JPH10242365A - Integrated circuit device having terminal arranged on bottom face and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation of external terminal while reducing the size of a package by forming an external lead of an external lead for forming an external connection terminal arranged on the bottom face and a stepped external lead. SOLUTION: An internally recessed step 4a is made in a sealed body 4 at the circumferential fringe part on the bottom face side of the sealed body along the circumferential fringe. An outer lead 2b comprises a first lead 2b1 extending along the side face and the step 4a of the sealed body 4 toward a piece on the opposite side and the bottom face side thereof and being bent on the bottom face to form a protrusion, and a second lead 2b2 extending along the side face of the sealed body 4 and being bent on the surface of the step 4a to form a protrusion of same height as that of the first lead 2b1. According to the structure, the lead can be protected against being deformed through contact with a carrying tray when a completed product is transported. Furthermore, occupation are of the entire package on a mounting board can be decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device and / or a semiconductor device.
Or an integrated circuit formed by other elements,
In particular, the IC chip on which the integrated circuit is mounted is sealed with a resin or the like, and the external connection terminals from the chip exposed from the sealing body are bent toward the bottom surface of the sealing body and contact with the wiring pattern of the mounting board. And a method of manufacturing the same.

[0002]

2. Description of the Related Art With the recent development of electronic technology, IC packages including LSIs have been required to be extremely compact. While the miniaturization of electronic devices has progressed, in order to mount a packaged IC device on, for example, a printed board as a substrate on which various electronic components constituting the device are mounted, the size of the package itself must be reduced. As so-called downsizing has been forced, the demands are increasing and widespread.

The technical problems associated with the miniaturization of the package are as follows. From the viewpoint of the material, there is a processing limit of narrowing the pitch between the external and internal leads of a commonly used lead frame. There is a wiring pattern allowable limit for the IC package external connection terminal on the mounting board side. More specifically, packaging finished IC devices,
Handling problems on the package supply side such as deformation of the external connection terminals before shipment and delivery, and solder bridges that bridge between the external connection terminals when mounting IC devices. There is also a mounting problem on the receiving side, such as a connection failure between the terminal and the wiring pattern of the mounting board due to deformation of the terminal. Therefore, in consideration of all these problems and problems, the miniaturization of the package is considerably restricted, and in addition, in view of achieving a desired level of high yield, it is further restricted. Become.

[0004] Among the above-mentioned problems, PLCC (Plastic Leaded Chip Carrier, also known as QFJ (Quad Flat J-lead package)) or SOJ which does not solve the problem of deformation of external connection terminals or defective mounting due to the deformation.
(Small Out-line J-lead package) is a package type IC device. In such a device, a chip on which the integrated circuit is mounted is sealed with a resin or the like while being supported by a lead frame, and external connection terminals exposed from the sealing body are bent toward the bottom surface of the sealing body. It has the function of making contact with the wiring pattern of the mounting board. For details, refer to FIG. 1 to FIG.

FIG. 1 shows the appearance of such an IC device, FIG. 2 is a view from the side, and FIG. 3 is a view from the bottom. In these figures, details such as the number of external terminal pins do not match. As is apparent from these figures, each of the external leads 200 protruding from the package body 100 serving as a sealing body containing an IC chip (not shown) is bent in a J-shape toward the bottom surface side of the body. The lead tip 201 curves to form a projection. Then, the projection is connected to the wiring pattern of the mounting board by soldering. I having such a structure
In the C device, basically, the external lead 200 is directed along the package body side end face and inward of the body, and its tip is not exposed outside the body side end face, so that the deformation of the lead is prevented. The Rukoto.
However, since this type of device also uses a lead frame, it is not possible to exceed the above-mentioned pattern allowable limit of the mounting board, and it is not possible to adopt a relatively large pitch of the external leads, It is used only for applications that do not require a large number of pins.

On the other hand, a package that can solve the technical problem caused by such a lead frame is a B-type package.
GA (Ball Grid Array) type has been put to practical use.
The outline is that a double-sided wiring board is used instead of a lead frame.
The terminal is led out to the outside of the IC chip through the wiring pattern of the supporting substrate as a supporting substrate of the C chip, and the externally exposed terminals are formed in a lattice or staggered pattern on the bottom surface of the package body with spherical projections made of solder or the like. And are resin-sealed except for the bottom surface.
According to this, since the external terminals can be formed using the entire bottom surface of the package body irrespective of only the peripheral end, a large number of external terminals can be formed in a small package body, and deformation of the terminals can be avoided. While realizing it.

However, in practice, BGA type packages are generally expensive, so that their fields of use are limited.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a low-cost package that can contribute to miniaturization of a package while preventing deformation of external terminals. And a method for manufacturing the same. Another object of the present invention is to provide an inexpensive integrated circuit device capable of forming many external terminals in a small package body while preventing deformation of the external terminals, and a method of manufacturing the same.

[0009]

SUMMARY OF THE INVENTION An integrated circuit device according to the present invention embeds an IC chip on which an integrated circuit is formed, leads connected to terminals of the chip, and internal leads of the chip and the leads. An integrated circuit device including a sealing body, wherein the sealing body is provided with at least one step recessed into the inside of the sealing body at an outer edge of a bottom surface thereof, and the external lead of the lead is A bottom positioning external lead bent to the bottom side of the stopper and extending along the step and forming an external connection terminal on the bottom of the sealing body; and a bottom positioning side external lead bent to the bottom side of the sealing body and And a step positioning external lead forming an external connection terminal having a height equal to the external connection terminal on the surface.

A method for manufacturing an integrated circuit device according to the present invention comprises:
A method of manufacturing an integrated circuit device, comprising: an IC chip on which an integrated circuit is formed; a lead connected to a terminal of the chip; and a sealing body that embeds an internal lead of the chip and the lead. A sealing step of embedding the chip and the internal lead and forming a sealing body having at least one step recessed inward at an outer edge of the bottom surface, and a bottom side of the sealing body with respect to the external lead of the lead A bottom-positioning external lead that is bent to extend along the step and forms an external connection terminal on the bottom surface of the sealing body; and an external connection that is bent toward the bottom side of the sealing body and forms the external connection at the surface of the step. And a shaping step of shaping the external lead into a step positioning external lead forming an external connection terminal having the same height as the terminal.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 4 is a schematic side view including a partial cross section of a QFJ type semiconductor integrated circuit device according to one embodiment of the present invention, and FIG. 5 is a schematic bottom view thereof. Note that the cross-sectional portion of FIG. 4 is a diagram when the integrated circuit device is cut along a dashed line in FIG.

Referring to FIGS. 4 and 5, an IC chip 1 on which a semiconductor integrated circuit is formed is mounted on a die pad 20 of a lead frame, and a eutectic alloy is formed or applied at a joint between the two. The silver paste is fixed to the die pad 20. PSG (phosphorus glass) (not shown) is provided on the surface of the chip 1 (the upper surface of FIG.
Although a surface protective film such as a film is coated, a plurality of electrodes or input / output terminals, for example, aluminum pads are exposed in the vicinity of the outer edge of the chip. These pads are connected to the tips of the inner leads 2a of the lead frame by bonding wires 3. The inner leads 2a correspond to the respective pads of the chip 1, and extend individually and are led to the outer leads 2b. Except for the outer lead 2b, the entire chip 1, die pad 20, inner lead 2a, and bonding wire 3 are embedded and sealed by a substantially parallel plate-shaped sealing body 4 made of a predetermined resin.

The main feature of this embodiment is that, as shown in detail in the enlarged perspective view of FIG. 6, the peripheral edge on the bottom side of the sealing body 4 is provided along the peripheral edge and along the peripheral edge. A step (step-like portion) 4a recessed inward is formed, and the outer lead 2b is formed along the side surface of the sealing body 4 and the side opposite to the sealing body 4 on the bottom surface side of the sealing body 4 along the step 4a. Along the first lead 2b1 extending in the direction opposite to the direction in which the lead extends, and curved on the bottom surface of the sealing body 4 to form a projection, and along the side surface of the sealing body 4. The first lead 2 extends and curves on the surface of the step 4a.
b1 and a second lead 2b2 which forms a protrusion having the same height. The first lead 2b1 is the second lead 2
A projection is formed farther from the side edge of the sealing body 4 than b2, and the first leads 2b1 and the second leads 2b2 are alternately arranged. Therefore, the protrusion 2b10 of the first lead 2b1 and the protrusion 2b20 of the second lead 2b2 are arranged in a staggered pattern when viewed from the bottom surface side of the sealing body 4. The protrusions 2b10 and 2b20 serve as connection points with the wiring pattern of the mounting board.

According to the IC device packaged as described above, a larger number of external connection terminals can be formed more efficiently than the conventional device as shown in FIGS. That is, in the conventional example, the dotted line P
As typically indicated by 0, the wiring pattern (pad) of the mounting board is formed along the line at the edge of the bottom surface of the sealing body 100 along a row, so that it depends only on the permissible limit of the wiring pattern. The external terminals of a simple package cannot be formed. On the other hand, in the present embodiment, the dotted line P in FIG.
1, the staggered protrusion 2b
The wiring patterns (pads) on the mounting board side are also formed in a staggered manner so as to properly contact these corresponding to 10 and 2b20. In other words, pads can be arranged not only in a row near the edge of the bottom surface of the sealing body 4 but also in a row further deeper than that. Therefore, in this embodiment, the external terminals of the package can be formed densely without depending only on the allowable limit of the wiring pattern.

Also, in the package of this embodiment, the external leads 2b are directed along the side end surface of the sealing body 4 and inward of the sealing body, and the front end thereof is positioned outside the side end surface of the sealing body. Since it is not exposed, the same deformation prevention of the lead as in the conventional example is achieved. An additional effect of this embodiment is that the first lead 2b1 formed along the step 4a is more difficult to deform. This is the first lead 2b
It is particularly advantageous to prevent the lead from contacting the transport tray due to vibration or the like during transportation of the finished product and being deformed due to an increase in the contact area with the surface of the first step 4a.

Also, as compared with a package of the type in which the external leads have a gull wing shape, the present embodiment forms the external connection terminals by bending the external leads inside the package body, so that the mounting board of the entire package is mounted. There is an advantage that the above occupied area can be small. The IC device shown in FIGS. 4 to 6 has one step at the peripheral end on the bottom surface of the sealing body 4. However, two or more steps may be provided. This is shown in FIGS.

FIG. 7 shows a QFJ according to another embodiment of the present invention.
FIG. 8 is a schematic side view of a type semiconductor integrated circuit device, and FIG.
Is a schematic bottom view thereof, and portions equivalent to those in FIGS. 4 and 5 are denoted by the same reference numerals. 7 and 8, two steps 4a and 4b are formed at the peripheral end of the bottom surface of the sealing body 4 'which forms the same sealing as the sealing body 4.
The outer lead 2b 'exposed from the sealing body 4'
It can be classified into three types. One of them extends along the side surface of the sealing body 4 ′ and the steps 4 a and 4 b and on the bottom side of the sealing body 4 ′ toward the side opposite to the sealing body 4 ′, and A first lead 2b0 that forms a projection by bending on the bottom surface of 4 ′,
The first lead 2b0 extends along the side surface of the sealing body 4 'and the step 4a and curves on the surface of the step 4b.
The second lead 2b1 forms a protrusion having the same height as that of the first and second leads 2b1, and the other one extends along the side surface of the sealing body 4 'and curves on the surface of the step 4a to form the first and second leads 2b1. This is a third lead 2b2 that forms a protrusion having the same height as the second leads 2b0 and 2b1. The first lead 2b0 forms a projection farthest from the side edge of the sealing body 4 'among the three types of leads, followed by the second lead 2b1, the third lead 2b2, and the first lead 2b0. Or the third lead 2b0,
2b1 and 2b2 are sequentially arranged. Therefore, the first
Or the protrusion 2b of the third lead 2b0, 2b1, 2b2
The reference numerals 00, 2b10, and 2b20 are arranged in a houndstooth check when viewed from the bottom surface side of the sealing body 4 or in a form deviated from each other in an oblique direction with respect to the edge of the sealing body. These protrusions 2b00, 2b10 and 2b20 serve as connection points with the wiring pattern of the mounting board.

In such a package as well, the external connection terminals (protrusions) are not only arranged in a line near the edge of the bottom surface of the sealing body 4 ', but also arranged in two lines further inward. Therefore, the same operation and effect as the previous embodiment can be obtained. The same effect as in the previous embodiment can be applied to the additional effect. In addition, based on the common idea that can be found from the embodiments of FIGS. 4 to 6 and the embodiments of FIGS. 7 and 8 described above, three or more steps are provided at the bottom edge of the sealing body. Various embodiments are possible, such as forming an external lead conforming to the above.

Next, a method of manufacturing the above-described integrated circuit device will be described. FIG. 9 is a flowchart mainly showing a so-called assembly process, and starts with dicing (step S10) for individually dividing chips formed on a wafer. Then, die bonding for mounting the chip 1 obtained by the dicing on the die pad of the lead frame 2 via a silver paste (step S11).
Is applied.

An example of the form of the lead frame 2 is shown in FIG.
Is shown in As can be seen from FIG. 9, the square die pad 20 is arranged at the center of the lead frame 2 and is connected to the outer frame 21 of the lead frame by hanging pins 2c extending in the respective diagonal directions. In the vicinity of the edge of the die pad 20, the tips of the inner leads 2a are arranged along the edges, and the inner leads 2a extend almost radially from the respective tips and have a resin flow stopping pattern called a dam bar or a tie bar. External lead 2b across 2d
(2b '). External lead 2b (2b ')
Are respectively connected to the outer frame 21.

After the die bonding in step S11, the die-bonded lead frame 2 is placed in an atmosphere of, for example, 175 ° C. for 90 minutes in order to solidify a silver paste as a thermosetting resin on the die pad. Step S12) The processing is performed. Next, wire bonding (step S13) for individually connecting the fixed pads of the chip 1 and the corresponding tips of the inner leads 2a is performed. When all the bonding is completed, the process proceeds to a resin sealing step S14 having one of the main features of the present embodiment. In the resin sealing step S14, the sealing body 4 (4 ') having the above-described steps is formed. The details can be described with reference to FIG.

FIG. 11 shows a transfer mold for packaging the present integrated circuit device by a so-called low-pressure transfer molding method, a manufacturing apparatus including the same, and a lead for mounting the bonded chip 1 set in the manufacturing apparatus. FIG. 3 is a schematic cross-sectional view illustrating a sealing form of a frame 2. In the following description, the integrated circuit device shown in FIGS. 7 and 8 will be described as an example.

In FIG. 11, the manufacturing unit for molding the sealing body 4 'mainly includes an upper mold (upper mold) 61 and a lower mold (lower mold) 71, which are mating molds. An injection mechanism for injecting the liquid resin into the cavity formed by the mold, and a void removing mechanism for removing bubbles or voids from the injected resin in the cavity. The injection mechanism includes a cull hole 81, a transfer plunger 91, a runner R1, and a gate G1, and the void removing mechanism includes an air vent V1.

Note that the cavity 710 of the lower mold 71 has a stepped shape, that is, steps 7a and 7b at the peripheral edge on the opening side, as shown in FIG. Step 4 in Sealed Body 4 ′
a, 4b (see FIGS. 7 and 8). The cavity 610 of the upper die 61 does not have such a step and has a substantially trapezoidal cross section.

The upper die 61 and the lower die 71 having such a shape are heated to a predetermined temperature in advance, and sandwich the lead frame 2 to be sealed fixed at a predetermined position (clamping). On the other hand, a predetermined resin 50 previously formed into a tablet shape as a raw material of the sealing body 4 ′ is heated by high frequency and filled in the cull hole 81. Alternatively, a raw material (tablet) is put into a cull hole of a mold that has been heated to a predetermined temperature in advance, preheated and filled. Then, the transfer plunger 91 is operated to squeeze the raw resin 50 and melt and press-inject it into the cavity 610 of the upper die 61 and the cavity 710 of the lower die 71 through the runner R1 and the gate G1.

The positional relationship between the upper die 61 and the lower die 71 and the lead frame 2 at this time is shown by a dashed line 40 in FIG. The lead frame 2 is fixed so that the die pad 20 is located at the center of the lower mold cavity 710. On the package bottom surface side of the lead frame 2, the resin injected into the lower mold cavity 710 through the gate G1 forms a bottom half of the sealing body 4 'in a region surrounded by the dashed line. The upper mold cavity 610 also has a step 7
The shape of the lower mold cavity 710 is substantially the same as that of the lower mold cavity 710 except for a. A half of the top surface side of the sealing body 4 'is formed in a region surrounded by a chain line.

In the upper and lower mold cavities 610 and 710 at the beginning of the resin injection, voids are mixed in the injected resin. The air vent V1 is a groove for extruding or extracting the void to the outside, and eliminates a final mixed void in the sealing resin. Thus, a lead frame having a form as shown in FIG. 12 is obtained by the resin sealing step S14 thus performed. FIG. 12 shows a schematic side view of such a lead frame.

This sealed lead frame is then
In order to further solidify the sealing body 4 'formed of the thermosetting resin, a curing (step S15) process of placing the sealed lead frame 2 in an atmosphere of, for example, 175 ° C for 5 hours is performed. Will be After that, dam bar 2d
Is cut (step S16), the outer leads 2b 'are plated with solder (step S17), and the process proceeds to a lead shaping step S18 having the other main feature of this embodiment. Details of the lead shaping step can be described with reference to the schematic sectional views of FIGS.

First, in FIG. 13 showing the pressing step, the lead frame 2 to be shaped is placed on the lower mold 75 with the stepped bottom surface facing upward, and is held by the upper mold 65 facing the lower mold 75. The base portion of the sealing body 4 'and the outer lead 2b', that is, the vicinity of the sealing body is sandwiched and tightened. The lower die 75 has a concave portion that opens toward the upper die 65, and the top half of the sealing body 4 ′ is housed therein. The upper die 65 has a similar concave portion that opens toward the lower die 75. And a half of the bottom surface side of the sealing body 4 ′ is placed therein. On the lower die 75, a guide die 65A facing the side surface of the upper die 65 is arranged. This guide mold 65
Between the A and the upper die 65, the press movable body 85 is configured to slide or slide up and down with the assistance of the guide die.

On the bottom surface of the movable press body 85, steps 85a, 8 corresponding to the steps 4a, 4b of the sealing body 4 'as described above.
5b is formed, and similar steps 75a and 75b are also formed on the upper surface of the lower mold 75 facing the bottom surface of the movable body, and the shapes and arrangement of the steps are mutually related. Therefore, from the initial setting state of the lead frame 2 shown by the dotted line, when the press movable body 85 reaches the lowest point of its stroke and presses and tightens the outer lead 2b ', the press movable body 85 and the lower mold Due to the steps 75, the lead frame 2 is transformed into a lead frame 2 shown by a solid line. Such press working can be performed simultaneously for all the outer leads 2b 'extending in four directions from the sealing body 4'. In this case, if the press movable body 85 is formed so as to surround the sealing body 4 ', the press operation control can be unified, which is convenient. Upon completion of the pressing step, the process proceeds to a cutting step in FIG.

In FIG. 14, the pressed lead frame 2 is placed on a comb-shaped lower mold 76. The lower mold 76 has the same concave portion as the lower mold 75 at the center, while three types of lower mold portions 760, 761, 762 for supporting the outer leads 2b 'are sequentially arranged around the concave portion. It has a structure that has been. First lower mold part 76
Numeral 0 is for forming the above-mentioned first lead 2b0, the end face of which is at the longest distance from the center of the lower mold 76 as compared with the other, and the upper face of which is formed by press working. The outer lead 2b 'has a shape corresponding to the two bent portions of the outer lead 2b'. The second lower mold portion 761 is for forming the above-described second lead 2b1, and its end face is separated from the central portion of the lower mold 76 by the second longest distance as compared with the other components. The upper surface has a shape corresponding to one bent portion (the first bent portion from the sealing body 4 ': the first bent portion) of the outer lead 2b' formed by press working. Further, the third lower mold part 762 is the third mold part 762 described above.
For forming the lead 2b2, the end face is separated from the center of the lower die 76 by the shortest distance as compared with the other one, and the upper face is formed on the outer lead 2b 'immediately before the first bent portion. Has a shape corresponding to. These lower mold portions 760, 761, 762 are arranged in sequence along the edge of the sealing body 4 ', and thus surround the sealing body accommodating recess as a whole and correspond to each outer lead. In the shape of a letter.

The upper die 66 has the same concave portion as the upper die 65 at the center, while the side end surface thereof has a third lower die portion 762.
And has a bottom surface for holding the outer lead 2b 'immediately before the first bent portion, facing the upper surface of the third lower mold portion 762. Three types of guiding dies 660, 661, 662 are opposed to the side end surfaces of the upper die 66.
Are arranged above the lead frame 2. The first guiding mold 660 defines a sliding or sliding trajectory of the first cutter 860 to form the first lead 2b0. The second guide die 661 defines the sliding or sliding trajectory of the second cutter 861 to form the second lead 2b1. The third guide die 662 defines the sliding or sliding trajectory of the third cutter 862 to form the third lead 2b2. That is, the mechanism for forming the first lead 2b0 is carried by the lower mold part 760, the guide mold 660, and the cutter 860, and the mechanism for forming the second lead 2b1 is constituted by the lower mold part 761, the guide mold 661. And cutter 86
1 carries a mechanism for forming the third lead 2b2,
The lower mold part 762, the guide mold 662, and the cutter 862 are responsible. Therefore, similarly to the lower mold portion, the cutter and the guide mold are arranged in order in four directions of the sealing body 4 ', and have a comb shape as a whole.

In such a cutting mechanism, the cutter 86
0, 861, 862 descends as shown by the arrow in the figure,
When the outer lead 2b 'reaches the corresponding lower die end face, the outer lead 2b' is cut at the position shown by the dotted line. As a result, various leads having appropriate lengths can be obtained. After cutting the outer lead 2b 'in this manner, the process proceeds to a bending process as shown in FIGS.

FIG. 15 shows a manner of bending the first lead 2b0. The portions to be bent by the upper and lower dies 67 and 77 having the same structure as the storage recess of the sealing body 4 'are shown. Sandwiching the removed first outer lead 2b0,
The tip of the first lead 2b0 is moved up and down by a punch 87
Into a U-shape. FIG. 16 shows a bending process of the second lead 2b1. The second lead 2b1 is formed by excluding portions to be bent by the upper and lower dies 68 and 78 having the same structure as the storage recess of the sealing body 4 '. 2 outer lead 2b1 and the second lead 2
The tip of b1 is deformed into a U-shape by driving a punch 88 that can move up and down. FIG.
The upper die and the lower die 6 having a structure equivalent to that of the storage recess of the sealing body 4 'are shown, showing a bending process of the lead 2b2.
The third outer lead excluding the portion to be bent is sandwiched by 9, 79, and the tip of the third lead 2b2 is deformed into a U-shape by driving a vertically movable punch 89.

Here, the U-shape formed at the tip of the first to third leads 2b2 has, as is clear from the figure, the heights of the first lead 2b0, the second lead 2b1, and the second lead. The three leads 2b2 increase in order, and the curvature of the tip of these leads increases as the lead becomes shorter. In the completed product as shown in FIG. 7, the leading end protrusions 2b00, 2b10, 2b2 of each lead are provided.
Here, the heights of the protrusions of 0 are adjusted so as to be the same. Such adjustment is achieved by changing the shape of the punched portion or by changing the driving speed.

The lower mold and the upper mold shown in FIGS. 15 to 17 are formed by integrating parts that can be used in common and forming a lead holding portion in a comb shape similar to FIG. 14 corresponding to three types of leads. By arranging the punches corresponding to the lower die and the upper die, the three bending steps can be realized as a single step. When the lead tip protrusion is formed, the process proceeds to the first bending step in FIG.

In FIG. 18, first to third leads 2
Both b0, 2b1, and 2b2 are sandwiched by upper and lower dies 6A and 7A having the same structure as the storage recess of the sealing body 4 'except for a portion to be bent. Then, in this state, the bending mechanism (three-body set type flange-up type) 8
A causes each lead to bend vertically upward. The bending mechanism 8A is directly by the actuating force f ₁ of the vertical downward applied with an initial working body 8A1 changed to horizontal force f _2, further this f ₂ with an intermediate working body 8A2 vertical upward force f changed to _3, the lead by the lead contact member 8A3 responsible for the force f ₃ 2B0,2b1,2b
2 is bent upward. However, instead of using such a bending mechanism, each lead may be bent by another method. When the first bending process is completed, the process proceeds to the second bending process of FIG.

In FIG. 19, the first to third leads 2b0, 2b1, and 2b2 that are bent vertically are now further bent vertically near the root of the sealing body 4 '.
As can be seen from the above description, the bending mechanism 8A is also used here.
Can be used. By this second bending, the leading end protruding portions 2b00, 2b10, 2b20 of each lead are brought closer to a predetermined position in the sealing body 4 '. When the second bending process is completed, the process proceeds to the pressing process of FIG.

In FIG. 20, the tip protrusion is a sealing member 4 '.
First to third leads 2b approached to a predetermined position
Each of 0, 2b1, and 2b2 is pressed against the sealing body 4 'by a pressing die 8B from above at a predetermined position of the distal end protrusion as a finish bending. This allows each lead to
The bottom surface of the sealing body 4 'and the surfaces of the steps 4a and 4b are aligned as closely as possible.

Note that, depending on the shape of the sealing body and the lead,
Even without such finish bending, it is possible to obtain a sufficient alignment between the lead and the sealing body only by the bending step of FIG. Thus, when the shaping process for the outer leads is completed, unnecessary components such as the exposed portions of the suspension pins 2c are removed from the lead frame 2, and all the processes of the lead shaping step S18 (FIG. 9) are completed.

After step S18, inspection (step S19),
After packing (step S20), shipment (step S21) is carried. In the above-described embodiment, the QFP type package is described. However, the present invention is not limited to this and can be applied to various forms such as a DIP type. In other words, the step is not limited to providing the step at the entire peripheral edge of the bottom surface of the package body, but the step is formed only at a predetermined outer edge or only a part of the predetermined outer edge among the four outer edges of the body bottom. Is established,
An external connection terminal suitable for such a body may be formed. Further, in the above-described embodiment, the tip of the external lead is formed in a U-shape as the external connection terminal, but various forms of forming a projection from the bottom surface of the package body are conceivable. It should be further noted that various shaping methods can be mentioned in addition to the lead shaping method shown in FIGS. 13 and 20 in particular.

In addition to the above, various means and steps have been described in the above embodiments, but it is possible to appropriately modify them within a range that can be designed by those skilled in the art.

[0043]

As described in detail above, according to the present invention,
It is possible to provide an inexpensive integrated circuit device that can contribute to downsizing of a package while preventing deformation of external terminals, and a method for manufacturing the same. Further, according to the present invention, it is possible to provide an inexpensive integrated circuit device capable of forming many external terminals in a small package body while preventing deformation of the external terminals, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is an external view of a conventional QFJ type IC device.

FIG. 2 is a side view of a conventional QFJ type IC device.

FIG. 3 is a bottom view of a conventional QFJ type IC device.

FIG. 4 is a schematic side view including a partial cross section of a QFJ type IC device according to an embodiment of the present invention.

FIG. 5 is a schematic bottom view of a QFJ-type IC device according to one embodiment of the present invention.

FIG. 6 is a schematic enlarged perspective view showing a bottom surface portion of a QFJ type IC device according to an embodiment of the present invention.

FIG. 7 is a schematic side view including a partial cross section of a QFJ-type IC device according to another embodiment of the present invention.

FIG. 8 is a schematic bottom view of a QFJ type IC device according to another embodiment of the present invention.

FIG. 9 is a flowchart showing a method for manufacturing an IC device according to the present invention.

FIG. 10 is a schematic plan view showing an example of a lead frame employed in the IC device according to the present invention.

11 is a transfer mold for packaging the integrated circuit device according to the embodiment of FIGS. 7 and 8 by a low-pressure transfer molding method, and a manufacturing apparatus including the transfer mold.
FIG. 2 is a schematic cross-sectional view showing a sealing form of a lead frame 2 mounted with a bonded chip 1 set in the manufacturing apparatus.

FIG. 12 is a schematic side view showing an aspect of the lead frame after a sealing step in the manufacturing method of FIG. 10 is completed.

FIG. 13 is a schematic side view showing an aspect of a pressing step during a lead shaping step in the manufacturing method of FIG. 10;

FIG. 14 is a schematic side view showing an aspect of a lead cutting step during a lead shaping step in the manufacturing method of FIG. 10;

FIG. 15 is a schematic side view showing an aspect of a bending process on a first lead during a lead shaping process in the manufacturing method of FIG. 10;

FIG. 16 is a schematic side view showing an aspect of a bending process on a second lead during a lead shaping process in the manufacturing method of FIG. 10;

FIG. 17 is a schematic side view showing an aspect of a bending process on a third lead during a lead shaping process in the manufacturing method of FIG. 10;

FIG. 18 is a schematic side view showing an aspect of a first bending step during a lead shaping step in the manufacturing method of FIG. 10;

FIG. 19 is a schematic side view showing an aspect of a second bending step during a lead shaping step in the manufacturing method of FIG. 10;

FIG. 20 is a schematic side view showing an aspect of a press bending step during a lead shaping step in the manufacturing method of FIG. 10;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC chip 2 Lead frame 20 Die pad 21 Outer frame 2a Inner lead 2b, 2b 'Outer lead 2b0, 2b1, 2b2 First, 2nd, 3rd outer lead 2b00, 2b10, 2b20 Projection part 2c Hanging pin 2d Dam bar 3 Bonding wire 4, 4 'Sealed body 4a, 4b Step 61, 65, 65A, 66, 660-662, 67, 6
8,69,6A Upper mold (part) 71,75,76,760-762,77,78,7
9, 7A Lower die (part) 610 Upper die cavity 710 Lower die cavity 7a, 7b Stepped portion 75a, 75b Stepped portion 81, 82 Cull portion 91, 92 Plunger R1, R2 Runner G1, G2 Gate V1, V2 Air vent 91, 92 Resin tablet 85 Press movable body 85a, 85b Step corresponding portion 860, 861, 862 Cutter 87, 88, 89 Punch 8A Bending mechanism 8B Holding type

Claims (14)

[Claims] 1. An integrated circuit device comprising: an IC chip on which an integrated circuit is formed; a lead connected to a terminal of the chip; and a sealing body that embeds an internal lead of the chip and the lead. At least one step recessed into the inside of the sealing body is provided at an outer edge of the bottom surface of the sealing body, and the external lead of the lead is bent toward the bottom surface side of the sealing body and is formed at the step. A bottom positioning external lead extending along and forming an external connection terminal on the bottom surface of the sealing body, and having a height equivalent to that of the external connection terminal on the surface of the step bent to the bottom surface side of the sealing body and the step. And a step positioning external lead forming an external connection terminal having the same. 2. The integrated circuit device according to claim 1, wherein each of the external connection terminals has a shape that curves outward from the bottom surface or the surface of the step. 3. The integrated circuit device according to claim 2, wherein the external connection terminal of the step-positioned external lead has a larger curvature than the external connection terminal of the bottom-positioned external lead. . 4. The integrated circuit according to claim 1, wherein said bottom positioning external leads and at least one of said step positioning external leads are alternately arranged. apparatus. 5. The method according to claim 5, wherein the step has a plurality of steps, the step positioning external lead has a type for each step, and the bottom surface positioning external lead and the various step positioning external leads are sequentially arranged. 5. An integrated circuit device having a bottom surface-arranged terminal according to claim 4. 6. The method according to claim 1, wherein the step is formed at a peripheral edge of a bottom surface of the sealing body.
Or an integrated circuit device having the bottom surface arranged terminal according to 5. 7. A method of manufacturing an integrated circuit device including an IC chip on which an integrated circuit is formed, a lead connected to a terminal of the chip, and a sealing body that embeds the chip and internal leads of the lead. A sealing step of embedding the chip and the internal lead and forming a sealing body having at least one step recessed inward at an outer edge of a bottom surface, and sealing the external lead of the lead. A bottom positioning external lead that is bent to the bottom surface side of the stopper and extends along the step and forms an external connection terminal on the bottom surface of the sealing body;
And a shaping step of shaping and separately forming a step positioning external lead that forms an external connection terminal having the same height as the external connection terminal on the surface of the step and bent on the bottom surface side of the sealing body. A method for manufacturing an integrated circuit device having a bottom surface arranged terminal. 8. The method according to claim 7, wherein each of the external connection terminals has a shape curving outward from the bottom surface or the surface of the step. . 9. The integrated circuit device according to claim 8, wherein the external connection terminal of the step-positioned external lead has a larger curvature than the external connection terminal of the bottom-positioned external lead. Manufacturing method. 10. The integrated circuit according to claim 7, wherein the bottom-positioned external leads and at least one of the step-positioned external leads are alternately arranged. Device manufacturing method. 11. The method according to claim 8, wherein the step has a plurality of steps, the step positioning external lead has a type for each step, and the bottom positioning external lead and the various step positioning external leads are sequentially arranged. The method for manufacturing an integrated circuit device having a bottom surface arranged terminal according to claim 10. 12. The method according to claim 7, wherein the step is formed at a peripheral edge of a bottom surface of the sealing body.
12. A method for manufacturing an integrated circuit device having the bottom surface-arranged terminal according to 10 or 11. 13. The mold for forming a cavity for forming a sealed body that embeds the chip and the internal lead and has at least one step recessed inward at an outer edge of a bottom surface in the sealing step. 8. The method according to claim 7, further comprising a molding step of injecting a molten resin into the cavity by using the method. 14. The shaping step includes: a first step of deforming an external lead of the lead into a shape corresponding to the step; and a step corresponding to each of the bottom surface positioning external lead and the step positioning external lead. A second step of cutting the external lead, and a third step of forming the tip of the external lead cut in the second step into an external terminal shape corresponding to each of the bottom positioning external lead and the step positioning external lead. 14. The method according to claim 7, further comprising: a fourth step of positioning a tip of the external lead on a bottom surface of the sealing body and on a surface of the step.