JPH10228869A - Plasma display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accomplish prevention of erroneous operation, reduction of power consumption, and improvement of a discharging characteristic by setting a dielectric constant, porosity, and a glass transition point of a stripe barrier rib provided with a specific line width to the specific values. SOLUTION: A dielectric constant of a barrier rib with a line width of 15-50μm is set to be 4-10, 6-9 desirably, and erroneous discharge via the barrier rib is prevented, while reduction in a softening point of glass and discharge voltage can be carried out. The barrier rib, in which a pitch is set to be 100-250μm (100-160μm, desirably) while a height is set to be 50-170μm (100-170μm, desirably), is excellent in erroneous discharge prevention, strength of the barrier rib, luminance of a panel, and a discharge life. When porosity of the barrier rib is set to be 10% or less (3% or less desirably), prevention of erroneous discharge, retention of adhesion with a substrate, and prevention of reduction in a discharge life and in luminance can be accomplished. Favorably, a glass transition point of a barrier rib material is set to be 430-500 deg.C while its glass softening point is set to be 470-580 deg.C, so that sufficient burning can be carried out and distortion and the like of the barrier rib can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display and a partition wall of a plasma addressed liquid crystal display.

[0002]

2. Description of the Related Art Plasma display panels (PDPs)
Since they can display at a higher speed than a liquid crystal panel and can be easily made larger, they have permeated OA equipment and public information display devices. Further, progress in the field of high-definition television is highly expected.

With the expansion of such applications, attention has been paid to color PDPs having delicate and many display cells. The PDP generates plasma discharge between opposing anode and cathode electrodes in a discharge space provided between the front glass substrate and the rear glass substrate, and emits ultraviolet light generated from a gas sealed in the discharge space. The display is performed by hitting a phosphor provided in the discharge space. In this case, a partition (also referred to as a barrier or a rib) is provided to suppress the spread of the discharge to a certain area and perform display in a specified cell, and to secure a uniform discharge space. The shape of the partition wall is approximately 30 to 8 in width.
0 μm and height of 100 to 200 μm, usually, an insulating paste made of glass is printed and dried on the front glass substrate and the rear glass substrate by a screen printing method, and the printing and drying process is repeated 10 to 20 times to obtain a predetermined value. After height
It is formed by firing. However, in the normal screen printing method, especially when the panel size is increased,
It is difficult to align the discharge electrode formed on the front transparent flat plate in advance with the printing place of the insulating glass paste,
There is a problem that it is difficult to obtain positional accuracy. In addition, by performing the superposition printing of the glass paste 10 to 20 times, the ribs and the edge of the side wall of the partition wall and the skirt are disturbed, and the accuracy of the height cannot be obtained, so that the display quality is deteriorated. There are problems of poor workability and low yield. In particular, the pattern width is 50 μm and the pitch is 100 μm
Below this, there is a problem that the bottom of the partition wall is easily spread due to the thixotropic property of the paste, and it is difficult to form a sharp and residue-free partition wall.

[0004] With the increase in the area and resolution of PDPs, such a method of screen printing makes it difficult to manufacture partition walls with a high aspect ratio and high definition, and this is disadvantageous in terms of cost. It has become to.

As a method for improving these problems, Japanese Patent Application Laid-Open Nos. 1-2296534, 2-165538, 5-342929, and 6-29 have been proposed.
No. 5676 proposes a method of forming a partition by a photolithography technique using a photosensitive paste. However, according to these methods, there are problems that a dense partition wall cannot be obtained after firing and that the sensitivity and resolution of the photosensitive insulating paste are low because the glass content of the photosensitive insulating paste is small. For this purpose, screen printing
It was necessary to obtain a partition wall having a high aspect ratio by repeatedly performing the exposure and development steps. However, if printing, exposure, and development are repeatedly performed, there is a problem of alignment, and there is a limit to cost reduction.

Japanese Patent Application Laid-Open No. 8-50811 proposes a method in which a partition is formed by one exposure using a photosensitive glass paste method. However, if the line width is reduced in order to increase the aperture ratio in order to improve the brightness, depending on the selected glass, there is a problem that erroneous discharge is likely to occur or the discharge voltage is increased and the power consumption is increased.

[0007]

The present invention relates to a partition for a plasma display. SUMMARY OF THE INVENTION It is an object of the present invention to provide a plasma display with reduced power consumption, less malfunction, and excellent discharge characteristics.

[0008]

An object of the present invention is to provide a plasma display having a stripe-shaped partition having a line width of 15 to 50 μm, wherein the dielectric constant of the partition is 4 to 10 μm.
This is achieved by a plasma display characterized by the following.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The dielectric constant of glass, which is a partition material of a plasma display, depends on its composition.
In general, when a large amount of B ₂ O ₃ or SiO ₂ is included, the dielectric constant is low, and when a large amount of Bi ₂ O ₃ , PbO, or Al ₂ O ₃ is included, the dielectric constant is high.

In a plasma display, the dielectric constant of the partition affects the electric capacity of the pixel cell or the possibility of erroneous discharge through the partition. As a result of various studies on the dielectric constant of the partition wall glass, it was found that it is important to set the dielectric constant of the partition wall to 4 to 10.

If it is smaller than 4, when a desired cell is discharged, adjacent cells also discharge.
This is not preferable because so-called erroneous discharge easily occurs. In addition, in order to make it 4 or less, a large amount of silicon oxide having a dielectric constant of about 3.8 must be contained, and the glass transition point becomes high and the firing temperature becomes high. Absent. If it is 10 or more, power loss due to an increase in the amount of charge occurs, which causes an increase in power consumption, which is not preferable. From the viewpoint of lowering the softening point of the glass, preventing erroneous discharge, and lowering the discharge voltage, 6 to 9 is more preferable.

The measurement of the dielectric constant is preferably performed as follows. First, the following sample shape is good. The partition wall glass is melted and processed into a 3 cmφ, 2 mm thick plate to form an electrode. At this time, it is made so that air bubbles do not enter. This is an LCR meter (Yokogawa Hewlett-Packard Company)
The electric capacity is measured at 20 ° C. and 1 MHz with HP4284A) to calculate the dielectric constant.

The shape of each part of the partition wall of the present invention is to prevent erroneous discharge,
Since the strength of the partition walls, the brightness of the panel, and the discharge life are excellent, the pitch is 100 to 250 μm, and the height is 50 to 50 μm.
170 μm is preferable, and more preferably, the pitch is 10 μm.
0 to 160 μm and height is 100 to 170 μm. Further, when the pitch is P, the line width is L, and the height is H, it is preferable that the following relationship be established.

When P = 100-140 μm L = 15-40 μm H = 100-140 μm When P = 140-250 μm L = 20-50 μm H = 120-170 μm If the line width is smaller than the above lower limit, It is not preferable because the peeling, falling, and the swinging width of the partition wall at the time of pattern formation become large.

If it is larger than the above upper limit, the brightness decreases due to the decrease in the aperture ratio, which is not preferable. In addition, when the aperture ratio is reduced, the phosphor is likely to protrude into the adjacent partition groove or adhere to the upper part of the partition wall, and the yield is undesirably reduced.

Regarding the height, if it is smaller than the above lower limit,
Since the discharge space becomes narrower, the plasma region becomes closer to the phosphor, and the phosphor is sputtered, it is not preferable in terms of life. If it is larger than the above upper limit, the ultraviolet light generated by the discharge is absorbed before reaching the phosphor, which lowers the luminance, which is not preferable. Further, the strength is also weak, and it is easy to fall down and peel off, which is not preferable.

In the present invention, the porosity of the partition walls is preferably 10% or less, because the partition walls have excellent adhesion to a substrate for preventing the dielectric constant from becoming too small or preventing the partition walls from falling down. It is more preferably at most 3%.

The lowest dielectric constant of glass is about 3.8 for quartz glass, whereas the dielectric constant of gas is close to 1, so that the larger the porosity, the smaller the composite dielectric constant of the entire partition. , Causing erroneous discharge. In addition, the porosity is 10% or less because the adhesion to the substrate is deteriorated, the strength is insufficient, and the discharge characteristics are deteriorated, such as a decrease in brightness due to gas and moisture discharged from the pores during discharge. Is preferred. Considering the discharge characteristics such as the discharge life and luminance stability of the panel, it is more preferably 3% or less.

Since pores cause moisture adsorption, moisture evaporates at the time of cell discharge, which undesirably lowers luminance. In particular, when there are many pores, even if the diameter of the pores is 1 μm or less, the exhaust resistance increases, and the gas adsorption due to the increase in the surface area of the pores increases, which is not preferable. Therefore, in order to reduce pores, sufficient firing is required. In addition, there is a problem that a fine pattern cannot be formed if a large hole is formed.

The porosity (P) is obtained by calculating the true density of the partition wall material by dt.
h, when the measured density of the partition is dex, it is defined as P = (dth-dex) / dth × 100.

The true specific gravity of the partition wall material is preferably calculated using the so-called Archimedes' method as follows. Using a mortar, crush the partition wall material to about 325 mesh or less so as not to be felt at the fingertips. Then, the true specific gravity is obtained as described in JIS-R2205. Next, in the measurement of the measured density, the partition is cut off so as not to lose its shape, and the measurement is performed using the Archimedes method in the same manner as described above except that pulverization is not performed.

Although the method for producing the partition wall of the present invention is not particularly limited, it is preferable to produce it by a photosensitive glass paste method which has few steps and can form a fine pattern.

The photosensitive glass paste method uses a photosensitive glass paste mainly composed of an inorganic component composed of glass powder and an organic component having photosensitivity, and baking and developing a pattern of a photomask by exposure and developing a partition pattern by developing. This is a method of forming and then firing to obtain partition walls.

When used for a partition of a plasma display or a plasma addressed liquid crystal display, a pattern is formed on a glass substrate having a low glass transition point and a low thermal softening point.
It is preferable to use a glass material having a thermal softening temperature of 470 to 580 ° C. from the viewpoint that sufficient firing is possible. Glass transition point 500 ° C, thermal softening point 5
If the temperature is higher than 80 ° C., it must be fired at a high temperature, and the substrate is distorted during firing. The glass transition point is 430
A material having a temperature of lower than 470 ° C. and a thermal softening point of less than 470 ° C. is not preferable because the partition walls are distorted when the phosphor is applied and fired in a subsequent step, causing peeling and disconnection.

Further, since the linear expansion coefficient of general high strain point glass used for the substrate glass is 80 to 90 × 10 ^-7 , the linear thermal expansion coefficient is 50 to prevent the substrate from warping. ~ 90 × 10 ^-7 , and further, 60-90 × 1
It is preferable to use a glass material of ^0-7 .

The composition of the glass material is preferably as follows. It is preferable that silicon oxide is blended in the glass in a range of 3 to 60% by weight. If the content is less than 3% by weight, the denseness, strength and stability of the glass layer are reduced, and the coefficient of thermal expansion deviates from desired values, so that a mismatch with the glass substrate is likely to occur. By setting the content to 60% by weight or less, the thermal softening point is lowered, and sufficient baking on a glass substrate becomes possible.

Boron oxide is 5 to 50% by weight in the glass.
The electrical, mechanical and thermal properties such as electrical insulation, strength, coefficient of thermal expansion, and denseness of the insulating layer can be improved by blending in the range. If it exceeds 50% by weight, the stability of the glass will decrease.

It can also be obtained by using a glass powder containing at least one of lithium oxide, sodium oxide and potassium oxide in an amount of 3 to 20% by weight, but alkali metal oxides such as lithium, sodium and potassium are added. The amount is 20% by weight or less, preferably 1% by weight.
By setting the content to 5% by weight or less, the stability of the paste can be improved. Further, since the glass transition point and the glass softening point can be lowered, low-temperature firing becomes possible.

As a glass composition containing lithium oxide,
It is preferable to contain a composition of lithium oxide 2-15% by weight silicon oxide 15-50% by weight boron oxide 15-40% by weight barium oxide 2-15% by weight aluminum oxide 6-25% by weight in terms of oxide.

In the above composition, sodium oxide or potassium oxide may be used instead of lithium oxide.
Lithium oxide is preferred from the viewpoint of paste stability.

By using a glass powder containing at least one of bismuth oxide, lead oxide and zinc oxide in a glass in an amount of 5 to 50% by weight, a photosensitive glass paste capable of forming a partition on a glass substrate by low-temperature firing can be obtained. Obtainable. If it exceeds 50% by weight, the heat-resistant temperature of the glass becomes too low, and it is difficult to bake the glass on a glass substrate. In particular, using glass containing 5 to 50% by weight of bismuth oxide has advantages such as a long pot life of the paste.

The glass composition containing bismuth oxide includes:
It is preferable that the composition contains bismuth oxide 10 to 40% by weight in terms of oxide, silicon oxide 3 to 50% by weight, boron oxide 10 to 40% by weight, barium oxide 8 to 20% by weight aluminum oxide 10 to 30% by weight.

Further, a glass containing both a metal oxide such as lead oxide, bismuth oxide and zinc oxide and an alkali metal oxide such as lithium oxide, sodium oxide and potassium oxide enables a heat treatment at a lower alkali content. Control of softening temperature and linear thermal expansion coefficient becomes easy.

Further, by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, zinc oxide, zirconium oxide, and the like, particularly aluminum oxide, barium oxide, and zinc oxide to the glass powder, the high quality and workability are improved. However, from the viewpoint of controlling the thermal softening point, the coefficient of thermal expansion, and the refractive index, the content is preferably 40% by weight or less, more preferably 25% by weight or less.

The amount of the glass powder used in the photosensitive glass paste method is 65 to 8 with respect to the sum of the glass powder and the organic component.
Preferably it is 5% by weight. If it is less than 65% by weight, the shrinkage ratio during firing becomes large, which causes disconnection and peeling of the partition walls, which is not preferable. Further, many organic components are burned off during firing, which is not preferable. Further, the pattern is likely to be thickened and a residual film is likely to occur during development.
If it is more than 85% by weight, the pattern formability deteriorates due to the small amount of the photosensitive component.

The glass generally used as an insulator is:
It has a refractive index of about 1.5 to 1.9. When the photosensitive glass paste method is used, if the average refractive index of the organic component is significantly different from the average refractive index of the glass powder, the reflection and scattering at the interface between the glass powder and the photosensitive organic component become large, and I can't get a pattern. Since the refractive index of a general organic component is 1.45 to 1.7, in order to improve the pattern formability, the refractive indices of the glass powder and the organic component are matched, and the average refractive index of the glass powder is 1. 0.5-1.
Preferably it is 65.

A total of 2 to 10% by weight of alkali metal oxides such as sodium oxide, lithium oxide and potassium oxide
By using the glass contained, not only the control of the thermal softening temperature and the coefficient of thermal expansion becomes easy, but also the average refractive index of the glass can be lowered, so that the difference in the refractive index from the organic substance can be easily reduced. become. If it is less than 2%, it becomes difficult to control the thermal softening temperature. When it is more than 10%, the brightness is reduced due to evaporation of the alkali metal oxide during discharge. Further, the addition amount of the oxide of the alkali metal is set at 10 to improve the stability of the paste.
It is preferably less than 8% by weight, more preferably less than 8% by weight.

In particular, the use of lithium oxide among the alkali metals makes it possible to relatively increase the stability of the paste.
Among the alkali metal oxides, the addition of lithium oxide and potassium oxide is effective because there is an advantage that the refractive index can be controlled by adding a relatively small amount.

As a result, it has a heat-softening temperature at which it can be printed on a glass substrate, can have an average refractive index of 1.5 to 1.65, and can easily reduce the refractive index difference from the organic component. become.

Glass containing bismuth oxide is preferred from the viewpoint of improving the heat softening temperature and water resistance.
Many glasses containing 0% by weight or more have a relative dielectric constant of 10 or more. Also, the refractive index becomes as large as 1.6 or more. Therefore, by using an oxide of an alkali metal such as sodium oxide, lithium oxide or potassium oxide and lead oxide in combination, it becomes easy to control the thermal softening temperature, thermal expansion coefficient, water resistance and refractive index.

The measurement of the refractive index of the glass material in the present invention is accurate when measuring the wavelength of light to be exposed by the photosensitive glass paste method in order to confirm the effect. In particular, 35
It is preferable to measure with light having a wavelength in the range of 0 to 650 nm. Further, i-line (365 nm) or g-line (4
(36 nm) is preferred.

The partition wall of the present invention may be colored black because it is excellent in increasing the contrast. By adding various metal oxides, the partition walls after firing can be colored. For example, by containing 1 to 10% by weight of a black metal oxide in the photosensitive paste,
A black pattern can be formed.

As the black metal oxide used at this time,
By including at least one, and preferably three or more of the oxides of Cr, Fe, Co, Mn, and Cu, blackening becomes possible. In particular, a black pattern can be formed by containing 0.5% by weight or more of each of the oxides of Fe and Mn.

Further, in addition to black, a pattern of each color can be formed by using a paste to which an inorganic pigment which develops a color such as red, blue or green is added. These coloring patterns can be suitably used for a color filter of a plasma display and the like.

The specific gravity of the partition wall of the present invention is preferably from 2 to 3.3. In order to reduce the content to 2 or less, the glass material must contain a large amount of an oxide of an alkali metal such as sodium oxide or potassium oxide, which is unfavorable because it evaporates during the discharge and lowers the discharge characteristics. . When it is 3.3 or more, the display becomes heavy when the screen is enlarged, or the substrate is distorted by its own weight, which is not preferable.

The partition wall material of the present invention has a glass softening point of 650.
A filler having a temperature of ８850 ° C. may be contained in an amount of 10５０50% by weight. Thereby, in the photosensitive glass paste method, the shrinkage ratio during firing after pattern formation is reduced, and pattern formation is facilitated. As the filler, high melting point glass or ceramics having a thermal softening temperature of 600 ° C. or higher can be used.

As the high melting point glass powder, a glass powder containing 15% by weight or more of silicon oxide and aluminum oxide is preferable, and the total content of these should be 50% by weight or more in the glass powder. It is effective to have. As an example, it is preferable to use a glass powder containing the following composition.

Silicon oxide: 15 to 50% by weight Boron oxide: 5 to 20% by weight Aluminum oxide: 15 to 50% by weight Barium oxide: 2 to 10% by weight Organic components are photosensitive monomers, photosensitive oligomers, and photosensitive polymers. And a binder, a photopolymerization initiator, an ultraviolet absorber, a sensitizer, a sensitization aid, a polymerization inhibitor, a plasticizer, and a thickener, if necessary. Agents, organic solvents, antioxidants, dispersants,
Additive components such as defoamers, organic or inorganic suspending agents are also added.

The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group in the molecule. (B) those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds. (C) So-called diazo resins such as condensates of diazo amines and formaldehyde. And others.

Examples of the photo-soluble type include (D) a complex of an inorganic salt or an organic acid of a diazo compound, and a quinone diazo compound containing the quinone diazo compound. For example, phenol, naphthoquinone-1,2-diazide-5-sulfonic acid ester of a novolak resin, and the like.

As the photosensitive component used in the present invention, all of the above can be used. As the photosensitive component which can be simply used as a photosensitive paste by being mixed with glass powder, the component (A) is preferred.

The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, sec-
Butyl acrylate, iso-butyl acrylate, te
rt-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate Heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafuro Pentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene Glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, Polypropylene Glycol diacrylate, triglycerol diacrylate,
Trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct,
Diacrylates of bisphenol A-propylene oxide adducts, acrylates such as thiophenol acrylate and benzyl mercaptan acrylate, and monomers in which 1 to 5 hydrogen atoms of these aromatic rings have been substituted with chlorine or bromine atoms, or Styrene, p-
Methylstyrene, o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α-methylstyrene, brominated α-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxymethyl Styrene, vinyl naphthalene, vinyl anthracene, vinyl carbazole, and those obtained by changing some or all of the acrylate in the molecule of the above compound to methacrylate, γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, etc. No. In the present invention, one or more of these can be used.

In addition, the developability after exposure can be improved by adding an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

The content of these monomers is preferably 5 to 30% by weight based on the sum of the glass powder and the photosensitive component.
Outside of this range, the pattern formability deteriorates and the hardness becomes insufficient after curing.

As the binder, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate-
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins.

Also, an oligomer or polymer obtained by polymerizing at least one of the compounds having a carbon-carbon double bond described above can be used. During the polymerization, the copolymer may be copolymerized with another photosensitive monomer so that the content of the photoreactive monomer is 10% by weight or more, more preferably 35% by weight or more.

As the monomer to be copolymerized, the developability after exposure can be improved by copolymerizing an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

The polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained has an acid value (AV) of preferably from 50 to 180, more preferably from 70 to 140. Further, when the acid value is less than 50, the solubility of the unexposed portion in the developing solution is reduced, so that the concentration of the developing solution is increased, and peeling occurs to the exposed portion, and a high-definition pattern is obtained. Hateful. When the acid value exceeds 180, the allowable development width becomes narrow.

By adding a photoreactive group to a side chain or a molecular terminal of the polymer or oligomer described above, it can be used as a photosensitive polymer or a photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acryl group, and a methacryl group.

A method for adding such a side chain to an oligomer or a polymer is to use an ethylenically unsaturated compound having a glycidyl group or an isocyanate group, or an acrylic acid, for a mercapto group, an amino group, a hydroxyl group or a carboxyl group in the polymer. There is a method in which chloride, methacrylic chloride or allyl chloride is added to make an addition reaction.

Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate, and glycidyl ether isocrotonic acid. .

Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate.

The ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is used in an amount of 0.05 to 0.05 to the mercapto group, amino group, hydroxyl group and carboxyl group in the polymer. It is preferable to add one molar equivalent.

The amount of the polymer component comprising the photosensitive polymer, the photosensitive oligomer and the binder in the photosensitive glass paste is excellent in terms of the pattern forming property and the shrinkage ratio after firing. It is preferably 5 to 30% by weight based on the sum of the components. Outside this range, it is not preferable because pattern formation is impossible or the pattern becomes thick.

As specific examples of the photopolymerization initiator,
Benzophenone, methyl o-benzoylbenzoate, 4,
4-bis (dimethylamine) benzophenone, 4,4-
Bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,
2-diethoxyacetophenone, 2,2-dimethoxy-
2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyl, Benzyl dimethyl ketanol, benzyl methoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone,
2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone,
4-azidobenzalacetophenone, 2,6-bis (p
-Azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2- (o
-Methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o
-Ethoxycarbonyl) oxime, 1-phenyl-3-
Ethoxy-propanetrione-2- (o-benzoyl)
Oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, naphthalenesulfonyl chloride , Quinoline sulfonyl chloride, N-
Light such as phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzthiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenyl sulfone, benzoin peroxide and eosin, and methylene blue Examples include a combination of a reducing dye and a reducing agent such as ascorbic acid and triethanolamine. In the present invention, one or more of these can be used.

The photopolymerization initiator is used in an amount of 0.
In the range of 0.5 to 30% by weight, more preferably
0.1 to 15% by weight. If the amount of the polymerization initiator is too small, the photosensitivity becomes poor, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.

It is also effective to add an ultraviolet absorber. By adding a compound having a high ultraviolet absorption effect, a high aspect ratio, high definition, and high resolution can be obtained. UV absorbers composed of organic dyes, especially 35
Organic dyes having a high UV absorption coefficient in the wavelength range of 0 to 450 nm are preferably used. Specifically, azo dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes, triazine dyes, p-aminobenzoic acid dyes and the like can be used. Even when the organic dye is added as a light absorbing agent, it is preferable because deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing. Among these, azo dyes and benzophenone dyes are preferred.

The addition amount of the organic dye is preferably 0.05 to 1 part by weight based on the glass powder. When the content is less than 0.05% by weight, the effect of adding the ultraviolet absorbent is reduced, and when it exceeds 1% by weight, the properties of the insulating film after firing are deteriorated, which is not preferable. More preferably, it is 0.1 to 0.18% by weight.

One example of the method of adding an ultraviolet light absorber composed of an organic dye is as follows. In addition to the method of preparing a solution in which an organic dye is dissolved in an organic solvent in advance and kneading the solution at the time of preparing the paste, a method of adding glass to the organic solvent is also used. After mixing the powder, a method of drying the powder is used. By this method, a so-called capsule-like powder in which the surface of each particle of the glass powder is coated with an organic film can be produced.

In the present invention, P contained in the glass powder
Metals and oxides such as b, Fe, Cd, Mn, Co, and Mg may react with the photosensitive components contained in the paste, causing the paste to gel in a short time, making application impossible. In order to prevent such a reaction, it is preferable to add a stabilizer to prevent gelation. As the stabilizer used, a triazole compound is preferably used. As the triazole compound, a benzotriazole derivative is preferably used. Among them, benzotriazole works particularly effectively. As an example of surface treatment of glass powder with benzotriazole used in the present invention, a predetermined amount of benzotriazole with respect to glass powder was dissolved in an organic solvent such as methyl acetate, ethyl acetate, ethyl alcohol, and methyl alcohol. Thereafter, the powder is immersed in the solution for 1 to 24 hours so that it can be sufficiently immersed. After immersion, preferably, the powder is naturally dried at 20 to 30 ° C., and the solvent is evaporated to prepare a powder which has been subjected to a triazole treatment. Percentage of stabilizer used (stabilizer /
Glass powder) is preferably 0.05 to 5% by weight.

The sensitizer is added to improve the sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone,
2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone,
4,4-bis (diethylamino) -benzophenone,
4,4-bis (dimethylamino) chalcone, 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene)- Isonaphthothiazole, 1,3-bis (4-
Dimethylaminobenzal) acetone, 1,3-carbonyl-bis (4-diethylaminobenzal) acetone,
3,3-carbonyl-bis (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N
-Phenylethanolamine, N-tolyldiethanolamine, N-phenylethanolamine, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazole, 1-phenyl-5-ethoxycarbonylthiotetrazole and the like. Can be In the present invention, one or more of these can be used. Some sensitizers can also be used as photopolymerization initiators. When a sensitizer is added to the photosensitive paste of the present invention, the addition amount is usually 0.05 to 30% by weight, more preferably 0.1 to 10% by weight, based on the photosensitive component. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be too small.

The polymerization inhibitor is added to improve the heat stability during storage. Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone,
N-nitrosodiphenylamine, phenothiazine, p-
t-butylcatechol, N-phenylnaphthylamine,
2,6-di-t-butyl-p-methylphenol, chloranil, pyrogallol and the like. When adding a polymerization inhibitor, the amount added, in the photosensitive paste,
Usually, it is 0.001 to 1% by weight.

Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, glycerin and the like.

The antioxidant is added to prevent oxidation of the acrylic copolymer during storage. Specific examples of antioxidants include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, and 2,6-di-t.
-4-ethylphenol, 2,2-methylene-bis-
(4-methyl-6-t-butylphenol), 2,2-
Methylene-bis- (4-ethyl-6-t-butylphenol), 4,4-bis- (3-methyl-6-t-butylphenol), 1,1,3-tris- (2-methyl-6
-T-butylphenol), 1,1,3-tris- (2
-Methyl-4-hydroxy-t-butylphenyl) butane, bis [3,3-bis- (4-hydroxy-3-t-
[Butylphenyl) butyric acid] glycol ester, dilaurylthiodipropionate, triphenylphosphite and the like.

When an antioxidant is added, the amount added is usually 0.001 to 1 in the paste.
% By weight.

When it is desired to adjust the viscosity of the solution, an organic solvent may be added to the photosensitive paste of the present invention. The organic solvent used at this time includes methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and an organic solvent mixture containing at least one of these are used.

The refractive index of the organic component means the refractive index of the organic component in the paste at the time of exposing the photosensitive component by exposure. In other words, when the paste is applied and the exposure is performed after the drying step, it refers to the refractive index of the organic component in the paste after the drying step. For example, there is a method of applying a paste on a glass substrate, drying the paste at 50 to 100 ° C. for 1 to 30 minutes, and measuring the refractive index.

The measurement of the refractive index in the present invention is preferably performed by a generally performed ellipsometry method or V-block method, and the measurement is performed at the wavelength of the light to be exposed, which is accurate for confirming the effect. In particular, it is preferable to measure with light having a wavelength in the range of 350 to 650 nm. Further, it is preferable to measure the refractive index at the i-line (365 nm) or the g-line (436 nm).

The refractive index after the organic component is polymerized by light irradiation can be measured by irradiating only the organic component with the same light as when irradiating the paste.

As the sensitizer, one having absorption at the exposure wavelength is used. In this case, the refractive index becomes extremely high near the absorption wavelength. In addition, the refractive index of the organic component can be improved. In this case, the sensitizer may be added in an amount of 3 to 10% by weight.

The photosensitive paste is usually prepared by mixing various components such as a glass powder, an ultraviolet absorber, a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator, a glass frit and a solvent so as to have a predetermined composition. The mixture is uniformly mixed and dispersed with three rollers or a kneading machine.

The viscosity of the paste is appropriately adjusted depending on the ratio of glass powder, thickener, organic solvent, plasticizer, suspending agent and the like, but the range is from 2000 to 200,000 cp.
s (centipoise). For example, when applying to a glass substrate by a spin coating method other than the screen printing method, 200 to 5000 cps is preferable. In order to obtain a film thickness of 10 to 20 μm by applying once by the screen printing method, 5
10,000 to 200,000 cps is preferable.

Next, an example of performing pattern processing using a photosensitive paste will be described, but the present invention is not limited to this.

A photosensitive paste is applied over the entire surface or a part of a glass substrate, a ceramic substrate, or a polymer film. As the application method,
Methods such as screen printing, a bar coater, a roll coater, a die coater, and a blade coater can be used. The coating thickness is determined by the number of coatings, screen mesh,
It can be adjusted by choosing the viscosity of the paste.

Here, when applying the paste on the substrate,
Surface treatment of the substrate can be performed to enhance the adhesion between the substrate and the coating film. Examples of the surface treatment liquid include silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and tris-silane.
(2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ (2-aminoethyl) aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane and the like, or organic metals such as organic titanium, organic aluminum and organic zirconium. The silane coupling agent or the organic metal is dissolved in an organic solvent, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol or the like.
Use the one diluted to a concentration of 1 to 5%. Next, after applying this surface treatment liquid uniformly on the substrate with a spinner or the like, 8
Surface treatment can be performed by drying at 0 to 140 ° C. for 10 to 60 minutes.When applied on a film, after drying on the film, performing the next exposure step,
There is a method in which an exposure step is performed after the film is pasted on a glass or ceramic substrate.

After application, exposure is performed using an exposure device. The exposure is generally performed by a mask exposure using a photomask, as is performed by ordinary photolithography. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component.

Further, a method of directly drawing with red or blue laser light without using a photomask may be used.

As an exposure apparatus, a stepper exposure machine, a proximity exposure machine, or the like can be used. In the case of performing a large-area exposure, after applying a photosensitive paste on a substrate such as a glass substrate, and performing the exposure while transporting, it is possible to expose a large area with an exposure machine having a small exposure area. it can.

The active light source used at this time is, for example,
Visible light, near-ultraviolet light, ultraviolet light, electron beam, X-ray, laser light, etc. are preferable. Among them, ultraviolet light is preferable. Etc. can be used. Among these, an ultra-high pressure mercury lamp is preferred.
Exposure conditions vary depending on the coating thickness, but 1 to 100 mW
Exposure is performed for 20 seconds to 30 minutes using an ultra-high pressure mercury lamp having an output of / cm ² .

By providing an oxygen shielding film on the surface of the applied photosensitive paste, the pattern shape can be improved. As an example of the oxygen shielding film, a film of polyvinyl alcohol (PVA) or cellulose, or a film of polyester or the like can be given.

The PVA film is formed by uniformly applying an aqueous solution having a concentration of 0.5 to 5% by weight on a substrate by a method such as a spinner and then drying at 70 to 90 ° C. for 10 to 60 minutes to evaporate water. Let me do it. In addition, it is preferable to add a small amount of alcohol to the aqueous solution because the coatability with the insulating film is improved and the evaporation is facilitated. A more preferred solution concentration of PVA is 1 to 3% by weight. Within this range, the sensitivity is further improved. The reason why the sensitivity is improved by the PVA application is presumed as follows. That is, when the photosensitive component undergoes a photoreaction, the presence of oxygen in the air is considered to hinder the photocuring sensitivity, but the presence of a PVA film is considered to improve the sensitivity during exposure because excess oxygen can be blocked. .

When a transparent film of polyester, polypropylene, polyethylene, or the like is used, there is a method in which these films are attached to the applied photosensitive paste.

After the exposure, development is performed utilizing the difference in solubility between the photosensitive portion and the non-photosensitive portion in the developing solution.
The immersion method, the shower method, the spray method, and the brush method are used.

As the developer to be used, an organic solvent in which the organic components in the photosensitive paste can be dissolved can be used. Water may be added to the organic solvent as long as the solvent does not lose its solubility. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be performed with an aqueous alkali solution. As the alkaline aqueous solution, a metallic alkaline aqueous solution such as sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution, etc. can be used, but it is preferable to use an organic alkaline aqueous solution since the alkaline component can be easily removed during firing.

As the organic alkali, an amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not preferable. The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.

Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of the paste and the substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used. When patterning is performed on a glass substrate, baking is performed at a temperature of 540 to 610 ° C. for 10 to 60 minutes.

A heating step at 50 to 300 ° C. may be introduced for the purpose of drying and preliminary reaction during each of the steps of coating, exposing, developing and baking.

[0098]

【Example】

Example 1 Hereinafter, the present invention will be specifically described using examples.
However, the present invention is not limited to this. Note that the embodiment,
The concentration (%) in the comparative examples is% by weight unless otherwise specified.

First, a photosensitive glass paste was prepared. The solvent (γ-butyrolactone) and the polymer were mixed to form a 40% solution and heated to 60 ° C. with stirring to dissolve all the polymers homogeneously.

The polymer was 40% methacrylic acid (M
AA), a weight average molecular weight obtained by subjecting a copolymer consisting of 30% methyl methacrylate (MMA) and 30% styrene (St) to an addition reaction of 0.4 equivalent of glycidyl methacrylate (GMA) to a carboxyl group. 43
000, a photosensitive polymer having an acid value of 95 was used.

Then, the solution was cooled to room temperature, and these were added so that the ratio of the photosensitive polymer was 25 parts by weight, the photosensitive monomer was 10 parts by weight, the photopolymerization initiator was 3 parts by weight, and the sensitizer was 1.8 parts by weight. To dissolve. Thereafter, the solution was
The mixture was filtered using a mesh filter to produce an organic vehicle. Here, the photosensitive monomer used in this example,
The photopolymerization initiator and the sensitizer are the following compounds.

A photosensitive monomer;

Embedded image Photopolymerization initiator; 2-benzyl-2 dimethylamino-1
-(4-morpholinophenyl) -butanone-1 Sensitizer; 2,4-diethylthioxanthone Then, it was weighed at a ratio of 0.13% with respect to sudan (azo organic dye) and glass powder. Sudan is the chemical formula C ₂₄ H
An azo organic dye having ₂₀ N ₄ O and a molecular weight of 380.45. Dissolve the sudan in acetone, add a dispersant, stir homogeneously with a homogenizer, add glass powder into this solution, uniformly disperse and mix, and then use a rotary evaporator at a temperature of 150 to 200 ° C. Dry and evaporate the acetone. In this way, a powder was obtained in which the surface of the glass powder was uniformly coated with a film of an ultraviolet absorbent composed of an organic dye (so-called capsule treatment).

The glass powder was 9% Li ₂ O, SiO ₂
22%, B ₂ O ₃ 33%, BaO 4%, Al ₂ O ₃ 23
%, ZnO 2%, and MgO 7%. The glass powder was made into a fine powder in advance using an attractor, and a non-spherical powder having an average particle size of 2.6 μm was used. The glass transition point was 476 ° C, the softening point was 519 ° C, and the refractive index at g-line was 1.59. This glass was processed into a 2 mm thick plate, and the relative dielectric constant was 8.3 when measured at 20 ° C. and 1 MHz with an impedance meter.

The organic vehicle and the glass powder to which the ultraviolet absorber had been added were added so as to be 49.8 parts by weight / 70 parts by weight, and mixed and dispersed with three rollers to prepare a photosensitive glass paste.

Next, in order to produce a plasma display panel member of an AC type as a glass substrate, a size 220 was used.
A 300 mm (A4 size) glass for a back plate and a glass substrate for a front plate were used. On the glass substrate for the back plate,
An electrode pattern having a fired thickness of 10 μm, a line width of 40 μm, and a pitch of 150 μm was formed by a photolithography method using a photosensitive silver paste as an address electrode. A transparent electrode with a bus electrode was formed on the glass substrate for the front plate. That is, the transparent electrode was formed by sputtering ITO, applying a resist, exposing, developing, and etching to form a transparent electrode having a fired thickness of 0.1 μm and a line width of 200 μm. In addition, a baked thickness of 10 μm and a line width of 50 μm were obtained by photolithography using a photosensitive silver paste using black silver powder.
m, a black bus electrode having a pitch of 150 μm was formed.

Further, a dielectric paste was applied to a thickness of 20 μm on the glass substrate for the front plate, and was baked by holding at 430 ° C. for 20 minutes. Next, using an electron beam evaporator to uniformly cover the formed transparent electrode, black electrode, and dielectric layer,
MgO was deposited. The thickness of the deposited film is 0.5 μm.

A photosensitive glass paste of bismuth-based glass was applied as a dielectric on a glass substrate for a back plate at a thickness of 15 μm. The composition of the bismuth-based glass powder used contained 26% by weight of Bi ₂ O ₃ . After drying at 80 ° C. for 30 minutes, the entire surface was exposed at an exposure amount of 10 J / cm ² .

For forming the partition walls, a photosensitive glass paste was uniformly applied on a glass substrate for a back plate by screen printing using a 325 mesh screen.
To avoid the occurrence of pinholes on the coating film,
Drying was repeated several times or more to adjust the film thickness.
Drying was performed at 80 ° C. for 10 minutes. Then 80 ° C
And dried for 1 hour.

Subsequently, using a negative type chromium mask having a pitch of 150 μm, the surface was exposed to ultraviolet light from an upper surface by an ultra-high pressure mercury lamp having an output of 50 mJ / cm ² . Exposure is 1.2 J / cm
^{Was 2} .

Next, a 0.3% by weight aqueous solution of monoethanolamine kept at 35 ° C. was developed by applying a shower for 120 seconds, followed by washing with water using a shower spray, and a space portion not cured by light. Was removed to form striped partition walls on the glass substrate for the back plate.

The glass substrate for the back plate on which the partition walls are formed as described above is baked at 580 ° C. for 30 minutes in air.
An insulating partition was produced. When the cross-sectional shape of the insulating partition wall was measured with a laser microscope, the pitch was 150 μm, the line width (half width) was 30 μm, and the height was 120 μm.

A partition was formed on a 100 mm square soda glass substrate under the same conditions as above, and the density was measured from the partition by the Archimedes method to calculate the porosity.
5%.

A phosphor layer was formed in a predetermined groove in the partition of the glass substrate for the back plate on which the insulating partition was formed by using a photosensitive paste method. That is, when forming red (R), R
Printing, photomask positioning, exposure, development, and baking (500 ° C, 30 minutes) using the photosensitive phosphor paste
Is performed to form a predetermined position. The same operation was performed for green (G) and blue (B) to form phosphors of three colors at predetermined positions.

Next, a low-melting glass paste as a sealant was provided on the front and rear glass substrates, and the glass paste was positioned so as to have a predetermined arrangement, and opposed to each other.
The glass substrate was sealed by treating for 0 minutes. Thereafter, the inside of the display area was evacuated and a mixed gas of 99% Ne and 1% Xe was sealed to complete a plasma display panel.

Next, the panel was connected to a discharge tester, and the time change of the discharge current flowing through the pixel cell was examined in order to maintain the light emitting state. As a result, the peak current was 0.7 A. Further, in order to measure the frequency of occurrence of erroneous discharge via the partition walls, the lamps were lit every other row along the partition wall forming direction, and no erroneous discharge was observed, which was favorable.

Example 2 The photosensitive monomer and glass powder were changed to the following,
These were added so that the composition of the photosensitive paste was 37.5 parts by weight of the photosensitive polymer, 15 parts by weight of the photosensitive monomer, 4.8 parts by weight of the photopolymerization initiator, and 4.8 parts by weight of the sensitizer. The procedure was the same as in Example 1, except that the glass and the organic component were mixed in a weight ratio of 70: 62.1.

Monomer: X ₂ N—CH (CH ₃ ) —CH ₂ — (OCH ₂ CH (CH ₃ )) n-NX ₂ X = —CH ₂ CH (OH) —CH ₂ O—CO—C (CH ₃ ) = CH ₂ n = 2-10 glass powder: composition Li ₂ O 7%, SiO ₂ 23%,
B ₂ O ₃ 32%, BaO 4%, Al ₂ O ₃ 22%, Z
nO 2%, MgO 6%, CaO 4%, non-spherical powder having an average particle size of 2.6 μm, glass transition point 487 ° C., softening point 528 ° C., refractive index at g line 1.59, dielectric constant 8.1 peak The current was 0.65 A, no erroneous discharge was observed, and the product was good.

Comparative Example A glass powder having a main component of PbO—B ₂ O ₃ —SiO ₂ , an average particle size of 3.5 μm, a spherical shape, and a relative dielectric constant of 11 was used, and the exposure amount was 7 J / cm ² . The study was conducted in the same manner as in Example 1 except that the development time was set to 50 seconds and the firing was performed at 580 ° C.

When the peak value of the discharge current when the light emitting state was maintained in the same manner as in Example 1, the peak value was 1.2 A, which was larger than that in Example.

[0120]

According to the present invention, the power consumption of the plasma display can be reduced and erroneous discharge can be prevented.

Claims (8)

[Claims] 1. A plasma display having a stripe-shaped partition having a line width of 15 to 50 μm, wherein the partition has a dielectric constant of 4 to 10. 2. The plasma display according to claim 1, wherein the partition walls have a pitch of 100 to 250 μm and a height of 50 to 170 μm. 3. The method according to claim 1, wherein the pitch of the partition walls is 100 to 160 μm and the height is 100 to 170 μm.
The plasma display as described. 4. The plasma display according to claim 1, wherein the porosity is 10% or less. 5. The plasma display according to claim 1, wherein the porosity is 3% or less. 6. The plasma display according to claim 1, wherein a glass material having a glass transition point of 430 to 500 ° C. and a glass softening point of 470 to 580 ° C. is used. 7. The plasma display according to claim 1, wherein the partition contains glass having the following composition. Lithium oxide: 2 to 15% by weight Silicon oxide: 15 to 50% by weight Boron oxide: 15 to 40% by weight Barium oxide: 2 to 15% by weight Aluminum oxide: 6 to 25% by weight 8. The plasma display according to claim 1, further comprising a partition having a refractive index of 1.5 to 1.65.