JPH10221047A - Fluorescent x-ray film thickness analyzer and method - Google Patents

Fluorescent x-ray film thickness analyzer and method

Info

Publication number
JPH10221047A
JPH10221047A JP2028597A JP2028597A JPH10221047A JP H10221047 A JPH10221047 A JP H10221047A JP 2028597 A JP2028597 A JP 2028597A JP 2028597 A JP2028597 A JP 2028597A JP H10221047 A JPH10221047 A JP H10221047A
Authority
JP
Japan
Prior art keywords
film
film thickness
standard sample
sample plate
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2028597A
Other languages
Japanese (ja)
Inventor
Masahiko Kuwata
正彦 桑田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Jeol Engineering Co Ltd
Original Assignee
Jeol Ltd
Jeol Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeol Ltd, Jeol Engineering Co Ltd filed Critical Jeol Ltd
Priority to JP2028597A priority Critical patent/JPH10221047A/en
Publication of JPH10221047A publication Critical patent/JPH10221047A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To enable a thickness over a wide range to be measured highly accurately. SOLUTION: In the fluorescent X-ray film thickness analyzer for placing a standard sample plate 10 whose thickness and composition ratio are known on a rear of a film 9 to be measured and radiating X-rays from an X-ray bulb 1 to detect fluorpscent X-rays generated from the standard sample plate 10 for measuring a thickness of the film 9 when an infinite thickness can be determined or cannot be determined, a mixture standard sample plate comprising a plurality of elements generating, characteristic X-rays of different energy is used as the standard sample plate 10. Among the fluorescent X-rays generated from the mixture standard sample plate, a ray whose intensity drops into a predetermined range due to absorption by the film 9 is selected as an analysis ray, and the thickness of the film 9 is obtained based on intensity of the analysis ray.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、無限厚とみなせ
る、または無限厚とみなせない場合には板厚と組成比が
既知の標準試料板を被測定膜の裏側におき、X線を照射
して標準試料板及び被測定膜から発生する蛍光X線を検
出して膜厚を測定する蛍光X線膜厚分析装置及び方法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of irradiating X-rays by placing a standard sample plate having a known thickness and composition ratio on the back side of a film to be measured, if the thickness can be regarded as infinite or not. And a method for detecting a fluorescent X-ray generated from a standard sample plate and a film to be measured to measure the film thickness.

【0002】[0002]

【従来の技術】蛍光X線を使用した膜厚分析は、めっ
き、蒸着膜、スパッタ膜、CVD膜などの膜厚測定や組
成分析に広く利用されている。近年、炭素から分析可能
なエネルギー分散型蛍光X線分析装置(EDXRF)が
市販されているが、ここで膜厚の算定に使用される分析
元素は、比較的重い元素が中心で、組成が軽元素からな
る高分子膜や紙等の被測定膜(試料)にはあまり使用さ
れていない。
2. Description of the Related Art Film thickness analysis using fluorescent X-rays is widely used for film thickness measurement and composition analysis of plating, evaporated films, sputtered films, CVD films, and the like. In recent years, an energy dispersive X-ray fluorescence spectrometer (EDXRF) that can analyze from carbon has been marketed, but the analysis elements used for calculating the film thickness are mainly relatively heavy elements and have a light composition. It is rarely used for a film to be measured (sample) such as a polymer film made of an element or paper.

【0003】膜厚測定を行うには、膜厚と組成が既知の
標準試料板から発生する特性線強度と試料を構成する元
素の特性線強度とを比較して求める方法、試料を透過し
たX線の透過損失から求める方法、試料からの散乱線強
度から求める方法等がある。試料を構成する元素の励起
線強度比から膜厚を測定する場合、励起線の吸収損失が
大きいため、極めて薄い試料でないと薄膜とみなせない
こと、また、透過損失で膜厚を求めるには試料と照射X
線との相互作用が小さいため極めて厚い試料でないと精
度が出ない等の理由で広い範囲の試料厚に対応するのは
困難であったこと等の理由で組成が軽元素からなる試料
の膜厚測定には蛍光X線分析が採用されなかった。そこ
で、従来は、放射線源のβ線を使用して透過損失を測定
していたが、管理上の問題から放射線を使用しない測定
法が求められていた。
In order to measure the film thickness, a method of comparing the characteristic line intensity generated from a standard sample plate having a known film thickness and composition with the characteristic line intensity of the elements constituting the sample is described. There are a method of obtaining from a transmission loss of a line, a method of obtaining from a scattered radiation intensity from a sample, and the like. When measuring the film thickness from the excitation line intensity ratio of the elements that make up the sample, the absorption loss of the excitation line is large, so the sample must be extremely thin to be considered a thin film. And irradiation X
The film thickness of a sample whose composition is made of a light element because it was difficult to respond to a wide range of sample thicknesses because the interaction with the line was small and accuracy was not achieved unless the sample was extremely thick. X-ray fluorescence analysis was not employed for the measurement. Therefore, transmission loss has conventionally been measured using β-rays from a radiation source, but a measurement method that does not use radiation has been required due to management problems.

【0004】図5は従来の蛍光X線膜厚分析装置を説明
するための図、図6はテトラフルオロエチレン−エチレ
ン共重合体(ETFE)中のフッ素K線強度と膜厚の関
係を示す図である。
FIG. 5 is a view for explaining a conventional fluorescent X-ray film thickness analyzer, and FIG. 6 is a view showing the relationship between the intensity of fluorine K-rays and the film thickness in tetrafluoroethylene-ethylene copolymer (ETFE). It is.

【0005】蛍光X線膜厚分析装置では、図5に示すよ
うに、X線管球21からX線(一次X線)を放出して無
限厚の下地23上の被測定膜22に照射し、被測定膜2
2及び下地23から発生する蛍光X線a、bを検出器2
4によって検出して電気信号に変換する。そして、この
蛍光X線をフィルターアンプで増幅、S/Nの改善を行
った後AD変換しコンピュータに取り込む。ここで検出
された蛍光X線のエネルギーとその量を測定することに
よって、被測定膜22の組成や膜厚を知ることができ
る。例えば被測定膜22がフッ素樹脂の場合のK線強度
と膜厚の関係を示したのが図6であり、縦軸はFP(Fu
ndamental Parameter)法計算によって求めた理論強度と
無限厚とみなせる標準試料フッ素の強度比である。この
関係から従来は、3μm以下の膜厚しか測定できず、測
定可能な膜厚の範囲は広くないことがわかる。
[0005] In the fluorescent X-ray film thickness analyzer, as shown in FIG. 5, X-rays (primary X-rays) are emitted from an X-ray tube 21 and applied to a film 22 to be measured on a base 23 having an infinite thickness. , Measured film 2
2 and fluorescent X-rays a and b generated from the base 23 are detected by the detector 2
4 and is converted into an electric signal. Then, the fluorescent X-rays are amplified by a filter amplifier, the S / N ratio is improved, AD-converted, and taken into a computer. The composition and thickness of the film 22 to be measured can be known by measuring the energy and the amount of the fluorescent X-rays detected here. For example, FIG. 6 shows the relationship between the K-line intensity and the film thickness when the film 22 to be measured is a fluororesin, and the vertical axis indicates FP (Fu
It is the intensity ratio between the theoretical intensity obtained by the ndamental parameter) method calculation and the standard sample fluorine which can be regarded as infinite thickness. From this relationship, it can be seen that conventionally, only a film thickness of 3 μm or less can be measured, and the range of the film thickness that can be measured is not wide.

【0006】[0006]

【発明が解決しようとする課題】図6に示す関係から明
らかなように被測定膜から発生するX線強度と膜厚の関
係は、膜厚が厚くなるのに従って直線性が悪くなり、測
定X線強度の統計変動よりカーブがねている部分では計
算不能となる。また、被測定膜の裏面に金属板などを置
いてそこから発生する蛍光X線の吸収量から膜厚を求め
る方法の場合、X線の吸収量は膜厚が薄くなるに従って
少なくなり、直線性が悪化する。したがって、いずれの
方法も膜厚を精度良く測定できる幅は狭い。このよう
に、被測定膜中に含まれる元素の特性X線を分解線とし
て使用するとその特性線エネルギーによって測定可能な
膜厚は決まってしまい、その範囲は狭い。
As is clear from the relationship shown in FIG. 6, the relationship between the X-ray intensity generated from the film to be measured and the film thickness is such that the linearity becomes worse as the film thickness increases, The calculation cannot be performed in the portion where the curve is curved due to the statistical fluctuation of the line intensity. In the case of a method in which a metal plate or the like is placed on the back surface of the film to be measured and the film thickness is determined from the amount of X-ray fluorescence generated from the metal plate, the amount of X-ray absorption decreases as the film thickness decreases. Worsens. Therefore, the width over which the film thickness can be accurately measured is narrow in any of the methods. As described above, when the characteristic X-ray of the element contained in the film to be measured is used as the decomposition line, the measurable film thickness is determined by the characteristic line energy, and the range is narrow.

【0007】[0007]

【課題を解決するための手段】本発明は、上記課題を解
決するものであって、広い範囲の膜厚を高精度で測定で
きるようにするものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is intended to measure a wide range of film thickness with high accuracy.

【0008】そのために本発明は、無限厚とみなせる、
または無限厚とみなせない場合には板厚と組成比が既知
の標準試料板を被測定膜の裏側におき、X線を照射して
標準試料板から発生する蛍光X線を検出して被測定膜の
膜厚を測定する蛍光X線膜厚分析装置において、前記標
準試料板として、エネルギーの異なる特性X線を発生す
る複数の元素からなる混合標準試料板を用い、該混合標
準試料板から発生する蛍光X線のうち、前記被測定膜に
よる吸収によってその強度が所定の範囲に低下する線を
分析線として選択し、該分析線の強度に基づき前記被測
定膜の膜厚を求めることを特徴とするものである。
Therefore, the present invention can be regarded as an infinite thickness,
Alternatively, if the thickness cannot be regarded as infinite, place a standard sample plate with a known thickness and composition ratio on the back side of the film to be measured, irradiate X-rays, detect fluorescent X-rays generated from the standard sample plate, and perform measurement. In the fluorescent X-ray film thickness analyzer for measuring the film thickness, a mixed standard sample plate made of a plurality of elements that generate characteristic X-rays having different energies is used as the standard sample plate, and the mixed standard sample plate is generated from the mixed standard sample plate. Of the fluorescent X-rays to be analyzed, a line whose intensity is reduced to a predetermined range by absorption by the film to be measured is selected as an analysis line, and the film thickness of the film to be measured is obtained based on the intensity of the analysis line. It is assumed that.

【0009】また、前記所定の範囲は、80〜20%で
あり、前記所定の範囲に低下する線のうち分析に使用す
る線は、70%以下で最も高いエネルギーを持つ線であ
り、前記所定の範囲に低下する線が複数ある場合には、
各線により求められる膜厚の平均値を求めることを特徴
とするものである。
The predetermined range is 80 to 20%, and among the lines falling to the predetermined range, a line used for analysis is a line having the highest energy of 70% or less. If there are multiple lines that fall in the range
It is characterized in that an average value of the film thickness obtained by each line is obtained.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しつつ説明する。図1は本発明に係る蛍光X線膜
厚分析装置の実施の形態を示す図であり、1はX線管
球、2はシャッタ、3はフィルタ、4は一次コリメー
タ、5は二次コリメータ、6は検出器、7はフィルター
アンプ&AD変換器、8はコンピュータシステム、9は
被測定膜、10は混合標準試料板、11は試料室、12
は排気口を示す。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing an embodiment of a fluorescent X-ray film thickness analyzer according to the present invention, wherein 1 is an X-ray tube, 2 is a shutter, 3 is a filter, 4 is a primary collimator, 5 is a secondary collimator, 6 is a detector, 7 is a filter amplifier & AD converter, 8 is a computer system, 9 is a film to be measured, 10 is a mixed standard sample plate, 11 is a sample room, 12
Indicates an exhaust port.

【0011】図1において、X線管球1は、照射X線を
発生するものであり、このX線は、シャッタ2、フィル
タ3、一次コリメータ4を通して被測定膜(試料フィル
ム)9に照射される。被測定膜9の裏側には、無限厚と
みなせる、または無限厚とみなせない場合には板厚と組
成比が既知の混合標準試料板10をおき、X線照射によ
り被測定膜9及び混合標準試料板10から励起された蛍
光X線が二次コリメータ5を通して検出器6で検出され
る。この蛍光X線は検出器6によって電気信号に変換さ
れ、フィルターアンプ&AD変換器7で増幅、S/Nの
改善を行った上でAD変換されコンピュータシステム8
に取り込まれる。本発明に係る蛍光X線膜厚分析装置
は、ここで、全測定エネルギー範囲に分散してスペクト
ルを生ずる混合標準試料板10を用い、混合標準試料板
10から発生する蛍光X線のうち、被測定膜9による吸
収によってその強度が所定の範囲に低下する線を選択し
て、その線を分析線として膜厚を求めるものである。
In FIG. 1, an X-ray tube 1 generates irradiation X-rays. The X-rays are applied to a film to be measured (sample film) 9 through a shutter 2, a filter 3, and a primary collimator 4. You. On the back side of the film 9 to be measured, a mixed standard sample plate 10 whose thickness and composition ratio are known can be regarded as an infinite thickness, or when it cannot be regarded as an infinite thickness, and the film 9 and the mixed standard are mixed by X-ray irradiation. The fluorescent X-rays excited from the sample plate 10 are detected by the detector 6 through the secondary collimator 5. The fluorescent X-ray is converted into an electric signal by the detector 6, amplified by the filter amplifier & AD converter 7, and S / N is improved, and then AD-converted to the computer system 8.
It is taken in. Here, the X-ray fluorescence film thickness analyzer according to the present invention uses the mixed standard sample plate 10 that generates a spectrum dispersed in the entire measurement energy range. A line whose intensity falls within a predetermined range due to absorption by the measurement film 9 is selected, and the line is used as an analysis line to determine the film thickness.

【0012】図2は混合標準試料板を被測定膜の裏側に
置いて測定を行ったときの各特性線が被測定膜による吸
収減衰特性を示す図、図3は混合標準試料板に含まれる
元素のスペクトルの例を示す図である。
FIG. 2 is a view showing the absorption attenuation characteristics of the film to be measured when the measurement is performed with the mixed standard sample plate placed on the back side of the film to be measured. FIG. 3 is included in the mixed standard sample plate. It is a figure showing an example of a spectrum of an element.

【0013】混合標準試料板10は、図2(A)〜
(E)に示すような特性X線を発生するものであり、特
性線が被測定膜9によって吸収され減衰する量が測定さ
れる。この特性から、アルミニウムのK線を使用すると
1μm程度、銅K線では100μm付近の膜厚が測定で
き、同様にMoL線では数μm、FeK線では数十μm
程度の膜厚に適していることがわかる。なお、(F)
は、被測定膜9の中の元素、フッ素の特性X線強度と膜
厚の関係を示している。したがって、被測定膜9の裏側
に置かれた混合標準試料板10から発生する特性X線の
うち、測定された強度から、膜厚とX線強度の関係にお
ける直線性が良い領域にある、例えば被測定膜9による
特性線の吸収によって被測定膜がない時に比較して強度
が40%以上、70%以下となるようなエネルギーを持
つ特性X線を選択することにより、膜厚に応じた最適な
分析線を選択し膜厚を計算することができる。
The mixed standard sample plate 10 is shown in FIGS.
A characteristic X-ray as shown in (E) is generated, and the amount by which the characteristic line is absorbed and attenuated by the film to be measured 9 is measured. From this characteristic, a film thickness of about 1 μm can be measured using an aluminum K line, and a film thickness of around 100 μm can be measured for a copper K line.
It can be seen that the film thickness is suitable for about the same. (F)
Indicates the relationship between the characteristic X-ray intensity of the element and fluorine in the film 9 to be measured and the film thickness. Therefore, among the characteristic X-rays generated from the mixed standard sample plate 10 placed on the back side of the film to be measured 9, the measured intensity is in a region where the linearity in the relationship between the film thickness and the X-ray intensity is good, for example, By selecting characteristic X-rays having an energy such that the intensity becomes 40% or more and 70% or less as compared to when there is no film to be measured due to absorption of the characteristic line by the film to be measured 9, the optimum according to the film thickness By selecting an appropriate analytical line, the film thickness can be calculated.

【0014】混合標準試料板に含まれる元素のスペクト
ルの例を示したのが図3であり、使用可能な特性X線の
エネルギーは、例えば AlKα 1.5KeV MoKα 3.5KeV Lα 2.3KeV GeKα 9.9KeV Lα 1.2KeV MnKα 5.9KeV TiKα 4.5KeV FeKα 6.4KeV CuKα 8.0KeV である。AlK線のように特性X線のエネルギーが低け
れば、薄い膜厚で吸収されて大きく減衰してしまうが、
特性X線のエネルギーが高ければ、薄い膜厚ではほとん
ど吸収されずに減衰が少なく、厚い膜厚の領域で減衰す
るようになる。つまり、特性X線が高エネルギーになる
ほど、厚い膜厚に対応できるので、これらを混合するこ
とにより、図2に示すように全測定エネルギー範囲に分
散してスペクトルを生ずる混合標準試料板10を構成す
ることができ、広い範囲の膜厚の被測定膜9に対応可能
となる。
FIG. 3 shows an example of the spectrum of the elements contained in the mixed standard sample plate. The usable characteristic X-ray energy is, for example, AlKα 1.5 KeV MoKα 3.5 KeV Lα 2.3 KeV GeKα 9 9.9 KeV Lα 1.2 KeV MnKα 5.9 KeV TiKα 4.5 KeV FeKα 6.4 KeV CuKα 8.0 KeV. If the energy of the characteristic X-ray is low, such as an AlK line, it is absorbed at a small film thickness and greatly attenuated.
If the energy of the characteristic X-rays is high, it is hardly absorbed at a thin film thickness and the attenuation is small, and the attenuation occurs in a thick film region. In other words, the higher the characteristic X-ray energy, the higher the film thickness can be accommodated. By mixing these, the mixed standard sample plate 10 that generates a spectrum dispersed in the entire measurement energy range as shown in FIG. It can be applied to the film to be measured 9 having a wide range of film thickness.

【0015】図4は本発明に係る蛍光X線膜厚分析装置
による膜厚測定処理を説明するための図である。本発明
に係る蛍光X線膜厚分析装置による膜厚測定に際して
は、前処理として、予め、膜の組成、密度が求められ
る。さらに、蛍光X線膜厚分析装置の仕様、つまり、X
線管球のターゲット、加速電圧、ベリリウム窓の厚さ、
パスの長さ、検出器の窓材、検出器の種類などに基づ
き、図2に示す特性線が求められる。そして、以下のよ
うな膜厚測定処理が実行される。
FIG. 4 is a view for explaining a film thickness measuring process by the fluorescent X-ray film thickness analyzer according to the present invention. When measuring the film thickness by the fluorescent X-ray film thickness analyzer according to the present invention, the composition and density of the film are determined in advance as pretreatment. Further, the specifications of the fluorescent X-ray film thickness analyzer, ie, X
The target of the tube, the acceleration voltage, the thickness of the beryllium window,
The characteristic line shown in FIG. 2 is obtained based on the length of the path, the window material of the detector, the type of the detector, and the like. Then, the following film thickness measurement processing is executed.

【0016】まず、試料(被測定膜)を装置の混合標準
試料板の上にセットしてスペクトルを測定する(ステッ
プS11)。次に、測定されたスペクトル中で、予め設
定された閾値を超えるピークのうち、最も高いエネルギ
ーのピークを分析線に指定しする(ステップS12)。
そして、分析線に指定したスペクトルについて予め測定
して記録されている濃度既知の混合標準試料板の強度と
の比を計算する(ステップS13)。続いて、分析線が
被測定膜中に含まれる元素からの特性X線であるか混合
標準試料板中に含まれる元素からの特性X線であるかを
調べる(ステップS14)。
First, a sample (film to be measured) is set on a mixed standard sample plate of the apparatus, and a spectrum is measured (step S11). Next, among the peaks exceeding a preset threshold value in the measured spectrum, the peak having the highest energy is designated as an analysis line (step S12).
Then, the ratio of the spectrum designated as the analysis line to the intensity of the mixed standard sample plate whose concentration is known and measured and recorded in advance is calculated (step S13). Subsequently, it is checked whether the analysis line is a characteristic X-ray from an element contained in the film to be measured or a characteristic X-ray from an element contained in the mixed standard sample plate (step S14).

【0017】分析線が被測定膜中に含まれる元素からの
特性X線の場合には、実測スペクトル強度と被測定膜の
組成比と膜厚から予想されるスペクトル強度の比が予め
設定された範囲、例えば70%以下で30%以上にある
か否かを調べ(ステップS15)設定された範囲にあれ
ば、その特性線で膜厚を計算し、表示後終了する(ステ
ップS16)。
In the case where the analysis line is a characteristic X-ray from an element contained in the film to be measured, the ratio between the measured spectrum intensity, the composition ratio of the film to be measured, and the spectrum intensity expected from the film thickness is set in advance. It is checked whether it is in a range, for example, 70% or less and 30% or more (step S15). If it is in the set range, the film thickness is calculated using the characteristic line, and the display is terminated (step S16).

【0018】分析線が混合標準試料板中に含まれる元素
からの特性X線の場合には、実測スペクトル強度と被測
定膜の組成比と膜厚から予想されるスペクトル強度の比
が予め設定された範囲にあるか否かを調べ(ステップS
17)設定された範囲にあれば、その特性線で膜厚を計
算し、表示後終了する(ステップS18)。
When the analysis line is a characteristic X-ray from an element contained in the mixed standard sample plate, the ratio between the measured spectrum intensity, the composition ratio of the film to be measured, and the spectrum intensity expected from the film thickness is preset. (Step S).
17) If it is within the set range, the film thickness is calculated using the characteristic line, and the display is terminated (step S18).

【0019】ステップS15、17の判断処理におい
て、実測スペクトル強度と被測定膜の組成比と膜厚から
予想されるスペクトル強度の比が予め設定された範囲に
ない場合には、測定スペクトル中の閾値を超えたピーク
のうち、次に高いエネルギーのピークを分析線に指定
し、ステップS13に戻る(ステップS19)。
In the judgment processing of steps S15 and S17, if the ratio of the measured spectrum intensity to the composition ratio of the film to be measured and the spectrum intensity expected from the film thickness is not within the preset range, the threshold value in the measured spectrum is determined. The peak having the next highest energy is designated as the analysis line among the peaks exceeding, and the process returns to step S13 (step S19).

【0020】なお、本発明は、上記実施の形態に限定さ
れるものではなく、種々の変形が可能である。例えば上
記実施の形態では、元素の組成を調整した混合標準試料
板を被測定膜の裏に置く例を示したが、化合物半導体上
に蒸着した試料(被測定膜)のように基板から発生する
X線として複数本の特性線が得られる場合にも、同様の
処理が可能となる。また、被測定膜の裏側に置かれた物
質から発生する特性X線のうち、測定された強度から、
膜厚とX線強度の関係における直線性が良い領域にあ
る、すなわち被測定膜による特性線の吸収によって被測
定膜がない時に比較して強度が70%以下となるような
エネルギーを持つ特性X線を分析線として選択して膜厚
を計算したが、ほぼ直線性の良好な範囲として80〜2
0%の範囲の特性X線を分析線として選択してもよい
し、その範囲内の特性X線を全て選択してそれらの平均
値により膜厚を求めるようにしてもよい。さらに、各特
性X線毎に上記の範囲を設定してもよい。
It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above-described embodiment, the example in which the mixed standard sample plate in which the composition of the elements is adjusted is placed on the back of the film to be measured is shown, but the mixed standard sample plate is generated from the substrate like a sample (film to be measured) deposited on a compound semiconductor. The same processing can be performed even when a plurality of characteristic lines are obtained as X-rays. Also, of the characteristic X-rays generated from a substance placed on the back side of the film to be measured, from the measured intensity,
The characteristic X having an energy such that the intensity is 70% or less as compared to when there is no film to be measured due to absorption of the characteristic line by the film to be measured is in a region where the linearity in the relationship between the film thickness and the X-ray intensity is good. The line was selected as the analysis line and the film thickness was calculated.
The characteristic X-rays in the range of 0% may be selected as the analysis lines, or all the characteristic X-rays in the range may be selected, and the film thickness may be obtained from the average value thereof. Further, the above range may be set for each characteristic X-ray.

【0021】[0021]

【発明の効果】以上の説明から明らかなように、本発明
によれば、被測定膜(試料)の裏側に置かれた混合標準
試料板から発生する特性X線のうち、測定されたスペク
トル強度と被測定膜の組成比と膜厚から予想されるスペ
クトル強度の比が予め設定された範囲にある特性線で膜
厚を計算するので、膜厚とX線強度の関係における直線
性の良い領域で膜厚を計算することができ、膜厚の測定
精度の向上を図ることができる。しかも、全測定エネル
ギー範囲に分散してスペクトルを生ずる混合標準試料板
を用いるので、広い範囲の膜厚の被測定膜に対応可能と
なる。
As is apparent from the above description, according to the present invention, the measured spectral intensity of the characteristic X-rays generated from the mixed standard sample plate placed on the back side of the film to be measured (sample) is measured. Since the film thickness is calculated using a characteristic line in which the ratio of the spectrum intensity expected from the composition ratio of the film to be measured and the film thickness is within a preset range, a region having good linearity in the relationship between the film thickness and the X-ray intensity is obtained. Can be used to calculate the film thickness, and the measurement accuracy of the film thickness can be improved. In addition, since a mixed standard sample plate that generates a spectrum dispersed in the entire measurement energy range is used, it is possible to cope with a film to be measured having a wide range of film thickness.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係る蛍光X線膜厚分析装置の実施の
形態を示す図である。
FIG. 1 is a diagram showing an embodiment of a fluorescent X-ray film thickness analyzer according to the present invention.

【図2】 混合標準試料板を被測定膜の裏側に置いて測
定を行ったときの各特性線が被測定膜による吸収減衰特
性を示す図である。
FIG. 2 is a diagram showing each characteristic line when a mixed standard sample plate is placed on the back side of a film to be measured and the absorption characteristic of the film to be measured is measured.

【図3】 混合標準試料板に含まれる元素のスペクトル
の例を示す図である。
FIG. 3 is a diagram showing an example of a spectrum of an element contained in a mixed standard sample plate.

【図4】 本発明に係る蛍光X線膜厚分析装置による膜
厚測定処理を説明するための図である。
FIG. 4 is a view for explaining a film thickness measuring process by the fluorescent X-ray film thickness analyzer according to the present invention.

【図5】 従来の蛍光X線膜厚分析装置を説明するため
の図である。
FIG. 5 is a view for explaining a conventional fluorescent X-ray film thickness analyzer.

【図6】 テトラフルオロエチレン−エチレン共重合体
(ETFE)中のフッ素K線強度と膜厚の関係を示す図
である。
FIG. 6 is a diagram showing the relationship between the fluorine K-ray intensity and the film thickness in a tetrafluoroethylene-ethylene copolymer (ETFE).

【符号の説明】[Explanation of symbols]

1…X線管球、2…シャッタ、3…フィルタ、4…一次
コリメータ、5…二次コリメータ、6…検出器、7…フ
ィルターアンプ&AD変換器、8…コンピュータシステ
ム、9…被測定膜、10…混合標準試料板、11…試料
室、12…排気口
DESCRIPTION OF SYMBOLS 1 ... X-ray tube, 2 ... Shutter, 3 ... Filter, 4 ... Primary collimator, 5 ... Secondary collimator, 6 ... Detector, 7 ... Filter amplifier & AD converter, 8 ... Computer system, 9 ... Film to be measured, 10: mixed standard sample plate, 11: sample chamber, 12: exhaust port

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 無限厚とみなせる、または無限厚とみな
せない場合には板厚と組成比が既知の標準試料板を被測
定膜の裏側におき、X線を照射して標準試料板から発生
する蛍光X線を検出して被測定膜の膜厚を測定する蛍光
X線膜厚分析装置において、前記標準試料板として、エ
ネルギーの異なる特性X線を発生する複数の元素からな
る混合標準試料板を用い、該混合標準試料板から発生す
る蛍光X線のうち、前記被測定膜による吸収によってそ
の強度が所定の範囲に低下する線を分析線として選択
し、該分析線の強度に基づき前記被測定膜の膜厚を求め
ることを特徴とする蛍光X線膜厚分析装置。
1. If the thickness can be regarded as infinite or cannot be regarded as infinite, a standard sample plate having a known thickness and composition ratio is placed on the back side of the film to be measured, and X-rays are applied to generate a standard sample plate. X-ray film thickness analyzer for measuring the film thickness of a film to be measured by detecting fluorescent X-rays to be emitted, wherein the standard sample plate is a mixed standard sample plate comprising a plurality of elements generating characteristic X-rays having different energies Of the fluorescent X-rays generated from the mixed standard sample plate, a line whose intensity is reduced to a predetermined range due to absorption by the film to be measured is selected as an analysis line, and based on the intensity of the analysis line, An X-ray fluorescence film thickness analyzer for determining the thickness of a measurement film.
【請求項2】 前記所定の範囲は、80〜20%である
ことを特徴とする請求項1記載の蛍光X線膜厚分析装
置。
2. The X-ray fluorescence film thickness analyzer according to claim 1, wherein the predetermined range is 80 to 20%.
【請求項3】 前記所定の範囲に低下する線のうち分析
に使用する線は、70%以下で最も高いエネルギーを持
つ線であることを特徴とする請求項1記載の蛍光X線膜
厚分析装置。
3. The X-ray fluorescence film thickness analysis according to claim 1, wherein a line used for analysis among the lines falling into the predetermined range is a line having the highest energy at 70% or less. apparatus.
【請求項4】 前記所定の範囲に低下する線が複数ある
場合には、各線により求められる膜厚の平均値を求める
ことを特徴とする請求項1記載の蛍光X線膜厚分析装
置。
4. The fluorescent X-ray film thickness analyzer according to claim 1, wherein when there are a plurality of lines falling in the predetermined range, an average value of the film thickness obtained by each line is obtained.
【請求項5】 無限厚とみなせる、または無限厚とみな
せない場合には板厚と組成比が既知の標準試料板を被測
定膜の裏側におき、X線を照射して標準試料板から発生
する蛍光X線を検出して被測定膜の膜厚を測定する蛍光
X線膜厚分析方法において、前記標準試料板として、エ
ネルギーの異なる特性X線を発生する複数の元素からな
る混合標準試料板を用い、該混合標準試料板から発生す
る蛍光X線のうち、前記被測定膜による吸収によってそ
の強度が所定の範囲に低下する線を分析線として選択
し、該分析線の強度に基づき前記被測定膜の膜厚を求め
ることを特徴とする蛍光X線膜厚分析方法。
5. If the thickness can be regarded as infinite, or if it cannot be regarded as infinite, a standard sample plate having a known thickness and composition ratio is placed on the back side of the film to be measured and irradiated from the standard sample plate by X-ray irradiation. X-ray film thickness analysis method for measuring the film thickness of a film to be measured by detecting fluorescent X-rays to be applied, wherein the standard sample plate is a mixed standard sample plate comprising a plurality of elements generating characteristic X-rays having different energies. Of the fluorescent X-rays generated from the mixed standard sample plate, a line whose intensity is reduced to a predetermined range due to absorption by the film to be measured is selected as an analysis line, and based on the intensity of the analysis line, A fluorescent X-ray film thickness analysis method characterized by determining a film thickness of a measurement film.
JP2028597A 1997-02-03 1997-02-03 Fluorescent x-ray film thickness analyzer and method Withdrawn JPH10221047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2028597A JPH10221047A (en) 1997-02-03 1997-02-03 Fluorescent x-ray film thickness analyzer and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2028597A JPH10221047A (en) 1997-02-03 1997-02-03 Fluorescent x-ray film thickness analyzer and method

Publications (1)

Publication Number Publication Date
JPH10221047A true JPH10221047A (en) 1998-08-21

Family

ID=12022908

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH10221047A (en)

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Publication number Priority date Publication date Assignee Title
JP2003506701A (en) * 1999-08-10 2003-02-18 コラス・アルミニウム・バルツプロドウクテ・ゲーエムベーハー X-ray fluorescence sensor for measuring thickness of metal sheet
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WO2012153462A1 (en) 2011-05-10 2012-11-15 信越半導体株式会社 Method for determining film thickness of soi layer of soi wafer
US8981291B2 (en) 2011-05-10 2015-03-17 Shin-Etsu Handotai Co., Ltd. Method for measuring film thickness of SOI layer of SOI wafer
WO2014065473A1 (en) * 2012-10-26 2014-05-01 나노씨엠에스(주) Method and device for measuring thickness of thin film layer using x-rays
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