JPH1022590A - Printed wiring board to take many faces - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the peeling-off trouble of a pattern or a foot print by providing cut-off parts, which are made around individual boards by the base material not containing glass cloth, with cut-off means, and bending the cut-off parts and taking out the individual boards. SOLUTION: For example, a plurality of individual boards 22 and a margin 24 contains glass cloth. A cut-off part 25 surrounding each individual board 22 does not contain glass cloth, and it is provided with many perforations 23 as cut-off means. In the case of dividing this printed board 21 to take many faces into each individual board 22, the cut-off part 25 along the perforations is bent, and the margin 24 is taken out. As a result, each individual board 22 can be made. This way, since the cut-off part 25 does not contain glass cloth as compared with the individual boards 22 and the margin 24 reinforced with glass cloths, it is low in strength, and it is easy to break in this region. As a result, the peeling-off trouble of a pattern 22a or a foot print 22b can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a multiple printed wiring board, and more particularly to a divided structure in an organic substrate.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to the drawings. FIG. 3 is a plan view showing a conventional multiple printed wiring board.

[0003] Reference numeral 1 denotes a one-layer or two-layer multi-layer printed wiring board, 2 denotes an individual substrate, 2a denotes a pattern, 2b denotes a through hole, 2c denotes a footprint, 3 denotes a margin, and 4 denotes a sewing hole. The multiple printed wiring board 1 is provided with a plurality of individual boards 2, and between the individual boards 2 and the margin 3, a large number of sewing holes 4 penetrating the front and back are provided. Each individual board 2
Are provided with a pattern 2a, a through hole 2b for mounting components, and a footprint 2c for mounting surface mount components.

Next, the operation will be described with reference to FIG. In order to create each individual board 2, a cutout along the perforated hole 4 of the multiple printed wiring board 1 is bent,
This is done by removing the margin 3. After separating the individual substrates 2, components are mounted on the through holes 2b and the footprints 2c. As a cutting means other than the sewing machine hole 4, there is a slit structure in which a V-shaped V-groove structure is provided in a cut portion of a substrate.

[0005] The V-groove structure is described in detail in Utility Model Application Publication No. 1-97574.

[0006]

However, the above-mentioned conventional multi-panel printed wiring board 1 has the following problems.

First, in the multi-cavity printed wiring board 1 shown in FIG. 3, there is a problem that, after the division, the stripped portion 5 of the pattern 2a or the footprint 2c is formed around the individual substrate 2 as shown in FIG. In particular, the narrow pattern 2a provided on the peripheral portion of the individual substrate 2 sometimes completely disappears.

FIG. 5 is a cross-sectional view when dividing into individual substrates 2. FIG. 5A is a cross-sectional view at the time of division, and FIG. 5B is a cross-sectional view showing separation at the time of division.

An organic multiple printed wiring board 1 has a substrate 2d such as glass cloth or paper and an adhesive resin 2e which is an adhesive such as epoxy or phenol, which are heated and pressurized mutually and stacked. When the printed circuit board 1 is a two-layer board, a pattern 2a and a footprint 2c are provided on both sides. In the case where the multiple printed wiring board 1 is to be divided into the individual substrates 2, it is divided by a dividing line 6 along a sewing hole (not shown). In these divisions, the force required for division increases as the plate thickness increases and the distance between the sewing holes increases and the number of holes decreases.

[0010] Adhesive resin 2e such as epoxy or phenol
As compared with the above, the substrate 2d, which is the core of the substrate, especially the glass cloth generally used has elasticity and is hard to be divided.

In the vicinity of the substrate 2d and the adhesive resin 2e where the division is completed, the strength at which the pattern 2a and the footprint 2c do not peel is smaller than the force required to bend the multi-cavity printed wiring board 1, and peeling occurs. It was that.

FIG. 6 is a sectional view of the individual substrate 2 before and after division. FIG. 6A is a cross-sectional view of the individual substrate 2 before being divided, and FIG. 6B is a cross-sectional view of the separated individual substrate 2 after separation. After the pattern 2a formed before the division is separated, a peeling portion 5 is formed, and the pattern 2a is lost.

[0013]

A multi-cavity printed wiring board is provided with a plurality of individual substrates containing a base material, and a perforated hole in a cutout provided around each individual substrate without containing the base material, The individual substrate is taken out by bending the cutout portion by the sewing hole.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a plan view showing a first embodiment of the present invention. Reference numeral 21 denotes a multi-layer printed wiring board of one or two layers, 22 denotes an individual substrate, 22a denotes a pattern, 22b denotes a footprint, 22c denotes a through hole, and 23 denotes a sewing hole.
4 is a blank space, and 25 is a cutout portion.

The plurality of individual substrates 22 and the margin 24 include glass cloth. Cutout 2 surrounding each individual substrate 22
Reference numeral 5 does not contain glass cloth, and a large number of sewing holes 23 are provided as cutting means.

Next, the operation will be described with reference to FIG. The cutout portion 25 is a film-like adhesive resin such as epoxy or phenol, and the individual substrate 22 and the margin 24 other than the cutout portion 25 mutually heat and press a plurality of glass cloths serving as the core of the substrate as the adhesive resin and the base material. By heating and pressurizing, the multiple printed wiring boards 21 are manufactured in a stacked state.

When the printed circuit board 21 is divided into individual substrates 22, the cutouts 25 along the sewing holes 23 are bent and the margins 24 are removed. As a result, each individual substrate 22 can be created.

As described above, since the cutout portion 25 does not contain glass cloth as compared with the individual substrate 22 and the margin 24 reinforced with glass cloth, the cutout portion 25 has low strength and is easily divided in this region. As a result, the conventional pattern 22a
And the peeling failure of the footprint 22b can be prevented.

FIG. 2 is a plan view showing a second embodiment of the present invention. Reference numeral 31 denotes a one-layer or two-layer multi-layer printed wiring board, 32 an individual substrate, 33 a sewing hole, 34 a blank space, and 35 a cutout portion. In the second embodiment,
The glass cloth is contained only in the plurality of individual substrates 32, and the margin 34 is made not containing the glass cloth. Also,
The cutout portion 35 does not contain glass cloth, and a number of sewing holes 33 are provided as cutout means.

Next, the operation will be described with reference to FIG. The blank 34 and the cut-out portion 35 do not contain glass cloth, and the individual substrates 32 contain glass cloth, so that the multiple printed wiring board 31 is manufactured.

When the multiple printed wiring board 31 is divided into individual boards 32, the printed circuit board 31 is bent at a cutout 35 along the machine hole 33. Since the margin 34 and the cutout 35 do not contain glass cloth, their strength is low, and as a result,
When the cut-out portion 35 of the multiple printed wiring board 31 is bent and the margin 34 is removed, the phenomenon of peeling does not appear, and a normal individual substrate 32 can be produced.

As described above, it is possible to easily divide the multiple printed wiring board 31 into the individual boards 32, and to prevent the separation from occurring. Further, there is no need to manage such that only the cutout portion 25 does not contain glass as in the first embodiment. Also, a margin 34, a cutout portion 35
Since the glass cloth is not contained, the amount of the glass cloth used is reduced, so that the cost of the multiple printed wiring board 31 can be reduced.

The multiple printed wiring boards 21 and 31 are
Although the description has been given of the case where one or two layers are applied, in the case of three or more layers, a part of the plurality of insulating layers is made of a glass cloth and an adhesive resin, and a multi-surface printed wiring board is formed. May be maintained. The other insulating layers may make it easier to take out a plurality of individual substrates, as in the first and second embodiments. That is, in the other insulating layer, the portion of each individual substrate may contain a glass cloth, and the portion of the cutout portion may be an insulating layer containing no glass cloth. In this case, the margin may or may not contain glass cloth.

The sewing holes, which are cutting means provided in the cutting section, are provided after heating and pressurizing and stacking the respective insulating layers. By including glass cloth in some of the insulating layers, the strength of the entire substrate can be secured, and separation or warping can be prevented during handling. Although glass cloth has been described as a general substrate, the present invention can also be applied to a case where paper or the like is used as the substrate.

In the first and second embodiments, the cutout 2
Although the cutout means provided on 5, 5 has been described using the sewing machine holes 23, 33, it may have a V-groove structure. Even in the case of a multilayer structure, the cutting means may have a V-groove structure. In the first and second embodiments, the margin 2
4 and 34, the individual substrates 22 and 32 and the cutout 2
Multiple printed circuit boards 21 and 3 with only 5 and 35
It may be 1. In the case of a multilayer, the margin may be eliminated.

[0026]

As described above, since the cutout surrounding the individual substrate is made of glass cloth-free material, the strength is low, and it is easy to separate in this area. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a plan view showing a second embodiment of the present invention.

FIG. 3 is a plan view showing a conventional multi-cavity printed wiring board.

FIG. 4 is a plan view showing a conventional separation of an individual substrate.

FIG. 5 is a cross-sectional view showing a conventional separation into individual substrates and separation during the division.

FIG. 6 is a cross-sectional view showing a conventional individual substrate before and after division.

[Explanation of symbols]

 Reference Signs List 21: multiple printed wiring board 22: individual board 22a: pattern 22b: footprint 22c: through hole 23: sewing hole 24: blank space 25: cut-out part

Claims (2)

[Claims] 1. A one-layer or two-layer multi-layer printed wiring board which divides a substrate and an adhesive resin into a plurality of individual substrates from an organic substrate stacked by heating and pressing, wherein the plurality of individual substrates containing a substrate are A cutting means provided at a cutting portion provided around the plurality of individual substrates without containing a base material, and the individual substrate is taken out by bending the cutting portion by the cutting means. Chamfered printed wiring board. 2. A multi-layer printed circuit board having three or more layers, in which a substrate and an adhesive resin are heated and pressed to divide an organic substrate having an insulating layer stacked into a plurality of individual substrates into a plurality of individual substrates. An insulating layer having at least one insulating layer containing therein, a place where the plurality of individual substrates containing a base material are provided, and a place where a cutout portion containing no base material is provided around the plurality of individual substrates. And heating and pressurizing, and the cutout portion is provided with a cutout means, and the cutout portion is bent by the cutout means to take out the individual substrate.