JPH1022624A - Soldering tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering tool which can perform favorable soldering even in the case that the soldering area is small. SOLUTION: A heat pulse system of soldering tool 30 is constituted such that the solder heating and fusion can be performed by providing a recess 36 at the tip of a metallic tool parent material 32, and setting and fixing a plate-shaped tip 34 where the abutment face to the solder heating region of the device is smaller enough than the solder heating region into the recess 36, and bringing the soldering tool 30 into precise abutment on the solder heating region of the device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a soldering tool. This soldering tool uses TCP (Tape Carrier Pa
ckage) and the printed circuit board foot pattern.
A reflow tool for a reflow bonder for joining by heating and re-melting the solder that has been attached in advance,
Particularly, it is of a pulse heating type in which the tool itself is heated by supplying a high-frequency current to the tool.

[0002]

2. Description of the Related Art FIG. 4A is a plan view of a conventional soldering tool, and FIG.

The soldering tool 1 shown in FIG. 4 is formed of a metal material such as molybdenum, inconel or the like, and has a substantially U-shape in plan view with a thickness t, and reference numerals 2, 3 at both ends. Are provided.

When heating the soldering tool 1, FIG.
As shown in (1), the electrode rods 4 and 5 are fitted into the through holes 2 and 3, and the high frequency power source 6 is connected to the electrode rods 4 and 5. Then, a high-frequency current is supplied from the high-frequency supply source 6 to the soldering tool 1.
, The tip portion indicated by reference numeral 7 is heated to the solder melting temperature. The thickness t of the soldering tool 1 is required to be at least 1 mm from the strength and yield of the tool 1 when processing a metal material.

[0005] To apply such a soldering tool 1,
FIG. 6 shows an example of an apparatus using the CP. In FIG. 6, 11
Is a glass substrate, and 13 is an LCD (Liquid Crystal Displa).
y) and 14 are printed circuit boards, and 15 is a plurality of TCPs.

[0006] Glass substrate 11 on which LCD 13 is mounted
And a printed circuit board 14 on which a wiring pattern (not shown) is formed, are disposed at a predetermined distance from each other, and a plurality of TCPs 1
5 is connected.

The description of the TCP 15 will be described with reference to FIG. 7 which is an enlarged view of a broken line frame 17 and FIG. 8 which is a sectional view taken along the line AA 'of FIG. The TCP 15 is a TAB (Tape Automated Bonded) made of a rectangular polyimide material indicated by reference numeral 19.
ng) An IC chip indicated by reference numeral 20 is mounted on the front surface of the tape, and a plurality of leads made of a copper material indicated by reference numeral 21 are fixed to the back surface, and soldering is performed by abutting a soldering tool 1 as shown in FIG. (Hereinafter referred to as a soldering area) in which the TAB tape is removed.

Each lead 21 is connected to the printed circuit board 14.
The above solder is arranged on a predetermined wiring pattern pre-coated with solder. Such TCP15
As shown in FIG. 8, the tip of the soldering tool 1 is brought into contact with the soldering area of the lead 21, and the lead 21 is heated to melt the solder on the wiring pattern and to solder the lead 21 to the wiring pattern. .

[0009]

The above-mentioned T
CP15 is a slim T that has recently come into use
The width W1 shown in FIG. 7 called CP is a size of 6 to 8 mm. In such a TCP 15, as shown in FIG. 7 and FIG.
No. 1 soldering area is located and the width W2 of the soldering area
Is about 1 mm or less, which is almost the same as or less than the limit thickness t of the soldering tool 1.

When soldering is performed in such a dimensional relationship, the soldering tool 1 rides on the coating resin portion of the IC chip 20 to damage the IC, or the TAB tape 1
9 has a problem that the soldering tool 1 cannot be mounted on the soldering tool 9 and good soldering cannot be performed.

The present invention has been made in view of the above points, and has as its object to provide a soldering tool that can perform good soldering even when the soldering area is small.

[0012]

FIG. 1 shows the principle of a soldering tool according to the present invention. The soldering tool shown in FIG. 1 has a metal tool base material 32 having a concave portion 36 at the tip.
And a pressing tip 34 whose contact surface with the solder heating area of the apparatus is smaller than the solder heating area is fixed to the recess 36.

According to the soldering tool having such a configuration, the contact surface of the chip 34 that contacts the solder heating area of the device is smaller than the soldering area, so that the soldering tool can accurately contact the solder heating area. The solder melting and heating can be performed in contact with each other.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view of a soldering tool according to an embodiment of the present invention, and FIG. 1B is a side view. In the embodiment shown in FIG. 1, portions corresponding to the respective portions of the conventional example shown in FIG. 4 are denoted by the same reference numerals, and description thereof will be omitted.

A soldering tool 3 according to one embodiment shown in FIG.
Reference numeral 0 denotes a combination of a tool base material indicated by reference numeral 32 and a pressure tip indicated by reference numeral. The tool base material 32 is formed of a metal material such as molybdenum or inconel, has a thickness t1, has a substantially U-shaped planar shape, and has through holes indicated by reference numerals 2 and 3 at both ends. Further, a concave portion indicated by reference numeral 36 is formed at the distal end portion.

The pressing tip 34 is made of the same material as that of the tool base material 32, and is formed in an elongated plate shape which just fits into the concave portion 36. The thickness t2 of the pressing tip 34 is the same as that of the conventional example with reference to FIG. It is processed to half the width W2 of the soldering area of the TCP 15 described. In other words, it is processed to half the width W2 of the opening of the TAB tape 19. Here, it is assumed that the width W2 is 1.2 mm and the thickness t2 is 0.6 mm.

That is, the soldering tool 30 is formed by fitting and fixing the pressing tip 34 in the concave portion 36 of the tool base material 32. When the soldering tool 30 is heated, similarly to the conventional example, As shown in FIG. 5, the electrode rods 4 and 5 are fitted into the through holes 2 and 3, and the high frequency
Are connected to each other, and a high-frequency current is supplied from the high-frequency supply source 6 to the soldering tool 1 to heat the pressing tip 34 to a solder melting temperature.

When the soldering tool 30 having such a configuration is used for solder melting, as shown in FIG. 2, the thickness t2 of the pressing tip 34 to be brought into contact with the soldering area of the lead 21 of the TCP 15 is reduced. Since the width is much smaller than the width W2 of the region, the soldering tool 30 can be brought into contact with the soldering region accurately to perform solder melting and heating.

Therefore, as in the prior art, the soldering tool 3
0 does not get on the coat resin portion of the IC chip 20 to damage the IC, and the soldering tool 1 does not get on the TAB tape 19 to perform good soldering.

Further, since it is not necessary to make the thickness t1 of the tool base material 32 smaller than the width W2 of the soldering region, the metal base material is processed so as to improve the strength and the yield, thereby forming the tool base material 32. It is possible to do.

Also, as shown by reference numeral 38 in FIG. 3, by forming the tip of the pressing tip 34 into a curved shape, when the pressing tip 34 is brought into contact with the lead 21 and heated during solder heating, The lead 21 can be prevented from being damaged or cut at the corner of the pressure tip 34.

[0022]

As described above, according to the soldering tool of the present invention, there is an effect that good soldering can be performed even when the soldering area of the device is small. Therefore, there is an effect that the quality of a product to be soldered can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a soldering tool according to an embodiment of the present invention.

FIG. 2 is a view showing a state in which a soldering tool according to the embodiment shown in FIG. 1 is brought into contact with a TCP lead;

FIG. 3 is a view showing a structure of the soldering tool according to the embodiment shown in FIG. 1 in which a tip end of a pressure tip is curved.

FIG. 4 is a diagram showing a configuration of a conventional soldering tool.

FIG. 5 is a diagram showing a heating circuit of the soldering tool.

FIG. 6 is a diagram illustrating an example of an apparatus using TCP to which a soldering tool is applied.

FIG. 7 is an enlarged view of a broken-line frame shown in FIG. 6;

FIG. 8 is a sectional view taken along line AA ′ of FIG. 7;

[Explanation of symbols]

 2, 3 through-hole 30 soldering tool 32 tool base material 34 pressure tip 36 recess t1 thickness of tool base material t2 thickness of pressure tip

Claims (3)

[Claims] 1. A metal tool base material having a concave portion at a tip end thereof, and a pressure chip having a contact surface with a solder heating region of an apparatus smaller than the solder heating region. Soldering tool characterized by being fixed. 2. The soldering tool according to claim 1, wherein the tool base material and the chip are made of the same material. 3. The soldering tool according to claim 1, wherein a corner of the solder heating area contact surface of the chip is curved.