JPH10242613A - Composite part - Google Patents
Composite partInfo
- Publication number
- JPH10242613A JPH10242613A JP9060090A JP6009097A JPH10242613A JP H10242613 A JPH10242613 A JP H10242613A JP 9060090 A JP9060090 A JP 9060090A JP 6009097 A JP6009097 A JP 6009097A JP H10242613 A JPH10242613 A JP H10242613A
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- terminal
- terminal pins
- transformer
- insulating transformer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、絶縁トランスを含
む電子部品が基板に実装される複合部品に関する。The present invention relates to a composite component in which an electronic component including an insulating transformer is mounted on a substrate.
【0002】[0002]
【従来の技術】図5は従来の複合部品の上面図、図6は
図5の部分断面図、図7は従来の複合部品の製造途中の
底面図である。従来の複合部品に、複数本の端子ピンを
有する絶縁トランス51、複数本の端子ピンを有するコ
イル等の電子部品52及び、絶縁トランス51とコイル
等の電子部品52が実装される絶縁基板53を備えたも
のがある。絶縁基板53は、複数の挿入孔54が形成さ
れ、裏面にラウンドパターン55Aと配線パターン55
B(一部のみ図示)が形成される。ラウンドパターン5
5Aは、挿入孔54の回りを取り囲むように形成され、
配線パターン55Bによって所定のラウンドパターンが
接続される。なお、図7における配線パターン55Bは
一部分のみが示されている。そして、この絶縁基板53
の表面には絶縁トランス51と、コイル等の電子部品5
2が実装される。絶縁トランス51は、6本の端子ピン
51A、51B、51C、51D、51E、51Fを備
え、この6本の端子ピンが絶縁基板53の所定の挿入孔
54にそれぞれ挿入され、絶縁基板53の裏面に突出し
た部分がそれぞれラウンドパターン55Aにはんだで接
続される。また、コイル等の電子部品52は、4本の端
子ピン52A、52B、52C、52Dを備え、この4
本の端子ピンが絶縁基板53の所定の挿入孔54にそれ
ぞれ挿入され、絶縁基板53の裏面に突出した部分がそ
れぞれラウンドパターン55Aにはんだで接続される。2. Description of the Related Art FIG. 5 is a top view of a conventional composite part, FIG. 6 is a partial cross-sectional view of FIG. 5, and FIG. 7 is a bottom view of the conventional composite part during manufacture. A conventional composite component includes an insulating transformer 51 having a plurality of terminal pins, an electronic component 52 such as a coil having a plurality of terminal pins, and an insulating substrate 53 on which the insulating transformer 51 and the electronic component 52 such as a coil are mounted. Some have been provided. The insulating substrate 53 has a plurality of insertion holes 54 formed therein.
B (only a part is shown) is formed. Round pattern 5
5A is formed so as to surround the insertion hole 54,
A predetermined round pattern is connected by the wiring pattern 55B. Note that only a part of the wiring pattern 55B in FIG. 7 is shown. Then, the insulating substrate 53
An electronic component 5 such as an insulating transformer 51 and a coil
2 is implemented. The insulating transformer 51 includes six terminal pins 51A, 51B, 51C, 51D, 51E, and 51F. The six terminal pins are inserted into predetermined insertion holes 54 of the insulating substrate 53, respectively. Are respectively connected to the round pattern 55A by soldering. The electronic component 52 such as a coil includes four terminal pins 52A, 52B, 52C, and 52D.
The terminal pins are inserted into predetermined insertion holes 54 of the insulating substrate 53, and the portions projecting from the back surface of the insulating substrate 53 are connected to the round patterns 55A by soldering.
【0003】[0003]
【発明が解決しようとする課題】このような複合部品
は、高い電圧が加えられたり、高い電圧が加わるおそれ
がある絶縁トランス51が絶縁基板53に実装されてい
る。従って、この絶縁トランス51に高い電圧が加えら
れたり、高い電圧が加わった場合、絶縁基板53の裏面
において高電圧が加わる端子ピン間(例えば、端子ピン
51Aと51D間)又は、高電圧が加わる端子ピンと配
線パターン間(例えば、端子51Fと配線パターン55
B間)が放電等で絶縁破壊するという問題があった。ま
た、高い電圧が加えられたり、高い電圧が加わるおそれ
がある絶縁トランス51と、他の電子部品が隣接して実
装された場合も、絶縁トランス51と他の電子部品間で
前述の様に放電等が発生し、絶縁破壊するという問題が
あった。この様な問題を解決するために、高電圧が加わ
る端子ピン間や、端子ピンと配線パターン間の距離を離
すことにより、絶縁耐圧特性を向上させることが考えら
れる。しかし、この種の複合部品は、小型化が望まれて
おり、かつこの複合部品に実装される電子部品の小型化
が進んでいるので、高電圧が加わる端子ピン間や、端子
ピンと配線パターン間の距離が十分に取れない。また、
前述の問題を解決するために、絶縁基板の裏面に、特
に、高電圧が加わる端子ピン間や、端子ピンと配線パタ
ーン間に絶縁コーテングを施すことが行われるが、絶縁
コーテングにムラが発生しやすいので十分な効果を得る
ことができなかった。In such a composite component, an insulating transformer 51 to which a high voltage is applied or a high voltage may be applied is mounted on an insulating substrate 53. Therefore, when a high voltage is applied to the insulating transformer 51 or when a high voltage is applied, a high voltage is applied between terminal pins (for example, between the terminal pins 51A and 51D) to which a high voltage is applied on the back surface of the insulating substrate 53. Between the terminal pin and the wiring pattern (for example, the terminal 51F and the wiring pattern 55)
B) has a problem that dielectric breakdown occurs due to discharge or the like. In addition, when the insulating transformer 51 to which a high voltage is applied or a high voltage is likely to be applied and another electronic component are mounted adjacent to each other, the discharge occurs between the insulating transformer 51 and the other electronic component as described above. And the like, and there is a problem of dielectric breakdown. In order to solve such a problem, it is conceivable to improve the withstand voltage characteristics by increasing the distance between the terminal pins to which a high voltage is applied or the distance between the terminal pins and the wiring pattern. However, this type of composite component is desired to be miniaturized, and electronic components mounted on this composite component are being miniaturized. Therefore, between a terminal pin to which a high voltage is applied, and between a terminal pin and a wiring pattern. Is not enough distance. Also,
In order to solve the above-described problem, an insulating coating is applied to the back surface of the insulating substrate, particularly, between terminal pins to which a high voltage is applied, or between the terminal pin and the wiring pattern, but the insulating coating tends to have unevenness. Therefore, a sufficient effect could not be obtained.
【0004】本発明は、高電圧が加わる端子ピン間や、
端子ピンと配線パターン間の絶縁性を高め、絶縁耐圧特
性を向上することができる複合部品を提供することを目
的とする。According to the present invention, a high voltage is applied between terminal pins,
It is an object of the present invention to provide a composite component capable of improving insulation between a terminal pin and a wiring pattern and improving dielectric strength characteristics.
【0005】[0005]
【課題を解決するための手段】本発明は、絶縁トランス
を含む電子部品が基板に実装された複合部品において、
基板は電子部品の端子を挿入する挿入孔と、挿入孔より
大きな貫通孔が設けられ、絶縁トランスは所定の端子が
貫通孔から突出しない様に切断されかつ回路と絶縁され
た状態にしたものである。According to the present invention, there is provided a composite component having an electronic component including an insulating transformer mounted on a substrate.
The board is provided with an insertion hole for inserting the terminal of the electronic component and a through hole larger than the insertion hole, and the insulating transformer is cut so that a predetermined terminal does not protrude from the through hole and is insulated from the circuit. is there.
【0006】[0006]
【発明の実施の形態】本発明の複合部品は、絶縁トラン
スを含む電子部品が実装される基板に、電子部品の端子
を挿入する挿入孔と、挿入孔より大きく形成されて絶縁
トランスの所定の端子が挿入される貫通孔が設けられ
る。絶縁トランスは、所定の端子が基板の貫通孔から突
出しない様に基板の厚みより短く切断される。従って、
絶縁トランスの所定の端子と基板間は絶縁され、絶縁層
となる空隙や、注入された絶縁材による絶縁層が形成さ
れるので、絶縁トランスの所定の端子と基板間の絶縁抵
抗値が増大する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A composite component according to the present invention has an insertion hole for inserting a terminal of an electronic component on a substrate on which an electronic component including an insulation transformer is mounted, and a predetermined size of the insulation transformer formed to be larger than the insertion hole. A through hole into which the terminal is inserted is provided. The insulating transformer is cut shorter than the substrate thickness so that predetermined terminals do not protrude from the through holes of the substrate. Therefore,
A predetermined terminal of the insulating transformer is insulated from the substrate, and a gap serving as an insulating layer or an insulating layer formed by the injected insulating material is formed, so that an insulation resistance value between the predetermined terminal of the insulating transformer and the substrate increases. .
【0007】[0007]
【実施例】以下、本発明の複合部品の実施例を示す図1
乃至図4を参照して説明する。図1は本発明の複合部品
の第1の実施例の側面図、図2は図1の部分断面図、図
3は基板に電子部品の端子ピンを挿入した状態の底面図
である。図1乃至図3において、11は絶縁トランス、
12はコイル等の電子部品、13は絶縁基板である。絶
縁トランス11は、6本の端子ピン11A、11B、1
1C、11D、11E、11Fを備える。また、コイル
等の電子部品12は、4本の端子ピン12A、12B、
12C、12Dを備える。この絶縁トランス11とコイ
ル等の電子部品12は、絶縁基板13に実装される。絶
縁基板13は、絶縁トランス11の所定のものを除いた
端子ピンやコイル等の電子部品12の端子ピンが挿入さ
れる挿入孔14と、絶縁トランス11の所定の端子ピン
が挿入される貫通孔17が設けられる。貫通孔17は、
挿入孔14よりも大きく形成される。絶縁基板13の裏
面には、ラウンドパターン15Aと配線パターン15B
が形成される。ラウンドパターン15Aは、挿入孔14
の回りを取り囲むように形成され、配線パターン15B
によって所定のラウンドパターンが接続される。そし
て、絶縁トランス11は、高い電圧が加わる端子ピンの
うち、高電位側又は、低電位側のいずれかの端子ピンが
絶縁基板13の厚みより短く切断される。例えば、端子
ピン11Aと11D間に高い電圧が加わり、端子ピン1
1Aが高電位側となった場合、低電位側の端子ピン11
Dが絶縁基板13の厚みより短く切断される。また、絶
縁トランス11の端子ピン11Fと配線パターン15B
間に高い電圧が加わる場合、端子ピン11Fが絶縁基板
13の厚みより短く切断される。この絶縁トランス11
は、端子ピン11A、11B、11C、11Eがそれぞ
れ挿入孔14に挿入され、端子ピン11Dと11Fがそ
れぞれ貫通孔17のほぼ中央に位置する様に挿入され
る。そして、絶縁トランス11の端子ピン11A、11
B、11C、11Eは、絶縁基板13の裏面から突出し
た部分がはんだでラウンドパターン15Aに接続され
る。端子ピン11Dと11Fは、絶縁基板とは絶縁さ
れ、固定されていない状態にある。コイル等の電子部品
12は、端子ピン12A、12B、12C、12Dがそ
れぞれ挿入孔14に挿入され、絶縁基板13の裏面から
突出した部分がはんだでラウンドパターン15Aに接続
される。FIG. 1 shows an embodiment of a composite part according to the present invention.
This will be described with reference to FIGS. FIG. 1 is a side view of a first embodiment of a composite component according to the present invention, FIG. 2 is a partial cross-sectional view of FIG. 1, and FIG. 3 is a bottom view in a state where terminal pins of the electronic component are inserted into a substrate. 1 to 3, reference numeral 11 denotes an insulating transformer,
12 is an electronic component such as a coil, and 13 is an insulating substrate. The insulating transformer 11 has six terminal pins 11A, 11B, 1
1C, 11D, 11E and 11F. Also, the electronic component 12 such as a coil has four terminal pins 12A, 12B,
12C and 12D are provided. The insulating transformer 11 and the electronic component 12 such as a coil are mounted on an insulating substrate 13. The insulating substrate 13 has an insertion hole 14 into which a terminal pin excluding a predetermined one of the insulating transformer 11 and a terminal pin of an electronic component 12 such as a coil, and a through hole into which a predetermined terminal pin of the insulating transformer 11 is inserted. 17 are provided. The through hole 17
It is formed larger than the insertion hole 14. On the back surface of the insulating substrate 13, a round pattern 15A and a wiring pattern 15B are provided.
Is formed. The round pattern 15A has the insertion hole 14
Is formed to surround the periphery of the wiring pattern 15B.
A predetermined round pattern is connected. In the insulating transformer 11, of the terminal pins to which a high voltage is applied, one of the terminal pins on the high potential side or the low potential side is cut shorter than the thickness of the insulating substrate 13. For example, when a high voltage is applied between the terminal pins 11A and 11D, the terminal pin 1
When 1A is on the high potential side, the terminal pin 11 on the low potential side
D is cut shorter than the thickness of the insulating substrate 13. Also, the terminal pins 11F of the insulating transformer 11 and the wiring patterns 15B
When a high voltage is applied therebetween, the terminal pin 11F is cut shorter than the thickness of the insulating substrate 13. This insulating transformer 11
The terminal pins 11A, 11B, 11C, and 11E are inserted into the insertion holes 14, respectively, and the terminal pins 11D and 11F are inserted so as to be located substantially at the centers of the through holes 17, respectively. Then, the terminal pins 11A, 11
In B, 11C, and 11E, portions protruding from the back surface of the insulating substrate 13 are connected to the round pattern 15A with solder. The terminal pins 11D and 11F are insulated from the insulating substrate and are not fixed. In the electronic component 12 such as a coil, the terminal pins 12A, 12B, 12C, and 12D are respectively inserted into the insertion holes 14, and portions protruding from the back surface of the insulating substrate 13 are connected to the round pattern 15A by solder.
【0008】図4は、本発明の複合部品の第2の実施例
の部分断面図である。絶縁基板43は、絶縁トランス4
1の所定のものを除く端子ピンやコイル等の電子部品4
2の端子ピンが挿入される挿入孔44と、挿入孔44よ
りも大きく形成され、絶縁トランス41の所定の端子ピ
ンが挿入される貫通孔47が設けられ、裏面にラウンド
パターンと配線パターンが形成される。絶縁トランス4
1は、端子ピン41Dと41Fが絶縁基板43の貫通孔
47から突出しない様に切断され、それ以外の端子ピン
の挿入孔44から突出した部分がはんだでラウンドパタ
ーンに接続される。そして、絶縁基板43の貫通孔47
内に絶縁性樹脂48が注入される。また、コイル等の電
子部品42の端子ピンは、挿入孔44から突出した部分
がはんだでラウンドパターンに接続される。FIG. 4 is a partial sectional view of a composite component according to a second embodiment of the present invention. The insulating substrate 43 includes an insulating transformer 4
Electronic components 4 such as terminal pins and coils other than those specified in 1.
An insertion hole 44 into which the second terminal pin is inserted, and a through hole 47 formed to be larger than the insertion hole 44 to insert a predetermined terminal pin of the insulating transformer 41 are provided, and a round pattern and a wiring pattern are formed on the back surface. Is done. Insulation transformer 4
1 is cut so that the terminal pins 41D and 41F do not protrude from the through hole 47 of the insulating substrate 43, and the other portions protruding from the insertion holes 44 of the terminal pins are connected to a round pattern by solder. Then, the through hole 47 of the insulating substrate 43
An insulating resin 48 is injected into the inside. The terminal pins of the electronic component 42 such as coils are protruded from the insertion holes 44 and connected to the round pattern with solder.
【0009】以上、本発明の複合部品の実施例を述べた
が、本発明はこれらの実施例に限られるものではない。
例えば、絶縁トランスやコイル等の電子部品の端子ピン
の本数は何本でよい。また、配線パターンは、絶縁基板
の両面に設けられ、所定の挿入孔を介して接続されても
よい。Although the embodiments of the composite part of the present invention have been described above, the present invention is not limited to these embodiments.
For example, the number of terminal pins of an electronic component such as an insulating transformer and a coil may be any number. Further, the wiring patterns may be provided on both surfaces of the insulating substrate and connected through predetermined insertion holes.
【0010】[0010]
【発明の効果】以上述べた様に本発明の複合部品は、高
電圧が加わる又は高電圧が加わるおそれのある端子同士
のうち少なくとも1つが、絶縁基板の貫通孔内に位置す
る様に短く切断されるので、高電圧が加わる端子間や、
高電圧が加わる端子と配線パターン間の絶縁耐圧特性を
向上することができる。As described above, the composite component of the present invention is cut short so that at least one of the terminals to which a high voltage is applied or to which a high voltage may be applied is located in the through hole of the insulating substrate. Between terminals to which high voltage is applied,
The withstand voltage characteristics between the terminal to which a high voltage is applied and the wiring pattern can be improved.
【図1】 本発明の複合部品の第1の実施例の側面図で
ある。FIG. 1 is a side view of a first embodiment of a composite part according to the present invention.
【図2】 図1の部分断面図である。FIG. 2 is a partial sectional view of FIG.
【図3】 基板に電子部品の端子ピンを挿入した状態の
底面図である。FIG. 3 is a bottom view showing a state where terminal pins of an electronic component are inserted into a substrate.
【図4】 本発明の複合部品の第2の実施例の部分断面
図である。FIG. 4 is a partial sectional view of a second embodiment of the composite part of the present invention.
【図5】 従来の複合部品の上面図である。FIG. 5 is a top view of a conventional composite part.
【図6】 図5の部分断面図である。FIG. 6 is a partial sectional view of FIG. 5;
【図7】 従来の複合部品の製造途中の底面図である。FIG. 7 is a bottom view of a conventional composite part in the process of being manufactured.
11 絶縁トランス 12 コイル等の電子部品 13 絶縁基板 DESCRIPTION OF SYMBOLS 11 Insulation transformer 12 Electronic component such as coil 13 Insulating substrate
Claims (2)
装された複合部品において、該基板は、電子部品の端子
を挿入する挿入孔と、該挿入孔より大きな貫通孔が設け
られ、該絶縁トランスは所定の端子が該貫通孔から突出
しない様に切断されかつ回路と絶縁された状態にあるこ
とを特徴とする複合部品。In a composite component having an electronic component including an insulating transformer mounted on a substrate, the substrate is provided with an insertion hole for inserting a terminal of the electronic component and a through hole larger than the insertion hole. A composite component characterized in that a predetermined terminal is cut so as not to protrude from the through hole and is insulated from a circuit.
項1に記載の複合部品。2. The composite component according to claim 1, wherein an insulating material is injected into the through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9060090A JPH10242613A (en) | 1997-02-28 | 1997-02-28 | Composite part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9060090A JPH10242613A (en) | 1997-02-28 | 1997-02-28 | Composite part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10242613A true JPH10242613A (en) | 1998-09-11 |
Family
ID=13132055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9060090A Pending JPH10242613A (en) | 1997-02-28 | 1997-02-28 | Composite part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10242613A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1174951A2 (en) * | 2000-07-17 | 2002-01-23 | Alcatel USA Sourcing, L.P. | System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
-
1997
- 1997-02-28 JP JP9060090A patent/JPH10242613A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1174951A2 (en) * | 2000-07-17 | 2002-01-23 | Alcatel USA Sourcing, L.P. | System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
EP1174951A3 (en) * | 2000-07-17 | 2004-04-21 | Alcatel USA Sourcing, L.P. | System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
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