JPH10218360A - Ceramic substrate sheet, method for carrying the same, and method for storing the same in storing case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To smoothly carry and store a ceramic substrate sheet by chamfering at least two neighboring corners in the direction of thickness. SOLUTION: A ceramic substrate sheet 10 has a chamfer 15 in the direction of thickness at the chamfered corner 13 and thus the tip end 13 of the chamfered corner does not abut on the substrate receiving part 24a of a carrying rail 24. Since the angle made by a lower main surface 18b and the chamfer 15 is made an obtuse angle, even if the substrate receiving part 24a has depressions and projections 24c, there is no big friction or scratch between the substrate receiving part 24a and the depressions and projections 24c and thus the ceramic substrate sheet 10 can be smoothly carried. The chamfer 15 may be formed by grinding by a grindstone or by cutting by a sharp cutter like a razor before burning a green sheet laminate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate sheet, a method of conveying the ceramic substrate sheet, and a method of storing the ceramic substrate sheet in a storage case, and more particularly, to a ceramic multilayer for mounting electronic parts and the like. The present invention relates to a ceramic substrate sheet including a wiring substrate, a method of transporting the ceramic substrate sheet, and a method of storing the ceramic substrate sheet in a storage case.

[0002]

2. Description of the Related Art Today, electronic components such as resistors, capacitors, and packages on which semiconductor elements are mounted are mounted on a printed wiring board made of resin or a wiring board made of ceramic.
The wiring board on which these various electronic components are mounted is arranged inside the electronic device, and the electronic device is assembled.

As a ceramic wiring board, a single-layer ceramic board having wiring layers formed on both sides of a ceramic substrate is used. In addition, in order to mount electronic components at a high density, a conductor layer is provided on the surface and inside of the board. Are also used.

[0004] In the ceramic multilayer wiring board, after a processing such as punching is performed on the green sheet, a conductor paste layer of a predetermined pattern is formed on the green sheet, and the green sheet on which the conductor paste layer is formed is laminated. Then, a green sheet laminate is produced, and then a firing process is performed. In this case, usually, individual ceramic multilayer wiring boards are not separately manufactured, but a conductor pattern corresponding to a plurality of ceramic multilayer wiring boards is formed and laminated on a green sheet having a large area, and baked. A ceramic substrate sheet including the ceramic multilayer wiring substrate of (1) is manufactured.

FIG. 3A is a plan view schematically showing a ceramic substrate sheet, and FIG. 3B is a sectional view taken along line II in FIG.

[0006] The ceramic substrate sheet 30 is formed with a dividing groove 11 having a V-shaped cross section, and is divided into individual ceramic multilayer wiring substrates 12 by applying a force in the thickness direction. . In addition, usually, dummy portions 14 used for transporting the ceramic substrate sheet 30 and mounting components are formed at both upper and lower ends in FIG. The flat corner chamfered portion 13 is formed such that the angle α with respect to the extension surface of the 17 is about 45 °. Although not shown, a wiring layer, a through hole, and the like are formed on each ceramic multilayer wiring substrate 12 in the ceramic substrate sheet 30, so that a resistor, a capacitor, and the like can be mounted. ing.

When actually mounting the electronic components, the manufactured ceramic substrate sheet 30 is transported by placing it on a transport device and stored in a storage case (magazine), and then stored in the storage case (magazine). The components are mounted on the mounting machine in case units.

FIG. 4A is a schematic side view of an example of the transfer device, and FIG. 4B is a sectional view taken along the line II-II in FIG.

The transport device 20 is constructed in the same manner as a normal transport device. A transport belt 21 is hung on a pair of rotating drums 22 rotated by a motor 23, and the ceramic substrate sheet 30 is transported by the transport belt 21. It has become so. A pair of substantially L-shaped transfer rails 24 each including a substrate receiving portion 24a and a side wall 24b are provided on both sides of the transfer belt 21 so that the transferred ceramic substrate sheet 30 does not deviate from a fixed track. The dummy portion 14 formed on the ceramic substrate sheet 30 comes into contact with the substrate receiving portion 24a of the transport rail 24.

FIG. 5A shows a ceramic substrate sheet 30.
FIG. 2B is a side view schematically showing a device for storing the storage case in the storage case and the vicinity of the storage case, and FIG.
FIG. 3 is a sectional view taken along line III-III.

After being conveyed by the conveyor belt 21, the ceramic substrate sheet 30 stops on the conveyor rail 24 at the end of the conveyor belt 21. A storage case 28 is placed on a storage case table 29 near the end of the transfer rail 24. The storage case 28 has a plurality of shelves 28 a in a vertical direction for storing the ceramic substrate sheet 30.
Are formed. In addition, below the transport rail 24,
An elevating lift 27 for moving the ceramic substrate sheet 30 in the vertical direction is installed, while a movable pin 26 for moving the ceramic substrate sheet 30 in the horizontal direction is installed above the transport rail 24. The movable pins 26 move freely in the up-down direction and the left-right direction in FIG. 5A, and can move the ceramic substrate sheet 30 rightward in FIG. In order not to hinder the movement of the movable pin 26, the lifting / lowering lift 27 is mounted on the substrate sheet support portions 27a, 2b provided at the upper end of the support rod 27c as shown in FIG.
7b is branched.

The ceramic substrate sheet 30 is placed in the storage case 2
8, the ceramic substrate sheet 30 stopped at the end of the transport rail 24 is first raised to a position suitable for storage by driving the lift 27, and then the movable pins 26 are driven. 3 (a), the lower end of the movable pin 26 on the left side of the ceramic substrate sheet 30 is lowered below the horizontal position of the ceramic substrate sheet 30.
Is moved in the horizontal direction on the right side to store the ceramic substrate sheet 30 in the storage case 28.

[0013]

However, there are the following problems when the above-described ceramic substrate sheet 30 is transported and when the ceramic substrate sheet 30 is stored in the storage case 28.

FIG. 6 is a vertical sectional view of the substrate receiving portion 24a of the transport rail 24 when the ceramic substrate sheet 30 is transported. As shown in FIG. 6, the substrate receiving portion 24a has a completely flat surface. It is difficult to perform the process, and fine irregularities 24c are formed in some places.

On the other hand, as shown in FIG. 3, a planar corner chamfered portion 13 is formed on the ceramic substrate sheet 30 in order to prevent catching or the like during transportation. The angle with 13 is 9
The angle is obtuse beyond 0 °. However, the angle between the main surface 18 and the corner chamfer 13 is approximately 90 degrees as before.
Or an acute angle of more than 90 ° due to warpage of the ceramic substrate sheet 30 or the like. for that reason,
When the ceramic substrate sheet 30 is conveyed, the front end of the ceramic substrate sheet 30 is placed on the substrate receiving portion 24 a
There is a problem that the robot may be stopped by being caught by the robot.

In this case, in the case of a ceramic substrate sheet having no conductor layer formed inside, since the thickness of the green molded body is relatively thin, a corner portion is subjected to a punching process or the like before firing to form a curved surface. However, it is possible to prevent the transport rail 24 from being caught to some extent. However, in the case of the ceramic substrate sheet 30 in which the multilayer wiring is formed, if the same punching processing is performed, the internal wiring is damaged, and it is difficult to perform the punching processing.

Further, even when the ceramic substrate sheet 30 is stored in the storage case 28 shown in FIG. 5, the ceramic substrate sheet 30 may be caught on the shelf 28a of the storage case 28 and the storage operation may be interrupted. was there.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to smoothly transfer and store a ceramic substrate sheet using a transfer device when storing the ceramic substrate sheet in a storage case. It is an object of the present invention to provide a ceramic substrate sheet that can be used, a method of conveying the ceramic substrate sheet, and a method of storing the ceramic substrate sheet in a storage case.

[0019]

In order to achieve the above object, a ceramic substrate sheet according to the present invention comprises:
In a ceramic substrate sheet having dummy portions at least at both ends, at least two adjacent corner portions are chamfered in a thickness direction.

According to the ceramic substrate sheet, at least two adjacent corners are chamfered in the thickness direction, and the angle between the chamfer and the main surface near the corner is much larger than 90 °. It is obtuse. Therefore, even when the corner portion comes into contact with the board receiving portion of the transfer rail constituting the transfer device or the shelf of the storage case when the ceramic substrate sheet is transferred by the transfer device or when the ceramic substrate sheet is stored in the storage case, catching occurs. Therefore, the transfer operation and the storage operation can be smoothly performed, and the interruption of the transfer operation and the storage operation in the storage case due to the catch can be prevented.

Further, in the method of conveying a ceramic substrate sheet according to the present invention, a conveying apparatus including a pair of conveying rails each including a side wall and a substrate sheet receiving portion and having a substantially L-shaped cross section is used. When the ceramic substrate sheet is conveyed, the corner portion of the ceramic substrate sheet on which the chamfering process has been performed is positioned on the front side in the traveling direction and is conveyed.

According to the method of conveying a ceramic substrate sheet, the corner portion subjected to the chamfering process is positioned at the front side in the traveling direction and is conveyed, so that the corner portion comes into contact with the substrate receiving portion of the conveying rail. The ceramic substrate sheet can be smoothly transported by the transport device without being caught, and the occurrence of a situation such as interruption of the transport operation due to the catch can be prevented.

Further, according to the method of storing a ceramic substrate sheet in a storage case according to the present invention, when the ceramic substrate sheet according to claim 1 is stored in a storage case in which shelves are formed in multiple stages in a vertical direction. It is characterized in that the corner portion of the sheet, on which the chamfering process has been performed, is stored on the storage case side.

According to the method for storing a ceramic substrate sheet described above, since the corner portion subjected to the chamfering process is positioned at the front side in the traveling direction to store the ceramic substrate sheet, even if the corner portion contacts the shelf of the storage case. The ceramic substrate sheet can be smoothly stored in the storage case without being caught, and the occurrence of a situation such as interruption of the storage operation due to the caught can be prevented.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a ceramic substrate sheet, a method of conveying the ceramic substrate sheet, and a method of storing the ceramic substrate sheet in a storage case according to the present invention will be described below with reference to the drawings. The type of the ceramic substrate sheet targeted in the present embodiment is not particularly limited, as long as it includes a ceramic multilayer wiring board for mounting one or more electronic components. In the following description, the same type as the ceramic substrate sheet 30 shown in FIG. 3 will be described as an example.

The constituent material of the ceramic substrate sheet is not particularly limited. For example, alumina, mullite,
Examples thereof include glass ceramic, aluminum nitride, and silicon carbide. Usually, glass ceramic is used.

FIG. 1A is a partially enlarged perspective view schematically showing a corner portion of the ceramic substrate sheet according to the embodiment, and FIG. 1B is a partially enlarged bottom view.

As in the conventional case, the upper and lower right corners (b)
In the figure, the corner chamfered portion 13 is formed so that the angle α of the side surface 17 with respect to the extension surface is about 45 °. In the case of the ceramic substrate sheet 10 according to the present embodiment,
In addition to the corner chamfered portion 13, the thickness direction chamfered portion 1
5 are formed, and the thickness-direction chamfered portion 15 has a trapezoidal shape. Therefore, 15a is referred to as an upper base and 15b is referred to as a lower base.

In FIG. 1, the chamfered portion 15 in the thickness direction is formed in the corner chamfered portion 13, but the chamfered portion 15 in the thickness direction is formed directly on a corner portion having no corner chamfered portion and a right angle in plan view. May be. In addition, the chamfers 15 in the thickness direction are formed at two adjacent corners to convey the ceramic substrate sheet 10,
When storing in the storage case 28, the two corners on which the thickness direction chamfered portions 15 are formed are located on the front side in the traveling direction (storage direction). Is formed, it is not necessary to worry about the position of the thickness direction taking part 15 when carrying.

The dimensions of the chamfer 15 in the thickness direction differ depending on the size of the chamfer 13 in the corner. Is preferably 0.3 to 0.6 mm, or b is preferably about 30 to 50% of the thickness a of the ceramic substrate sheet 10. (A) The horizontal distance c between the left end of the upper bottom 15a and the left end of the lower bottom 15b in the figure is preferably 1.0 to 5.0 mm,
Further, c / b is preferably 3 to 10.

The thickness-direction chamfered portion 15 can be formed by grinding with a grinding plate or the like. Before firing the green sheet laminate, a cut is made with a razor-shaped sharp blade or the like, and the thickness direction chamfered portion 15 is formed. A portion corresponding to the chamfered portion 15 may be formed.

Next, a method of transporting the ceramic substrate sheet 10 having the chamfered portion 15 in the thickness direction will be described. The transfer of the ceramic substrate sheet 10 is performed using the transfer device 20 shown in FIG. FIG. 2 is a perspective view of the transfer rail 24 and the ceramic substrate sheet 10 (FIG. 1) when the ceramic substrate sheet 10 is transferred using the transfer device 20.
FIG. 3 is a cross-sectional view schematically illustrating a ceramic substrate sheet 10 shown in FIG.

As is clear from FIG. 2, the corner chamfered portion 15 of the ceramic substrate sheet 10 is further formed with the chamfered portion 15 in the thickness direction.
3 does not come into contact with the substrate receiving portion 24a of the transport rail 24, and the lower main surface 18b and the thickness-direction chamfered portion 15
Is an obtuse angle far greater than 90 °. Therefore, even if the uneven portion 24c exists in the substrate receiving portion 24a, the uneven portion 24c and the ceramic substrate sheet 10
There is no big friction or catch between
The ceramic substrate sheet 10 can be transported smoothly.

When the ceramic substrate sheet 10 is stored in the storage case 28 shown in FIG. 5, since the ceramic substrate sheet 10 is formed with the chamfer 15 in the thickness direction,
The ceramic substrate sheet 10 is placed on the shelf 28a of the storage case 18.
The ceramic substrate sheet 10 can be smoothly stored in the storage case 28 without being caught in the storage case 28.

[0035]

Embodiments and Comparative Examples Hereinafter, embodiments of a ceramic substrate sheet, a method of conveying the ceramic substrate sheet, and a method of storing the ceramic substrate sheet in a storage case according to the present invention will be described with reference to the drawings.

As a comparative example 1, a ceramic substrate sheet having no corner chamfered at the corner portion was used. As a comparative example 2, a ceramic substrate sheet 30 having only the corner chamfered portion 13 at the corner portion was used. A transport test using the transport device 20 and a storage test in the storage case 28 were performed in the same manner as in the above case. The conditions and results of the examples and comparative examples are shown below. The following conditions (i) to (iV) are common to the examples and the comparative examples.

(1) Production of ceramic substrate sheet (i) Production of green sheet Slurry: ceramic mixed powder (alumina powder: 50 to 3)
5 wt%, glass powder: 50 to 65 wt%), resin, organic solvent, and plasticizer Molding method: doctor blade method Green sheet thickness: 250 μm (ii) Formation of conductor paste layer Conductor paste: Ag powder, resin (2 (5 wt%), solvent, etc. Thickness of conductive paste layer: 8 to 15 μm (iii) Preparation and firing of green sheet laminate Number of laminated green sheets: 5 Lamination temperature: 80 ° C., lamination pressure ： 100kg / c
m ² firing atmosphere: air atmosphere, firing temperature: 890 ° C., firing time: 3 hours (iV) Dimensions and the like of manufactured ceramic substrate sheet Material: glass ceramic Ceramic substrate sheet outer diameter: 100 mm × 100 mm
× 1.0 mm (V) Corner chamfering process Comparative Example 1: No chamfering process Comparative Example 2: Forming only the corner chamfered portion 13 Width d of the corner chamfered portion 13 (FIG. 3): 4.0 mm Example 1: Corner chamfering In addition to the portion 13, a chamfered portion 15 in the thickness direction is formed. Dimensions of the chamfered portion 15 in the thickness direction (FIG. 1 (a)) A vertical distance b between the upper bottom 15a and the main surface 18: 0.5 mm. Horizontal distance c from the left end: 3.
0 mm Example 2: Only the chamfer in the thickness direction is formed In this case, the shape of the chamfer in the thickness direction is an isosceles triangle.

Dimension of the base of the isosceles triangle: 5.6 m
m, height of the isosceles triangle: 2.8 mm (2) Transport test 1000 ceramic substrate sheets (samples) according to each of the examples and comparative examples were manufactured, and the transport device 20 (FIG. 4) was used. The conveyance was repeated 1,000 times, and the degree of occurrence of catch was observed.

(3) Storage Test Attempting to store 1000 pieces of the ceramic substrate sheets (samples) according to the respective Examples and Comparative Examples in the storage case 28 using the storage device shown in FIG. Was observed.

(4) Results The results are shown in Table 1 below.

[0041]

[Table 1]

As is clear from the results shown in Table 1 above, the conventional ceramic substrate sheets (Comparative Examples 1 and 2) were considerably caught, whereas the ceramic substrate sheets according to the Examples were considerably caught. In this case, almost no snagging occurred, and the transfer could be smoothly carried out in the storage case.

[Brief description of the drawings]

FIG. 1A is a partially enlarged perspective view schematically showing a corner portion of a ceramic substrate sheet according to an embodiment of the present invention, and FIG. 1B is a partially enlarged bottom view.

FIG. 2 is a longitudinal sectional view of a substrate receiving portion of a transport rail when a ceramic substrate sheet is being transported.

FIG. 3A is a plan view schematically showing a conventional ceramic substrate sheet, and FIG. 3B is a plan view showing I in FIG.
FIG. 2 is a sectional view taken along line I.

FIG. 4A is a side view schematically illustrating an example of a transfer device, and FIG. 4B is a cross-sectional view taken along line II-II in FIG.

5A is a side view schematically showing the vicinity of a device for storing a ceramic substrate sheet and a storage case, and FIG. 5B is a cross-sectional view taken along line III-III in FIG.

FIG. 6 is a longitudinal sectional view of a substrate receiving portion of a transport rail when a ceramic substrate sheet is being transported.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Ceramic board sheet 14 Dummy part 15 Chamfer part in thickness direction 24 Transfer rail 24a Board receiving part 24b Side wall 28 Storage case 28a Shelf

Claims (3)

[Claims] 1. A ceramic substrate sheet having dummy portions at least at both ends, wherein at least two adjacent corner portions are chamfered in a thickness direction. 2. The method according to claim 1, wherein the transfer of the ceramic substrate sheet is performed using a transfer device including a pair of transfer rails each having a side wall and a substrate sheet receiving portion and having a substantially L-shaped cross section. A method of conveying a ceramic substrate sheet, wherein a corner portion of a sheet subjected to chamfering processing is positioned at a front side in a traveling direction and is conveyed. 3. When the ceramic substrate sheet according to claim 1 is stored in a storage case in which shelves are formed in multiple stages in a vertical direction, a corner portion of the ceramic substrate sheet that has been chamfered is positioned on the storage case side. A method for storing a ceramic substrate sheet in a storage case, wherein the ceramic substrate sheet is stored.