JPH1023595A - Speaker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a speaker with high productivity and facilitating insert molding by combining a resin frame and a resin enclosure so as to configure a prescribed magnetic circuit and integrating them through welding. SOLUTION: A resin frame 30 is formed by inserting a top plate 18 into a prescribed forming die and injecting a resin into a piece cavity with a shape of the resin frame 30 formed by an outer circumferential face, part of an upper face and an inner face of the forming die. A resin enclosure 20 insert-molded and the resin frame 30 are combined by using a prescribed jig after forming a gap between a center pole 111 and a top plate 13. Then a flange 21 and a skirt 21 are welded and integrated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a loudspeaker in which a frame is formed of resin.

[0002]

2. Description of the Related Art FIG. 5 shows a basic configuration of a conventional general loudspeaker having an external magnet type magnetic circuit, in which a lower plate 1, a magnet 2, and an upper plate 3 are stacked in this order. A frame 4 is fixed to the upper plate 3 by means of bonding, screwing, caulking, welding, or the like, and a damper 5, a cone paper 6, a voice coil 7, A vibration system including a dust proof 10 and the like is attached.

[0003] Recently, a frame formed of a resin has been frequently used for the purpose of reducing the size and weight.
A loudspeaker in which a foom is formed of a resin has less leakage magnetic flux to the outside than a loudspeaker in which the frame is made of iron, and thus is suitable for use in combination with a video device such as a CRT.

A loudspeaker using a resin frame is known, for example, from Japanese Patent Application Laid-Open No. 3-35669. This is, as shown in FIG.
A magnetic circuit 24 composed of an upper plate 1, an upper plate 22, and a lower plate 23 is integrally molded into a mold portion 32 of a frame 25 by insert molding. The frame 25 has a diaphragm 20, a voice coil 27, a damper 28
And a vibration system including the dust cap 30.

[0005]

In recent years, the reuse (recycling) of resources has been encouraged, and there has been a demand for the loudspeakers to reuse the components and materials thereof, that is, magnetic circuit components and frame resin materials. From the point of view of recycling, as shown in Fig. 5, it is extremely difficult to disassemble and take out parts / materials because the parts are firmly connected by bonding etc., so they are crushed finely with a shredder, and all are shredded as dust. You have to discard it. Further, even if it can be disassembled, there is an inconvenience that foreign matter such as an adhesive adheres to parts and materials, so that it is necessary to remove and recycle it.

On the other hand, as shown in FIG. 6, a magnetic circuit integrated with a frame by a mold can be taken out by breaking the mold.
If the magnet is demagnetized, the magnetic circuit is naturally broken down into individual components, which makes recycling possible. However, in general, the mold portion is made so as not to be easily broken, and if it is forcibly broken, a magnet made of a brittle material such as ferrite may be damaged and may not be recycled.

When the magnetic circuit is integrally molded with the frame by insert molding, high-pressure molding is performed. Therefore, the gap of the magnetic circuit into which the voice coil is inserted, that is, the center pole of the lower plate 23 and the upper plate 22 are formed. In order to maintain the accuracy of the gap between them, a highly accurate positioning means that can withstand high pressure is required, which leads to an increase in manufacturing cost. Alternatively, if the positioning accuracy is reduced in order to reduce the manufacturing cost, the accuracy of the gap is reduced and the quality of the product is reduced.

In addition, dust is easily generated due to chipping of a ferrite magnet during high-pressure insert molding.
Since the gap between the center pole and the upper plate 22 is narrow, it is extremely difficult to remove dust. Therefore, the entire molded product must be discarded as a defective product,
Productivity decreases. In addition, since the size of the high-pressure insert molding machine is increased, the equipment cost is increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a speaker which can be easily insert-molded. Another object is to realize a speaker with high productivity.

It is another object of the present invention to provide a speaker that can be easily disassembled, contains no foreign matter such as an adhesive after disassembly, and is easy to recycle.

[0011]

[Means for Solving the Problems]

[1] A first invention for solving the problem is a resin frame molded by inserting a top plate, and a resin enclosure molded by inserting a magnet and a bottom plate, wherein the top plate has the magnet and the resin. It is characterized in that it is combined with a bottom plate to form a magnetic circuit and integrated by welding.

According to the first aspect of the present invention, since the resin frame has only the top plate inserted therein, molding is easy. Further, the resin enclosure in which the magnet and the bottom plate are inserted can be molded at a low pressure, and the positioning accuracy can be made looser than the gap accuracy. That is, the resin enclosure can be easily molded, and even if dust such as a piece of magnet is generated inside, it is easy to remove the resin enclosure.

When a resin frame is combined with and welded to such a resin enclosure, a gap between the top plate and the bottom plate can be precisely formed by a jig or the like, so that a magnetic circuit having a high gap accuracy can be easily formed. can do.

As described above, it is possible to realize a speaker in which insert molding can be easily performed. Further, a speaker with high productivity can be realized. [2] A second invention for solving the problem is a resin frame having a top plate attached thereto and a resin enclosure formed by inserting a magnet and a bottom plate, wherein the top plate is provided together with the magnet and the bottom plate. It is characterized by being combined by welding so as to form a magnetic circuit.

According to the second aspect of the present invention, since the resin frame does not insert a magnetic circuit component, molding is easy. Further, the resin enclosure in which the magnet and the bottom plate are inserted can be molded at a low pressure, and the positioning accuracy can be made looser than the gap accuracy. That is, the resin enclosure can be easily molded, and even if dust such as a piece of magnet is generated inside, it is easy to remove the resin enclosure.

When a resin frame is combined with and welded to such a resin enclosure, a gap between the top plate and the bottom plate can be precisely formed with a jig or the like, so that a magnetic circuit having a high gap accuracy can be easily formed. can do.

As described above, it is possible to realize a speaker in which insert molding can be easily performed. Further, a speaker with high productivity can be realized. [3] A third invention for solving the problem is characterized in that, in the second invention, the resin frame has positioning means for positioning the top plate.

According to the third aspect of the present invention, since the top plate can be accurately positioned by the positioning means, a magnetic circuit having a high gap accuracy can be easily formed.

[4] A fourth aspect of the present invention for solving the problem is characterized in that, in any one of the first to third aspects, a slit for breaking is provided in the resin enclosure.

According to the fourth aspect of the present invention, by breaking the resin enclosure using the slit for breaking, the resin portion and the magnetic circuit can be easily separated from each other. Can be recycled in a pure state free from contamination by foreign substances such as adhesives. That is, a speaker that can be easily recycled can be realized.

[5] A fifth aspect of the present invention for solving the problems is that, in any one of the first to fourth aspects, a slit for breaking is provided in a welded portion between the resin frame and the resin enclosure. Features.

According to the fifth aspect of the present invention, by breaking the resin enclosure using the slit for breaking, the resin portion and the magnetic circuit can be easily separated from each other. Can be recycled in a pure state free from contamination by foreign substances such as adhesives. That is, a speaker that can be easily recycled can be realized.

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiment.

FIG. 1 is a sectional view showing the structure of a speaker. This speaker is an example of an embodiment of the present invention. As shown in FIG.
, A magnet 12 and a top plate 13. The magnetic circuit 10 has a generally short columnar outer shape. The bottom plate 11 and the top plate 13 are magnets 12
The yoke of the magnetic circuit 10 is constituted by contacting the two magnetic poles.

The bottom plate 11 has a columnar center pole 111. The top plate 13 forms a concentric ring with the center pole 111. A gap is formed between the side peripheral surface of the center pole 111 and the annular inner wall of the top plate 13.

The bottom plate 11 and the magnet 12 are housed in a resin enclosure 20. The resin enclosure 20 has a substantially cylindrical shape, and a flange 21 is formed at an upper end thereof.

The top plate 13 is housed in the resin frame 30. The resin frame 30 has a cup-like shape opened upward. The bottom 31 of the lower end of the resin frame 30 has a shape adapted to the flange 21 of the resin enclosure 20.

Resin enclosure 20 containing bottom plate 11 and magnet 12 and top plate 1
Each of the resin frames 30 accommodating 3 is manufactured by insert molding.

That is, in the resin enclosure 20, the bottom plate 11 and the magnet 12 are inserted into a predetermined mold (not shown), and a piece cavity corresponding to the shape of the resin enclosure 20 formed by the outer peripheral surface and the inner surface of the mold. Is molded by injecting a resin.

[0030] Such insert molding can be performed at a considerably lower pressure than in the conventional case where the frame in which the entire magnetic circuit is inserted is integrally formed by injection molding. Since the pressure is low, the risk of chipping of the ferrite magnet and the like is reduced. Further, a compact molding machine can be used.

Since the top plate 13 is not included, strict positioning for maintaining the gap accuracy is not required. Further, even if dust such as fragments of magnets is generated during the molding process, the dust can be easily removed because the opening of the gap between the center pole 111 and the magnet 12 is wide. In addition, the magnet 12 during the insert molding
Is in a non-magnetized state.

The resin frame 30 has a top plate 13 inserted into a predetermined molding die (not shown), and a resin cavity is formed in a piece cavity corresponding to the shape of the resin frame 30 formed by the outer peripheral surface and a part of the upper surface and the inner surface of the molding die. By injection.

The resin enclosure 20 and the resin frame 30 which are insert-molded as described above are assembled after a gap between the center pole 111 and the top plate 13 is set using a predetermined jig (not shown). Then, the flange 21 and the skirt 31 are welded and integrated.

The welding is performed over the entire circumference of the flange 21 and the skirt 31. Examples of welding techniques include ultrasonic bonding (ultrasonic welding), which applies ultrasonic waves to the welded parts to generate heat and melt-bonds them, high-frequency welding that uses resin generated by using heat generated when placed in a high-frequency electric field, or high-frequency welding. High-frequency heating bonding or the like in which the adherend is placed in an electric field and heated and bonded. Above all, ultrasonic welding is preferred in that strong welding can be performed by a simple method.

FIGS. 2 and 3 show a side view and a bottom view of the speaker, respectively. As shown in both figures, the resin enclosure 20 has a slit 22 and the resin frame 3
0 has a slit 32. Resin enclosure 20 and resin frame 30 are provided with slits 22 and 32
It is molded in a form having

The slit 22 of the resin enclosure 20 is oriented in the longitudinal direction of the speaker, that is, the resin enclosure 20.
Are formed along the height direction. The length of the slit 22 is substantially equal to the height of the resin enclosure 20, and the depth is equal to the thickness of the resin enclosure 20 or a thin wall is left at the bottom. For example, four such slits 22 are formed along the circumference of the resin enclosure 20. The number of the slits 22 is not limited to four, but may be an appropriate number.

The slit 32 of the resin frame 30 is formed in the skirt 31, that is, the resin enclosure 20 and the resin frame 3.
No. 0 is formed along the longitudinal axis of the speaker at the welded portion.
The length of the slit 32 is substantially equal to the thickness of the top plate 13 inserted in the back of the skirt portion 31, and the depth reaches the top plate 13 or remains thin at the bottom. Such a slit 32 forms the resin frame 3
For example, twelve pieces are formed along the circumference of the 0 skirt 31. The number of the slits 22 is not limited to 12, and may be an appropriate number.

These slits 22 and 32 are used for recycling the resin enclosure 20 and the resin frame 3 during recycling.
This is for taking out the internal magnetic circuit 10 by destroying 0. That is, when the tip of a tool such as a flathead screwdriver is inserted into the slit 22 and pryed, the resin enclosure 20 is broken, and the resin coating covering the magnet 12 and the bottom plate 11 is peeled off.

When a tool is inserted into the slit 32 and pryed, the skirt 31 of the resin frame 30 is broken, and the resin is peeled from the top plate 13. As a result, the resin covering the magnetic circuit 10 is peeled off.
Can be taken out.

The magnetic circuit 10 taken out of itself is demagnetized so that individual components, that is, the bottom plate 1
1, disassembled into a magnet 12 and a top plate 13, and each is provided for recycling. Since these parts have no adhesive, they can be recycled in a pure state.

Further, the resin frame 30 and the resin enclosure 20 after the magnetic circuit 10 is taken out are separated in a pure state without being contaminated by foreign substances such as an adhesive. These are also sent to a recycling process (recycling) as a resin material.

FIG. 4 shows another embodiment of the present invention. In FIG. 4, the same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. The difference from the one shown in FIG.
The point is that the resin frame 30 is molded without inserting the top plate 13. Since it is not insert molding, high cycle molding is possible, and as a result, cost reduction can be realized.

The resin frame 30 has a flange 33 for attaching the top plate 13. Flange 33
Is provided with a positioning hole 34, and the top plate 13 is attached by inserting the protrusion 131 into the hole 34. The positioning hole 34 is an example of an embodiment of the positioning means in the present invention. It is preferable to lightly caulk this part after insertion in order to ensure attachment.

The resin frame 30 to which the top plate 13 is attached is integrated with the resin enclosure 20 in the same manner as in FIG. As shown in FIGS. 2 and 3, an example of this embodiment
The slits 22 and 32 are provided in the resin frame 30 and the resin frame 30, respectively, and at the time of recycling, the magnetic circuit 10 is taken out by breaking at the portion.

[0045]

As described in detail above, according to the first aspect of the present invention for solving the problems, since the resin frame has only the top plate inserted therein, molding is easy. Further, the resin enclosure in which the magnet and the bottom plate are inserted can be molded at a low pressure, and the positioning accuracy can be made looser than the gap accuracy. That is, the resin enclosure can be easily molded, and even if dust such as a piece of magnet is generated inside, it is easy to remove the resin enclosure.

When a resin frame is combined with and welded to such a resin enclosure, the gap between the top plate and the bottom plate can be precisely formed with a jig or the like, so that a magnetic circuit having a high gap accuracy can be easily formed. can do.

As described above, it is possible to realize a speaker in which insert molding can be easily performed. Further, a speaker with high productivity can be realized. Further, according to the second aspect of the present invention for solving the problems, the resin frame does not insert magnetic circuit components, so that molding is easy. Further, the resin enclosure in which the magnet and the bottom plate are inserted can be molded at a low pressure, and the positioning accuracy can be made looser than the gap accuracy. In other words, the resin enclosure is easy to mold, and
Even if dust such as fragments of magnets is generated inside, it is easy to remove.

When a resin frame is combined and welded to such a resin enclosure, a gap between the top plate and the bottom plate can be precisely formed by a jig or the like, so that a magnetic circuit having a high gap accuracy can be easily formed. can do.

As described above, it is possible to realize a speaker in which insert molding can be easily performed. Further, a speaker with high productivity can be realized. According to the third aspect of the present invention, since the top plate can be accurately positioned by the positioning means,
A magnetic circuit having a high gap accuracy can be easily configured.

According to the fourth aspect of the present invention for solving the problems, the resin enclosure and the magnetic circuit can be easily separated by breaking the resin enclosure using the slit for breaking, and In addition, they can be recycled in a pure state where they are not contaminated by foreign substances such as adhesives. That is, a speaker that can be easily recycled can be realized.

According to the fifth aspect of the present invention for solving the problems, the resin enclosure and the magnetic circuit can be easily separated by destroying the resin enclosure using the slit for breaking. In addition, they can be recycled in a pure state without being contaminated with an adhesive or the like. That is, a speaker that can be easily recycled can be realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an example of an embodiment of the present invention.

FIG. 2 is a side view showing a configuration of an example of an embodiment of the present invention.

FIG. 3 is a bottom view showing a configuration of an example of an embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a configuration of an example of an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a configuration of a conventional example.

FIG. 6 is a cross-sectional view showing a configuration of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Magnetic circuit 11 Bottom plate 111 Center pole 12 Magnet 13 Top plate 131 Projection part 20 Resin enclosure 21 Flange 22 Slit 30 Resin frame 31 Hem part 32 Slit 33 Flange 34 Positioning hole 40 Vibration system 41 Voice coil 411 Coil part 42 Vibration plate 43 Dust cap 44 Edge 45 Damper

Claims (5)

[Claims] 1. A resin frame molded by inserting a top plate and a resin enclosure molded by inserting a magnet and a bottom plate so that the top plate forms a magnetic circuit together with the magnet and the bottom plate. A loudspeaker characterized by being combined and integrated by welding. 2. A resin frame to which a top plate is attached and a resin enclosure formed by inserting a magnet and a bottom plate are combined and welded so that the top plate forms a magnetic circuit together with the magnet and the bottom plate. A speaker characterized by being integrated by: 3. The loudspeaker according to claim 2, wherein the resin frame has positioning means for positioning the top plate. 4. The speaker according to claim 1, wherein a slit for breaking is provided in the resin enclosure. 5. The loudspeaker according to claim 1, wherein a slit for breaking is provided in a welding portion between the resin frame and the resin enclosure.