JPH10223736A - Table device and plasma processor using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a table device and plasma processor using the same capable of controlling temperature excellently without destructing a processed body even under low pressure. SOLUTION: A table device 17 for temperature-controlling a processed body to be processed inside a chamber 11 is to be equipped with a table main body 19 wherein the shape of a mounting surface 20 is formed in a recessed and curved shape, a temperature control means 21 provided inside the table main body 19 for controlling the temperature of the mounting surface 20, as well as a clamping means 26 provided on the mounting surface 20 side of the table main body 19 tightly pressing the processed body 18 against the mounting surface 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a table apparatus having a function of controlling the temperature of a processing object such as a liquid crystal substrate or a semiconductor wafer, and a plasma processing apparatus using the table apparatus.

[0002]

2. Description of the Related Art A plasma processing apparatus has been used to process an object to be processed such as a liquid crystal substrate or a semiconductor wafer. This plasma processing apparatus supplies a medium gas inside,
The medium gas is excited and turned into plasma, and a process such as ashing and etching is performed on the object to be processed using radicals and ions generated by the plasma.

That is, in the plasma processing apparatus, the medium gas is introduced into the chamber so as to be in a low pressure state of several Pa to several tens Pa, and the medium gas in the chamber is excited by microwaves. As a result, the medium gas is turned into plasma to generate active species. This microwave is transmitted by a waveguide from a microwave source,
The microwave transmitted to the other end side is transmitted through an introduction window formed of quartz glass or the like and enters the chamber,
The medium gas in this chamber is excited.

A table apparatus 1 shown in FIG. 12 is provided inside the chamber. The table apparatus 1 has a table main body 3 on which a workpiece 2 such as a semiconductor wafer or a liquid crystal substrate is mounted. The temperature of the processing target 2 is controlled by a temperature control device 4 such as a heater provided inside the table main body 3. Then, the temperature of the object 2 to be processed is controlled.
The active species such as the above radicals and ions perform processes such as etching and ashing.

[0005]

Recently, the diameter of a semiconductor wafer and the area of a liquid crystal substrate have been remarkably increased. As the size of the object to be processed increases, the size of the table device also increases. However, since the inside of the chamber is in a low pressure state close to vacuum, it is difficult to conduct heat. For this reason, the object to be processed is brought into direct contact with the surface of the table body to adjust the temperature of the object to be processed.

However, it is difficult to make the entire back surface of the large-sized object as described above tightly adhere to the surface of the table body. For this reason, when the object is simply placed on the table main body, a temperature difference occurs between the contact part and the non-contact part, and thus, when the object is treated, The reaction speed becomes uneven.

Further, when the temperature of the object is adjusted simply by placing the object on the table body, the object may be warped. When the object to be processed is warped, the contact area with the surface of the table main body is further reduced, and in that portion, the temperature difference due to a decrease in heat conduction efficiency becomes more remarkable.

The present invention has been made based on the above circumstances, and an object of the present invention is to provide a table apparatus capable of controlling the temperature without destruction of a processing object and a plasma processing apparatus using the table apparatus. Is to do.

[0009]

According to a first aspect of the present invention, there is provided a table apparatus for mounting an object to be processed in a processing chamber and controlling the temperature of the table, wherein the surface on which the object is mounted has a concave shape. A table body formed into a curved surface, temperature adjusting means provided inside the table body to adjust the temperature of the mounting surface, and clamp means for holding the processing object on the mounting surface so as to be in close contact with the processing object And characterized in that:

According to a second aspect of the present invention, the table main body is provided with a gas supply passage for supplying a heat conducting gas between the mounting surface and the object to be processed.
It is a table device of description.

According to a third aspect of the present invention, the table main body is provided with a sealing member for preventing the heat conduction gas supplied between the mounting surface and the object to be processed from leaking. The table device according to claim 2, wherein

According to a fourth aspect of the present invention, the introduction surface is provided with an introduction groove for introducing and dispersing the heat conducting gas supplied from the gas supply passage between the installation surface and the object. The table device according to claim 2 or 3, wherein

According to a fifth aspect of the present invention, there is provided the table apparatus according to the first aspect, wherein an elastic member is provided on the mounting surface. According to a sixth aspect of the present invention, the clamp means includes a clamp pair abutting on opposite ends of the object to be processed, and a clamp driving mechanism for bringing the pair of clamps close to each other and bringing the object into close contact with the mounting surface. 2. The table device according to claim 1, comprising:

According to a seventh aspect of the present invention, the clamping means is
2. The table device according to claim 1, wherein the table device is a clamp unit that presses the vicinity of the edge of the object placed on the mounting surface from above to bring the object into close contact with the mounting surface.

The invention according to an eighth aspect of the present invention is characterized in that there is provided a supporting means which is provided in the table main body so as to be able to protrude and retract, and supports near the edge of the object to be processed from the table main body side. Table device.

According to a ninth aspect of the present invention, there is provided a plasma processing apparatus using the table apparatus according to any one of the first to eighth aspects. According to the first, fifth to seventh aspects of the present invention, the object to be processed can be held in close contact with the mounting surface of the table body, so that a temperature difference generated in the object during temperature adjustment can be suppressed. .

According to the second to fourth aspects of the present invention, by interposing a gas for heat conduction between the object to be processed and the one surface,
It is possible to increase the thermal conductivity for the object to be processed,
The temperature difference of the object can be further suppressed.

According to the eighth aspect of the present invention, since the object to be processed can be curved before the object to be mounted on the mounting surface, the friction between the object to be processed and the mounting surface can be minimized. Can be suppressed. According to the ninth aspect of the present invention, the temperature unevenness of the object can be suppressed as much as possible, so that the surface treatment of the object can be performed uniformly.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG.
FIG. 2 is a cross-sectional view illustrating a configuration of a table apparatus, FIG. 2 is a cross-sectional view illustrating a configuration of a plasma processing apparatus, and FIG. 3 is a perspective view illustrating a shape of a surface of the table apparatus on which an object to be processed is placed.

In FIG. 2, the plasma processing apparatus 10 has a chamber 11, and a gas supply pipe 12 is connected to the chamber 11 so that a medium gas can be supplied into the chamber 11. . The other end of the gas supply pipe 12 is connected to a supply source of a medium gas (not shown) so as to supply a medium gas for etching, CVD or ashing via the gas supply pipe 12. .

One end of a gas suction pipe 13 is connected to the bottom of the chamber 11. This gas suction pipe 1
The other end of 3 is connected to a suction pump (not shown) to reduce the pressure inside the chamber 11.

A microwave is introduced into the chamber 11. The microwave is generated by the microwave source 14 and transmitted from the microwave source 14 to the waveguide 15. One end 15a of the waveguide 15 is connected to the microwave source 14 and the other end 15b
Is provided so as to face an introduction window 16 made of a dielectric material such as quartz which makes the chamber 11 airtight. The microwave generated by the microwave generation source 14 is applied to a waveguide 15
The light is transmitted to the introduction window 16 through the transmission window 16, and transmitted through the introduction window 16 to the inside of the chamber 11.

A table device 17 is provided inside the chamber 11 below the introduction window 16. FIG.
FIG. The table device 17 has a table main body 19 on which an object 18 such as a liquid crystal substrate or a semiconductor wafer is placed. The upper surface of the table main body 19 facing the introduction window 16 is, as shown in FIG. The center portion is the lowest mounting surface 20 of the concavely curved (cylindrical) workpiece to be processed.

The mounting surface 20 is so loose that when the object 18 is brought into close contact with the mounting surface 20, the object 18 is not broken or adversely affected in the next process. The object 18 has a large curvature and can be bent in close contact with the mounting surface 20. For example, in the case of a liquid crystal glass substrate having a side of 500 mm and a thickness of 1 mm, the height difference between the peripheral portion and the central portion needs to be 100 mm or less, and is preferably formed into a curved surface of about 5 to 30 mm.

Further, inside the table body 19,
A heating wire 21 is provided as a temperature adjusting means, and the table body 19 is heated by the heating wire 21 so that the mounting surface 20 of the table body 19 has a uniform temperature.

At the center of the table body 19, a through hole 22 is formed, one end of which is opened on the mounting surface 20 and the other end is opened on the lower surface of the table body 19. A gas introduction pipe 23 is connected to the other end of the through hole 22.
The other end of the gas introduction pipe 23 is connected to a medium gas supply source (not shown). Therefore, the gas introduction pipe 2
By means of 3, a heat conducting gas can be supplied to the surface of the table body 19 from outside the chamber 11. Further, as shown in FIG.
A plurality of introduction grooves 24 for introducing and dispersing the heat transfer gas along the mounting surface 20 are formed radially with one end communicating with one end of the through hole 22.

Further, in the peripheral portion of the mounting surface 20, the mounting surface 20 includes an object 18 to be processed such as a liquid crystal substrate or a semiconductor wafer.
Is mounted, an O-ring 25 is provided in close contact with the periphery of the back surface of the processing object 18 along the peripheral portion of the back surface of the processing object 18. A space between the mounting surface 20 is hermetically sealed.

The mounting surface 20 of such a table body 19
The substrate holding mechanisms 26 are provided as clamping means on both ends in the bending direction. This substrate holding mechanism 2
The table body 1 is engaged with the end of the object 18 to be processed.
The object 18 is pressed so as to be in close contact with the mounting surface 20 of the substrate 9. In the present embodiment, the substrate holding mechanism 26 has a base 27 attached to the chamber 11. One end of a first arm 28 is pivotally connected to the base 27, and the other end of the first arm 28 is connected to the second arm 2.
One end of 9 is pivoted. A rod 30a of a cylinder 30 having one end pivotally attached to the base 27 is pivotally attached to a middle part of the second arm 29. When the cylinder 30 is operated, the arms 28 and 29 can be bent and extended. ing.

At the other end of the second arm 29, a clamp 31 is provided rotatably.
An engagement portion 31a that engages above and to the side of the object to be processed 18 is formed at the end of. When the hydraulic cylinder 30 is operated to extend the pair of arms 28 and 29, the clamp 31 slides along the curved end of the mounting surface 20, and the engaging portion 31 a is moved to the end of the workpiece 18. Press the top and end faces. When both ends of the object 18 are pressed by the pair of clamps 31, the object 18 bends and deforms along the mounting surface 20. As a result, the object 18 is brought into close contact with the mounting surface 20 of the table body 19.

In the present embodiment, the substrate holding mechanism 26 is attached to the chamber 11, but the substrate holding mechanism 26 may be attached to another part such as the table device 17 or the like.

The table device 1 having the above configuration
The operation of No. 7 will be described below. First, the target object 18
Is mounted on the mounting surface 20 of the table body 19, and thereafter, the substrate holding mechanism 26 is operated to bring the engaging portion 31a of the clamp 31 into contact with the side and the upper side of the object 18 to be processed. When the hydraulic cylinder 30 is extended, the clamp 31 rotates downward around the portion to be attached to the second arm 29 while the clamp 31 rotates.
Apply compressive force to

As a result, the object 18 is curved and deformed along the mounting surface 20 and comes into close contact with the mounting surface 20. Since the back surface of the processing object 18 is press-bonded to the O-ring 25 provided on the mounting surface 20 by the bending deformation of the processing object 18, the processing surface of the processing object 18 and the mounting surface 20 of the table main body 19 are pressed. The space is a state of being hermetically sealed.

After the object 18 is brought into close contact with the mounting surface 20 of the table body 19 in this manner, the mounting surface 20 and the object 18 are connected to each other through the gas introduction pipe 23 through the through hole 22. During this time, a gas for heat conduction is supplied. The heat-conducting gas supplied from the through hole 22 to the mounting surface 20
Radiation is introduced and dispersed radially along the mounting surface 20 along the introduction groove 24 formed on the top surface 0. In this case, the pressure for heat conduction is adjusted to an appropriate pressure so that the processing object 18 is deformed upward so that the close contact with the mounting surface 20 is not impaired. Table main body 1 whose temperature is controlled by heating wire 21
By 9, the temperature adjustment of the object 18 is started.

In such a table device 17,
The surface of the table body 19 is formed on the mounting surface 20, and a substrate holding mechanism 26 is provided on the surface of the table body 19. For this reason, the substrate holding mechanism 26
The processing target 18 can be deformed into a curved plate shape and brought into close contact with the mounting surface 20.

Pressing the workpiece 18 with the clamp 31 in this manner is not effective when the temperature is adjusted.
Can be prevented from warping, so that the adhesion of the object 18 is enhanced, the efficiency of temperature control is improved, and the temperature distribution of the object 18 is less likely to be uneven. Therefore, the treatment of the surface of the object 18 is also good.

In this embodiment, the table body 1
A gas introduction pipe 23 is connected to the lower end of the through hole 22 provided in the nozzle 9, so that a gas for heat conduction can be supplied to the mounting surface 20. For this reason, since the heat conduction gas can be interposed between the back surface of the processing target 18 and the mounting surface 20, the efficiency of heat conduction to the processing target 18 is further improved.

Further, when the object 18 is mounted on the mounting surface 20, an O-ring 25 is provided so as to be in close contact with the periphery of the back surface of the object 18, so that the heat conductive gas can pass through the through holes. Even when supplied from 22, the leakage from the portion surrounded by the O-ring 25 into the chamber 11 is reduced.

Further, on the mounting surface 20 surrounded by the O-ring 25, an introduction groove 24 is formed radially from the discharge port of the through hole 22 to the vicinity where the O-ring 25 is formed. . For this reason, it is possible to supply the heat conducting gas without bias along the mounting surface 20.

With the configuration in which the heat conductive gas is interposed between the mounting surface 20 and the back surface of the processing object 18, unevenness in the temperature distribution of the processing object 18 is further reduced, and thus the processing object 18 It is also possible to keep the surface temperature of 18 even more uniform. Therefore, the processing of the processing object 18 is further improved.

Next, according to a second embodiment of the present invention,
This will be described with reference to FIGS. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 4 is an enlarged perspective view of the table device.
On the mounting surface 20 of the table body 19, an elastic member 42 having good heat conductivity, for example, silicone rubber or Teflon rubber,
Viton or the like is provided by bonding or the like. When such an elastic member is provided, the object 18 and the mounting surface 20 can be brought into close contact with each other, and temperature unevenness of the object 18 can be suppressed as much as possible.

In the drawing, reference numeral 43a denotes a clamp mechanism, the lower portion of which is formed to have a curved surface substantially the same as the concave curved surface of the mounting surface 20. Then, the ends of the two bent sides of the object 18 placed on the table body 19 are connected to the mounting surface 2 from above.
It is configured to be pressed against and brought into close contact with zero. By providing such a clamp mechanism 43a, it is possible to prevent the object to be processed 18 from warping and to make the object to be processed 18 more closely adhere to the mounting surface 20.

FIG. 5 shows a modification of the clamp mechanism. The difference from the clamp mechanism 43a is that the clamp mechanism 43a presses two sides of the workpiece 18 while the clamp mechanism 43b does not. It is configured so that four sides of the body 18 can be pressed.

FIG. 6 shows a modification of the clamp mechanism. The clamp mechanism 43c is composed of a plurality of pins, and presses at least two bent sides of the object 18 to the mounting surface 20 from above. Make up.

As described above, in the second embodiment, the clamp mechanism is clamped from above so as to be in close contact with the mounting surface 20, so that the workpiece 18 may be warped or the heat transfer gas may be used. Can be prevented from floating.

Next, a third embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIGS. In this embodiment,
Before placing the workpiece 18 on the placing surface 20, the placing surface 2
It is intended to match the concave surface of 0. FIG. 7 (a)
The case shown in (1) is a case where the object to be processed 18 is bent by its own weight and the bending is almost equal to the concave curved surface of the mounting surface 20. 44 in the figure
Is a table body, and the table body 44 has
As shown in (b), four support pins 45 are attached to the object 18 to be processed.
7 (c), or two plate-like supports 45a are provided corresponding to the two sides of the object 18 to be bent, as shown in FIG.
4 and is configured to be able to protrude and retract from the mounting surface 20. When the object 18 is projected and supported when being placed, the object 18 is bent by its own weight, and the support pin 45 or the plate-like support 45a is processed so that the object 18 is placed on the mounting surface. 20.

FIGS. 8 and 9 show the object 1 to be processed.
Reference numeral 8 denotes a supporting body in a case where it bends from the concave curved surface of the mounting surface 20 when it is bent by its own weight. In FIG. 8A, a plurality of support pins 47 are provided on the table body 46 so as to support two bending sides of the object 18 as shown in FIG. 20 can be protruded and retracted. Then, when placing the workpiece 18,
The support pins 47 are protruded along the concave curved surface of the mounting surface 20 to support the object 18 to be processed, and are lowered to be mounted on the mounting surface 20.

In FIG. 9A, a plate-like support 49 is provided on the table body 48 at a position supporting the two bent sides of the object 18 as shown in FIG.
The object to be processed 18 is supported in such a manner as to be able to protrude and retract with respect to the support pin 47 and is protruded in the same manner as the support pin 47, and is lowered and mounted on the mounting surface 20.

FIG. 10 shows a case in which the object 18 does not bend very much under its own weight and needs to be pressed from above. The above-mentioned state is shown in the state where the object 18 is supported by the supports 45, 45a, 47 and 49. Clamps 43a, 43b, 4
It is pressed from above by 3c. When held in this manner, it is possible to prevent the mounting surface 20 and the back surface of the processing object 18 from rubbing.

The above-mentioned clamps 43a, 43b, 43c
Further, it is more effective to provide a wheel or a ball as shown in FIG. 11 at a contact portion of the supports 45, 45a, 47, and 49 with the object to be processed 18 so as to minimize the friction with the object to be processed 18. is there.

Although the present invention has been described with reference to an embodiment, the present invention can be modified in various ways.
This will be described below. In the above embodiment, the table body 1
Although the surface of 9 has a cylindrical surface, it can be formed in various shapes other than this, such as an elliptical surface and a spherical surface.

The table body 19 is used for temperature control.
Is a configuration using a heating wire 21 inside, but a configuration using another heater for heating or a chiller for cooling may be used instead of the heating wire 21.

The gas introduction pipe 23 does not necessarily need to be formed from below the table body 19 toward this surface. For example, the gas introduction pipe 23 may be formed from the side of the table body 19 toward this surface. A configuration may be provided.

Further, the introduction groove 24 may not be formed radially from the discharge port of the through hole 22, but may be a mesh-like one as long as it supplies the heat conductive gas without unevenness along the mounting surface 20. However, it may be formed in any manner.

In this embodiment, O is used as the sealing member.
This is a configuration using the ring 25.
Any material other than the ring 25 may be used. The mounting surface 20 of the table body 19 and the object 18
A gas vent pipe may be formed in the table main body 19 in order to prevent the object to be processed 18 from being lifted up by the pressure of the heat conducting gas supplied to the back surface of the table. In this case, it is possible to form a valve or the like in the gas vent pipe and maintain the pressure of the heat transfer gas supplied to the gap appropriately. In this way, it is possible to further prevent the heat conduction gas supplied to the gap from being lifted up, and to adjust the pressure to an appropriate value to minimize the leakage of the heat conduction gas from the gap to the chamber 11. It can be suppressed. In this case, a pressure valve may be formed in the gas vent pipe as needed. Further, the present invention can be applied to CVD.

[0056]

As described above, according to the first, fifth to seventh aspects of the present invention, the object to be processed can be held in close contact with the mounting surface of the table main body. A temperature difference generated in the object can be suppressed.

According to the second to fourth aspects of the present invention, by interposing a gas for heat conduction between the object to be processed and the one surface,
It is possible to increase the thermal conductivity for the object to be processed,
The temperature difference of the object can be further suppressed.

According to the eighth aspect of the present invention, the object to be processed can be curved before the object to be mounted on the mounting surface, so that the object to be processed and the mounting surface can be rubbed. It can be suppressed as much as possible. According to the ninth aspect of the invention, it is possible to minimize the temperature unevenness of the object to be processed, so that the surface treatment of the object to be processed can be performed uniformly.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a table device according to a first embodiment of the present invention.

FIG. 2 is a side view showing the configuration of the plasma processing apparatus according to the embodiment.

FIG. 3 is a perspective view showing a surface of a table body of the table device according to the embodiment;

FIG. 4 is a perspective view of a table device according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a configuration of a clamp mechanism according to the embodiment.

FIG. 6 is a perspective view showing a configuration of a clamp mechanism according to the embodiment.

FIG. 7A is a cross-sectional view of a table device according to a third embodiment of the present invention, FIG. 7B is a plan view showing a relationship between an object to be processed and a support, and FIG. FIG.

FIG. 8A is a cross-sectional view of a modification of the table device according to the embodiment, and FIG. 8B is a plan view showing a relationship between a processing target and a support.

FIG. 9A is a cross-sectional view of a modification of the table device according to the embodiment, and FIG. 9B is a plan view showing a relationship between a processing target and a support.

FIG. 10 is a sectional view of a modification of the table device according to the embodiment;

FIG. 11 is an enlarged view of a contact portion of a clamp mechanism or a support with a workpiece.

FIG. 12 is a sectional view showing a configuration of a conventional table device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Plasma processing apparatus 11 ... Chamber 14 ... Microwave generation source 15 ... Waveguide 16 ... Introduction window 17 ... Table device 18 ... Processed object 19 ... Table main body 20 ... Placement surface 21 ... Temperature control device 23 ... Gas introduction Piping 24 ... Introduction groove 25 ... O-ring 26 ... Substrate holding mechanism 31 ... Clamp 43 ... Clamp mechanism

Claims (9)

[Claims] 1. A table device for mounting an object to be processed inside a processing chamber and adjusting the temperature, wherein a table body on which the surface on which the object to be processed is mounted is formed in a concave curved shape; A table provided inside the table body, comprising: a temperature adjusting means for adjusting the temperature of the mounting surface; and a clamp means for holding the object to be processed on the mounting surface so as to be in close contact therewith. apparatus. 2. The table apparatus according to claim 1, wherein the table main body is provided with a gas supply path for supplying a heat conducting gas between the mounting surface and the object to be processed. 3. The table main body is provided with a sealing member for preventing a gas for heat conduction supplied between the mounting surface and the object to be processed from leaking.
Table device as described. 4. An introduction groove for introducing and dispersing the heat transfer gas supplied from the gas supply path between the installation surface and the object to be processed, wherein the introduction surface is formed on the installation surface. The table device according to claim 2 or 3, wherein 5. The table device according to claim 1, wherein an elastic member is provided on the mounting surface. 6. The clamping means has a clamp pair that abuts on opposite ends of the object to be processed, and a clamp drive mechanism that brings the pair of clamps close to each other and brings the object into close contact with the mounting surface. The table device according to claim 1, wherein: 7. The apparatus according to claim 1, wherein the clamping means is a clamping means which presses, from above, a vicinity of an edge of the object placed on the placement surface and makes it closely contact with the placement surface. 2. The table device according to 1. 8. The table apparatus according to claim 1, further comprising support means provided to be protrudable and retractable in said table main body, and supporting near an edge of said object to be processed from said table main body side. 9. A plasma processing apparatus using the table device according to any one of claims 1 to 8.