JPH1024551A - Squeegee of solder paste - Google Patents

Squeegee of solder paste

Info

Publication number
JPH1024551A
JPH1024551A JP18348196A JP18348196A JPH1024551A JP H1024551 A JPH1024551 A JP H1024551A JP 18348196 A JP18348196 A JP 18348196A JP 18348196 A JP18348196 A JP 18348196A JP H1024551 A JPH1024551 A JP H1024551A
Authority
JP
Japan
Prior art keywords
solder paste
squeegee
stirring
container
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18348196A
Other languages
Japanese (ja)
Inventor
Hidenori Kawahara
秀徳 川原
Isao Okonogi
功 小此木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Saitama Ltd
Original Assignee
NEC Saitama Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Saitama Ltd filed Critical NEC Saitama Ltd
Priority to JP18348196A priority Critical patent/JPH1024551A/en
Publication of JPH1024551A publication Critical patent/JPH1024551A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To stabilize emitting quantity by providing two stirring rods rotated mutually contrarily toward an emitting orifice to a stirring part for kneading solder paste passing through the emitting orifice. SOLUTION: This squeegee openes a container lid 4 and, after solder paste is supplied into a metal container 1, the lid is closed to be fixed by setscrews 5 to hermetically close the container 1. By this constitution, deterioration such as the viscosity change or oxidation of solder paste can be minimized. Two stirring rods 2 are provided in the container 1 to be rotated by an external motor 3. Two stirring rods 2 are rotated in an inside direction toward an emitting orifice 6. By these stirring rods 2, the solder paste 7 is stirred and emitting pressure is generated toward the emitting orifice 6. The cross section of each stirring rod 2 may be circular but, by cutting grooves in the surface of the stirring rod to form a screw like cross section, stirring effect is generated still more.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、はんだペーストの
スキージに関し、特にプリント配線板の所定の位置に、
所定の量のはんだペーストなどの印刷剤を印刷により供
給するためのスクリーン印刷装置のスキージに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste squeegee, and more particularly, to a squeegee at a predetermined position on a printed wiring board.
The present invention relates to a squeegee of a screen printing apparatus for supplying a predetermined amount of a printing agent such as a solder paste by printing.

【0002】[0002]

【従来の技術】このスキージは電子部品を搭載するプリ
ント配線板の印刷配線に用いられるスクリーン印刷機に
取付けられ、プリント配線板の回線パターンのはんだ付
け工程に先立ち、はんだペーストをスクリーン印刷によ
り回路パターンに塗布する工程に用いられる。
2. Description of the Related Art A squeegee is mounted on a screen printing machine used for printed wiring of a printed wiring board on which electronic components are mounted. Prior to a step of soldering a circuit pattern of the printed wiring board, a solder paste is screen-printed on a circuit pattern. Used in the step of applying to

【0003】従来、この種のスキージは、はんだペース
トを貯溜する密閉型の容器と、この容器の下部に設けら
れた吐出口と、この吐出口を通過する前記はんだペース
トを練り合わせるための攪拌部とから構成されている。
Conventionally, a squeegee of this type has a closed container for storing solder paste, a discharge port provided at a lower portion of the container, and a stirring section for kneading the solder paste passing through the discharge port. It is composed of

【0004】はんだペーストを貯溜する密閉型の容器
は、はんだペーストの酸化を防止してはんだ付け性の低
下を避けるためであり、また攪拌することによりその粘
度を適度に保ち吐出口から吐出するはんだペーストの量
を一定にするものである。
[0004] The closed type container for storing the solder paste is for preventing the solder paste from being oxidized and preventing the solderability from being deteriorated. This is to keep the amount of the paste constant.

【0005】この種のスキージの従来例としては、特開
平4−284249公報に記載されたものがある。図3
はこの公報のスキージ部分を示す断面図である。本例は
印刷剤がクリーム状はんだの例であるが、シリンジ37
内に大気から遮断されて収容されたクリーム状はんだ3
6はケーシング35内において偏心した攪拌ローラ32
により印刷に適した粘度に攪拌され、自重およびシリン
ジ37に供給される窒素ガスの押出力により吐出口31
から吐出され、よりプリント基板に印刷される。
As a conventional example of this type of squeegee, there is one disclosed in Japanese Patent Application Laid-Open No. 4-284249. FIG.
FIG. 1 is a cross-sectional view showing a squeegee portion of this publication. In this example, the printing agent is cream solder, but the syringe 37 is used.
Creamy solder 3 shielded from the atmosphere
6 is a stirring roller 32 eccentric in a casing 35.
Is stirred to a viscosity suitable for printing, and the ejection port 31 is pressed by its own weight and the pushing force of the nitrogen gas supplied to the syringe 37.
And printed on a printed circuit board.

【発明が解決しようとする課題】このように従来例にお
いては、偏心した攪拌ローラにより、クリーム状はんだ
を攪拌し、攪拌されたクリーム状はんだは自重と窒素ガ
スとの押出力で吐出口から吐出するようになっている。
従って、吐出量はクリーム状はんだの粘度と自重と窒素
ガス圧とで決まるが、クリーム状はんだなどの印刷剤の
粘度、自重が変った場合など吐出量を適度に保つのが面
倒となる問題がある。また窒素ガスを供給する場合はシ
リンジ内を機密構造にする必要があり構造が複雑になる
などの問題がある。
As described above, in the conventional example, the creamy solder is stirred by the eccentric stirring roller, and the stirred creamy solder is discharged from the discharge port by the pushing force of its own weight and nitrogen gas. It is supposed to.
Therefore, the discharge amount is determined by the viscosity of the cream solder, its own weight, and the nitrogen gas pressure.However, when the viscosity of the printing agent such as the cream solder or its own weight changes, it becomes troublesome to keep the discharge amount at an appropriate level. is there. Further, when supplying nitrogen gas, it is necessary to make the inside of the syringe a secret structure, and there is a problem that the structure becomes complicated.

【0006】[0006]

【課題を解決するための手段】本発明のはんだペースト
のスキージは、はんだペーストを貯溜する密閉型の容器
と、この容器の下部に設けられた吐出口と、この吐出口
を通過する前記はんだペーストを練り合わせるための攪
拌部とから構成するはんだペーストを練り合わせるため
の攪拌部とから構成するはんだペーストのスキージにお
いて、前記攪拌部は前記容器の外部に取付けられたモー
タにより駆動し互に相対して前記吐出口に向って回転す
る2本の攪拌棒を備えている。
According to the present invention, there is provided a solder paste squeegee comprising a closed container for storing solder paste, a discharge port provided at a lower portion of the container, and the solder paste passing through the discharge port. A stirrer for kneading the solder paste, and a stirrer for kneading the solder paste. The stirrer is driven by a motor attached to the outside of the container to face each other. And two stirring rods rotating toward the discharge port.

【0007】また、前記攪拌部のモータは回転数を可変
するための制御部を備えても良い。
[0007] The motor of the stirring unit may include a control unit for changing the number of rotations.

【0008】[0008]

【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して詳細に説明する。
Next, embodiments of the present invention will be described in detail with reference to the drawings.

【0009】図1は本発明のスキージの構造を示し
(a)は外観斜視図、(b)は(a)の断面図である。
FIG. 1 shows the structure of a squeegee according to the present invention, wherein (a) is an external perspective view and (b) is a sectional view of (a).

【0010】本スキージは容器フタ4を開け、はんだペ
ーストを供給したのちフタを閉め、止めネジ5で固定す
ることにより、金属製の容器1内は密閉される。これに
より、はんだペーストの粘度変化、酸化といった劣化を
最小限に押さえることができる。
In this squeegee, the inside of the metal container 1 is sealed by opening the container lid 4, supplying the solder paste, closing the lid, and fixing with the set screw 5. Thereby, deterioration such as change in viscosity and oxidation of the solder paste can be minimized.

【0011】また、容器1の内部には、2本の攪拌棒2
が設けられ、外部のモーター3により回転するようにな
っている。この2本の攪拌棒2が図1(b)中の矢印で
示すように吐出口6に向ってそれぞれ内側方向に回転す
る。これによりはんだペースト7を攪拌するとともに、
吐出口6に向かって吐出圧力を発生させている。尚、図
1(b)において、攪拌棒2の断面は円であるが、表面
に溝を切りその断面をスクリュー状にした方がより一層
攪拌効果が発生する。
Further, two stirring rods 2 are provided inside the container 1.
Are provided, and are rotated by an external motor 3. The two stirring rods 2 rotate inward toward the discharge ports 6 as indicated by arrows in FIG. This agitates the solder paste 7 and
The discharge pressure is generated toward the discharge port 6. In FIG. 1B, the cross section of the stirring rod 2 is a circle. However, a stirring effect is further generated when a groove is formed on the surface and the cross section is formed in a screw shape.

【0012】次にこのスキージの印刷動作について図2
を参照して説明する。通常はスキージはスクリーン印刷
機(図示せず)に装着され以下に説明する動作を行う。
最初スキージは図中左側の状態でメタルマスク8の表面
上から離れて、攪拌棒は回転していない。次にスキージ
が下降し、メタルスキージ8の表面上に密着する。スキ
ージが右へ摺動し始めると同時に攪拌棒2が回転し始め
る。スキージが摺動している途中にメタルマスク8に回
路パターンの開孔部があると、攪拌棒2の回転により発
生する吐出圧力により、スキージの吐出口6よりはんだ
ペースト7が開孔部に充填される(図中中央の状態)。
スキージの摺動が終了すると攪拌棒2の回転が止まり、
スキージが上昇して動作が終了する(図中右側の状
態)。以上の動作を往復して行うことにより連続してプ
リント配線板にはんだペーストを印刷により供給するこ
とができる。
Next, the printing operation of the squeegee will be described with reference to FIG.
This will be described with reference to FIG. Usually, the squeegee is mounted on a screen printing machine (not shown) and performs the operation described below.
At first, the squeegee is separated from the surface of the metal mask 8 on the left side in the figure, and the stirring bar is not rotating. Next, the squeegee descends and adheres to the surface of the metal squeegee 8. At the same time as the squeegee starts sliding to the right, the stirring bar 2 starts rotating. If there is an opening of the circuit pattern in the metal mask 8 while the squeegee is sliding, the solder paste 7 fills the opening from the discharge port 6 of the squeegee due to the discharge pressure generated by the rotation of the stirring rod 2. (Center state in the figure).
When the sliding of the squeegee ends, the rotation of the stirring rod 2 stops,
The squeegee rises and the operation ends (the state on the right side in the figure). By performing the above operation reciprocally, the solder paste can be continuously supplied to the printed wiring board by printing.

【0013】即ち、スキージがメタルマスク上を摺動中
は2本の攪拌棒の回転により、吐出口に向って吐出圧力
がかかっており、メタルマスクの開口部にはんだペース
トが注入され、印刷終了時には、攪拌棒の回転が止まる
ことにより、はんだペーストがもれることなくスキージ
を上昇させることができる。
That is, while the squeegee is sliding on the metal mask, the discharge pressure is applied to the discharge port by the rotation of the two stirring rods, the solder paste is injected into the opening of the metal mask, and the printing is completed. Occasionally, the rotation of the stir bar stops, so that the squeegee can be raised without leakage of the solder paste.

【0014】また、攪拌棒の回転数を可変するようにし
て、はんだペーストの粘度に応じて適度の吐出圧力を得
られるよう調整機構を設けても良い。
Further, an adjusting mechanism may be provided so that the rotational speed of the stirring rod is variable so that an appropriate discharge pressure can be obtained according to the viscosity of the solder paste.

【0015】[0015]

【発明の効果】以上説明したように本発明のはんだペー
ストのスキージは、攪拌部に2本の攪拌棒を用い吐出口
に向って互に内側に回転させることにより、はんだペー
ストの粘度を一定に保つと同時に吐出圧力を得ている。
従って攪拌棒の回転数を調整することによりはんだペー
ストの吐出量を一定にし安定化できる効果がある。また
はんだペーストの塗布完了後は攪拌棒の回転を止めれば
吐出口からはんだペーストの吐出は停止するので、はん
だペーストの無駄なくスキージを上げ次の位置に移動で
きる効果がある。更に吐出圧力を容器のガス圧に頼らな
いので容器を気密にする必要がなく簡単な構造ですむと
いう効果がある。
As described above, the solder paste squeegee of the present invention has two stirring rods in the stirring section and is rotated inward toward the discharge port to keep the viscosity of the solder paste constant. At the same time, the discharge pressure is obtained.
Therefore, by adjusting the number of rotations of the stirring rod, there is an effect that the discharge amount of the solder paste can be made constant and stabilized. Further, after the application of the solder paste is completed, if the rotation of the stirring bar is stopped, the discharge of the solder paste from the discharge port is stopped, so that there is an effect that the squeegee can be raised and moved to the next position without waste of the solder paste. Further, since the discharge pressure does not depend on the gas pressure of the container, there is an effect that the container does not need to be airtight and a simple structure is sufficient.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態例を示す(a)は外観斜視
図,(b)は(a)の断面図である。
FIGS. 1A and 1B show an embodiment of the present invention, in which FIG. 1A is an external perspective view, and FIG. 1B is a cross-sectional view of FIG.

【図2】図1におけるスキージの動作を示す断面図であ
る。
FIG. 2 is a sectional view showing the operation of the squeegee in FIG.

【図3】従来のスキージを示す断面図である。FIG. 3 is a sectional view showing a conventional squeegee.

【符号の説明】[Explanation of symbols]

1 容器 2 攪拌棒 3 モーター 4 容器フタ 5 止めネジ 6 吐出口 7 はんだペースト 8 メタルマスク 9 プリント配線板 DESCRIPTION OF SYMBOLS 1 Container 2 Stirrer stick 3 Motor 4 Container lid 5 Set screw 6 Discharge port 7 Solder paste 8 Metal mask 9 Printed wiring board

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 はんだペーストを貯溜する密閉型の容器
と、この容器の下部に設けられた吐出口と、この吐出口
を通過する前記はんだペーストを練り合わせるための攪
拌部とから構成するはんだペーストのスキージにおい
て、前記攪拌部は前記容器の外部に取付けられたモータ
により駆動し互いに相対して前記吐出口に向って回転す
る2本の攪拌棒を備えることを特徴とするはんだペース
トのスキージ。
1. A solder paste comprising a closed container for storing a solder paste, a discharge port provided at a lower portion of the container, and a stirring unit for kneading the solder paste passing through the discharge port. The squeegee according to any one of claims 1 to 3, wherein the stirring unit includes two stirring rods driven by a motor mounted outside the container and rotated toward the discharge port with respect to each other.
【請求項2】 前記攪拌部のモータは回転数を可変する
ための制御部を備えることを特徴とする請求項1記載の
はんだペーストのスキージ。
2. The squeegee for a solder paste according to claim 1, wherein the motor of the stirring unit includes a control unit for changing the number of rotations.
【請求項3】 前記攪拌棒は断面がスフリュー型である
ことを特徴とする請求項1および2記載のはんだペース
トのスキージ。
3. A squeegee for a solder paste according to claim 1, wherein said stirring rod has a cross section of a slush type.
JP18348196A 1996-07-12 1996-07-12 Squeegee of solder paste Pending JPH1024551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18348196A JPH1024551A (en) 1996-07-12 1996-07-12 Squeegee of solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18348196A JPH1024551A (en) 1996-07-12 1996-07-12 Squeegee of solder paste

Publications (1)

Publication Number Publication Date
JPH1024551A true JPH1024551A (en) 1998-01-27

Family

ID=16136573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18348196A Pending JPH1024551A (en) 1996-07-12 1996-07-12 Squeegee of solder paste

Country Status (1)

Country Link
JP (1) JPH1024551A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001007255A1 (en) * 1999-07-26 2001-02-01 Matsushita Electric Industrial Co., Ltd. Solder-paste printing device and printing method
JP2007216266A (en) * 2006-02-17 2007-08-30 Juki Corp Flux film deposition apparatus and flux transferring device
JP2008221541A (en) * 2007-03-12 2008-09-25 Matsushita Electric Ind Co Ltd Method and equipment for screen printing
WO2020079797A1 (en) * 2018-10-18 2020-04-23 株式会社Fuji Film deposition device
CN115476013A (en) * 2022-10-28 2022-12-16 无锡市盛和科技有限公司 Soldering paste coating process for wire mesh carrier

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7032513B2 (en) 1996-05-22 2006-04-25 Matsushita Electric Industrial Co., Ltd. Printing screen cleaning method and apparatus
WO2001007255A1 (en) * 1999-07-26 2001-02-01 Matsushita Electric Industrial Co., Ltd. Solder-paste printing device and printing method
US6923117B1 (en) 1999-07-26 2005-08-02 Matsushita Electric Industrial Co., Ltd. Solder paste printing apparatus and printing method
US6935232B2 (en) 1999-07-26 2005-08-30 Matsushita Electric Industrial Co., Ltd. Solder paste printing apparatus and printing method
JP2007216266A (en) * 2006-02-17 2007-08-30 Juki Corp Flux film deposition apparatus and flux transferring device
JP2008221541A (en) * 2007-03-12 2008-09-25 Matsushita Electric Ind Co Ltd Method and equipment for screen printing
WO2020079797A1 (en) * 2018-10-18 2020-04-23 株式会社Fuji Film deposition device
CN112739539A (en) * 2018-10-18 2021-04-30 株式会社富士 Film forming apparatus
CN115476013A (en) * 2022-10-28 2022-12-16 无锡市盛和科技有限公司 Soldering paste coating process for wire mesh carrier
CN115476013B (en) * 2022-10-28 2024-04-02 无锡市盛和科技有限公司 Solder paste coating process of wire mesh carrier

Similar Documents

Publication Publication Date Title
US7383770B2 (en) Printing device for electronic parts having a roller and a squeegee arrangement
KR100498778B1 (en) Fluid material filling apparatus and related filling method
KR100224555B1 (en) Printing squeegee apparatus
JPH1024551A (en) Squeegee of solder paste
US5493969A (en) Screen printing apparatus and screen printing method
JP3058454U (en) Printing paste supply device
US20050183592A1 (en) Screen printing apparatus and screen printing method
JPH1034878A (en) Cream solder printing squeegee device and printing method
JPH10296950A (en) Method and apparatus for printing cream solder
JP2943164B2 (en) Screen printing machine printing paste supply device
KR20110004223A (en) An extrusion apparatus for a conductive paste
JPH05237986A (en) High viscosity paste filling method and apparatus
JPH08300612A (en) Creamy solder printing device
JP2816600B2 (en) Enclosed cream solder application device
JP3316523B2 (en) Screen printing equipment
JPH1142762A (en) Squeegee device, solder paste printing method, and solder paste printing apparatus
JP3216234B2 (en) Printing machine and method
JPH07236852A (en) Quantitative supply of liquid
JP4222897B2 (en) Kneading method and apparatus
JPS6044984B2 (en) Cream material applicator
JPH0422468A (en) Cream solder supply apparatus
JP2000130317A (en) Liquid supply mechanism
JPH01211994A (en) Screen printing method and its equipment
JPH079660A (en) Roll printing machine
JPH11274207A (en) Method and device for forming bump electrode

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19990406