JPH10242609A - Ceramic circuit substrate and its manufacture - Google Patents

Ceramic circuit substrate and its manufacture

Info

Publication number
JPH10242609A
JPH10242609A JP4035997A JP4035997A JPH10242609A JP H10242609 A JPH10242609 A JP H10242609A JP 4035997 A JP4035997 A JP 4035997A JP 4035997 A JP4035997 A JP 4035997A JP H10242609 A JPH10242609 A JP H10242609A
Authority
JP
Japan
Prior art keywords
green sheet
cover coat
ceramic
circuit board
conductor pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4035997A
Other languages
Japanese (ja)
Inventor
Masato Nakamura
真人 中村
Shosaku Ishihara
昌作 石原
Masahide Okamoto
正英 岡本
Norihiro Ami
徳宏 阿美
Yoichi Abe
洋一 阿部
Madoka Kinoshita
円 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4035997A priority Critical patent/JPH10242609A/en
Publication of JPH10242609A publication Critical patent/JPH10242609A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

PROBLEM TO BE SOLVED: To strengthen highly a cover coat, by giving to a conductor pad the structure having holes or notches in its outer peripheral portion, and by joining the cover coat to a ceramic portion present below the conductor pad. SOLUTION: A green sheet is created by the applying of a copper paste with the thickness of 0. 5μm to a polyester film and by drying thereafter the intermediate. In the green sheet, holes 7 with their diameters of 160μm are bored at the space of 450μm by punching, and the printings and fillings of the copper paste into the holes 7 are performed. Further, a surface layer, power supply layer, and wiring layer are formed by the printings of the copper paste. Also, on the surface layer, a metallic conductor pad 1 is printed, and thereon, a cover coat portion 5 is printed. Thereby, the cover coat portion 5 and a ceramic portion present below the metallic conductor pad 1 are joined to each other to make possible the high strengthening of the cover coat.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は電気入出力のための
ピンを取り付けて機能モジュールを構成するのに好適な
多層回路基板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer circuit board suitable for forming a functional module by attaching pins for electrical input / output and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】セラミック回路基板は金属導体とセラミ
ック絶縁部より構成される。セラミック回路基板は基板
表面に電子部品を接続するための入出力ピンをはんだで
接続されるための導体パッドを有する。しかし導体金属
とセラミック絶縁部の接着強度が弱い場合、入出力用ピ
ンの引っ張り強度が低い。また導体パッドの端面から薬
液が染み込み界面を腐食するといった問題があった。こ
の問題を解決するための従来技術として、導体ペースト
にて導体パッドを形成後、セラミックペーストで導体パ
ッドの端部を被覆した後、焼結を行い図２に示す様な断
面構造持たせるカバーコート形成法が知られている。2. Description of the Related Art A ceramic circuit board comprises a metal conductor and a ceramic insulating portion. The ceramic circuit board has conductor pads on the board surface for connecting input / output pins for connecting electronic components with solder. However, when the bonding strength between the conductor metal and the ceramic insulating portion is weak, the tensile strength of the input / output pin is low. There is also a problem that a chemical solution permeates from the end face of the conductor pad and corrodes the interface. As a conventional technique for solving this problem, a cover coat is formed by forming a conductive pad with a conductive paste, coating the end of the conductive pad with a ceramic paste, and then sintering to have a sectional structure as shown in FIG. Forming methods are known.

【０００３】[0003]

【発明が解決しようとする課題】しかし、従来技術の場
合、カバーコートは非常に薄いためカバーコート自体の
強度は低い。そのため入出力用ピンの引っ張り強度の向
上は充分ではなかった。また低応力で容易に微細なクラ
ックが入り破壊され、カバーコートが消失してしまうと
いう問題があった。However, in the case of the prior art, the strength of the cover coat itself is low because the cover coat is very thin. Therefore, the improvement of the tensile strength of the input / output pin has not been sufficient. Further, there is a problem that fine cracks easily enter and break at low stress, and the cover coat disappears.

【０００４】本発明は良好な強度を有するカバーコート
を有する回路基板及びその製造方法を提供することを目
的とする。またこのような回路基板の材料となるグリー
ンシートを提供することを目的とする。さらにこのよう
な回路基板とこれに搭載された電子デバイスとを含んで
構成される電子デバイス実装体を提供することを目的と
する。An object of the present invention is to provide a circuit board having a cover coat having good strength and a method for manufacturing the same. It is another object of the present invention to provide a green sheet used as a material for such a circuit board. It is still another object of the present invention to provide an electronic device package including such a circuit board and an electronic device mounted thereon.

【０００５】[0005]

【課題を解決するための手段】本発明は、上記の目的を
達成するために、導体パッドを外周部に孔もしくは切り
込みを有する構造とする事によって、カバーコートと導
体パッド下部のセラミック部分を接合させカバーコート
を高強度化した。According to the present invention, in order to achieve the above object, a cover pad and a ceramic portion below the conductive pad are joined by forming a conductive pad having a hole or a cut in an outer peripheral portion. Then, the cover coat was strengthened.

【０００６】[0006]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

（実施例１）以下、本発明の実施例により具体的に説明
する。(Example 1) Hereinafter, an example of the present invention will be specifically described.

【０００７】セラミック回路基板の製造方法は、まずグ
リーンシートを作成するためのスラリをつくる。スラリ
の製造方法は平均粒径３μｍの軟化温度８２０℃のホウ
ケイ酸ガラス粉末６３重量部と平均粒径３μｍのムライ
ト粒子３７重量部アクリル系バインダ１７重量部加えボ
ールミルで２４ｈ湿式混合して作製する。次に真空脱泡
して適度に粘度を調節する。次にこのスラリをドクタを
用いて、ポリエステルフィルム上に０．５μｍの厚さに
塗布してその後乾燥してグリーンシートを作製した。次
にこのグリーンシートにポンチで直径１６０μｍの孔を
４５０μｍ間隔で明け、銅ペーストを印刷充填し、さら
に銅ペーストの印刷により表面層、電源層、配線層を形
成した。表面層には導体パッドを印刷し、その上にカバ
ーコート印刷した。銅ペーストは平均粒径３μの還元銅
粉１００重量部にバインダとしてエチルセルロース１０
重量部と溶剤９０重量部を混合し作製したビヒクル１０
重量部加えたものを、らいかい機で３０分混合し、さら
に３本ロールを数回通して混練し、適当な粘度に調節し
孔埋め印刷及びスクリーン印刷した。カバーコートペー
ストは還元銅粉の代わりにグリーンシート作製に用いた
ものと同一のセラミック粉末を用い銅ペーストと同様に
作製した。このようにして作製したグリーンシートを５
０枚位置合わせした後、熱間プレスにより圧着した。圧
着は、温度１３０℃、圧力１５０ｋｇｆ／ｃｍ2とし
た。圧着したグリーンシートは脱脂のため、１００℃／
ｈ以下の昇温速度で昇温し、８５０℃で１０時間保持し
た。雰囲気はバインダカーボンの除去が可能で、かつ、
銅が酸化しないＮ2＋Ｈ2Ｏ＋Ｈ2雰囲気で行った。その
後、雰囲気をＮ2に切り替え１０００℃で２ｈ保持し、
焼結緻密化させた。この基板の断面を見たところ、カバ
ーコートと導体パッドの下のガラスセラミックが接合し
ていた（図３） （実施例２）実施例１で作製した回路基板の裏面導体パ
ッドに置換金メッキ後ＡuＳｎはんだを用い、ＣuＺr製
の電気信号入出力用ピンを導体パッドにろう付けしたと
ころ、引っ張り強度が４ｋｇｆ以上と良好であった。In a method of manufacturing a ceramic circuit board, first, a slurry for forming a green sheet is prepared. The slurry is produced by adding 63 parts by weight of borosilicate glass powder having an average particle size of 3 μm and a softening temperature of 820 ° C., 37 parts by weight of mullite particles having an average particle size of 3 μm, 17 parts by weight of an acrylic binder, and wet-mixing with a ball mill for 24 hours. Next, the viscosity is adjusted appropriately by vacuum degassing. Next, this slurry was applied on a polyester film to a thickness of 0.5 μm using a doctor, and then dried to prepare a green sheet. Next, holes having a diameter of 160 μm were formed in the green sheet with a punch at intervals of 450 μm, a copper paste was printed and filled, and a surface layer, a power supply layer, and a wiring layer were formed by printing the copper paste. A conductor pad was printed on the surface layer, and a cover coat was printed thereon. Copper paste is prepared by adding 100 parts by weight of reduced copper powder having an average particle size of 3 μm to ethyl cellulose 10 as a binder.
A vehicle 10 prepared by mixing 90 parts by weight of a solvent and 90 parts by weight of a solvent.
The parts by weight were mixed with a mill for 30 minutes, and further kneaded by passing through three rolls several times, adjusted to an appropriate viscosity, and subjected to hole filling printing and screen printing. The cover coat paste was produced in the same manner as the copper paste using the same ceramic powder as that used for producing the green sheet instead of the reduced copper powder. The green sheet prepared in this way is
After aligning zero sheets, they were pressed by a hot press. The pressure bonding was performed at a temperature of 130 ° C. and a pressure of 150 kgf / cm 2 . The pressed green sheet is 100 ° C /
The temperature was raised at a heating rate of not more than h and maintained at 850 ° C. for 10 hours. The atmosphere is capable of removing binder carbon, and
The test was performed in an N 2 + H 2 O + H 2 atmosphere where copper was not oxidized. After that, the atmosphere was switched to N 2 and kept at 1000 ° C. for 2 hours.
Sintered and densified. Looking at the cross section of this substrate, it was found that the cover coat and the glass ceramic under the conductor pad were joined (FIG. 3). (Example 2) AuSn was applied to the rear surface conductor pad of the circuit board fabricated in Example 1 after replacement gold plating. When a CuZr electric signal input / output pin was brazed to the conductor pad using solder, the tensile strength was as good as 4 kgf or more.

【０００８】[0008]

【発明の効果】カバーコートが導体パッド下部のセラミ
ック部分と接合する事によって高強度化する。According to the present invention, the cover coat is joined to the ceramic portion below the conductive pad to increase the strength.

【図面の簡単な説明】[Brief description of the drawings]

【図１】カバーコートを有するセラミック回路基板の断
面図。FIG. 1 is a cross-sectional view of a ceramic circuit board having a cover coat.

【図２】本発明を実現するための導体パッド形状の説明
図。FIG. 2 is an explanatory diagram of a conductor pad shape for realizing the present invention.

【図３】本発明によって得られるセラミック回路基板の
断面図。FIG. 3 is a sectional view of a ceramic circuit board obtained by the present invention.

【符号の説明】[Explanation of symbols]

２…スルーホール、 ３…入出力用ピン、 ４…半田、 ５…カバーコート、 ６…セラミック絶縁体、 ９…接続部。 2 ... Through hole, 3 ... I / O pin, 4 ... Solder, 5 ... Cover coat, 6 ... Ceramic insulator, 9 ... Connection.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 3/46 Ｈ０５Ｋ 3/46 Ｎ (72)発明者 阿美 徳宏 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 (72)発明者 阿部 洋一 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 (72)発明者 木下 円 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI H05K 3/46 H05K 3/46 N (72) Inventor Norihiro Ami 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Pref. Inside the research laboratory (72) Inventor Yoichi Abe 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Production Technology Research Institute (72) Inventor circle Enzo 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Japan Production technology Hitachi, Ltd. In the laboratory

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】金属導体とセラミック絶縁部より構成され
るセラミック回路基板で、カバーコートと導体パッドの
下部のセラミック部分を接合させるための孔又は切れ込
みを上記導体パッドの外周部の断面方向に有する事を特
徴とするセラミック回路基板。1. A ceramic circuit board comprising a metal conductor and a ceramic insulating portion, wherein a hole or cut for joining a cover coat and a ceramic portion below a conductive pad is provided in a cross-sectional direction of an outer peripheral portion of the conductive pad. Ceramic circuit board characterized by the following. 【請求項２】請求項１に記載の形状をもつ導体パッド。2. A conductive pad having the shape according to claim 1. 【請求項３】ガラスセラミック粉末とバインダ、溶剤、
その他の助剤からなるグリーンシートを製造し、上記グ
リーンシートに孔をあけた後、請求項２に記載の形状の
上記導体パッドをパターン印刷し、その上にカバーコー
トを印刷してなるグリーンシート。3. A glass ceramic powder, a binder, a solvent,
A green sheet formed by manufacturing a green sheet comprising other auxiliaries, forming a hole in the green sheet, pattern-printing the conductor pad having the shape according to claim 2, and printing a cover coat thereon. . 【請求項４】ガラスセラミック粉末とバインダ他の助剤
からなるグリーンシートを製造し、上記グリーンシート
に孔をあけた後、導体ペースト組成物を孔埋め印刷及び
パターン印刷して作製したグリーンシートと表面層とし
て請求項３に記載のグリーンシートを位置合わせして複
数枚積層圧着してなるグリーンシート積層体。4. A green sheet comprising a glass ceramic powder, a binder and other auxiliaries is produced, a hole is formed in the green sheet, and then a green sheet prepared by filling and printing a conductive paste composition with a hole is formed. A green sheet laminate comprising a plurality of the green sheets according to claim 3 aligned as a surface layer and laminated and pressed. 【請求項５】請求項４に記載の上記グリーンシート積層
体を焼結する回路基板の製造方法。5. A method of manufacturing a circuit board, comprising sintering the green sheet laminate according to claim 4.
JP4035997A 1997-02-25 1997-02-25 Ceramic circuit substrate and its manufacture Pending JPH10242609A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4035997A JPH10242609A (en) 1997-02-25 1997-02-25 Ceramic circuit substrate and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4035997A JPH10242609A (en) 1997-02-25 1997-02-25 Ceramic circuit substrate and its manufacture

Publications (1)

Publication Number Publication Date
JPH10242609A true JPH10242609A (en) 1998-09-11

Family

ID=12578456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4035997A Pending JPH10242609A (en) 1997-02-25 1997-02-25 Ceramic circuit substrate and its manufacture

Country Status (1)

Country Link
JP (1) JPH10242609A (en)

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