JPH10229151A - Molding-type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To position an electronic component element in a process, for soldering the electronic component element on lead terminal parts. SOLUTION: Positioning parts 18 are formed in connection parts 19 of pairing lead terminal parts 11. Even if the position and the direction of the electronic part element 12 are displaced in a state in which the electronic component element 12 is placed on the lead terminal parts 11 and solder 19 is melted, the displacements of the position and the direction are controlled or corrected by the positioning parts 18. Thus, the electronic component element 12 is securely fixed to a prescribed position in the lead terminal parts 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a molded electronic component such as a chip register.

[0002]

2. Description of the Related Art Molded electronic components such as chip registers and chip diodes are manufactured as follows.
First, cream-like solder 2 is applied to the tips of a plurality of pairs of lead terminal portions constituting a lead frame (see FIG. 9), and chip-like electronic component elements 3 such as resistors and diodes are mounted thereon. Then, the electronic component element 3 is bridged between the two lead terminal portions 1 (see FIG. 10), and is placed in a tunnel furnace (not shown) to melt the solder 2 in a high-temperature atmosphere, thereby connecting the electronic component element 3 to the lead terminals. Fixed to part 1, then
A fixed portion between the electronic component element 3 and the lead terminal portion 1 is surrounded by a resin mold 4, the lead terminal portion 1 is cut off from the runner 5, and the connecting portion 6 is cut to separate the two lead terminal portions 1. Thus, a molded electronic component as shown in FIG. 11 is obtained.

[0003]

In the above manufacturing process, when the electronic component element 3 is mounted or when the solder 2 is melted, the position and orientation of the electronic component element 3 may be shifted. In this state, the position and orientation of the electronic component element 3 may not be appropriate (see FIG. 12), but this causes a decrease in reliability with respect to conductivity and the like. The present invention has been made in view of the above circumstances, and has as its object to position an electronic component element in a step of soldering the electronic component element to a lead terminal portion.

[0004]

According to a first aspect of the present invention, there is provided a mold-type electronic component in which an electronic component is fixed to a plurality of lead terminals by soldering and the electronic component is resin-molded. It is characterized in that a positioning portion for positioning the electronic component element at a predetermined fixing position is provided in the lead terminal portion. A second aspect of the present invention is characterized in that, in the first aspect of the invention, the positioning portion is formed by depressing a fixing region of the electronic component element in the lead terminal portion.

[0005]

Actions and effects of the present invention

<Claim 1> Even when the position and orientation of the electronic component element are shifted when the electronic component element is mounted on the lead terminal portion or when the solder is melted, the shift of the position and direction is regulated or corrected by the positioning portion. Therefore, the electronic component element is securely fixed to a predetermined position in the lead terminal portion. <Claim 2> In a state where the solder is melted, the solder does not protrude from the positioning portion and evenly wraps around the entire positioning portion, so that the reliability of fixing by soldering is improved and the solder is removed. Also, the reliability of the contact between the lead terminal portion and the electronic component element via the terminal is improved.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION

<First Embodiment> Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. The molded electronic component 10 of the present embodiment is housed in the housing 20 to constitute a molded electronic component built-in connector. The molded electronic component 10 includes a pair of lead terminal portions 11, a chip-shaped electronic component device 12 such as a resistor and a diode fixed to the base ends of the two lead terminal portions 11, and an electronic component device 1.
2 and a package 13 in which the base ends of the lead terminal portions 11 are surrounded by a resin mold, and the leading ends of both lead terminal portions 11 protrude from the package 13. When the molded electronic component 10 is housed in the housing 20, the two lead terminal portions 11 face the hood portion 20A of the housing 20.

Next, the mold type electronic component 10 and its manufacturing method will be described in detail. The lead terminals 11 in a state before manufacture are arranged with a predetermined interval between them, and the two lead terminals 11 are connected to each other by a connecting portion 14. A plurality of pairs of lead terminal portions 11 are integrated in a parallel state by an elongated liner 15. The lead frame 16 is formed by the lead terminal portion 11, the connecting portion 14, and the liner 15.
Is configured.

At the base end (the end opposite to the liner 15) of the pair of lead terminals 11, connecting portions 17 projecting toward each other are formed. A positioning unit 18 is provided for positioning the electronic component element 12 at a predetermined position and orientation. The positioning portion 18 is formed by depressing the mounting region of the electronic component element 12 in the connection portion 17 in a rectangular shape. As shown in FIG. 6, the dimensions of the positioning part 18 are such that when the electronic parts 12 are placed on both positioning parts 18 so as to bridge them, on the bottom surface 18A of the positioning part 18, the electronic parts 12 It is set so as to match without leaving a large gap.

On one side of the periphery of the positioning portion 18 close to the connection portion 17 on the other side, the bottom surface 1 of the positioning portion 18
8A is released to the outside of the connection portion 17, and the bottom surfaces 18A of both positioning portions 18 are arranged at the same height at the release edge. Also, the remaining three sides
The bottom surface 18A of the positioning portion 18 and the top surface of the connecting portion 17 are formed as an inclined surface 18B.
Accordingly, the position and the orientation of the electronic component element 12 placed on the bottom surface 18A of the positioning portion 18 are restricted. When the electronic component element 12 is placed at an inappropriate position or orientation, the electronic component element 12 is corrected to the correct position and orientation by the inclination of the inclined surface 18B.

Next, the manufacturing process of the molded electronic component 10 will be described. As shown in FIG. 2, an appropriate amount of creamy solder 19 is applied to the bottom surface 18A of the positioning portion 18, respectively.
Is placed in a bridge state between the two lead terminal portions 11. This is put in a tunnel furnace (not shown), and the solder 19 is melted in a high-temperature atmosphere.
Is fixed to both lead terminal portions 11 (see FIG. 3).
After that, the fixed portion between the electronic component element 12 and the lead terminal portion 11 is surrounded by a resin mold to form the package 1.
3, the lead terminal portion 11 is cut off from the runner 15, and the connecting portion 14 is cut to form the two lead terminal portions 11
Is separated. Thus, the molded electronic component 10 as shown in FIG. 4 is obtained. The thus-obtained molded electronic component 10 is housed in the housing 20, thereby completing the connector with a built-in molded electronic component as shown in FIG.

In the above-described manufacturing process, when the electronic component element 12 is mounted on the lead terminal portion 11 or when the solder 19 is melted in a tunnel furnace, the position and orientation of the electronic component element 12 may be shifted. . However, in this embodiment,
Since the positioning portion 18 is provided, even if the position and the direction of the electronic component element 12 are displaced when the electronic component element 12 is placed on the lead terminal portion 11, the outer edge and the corner of the electronic component element 12 remain
By contacting the inclined surface 18B of FIG. 8, the displacement of the position and the direction is corrected. Even if the electronic component element 12 receives a force that shifts its position or direction due to the flow action of the molten solder 19, the electronic component element 12 comes into contact with the inclined surface 18 </ b> B of the positioning portion to change its position or direction. The deviation is regulated.

As described above, in the present embodiment, the positioning section 1
By providing 8, the deviation of the position and direction of the electronic component element 12 in the soldering step is regulated or corrected, so that the electronic component element 12 is soldered to an appropriate position and direction. Thereby, the reliability of the electrical conductivity between the electronic component element 12 and the lead terminal portion 11 is improved. Further, in the present embodiment, since the positioning portion 18 is formed to be recessed from the upper surface of the connection portion 17,
The melted solder 19 uniformly wraps around the entire positioning portion 18. Thereby, the reliability of the fixation of the electronic component element 12 by soldering is improved, and the contact reliability between the electronic component element 12 and the lead terminal portion 11 via the solder 19 is also improved.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment,
The positioning portion has a configuration different from that of the first embodiment. Other configurations are the same as those in the first embodiment, and thus the same configurations are denoted by the same reference numerals, and description of the structures, operations, and effects will be omitted. The positioning portion 21 according to the second embodiment is formed of a substantially hemispherical protrusion protruding from the upper surface of each connection portion 17. Of the peripheral edge of the region where the electronic component element 12 is mounted on the connection portion 17, the connection portion on the mating side is formed. 1
The other three sides (one side provided with the inclined surface 18B in the above embodiment) except for one side corresponding to 7 are arranged at the center positions, respectively. Therefore, one electronic component element 1
2 is positioned so as to be surrounded from four sides by the six positioning portions 21, and the deviation of the position and the direction of the electronic component element 12 is regulated or corrected by the positioning portions 21.

<Other Embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. In addition, various changes can be made without departing from the scope of the invention. (1) In the above embodiment, the molded electronic component having two lead terminals has been described. However, the present invention can be applied to a molded electronic component having three or more lead terminals. .

(2) The positioning portion is not limited to the one described in the above embodiment. For example, a wall-shaped rising portion may be formed in the lead terminal portion. (3) In the above embodiment, the parallel type molded electronic component in which the electronic component element is mounted so as to bridge two lead terminal portions arranged at the same height has been described. The present invention can also be applied to a sandwich-type molded electronic component in which an electronic component element is mounted on a terminal portion and the other lead terminal portion is superposed thereon. In this case, the positioning portion may be provided on only one of the upper and lower lead terminal portions, or may be provided on both the upper and lower lead terminal portions.

(4) In the above embodiment, the resin-molded molded electronic component is accommodated in the housing. However, the present invention can also be applied to the case where resin molding is performed in the housing.

[Brief description of the drawings]

FIG. 1 is a perspective view of a lead frame and an electronic component element according to a first embodiment.

FIG. 2 is a perspective view showing a state in which solder is applied to a lead terminal portion in the first embodiment.

FIG. 3 is a perspective view showing a state in which the electronic component element is soldered to a lead terminal hood in the first embodiment.

FIG. 4 is a perspective view of the molded electronic component of the first embodiment.

FIG. 5 is a perspective view of the molded electronic component built-in connector of the first embodiment.

FIG. 6 is a partially enlarged plan view showing a state where an electronic component element is mounted on a positioning unit according to the first embodiment.

FIG. 7 is a sectional view taken along line XX of FIG. 6;

FIG. 8 is a perspective view of a lead frame and an electronic component element according to a second embodiment.

FIG. 9 is a perspective view showing a state in which solder is applied to lead terminal portions in a conventional example.

FIG. 10 is a perspective view showing a state in which an electronic component element is mounted on a lead terminal portion in a conventional example.

FIG. 11 is a perspective view of a conventional molded electronic component.

FIG. 12 is a plan view showing a state in which the position and orientation of the electronic component element are improperly fixed in the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Mold electronic component 11 ... Lead terminal part 12 ... Electronic component element 18 ... Positioning part 19 ... Solder 21 ... Positioning part

Claims (2)

[Claims] 1. A molded electronic component in which an electronic component element is fixed to a plurality of lead terminal parts by soldering and the electronic component element is resin-molded. A molded electronic component, comprising: a positioning portion for positioning at a fixing position. 2. The molded electronic component according to claim 1, wherein the positioning portion is formed by depressing a fixing region of the electronic component element in the lead terminal portion.