JPH10242784A - Production of piezoelectric resonator - Google Patents

Production of piezoelectric resonator

Info

Publication number
JPH10242784A
JPH10242784A JP4559097A JP4559097A JPH10242784A JP H10242784 A JPH10242784 A JP H10242784A JP 4559097 A JP4559097 A JP 4559097A JP 4559097 A JP4559097 A JP 4559097A JP H10242784 A JPH10242784 A JP H10242784A
Authority
JP
Japan
Prior art keywords
electrode
piezoelectric
pads
resonator
piezoelectric resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4559097A
Other languages
Japanese (ja)
Other versions
JP3525671B2 (en
Inventor
Hiroyasu Ikeda
弘康 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP04559097A priority Critical patent/JP3525671B2/en
Publication of JPH10242784A publication Critical patent/JPH10242784A/en
Application granted granted Critical
Publication of JP3525671B2 publication Critical patent/JP3525671B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily decide the quality of a piezoelectric resonator by separating the electrode pads from each other on a piezoelectric substrate of a large size and cutting every electrode pad into pieces. SOLUTION: Plural pairs of vibration containment electrodes 2 are provided opposite to each other on both sides of a piezoelectric substrate 1 of a large size, and an electrode pad 4 is connected to each electrode 2 to connect it to an external terminal via a draw-out electrode 3. These pads 4 are separated from each other, and the width of the pad 4 is set longer than the width or diameter of each electrode 2 by 100μ or more. Then the substrate 1 is cut into pieces among the pads 4 for a group of piezoelectric resonators. In such a production method of piezoelectric resonators, a non-defective resonator is decided as long as it's cut into pieces among the pads 4. Meanwhile, the quality is decided according to the presence or absence of the slip electrodes 5 for a piezoelectric resonator that has plural electrodes 5 among its separated pads 4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、セラミックフィル
ターや発振子などに使用される圧電共振子の製造方法に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a piezoelectric resonator used for a ceramic filter, an oscillator and the like.

【0002】[0002]

【従来の技術】図7は従来の圧電共振子が複数接続され
た圧電共振子群を示した平面図である。圧電共振子群
は、圧電共振子が複数設けられたものである。
2. Description of the Related Art FIG. 7 is a plan view showing a piezoelectric resonator group in which a plurality of conventional piezoelectric resonators are connected. The piezoelectric resonator group includes a plurality of piezoelectric resonators.

【0003】つまり圧電基板11の表裏両面には複数の
振動閉じ込め電極12と、それから引き出した引き出し
電極13と、外部端子(図示せず)と接続するための電
極パッド14とを形成しており、それぞれを切断すれ
ば、図8に示す個片の圧電共振子18に分離される。電
極パッド14は外部端子と接続するために必要な面積を
有するように設計されている。
That is, a plurality of vibration confinement electrodes 12, extraction electrodes 13 extracted therefrom, and electrode pads 14 for connecting to external terminals (not shown) are formed on both front and back surfaces of the piezoelectric substrate 11, When each is cut, it is separated into the individual piezoelectric resonators 18 shown in FIG. The electrode pad 14 is designed to have an area necessary for connecting to an external terminal.

【0004】また、個々の圧電共振子18において、1
6は端面からの影響を小さくするために設けた非電極形
成部である。この非電極形成部16は、端面からの影響
による不要共振応答が共振周波数近傍に発生しないよう
に振動閉じ込め電極12から端面までの距離を十分大き
くするために必要なものである。
In each piezoelectric resonator 18, 1
Reference numeral 6 denotes a non-electrode forming portion provided to reduce the influence from the end face. The non-electrode forming part 16 is necessary for sufficiently increasing the distance from the vibration confining electrode 12 to the end face so that unnecessary resonance response due to the influence from the end face does not occur near the resonance frequency.

【0005】[0005]

【発明が解決しようとする課題】上記の従来の構成で
は、限界まで小さくした非電極形成部16を確保するた
めに、圧電共振子18個片への切断の精度を上げる必要
があり、共振子形成プロセスに異常が発生し、非電極形
成部16が限界以下の寸法になったと予想される場合、
非電極形成部16が限界以下の圧電共振子18は、選別
し取り除く必要がある。しかしながら振動閉じ込め電極
12と共振子端面迄の距離の限界寸法は、共振周波数に
より異なるが、下限値でおよそ50μ程度であるため目
視により限界寸法を満たしているかどうかを判断するこ
とは困難であり、そのために不良品が含まれていると予
想される加工ロットは、そのすべてを廃棄しなければな
らず、歩留まりの低下が発生するという問題点を有して
いた。
In the above-described conventional structure, it is necessary to increase the precision of cutting the piezoelectric resonator into 18 pieces in order to secure the non-electrode forming portion 16 reduced to the limit. When an abnormality occurs in the forming process and the non-electrode forming portion 16 is expected to have a size smaller than the limit,
The piezoelectric resonator 18 whose non-electrode forming portion 16 is below the limit needs to be sorted out. However, the critical dimension of the distance between the vibration confinement electrode 12 and the end face of the resonator differs depending on the resonance frequency. For this reason, all processing lots that are expected to contain defective products have to be discarded, which has the problem of lowering the yield.

【0006】本発明は、上記従来の問題点を解決するも
ので、小形、高性能の共振子を形成する際、歩留まりの
低下が発生することのない圧電共振子の製造方法を提供
するものである。
The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing a piezoelectric resonator which does not cause a reduction in yield when forming a small and high-performance resonator. is there.

【0007】[0007]

【課題を解決するための手段】この課題を解決するため
に本発明は、大板状の圧電基板の表裏両面に表裏対向す
る複数対の振動閉じ込め電極を設け、前記各振動閉じ込
め電極にはそれぞれ引き出し電極を介して外部端子へ接
続するための電極パッドを接続し、前記複数の電極パッ
ドは、それぞれ分離されており、各電極パッドの幅寸法
を、振動閉じ込め電極の幅または直径よりも100μ以
上長くした圧電共振子群の、前記電極パッド間で圧電基
板を分断して個片とするものである。
According to the present invention, a plurality of pairs of vibration confinement electrodes are provided on both sides of a large-plate-shaped piezoelectric substrate. An electrode pad for connection to an external terminal is connected via an extraction electrode, and the plurality of electrode pads are separated from each other, and the width of each electrode pad is at least 100 μm larger than the width or diameter of the vibration confinement electrode. The piezoelectric substrate is divided into individual pieces between the electrode pads of the elongated piezoelectric resonator group.

【0008】[0008]

【発明の実施の形態】本発明の請求項1の発明は、大板
状の圧電基板の表裏両面に表裏対向する複数対の振動閉
じ込め電極を設け、前記各振動閉じ込め電極にはそれぞ
れ引き出し電極を介して外部端子へ接続するための電極
パッドを接続し、前記複数の電極パッドは、それぞれ分
離されており、各電極パッドの幅寸法を、振動閉じ込め
電極の幅または直径よりも100μ以上長くした圧電共
振子群の、前記電極パッド間で圧電基板を分断して個片
とする圧電共振子の製造方法であって、電極パッド間で
分断されたものであれば良品とすることができる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, a plurality of pairs of vibration confinement electrodes are provided on both front and back surfaces of a large-sized piezoelectric substrate, and each of the vibration confinement electrodes has an extraction electrode. An electrode pad for connecting to an external terminal through the piezoelectric element, wherein the plurality of electrode pads are separated from each other, and the width of each electrode pad is at least 100 μm longer than the width or diameter of the vibration confinement electrode. A method of manufacturing a piezoelectric resonator in which a piezoelectric substrate is divided into individual pieces between the electrode pads of a resonator group, and if the piezoelectric resonator is divided between the electrode pads, a good product can be obtained.

【0009】また本発明の請求項2の発明は分離された
電極パッド間に、複数のスリット電極を有する請求項1
記載の圧電共振子の製造方法であって、スリット電極の
存在により良否判定が行えるものとなる。
According to a second aspect of the present invention, a plurality of slit electrodes are provided between the separated electrode pads.
In the method for manufacturing a piezoelectric resonator described above, the quality can be determined based on the presence of the slit electrode.

【0010】以下、本発明の一実施形態について図面を
参照しながら説明する。図1は45MHzの共振周波数を
もつ圧電共振子の例である。この場合において、振動閉
じ込め電極2の直径としては不要共振が発生しない寸法
としてa=0.6mmを選択している。また、振動閉じ込
め電極2から図2の切断後の圧電共振子8端面迄の距離
は不要共振が発生しないためには、非電極形成部6にお
いて少なくとも100μ必要であることより分離された
各電極パッド4幅は、振動閉じ込め電極2の直径aより
も片側100μ(=100μ)、つまり全体として20
0μ長くなっている。図2,図3は図1の大板の圧電基
板1より個片の圧電共振子8を切り出した状態を示す。
図2は共振子形成プロセスが正常に行われた状態を示し
ており、電極パッド4両側に端面まで非電極パッド形成
部7を有している。つまり、電極パッド4が欠ける事な
く切断されていれば、不要共振が発生しないために必要
な下限値100μが確保されていることを、容易に認識
することができる。なお非電極パッド形成部7の距離は
切断の刃厚、刃ぶれ、等共振子作成プロセスの各工程の
公差より決定する。図3は共振子形成プロセスで異常が
発生したものを示し、振動閉じ込め電極2、引き出し電
極3、電極パッド4いずれも左側にずれており、左側に
は非電極パッド形成部7が存在していないことより、共
振子端面迄の距離が不要共振が発生しないために必要な
下限値100μが確保されていないことを容易に認識す
ることができる。つまり、目視による選別が可能であ
り、非電極パッド形成部7の有無の認識により画像認識
も容易に行うことができる。図4は、電極パッド4の間
に複数のスリット電極5を有した圧電基板を示し、共振
子形成プロセスが正常に行われた場合を図5に示し、異
常が発生した場合を図6に示している。図6の場合は図
3の場合同様、共振子端面迄の距離が、不要共振が発生
しないために必要な距離確保されていないことを容易に
認識することができる。つまり、この場合は切り出され
た圧電共振子8の電極パッド4の両側の非電極パッド形
成部7に存在するスリット電極5の数より、より簡単に
判断することができる。具体的には、正常である図5で
は電極パッド部4の両側のスリット電極5の数はおのお
の1個であり、共振子端面迄の距離が不要共振が発生し
ないために必要な距離確保されている。図9に必要な距
離(45MHzの場合は100μ)が確保されている場合
のインピーダンス特性を実線Aで、確保されていない場
合のインピーダンス特性を破線B,Cで示す。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an example of a piezoelectric resonator having a resonance frequency of 45 MHz. In this case, the diameter of the vibration confining electrode 2 is selected to be a = 0.6 mm so that unnecessary resonance does not occur. The distance from the vibration confining electrode 2 to the end face of the piezoelectric resonator 8 after cutting in FIG. 2 is required to be at least 100 μm in the non-electrode forming part 6 in order to prevent unnecessary resonance from occurring. 4 is 100 μm (= 100 μ) on one side of the diameter a of the vibration confinement electrode 2, that is, 20 μm as a whole.
0μ longer. 2 and 3 show a state in which individual piezoelectric resonators 8 are cut out from the large piezoelectric substrate 1 in FIG.
FIG. 2 shows a state in which the resonator forming process has been performed normally, and has non-electrode pad forming portions 7 on both sides of the electrode pads 4 up to the end faces. That is, if the electrode pad 4 is cut without chipping, it can be easily recognized that the lower limit of 100 μ necessary for preventing unnecessary resonance from occurring is secured. The distance between the non-electrode pad formation portions 7 is determined based on the cutting blade thickness, blade runout, and the tolerance of each step of the resonator forming process. FIG. 3 shows a state in which an abnormality has occurred in the resonator formation process. The vibration confinement electrode 2, the extraction electrode 3, and the electrode pad 4 are all shifted to the left, and the non-electrode pad formation part 7 does not exist on the left. Thus, it can be easily recognized that the distance to the resonator end face is not required, and the lower limit 100 μ necessary for preventing unnecessary resonance from being generated is not secured. That is, selection by visual inspection is possible, and image recognition can be easily performed by recognizing the presence / absence of the non-electrode pad forming portion 7. FIG. 4 shows a piezoelectric substrate having a plurality of slit electrodes 5 between the electrode pads 4. FIG. 5 shows a case where the resonator forming process has been performed normally, and FIG. 6 shows a case where an abnormality has occurred. ing. In the case of FIG. 6, similarly to the case of FIG. 3, it can be easily recognized that the distance to the end face of the resonator is not ensured so that unnecessary resonance does not occur. That is, in this case, it can be more easily determined from the number of the slit electrodes 5 existing in the non-electrode pad formation portions 7 on both sides of the cut-out piezoelectric resonator 8 on the electrode pad 4. More specifically, in FIG. 5, which is normal, the number of slit electrodes 5 on both sides of the electrode pad portion 4 is one, and the distance to the end face of the resonator is sufficient to prevent unnecessary resonance from occurring. I have. In FIG. 9, the impedance characteristics when the necessary distance (100 μm for 45 MHz) is secured are shown by solid lines A, and the impedance characteristics when the required distance is not secured are shown by broken lines B and C.

【0011】[0011]

【発明の効果】以上の実施の形態の説明からも明らかな
ように本発明は、電極パッドを、それぞれ分離し、分離
された電極パッド間で個片に分断することにより、良
品、不良品を容易に判断することが可能となる。
As is clear from the above description of the embodiment, the present invention separates the electrode pads from each other and separates the electrode pads into individual pieces between the separated electrode pads, thereby eliminating defective products and defective products. It is possible to easily determine.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態における圧電共振子群の平
面図
FIG. 1 is a plan view of a group of piezoelectric resonators according to an embodiment of the present invention.

【図2】同圧電共振子群より面常な加工プロセスにより
作成された圧電共振子の平面図
FIG. 2 is a plan view of a piezoelectric resonator formed by a processing process more ordinary than the piezoelectric resonator group.

【図3】同圧電共振子群より加工プロセスに異常が生じ
た状態で作成された圧電共振子の平面図
FIG. 3 is a plan view of a piezoelectric resonator formed in a state where an abnormality has occurred in a processing process from the piezoelectric resonator group.

【図4】本発明の他の実施形態における圧電共振子群の
平面図
FIG. 4 is a plan view of a group of piezoelectric resonators according to another embodiment of the present invention.

【図5】同圧電共振子群より面常な加工プロセスにより
作成された圧電共振子の平面図
FIG. 5 is a plan view of a piezoelectric resonator formed by a processing process more ordinary than the piezoelectric resonator group.

【図6】同圧電共振子群より加工プロセスに異常が生じ
た状態で作成された圧電共振子の平面図
FIG. 6 is a plan view of a piezoelectric resonator formed in a state where an abnormality has occurred in a processing process from the piezoelectric resonator group.

【図7】従来例の圧電共振子群の平面図FIG. 7 is a plan view of a conventional piezoelectric resonator group.

【図8】同圧電共振子群より作成された圧電共振子の平
面図
FIG. 8 is a plan view of a piezoelectric resonator formed from the piezoelectric resonator group.

【図9】非電極形成部が確保されている場合と、限界以
下の場合の共振子の周波数特性を示す図
FIG. 9 is a diagram illustrating frequency characteristics of a resonator when a non-electrode forming portion is secured and when the non-electrode forming portion is below a limit.

【符号の説明】[Explanation of symbols]

1 圧電基板 2 振動閉じ込め電極 3 引き出し電極 4 電極パッド 8 圧電共振子 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 2 Vibration confinement electrode 3 Leader electrode 4 Electrode pad 8 Piezoelectric resonator

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 大板状の圧電基板の表裏両面に表裏対向
する複数対の振動閉じ込め電極を設け、前記各振動閉じ
込め電極にはそれぞれ引き出し電極を介して外部端子へ
接続するための電極パッドを接続し、前記複数の電極パ
ッドは、それぞれ分離されており、各電極パッドの幅寸
法を、振動閉じ込め電極の幅または直径よりも100μ
以上長くした圧電共振子群の、前記電極パッド間で圧電
基板を分断して個片とする圧電共振子の製造方法。
A large-sized piezoelectric substrate is provided with a plurality of pairs of vibration confinement electrodes facing each other on both sides thereof, and each of the vibration confinement electrodes has an electrode pad for connecting to an external terminal via a lead-out electrode. Connected, the plurality of electrode pads are separated from each other, and the width dimension of each electrode pad is set to 100 μm more than the width or diameter of the vibration confinement electrode.
A method of manufacturing a piezoelectric resonator of a group of piezoelectric resonators having a length as described above, wherein the piezoelectric substrate is divided into individual pieces between the electrode pads.
【請求項2】 分離された電極パッド間に、複数のスリ
ット電極を有する請求項1記載の圧電共振子の製造方
法。
2. The method according to claim 1, wherein a plurality of slit electrodes are provided between the separated electrode pads.
JP04559097A 1997-02-28 1997-02-28 Manufacturing method of piezoelectric resonator Expired - Fee Related JP3525671B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04559097A JP3525671B2 (en) 1997-02-28 1997-02-28 Manufacturing method of piezoelectric resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04559097A JP3525671B2 (en) 1997-02-28 1997-02-28 Manufacturing method of piezoelectric resonator

Publications (2)

Publication Number Publication Date
JPH10242784A true JPH10242784A (en) 1998-09-11
JP3525671B2 JP3525671B2 (en) 2004-05-10

Family

ID=12723575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04559097A Expired - Fee Related JP3525671B2 (en) 1997-02-28 1997-02-28 Manufacturing method of piezoelectric resonator

Country Status (1)

Country Link
JP (1) JP3525671B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903489B2 (en) 2000-07-25 2005-06-07 Tdk Corporation Piezoelectric resonator, piezoelectric resonator component and method of making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903489B2 (en) 2000-07-25 2005-06-07 Tdk Corporation Piezoelectric resonator, piezoelectric resonator component and method of making the same

Also Published As

Publication number Publication date
JP3525671B2 (en) 2004-05-10

Similar Documents

Publication Publication Date Title
US7498723B2 (en) Piezoelectric resonator and method for manufacturing thereof
US7690095B2 (en) Method for manufacturing quartz piece
EP0228863B1 (en) Method of dividing a substrate into a plurality of substrate portions
US20020121337A1 (en) Filters
US6848155B2 (en) Method of manufacturing an edge reflection type surface acoustic wave device
JP3894771B2 (en) Piezoelectric resonance device
JP2002374146A (en) Piezoelectric vibrating reed and piezoelectric device
JPH10242784A (en) Production of piezoelectric resonator
JP2844362B2 (en) Manufacturing method of semiconductor chip
US20020115232A1 (en) Semiconductor chip production method and semiconductor wafer
JPS62200813A (en) Piezoelectric thin film resonator
KR100440385B1 (en) Piezoelectric element and mobile communication device using the same
US20050134406A1 (en) Piezoelectric thin film resonator and method for manufacturing the same
JPH06103820B2 (en) Method for manufacturing surface acoustic wave element
JP2003008396A (en) Surface acoustic wave element and its manufacturing method
JPS63182904A (en) Energy confinement type piezoelectric vibrator component
JP3395861B2 (en) Manufacturing method of piezoelectric resonator
EP0837518B1 (en) Dielectric filter
KR100298893B1 (en) A electode devision type piezo-electric filter
JP2001136041A (en) Pattern of surface acoustic wave filter and method for the manufacturing the surface acoustic wave filter
JP2024108319A (en) Manufacturing method of vibration element
JPH0637567A (en) Electrode forming method for thick system crystal resonator
JP4549226B2 (en) Wafer with many crystal units formed
JPH10126107A (en) Dielectric filter
JPH02241106A (en) Manufacture of ultrasonic wave delay line

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040127

A61 First payment of annual fees (during grant procedure)

Effective date: 20040209

Free format text: JAPANESE INTERMEDIATE CODE: A61

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080227

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090227

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100227

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees