in FIG. 2, FIG. 4A is a plan view, and FIG. 4B is a longitudinal sectional view of FIG. 4A.
FIG. 5 is a sectional view taken along line IVB-IVB of FIG.

FIG. 5 is a perspective view of the tungsten rod supporting member shown in FIG. 4;

FIG. 6 is a sectional view taken along line VI-VI of FIG. 4A.

FIG. 7 is a perspective view of the sample holding member shown in FIG. 4;

FIG. 8 is an operation explanatory view of the first embodiment.

FIG. 9 is a sectional view of a conventional general transmission electron microscope.

FIG. 10 is an enlarged view of a main part of FIG. 9;

FIG. 11 is a modification of the part shown in FIG. 10;
FIG. 2 is an explanatory diagram of a transmission electron microscope that allows observation of a material deposited on a sample surface while performing vacuum deposition on the sample surface in the electron microscope.

FIG. 12 is an operation explanatory view of the transmission electron microscope shown in FIG. 11;

[Explanation of symbols]

B: electron beam, F: sample holder, J: vapor deposition material heating device,
S: sample, Sb: surface to be deposited, 1: electron microscope, 2: barrel, 3: electron gun, 9: holder mounting member, 11: holder outer cylinder, 26: sample holding member, 43: evaporation material

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Mikio Naruse 3-1-2, Musashino, Akishima-shi, Tokyo Japan Electronics Co., Ltd.

Claims (1)

[Claims] 1. A sample holder having the following requirements: (A0
1) A cylindrical holder mounting member that penetrates a column of an electron microscope that is arranged so as to surround the outside of a path of an electron beam emitted from an electron gun, along a holder axial direction crossing the path of the electron beam. A holder outer cylinder slidably supported,
(A02) a sample holding member that is supported by the holder outer cylinder and holds the sample in a state where the surface on which the sample is to be deposited is parallel to the electron beam path; (A03) that is supported by the holder outer cylinder and that the sample is deposited Vapor deposition material disposed at a position facing the surface, (A
04) A deposition material heating device for heating the deposition material to deposit on the surface to be deposited.