JPH10216500A - Vacuum vessel and film forming device using same - Google Patents

Vacuum vessel and film forming device using same

Info

Publication number
JPH10216500A
JPH10216500A JP9026544A JP2654497A JPH10216500A JP H10216500 A JPH10216500 A JP H10216500A JP 9026544 A JP9026544 A JP 9026544A JP 2654497 A JP2654497 A JP 2654497A JP H10216500 A JPH10216500 A JP H10216500A
Authority
JP
Japan
Prior art keywords
vessel body
container body
outer peripheral
peripheral wall
cooling water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9026544A
Other languages
Japanese (ja)
Other versions
JP3002649B2 (en
Inventor
Hirotsugu Takizawa
洋次 瀧澤
Hideki Mori
秀樹 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Engineering Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Priority to JP9026544A priority Critical patent/JP3002649B2/en
Publication of JPH10216500A publication Critical patent/JPH10216500A/en
Application granted granted Critical
Publication of JP3002649B2 publication Critical patent/JP3002649B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration of a vessel body and to attain sufficient cooling effect by equipping a cylindrical vessel body having unwelded structure inside and having a gas introducing port and a gas discharge port at the outer peripheral wall thereof with a cooling channel having a cooling water inlet and a cooling water outlet and formed by selectively cutting the outer peripheral wall thereof. SOLUTION: By using a cylindrical vessel body 11 made of stainless steel inside which there is no welded part, even if highly corrosive gas such as silane, arsine, or chlorine is present in the vessel body 11, the deterioration in the vessel body 11 with secular change is eliminated and no leakage to the outside occurs. The outer peripheral wall of the vessel body 11 is subjected to working with a lot of steps by cutting it to constitute a cooling water channel 13 by the vessel body 11 and a pressing plate 12 made of stainless steel. Then, the area of the channel 13 in contact with the vessel body 11 is sufficiently provided and cooling water uniformly flows in the channel to obtain sufficient cooling effect. As a result, the deterioration of the vessel body 11 is prevented and sufficient cooling effect is obtained by the cooling channel.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、容器本体に改良を
施した真空容器及びこれを用いた成膜装置気相成長成膜
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum container having an improved container body and a film forming apparatus using the same.

【0002】[0002]

【従来の技術】従来、ウェハ等の被処理物に例えば蒸着
を行なう際、例えば図1に示すような真空容器1が用い
られている。ここで、真空容器1は、ステンレス製のパ
イプ2と、このパイプ2の外周壁に巻き付けるように設
けられた冷却用のステンレス製の配管3と、パイプ2の
上端部及び下端部に取り付けられた環状のフランジ4と
から構成されている。ここで、前記配管3は溶接(溶接
部5)によりパイプ2の外周壁に固定され、フランジ4
もパイプ2の内側に沿って周状に溶接(溶接部6)する
ことにより固定されている。
2. Description of the Related Art Conventionally, for example, when vapor deposition is performed on an object to be processed such as a wafer, a vacuum vessel 1 as shown in FIG. 1 is used. Here, the vacuum vessel 1 was attached to a stainless steel pipe 2, a cooling stainless steel pipe 3 provided to be wound around the outer peripheral wall of the pipe 2, and an upper end and a lower end of the pipe 2. And an annular flange 4. Here, the pipe 3 is fixed to the outer peripheral wall of the pipe 2 by welding (welded portion 5), and the flange 4
Is also fixed by welding (welded portion 6) circumferentially along the inside of the pipe 2.

【0003】ところで、図1の真空容器の場合、チャン
バ1の内側が溶接部6によりフランジ4と溶接された構
成となっている。従って、かかるチャンバ1を用いてウ
ェハ等を処理する際、真空容器1内に材料ガスを流すた
め、材料ガスが腐食性の高いガスであると、経時変化と
共に溶接部6が劣化する恐れがある。また、図1の真空
容器は、パイプ2の外周壁に冷却用の配管3を巻き付
け、この配管3に冷却水を流すことによりパイプ2を冷
却する構成であるため、配管3がパイプ2に一部しか接
っしておらず、パイプ2を十分に冷却することができな
い。
In the case of the vacuum vessel shown in FIG. 1, the inside of the chamber 1 is welded to the flange 4 by a weld 6. Therefore, when processing a wafer or the like using such a chamber 1, a material gas flows into the vacuum vessel 1. Therefore, if the material gas is a highly corrosive gas, the welded portion 6 may be deteriorated with aging. . The vacuum vessel of FIG. 1 has a configuration in which a pipe 3 for cooling is wound around the outer peripheral wall of the pipe 2 and the pipe 2 is cooled by flowing cooling water through the pipe 3. The pipes 2 cannot be cooled sufficiently because they only touch each other.

【0004】また、従来、図2に示すような真空容器7
が知られている。この真空容器7は冷却効果を高めるた
めにパイプ8を二重壁構造とし、その空洞部9に冷却水
を溜め込むことを特徴とする。なお、フランジ4のパイ
プ8への固定は、図1の場合と同様、溶接により行なっ
ている。しかし、図2の真空容器の場合も、図1の真空
容器と同様、溶接部の劣化の恐れがある。また、冷却部
の溜め込み方式は、冷却水がパイプ8に対し均等な流れ
を与えず、パイプ8の冷却が不十分であるとともに、冷
却水が真空容器7内に漏れる危険性がある。
Conventionally, a vacuum vessel 7 as shown in FIG.
It has been known. The vacuum vessel 7 is characterized in that the pipe 8 has a double wall structure in order to enhance the cooling effect, and the cooling water is stored in the hollow portion 9 thereof. The fixing of the flange 4 to the pipe 8 is performed by welding as in the case of FIG. However, also in the case of the vacuum vessel of FIG. 2, there is a possibility that the welded portion is deteriorated as in the case of the vacuum vessel of FIG. In addition, in the cooling system of the cooling unit, the cooling water does not give an even flow to the pipe 8 and the cooling of the pipe 8 is insufficient, and the cooling water may leak into the vacuum vessel 7.

【0005】更に、図1又は図2の真空容器も、気相成
長成膜装置の一構成としてに用いた場合、パイプの冷却
が十分でないため、容器内に導入されたガスが比較的温
度が高いパイプ内壁で反応してパーティクルが発生し、
これが被処理物に悪影響を及ぼすおそれがある。
Further, when the vacuum vessel shown in FIG. 1 or FIG. 2 is also used as one component of a vapor phase growth film forming apparatus, the gas introduced into the vessel has a relatively low temperature due to insufficient cooling of the pipe. Particles are generated by reacting on the high pipe inner wall,
This may adversely affect the object to be processed.

【0006】[0006]

【発明が解決しようとする課題】本発明は上記事情を考
慮してなされたもので、第一に、内側が非溶接構造の円
筒状の容器本体を用いることにより容器本体の劣化を防
止するとともに、この容器本体の外周壁に該外周壁を選
択的に削ることによって形成される冷却用の水路を設
け、この水路に冷却水を流すことにより、十分な冷却効
果を有する真空容器を提供することを目的とする。第
二、こうした真空容器を用いることにより、パーティク
ルの悪影響もなく良好な環境中で被処理物を処理しえる
気相成長成膜装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances. First, by using a cylindrical container body having a non-welded structure on the inside, deterioration of the container body is prevented. By providing a cooling water channel formed by selectively shaving the outer peripheral wall on the outer peripheral wall of the container body, and supplying cooling water through the water channel, to provide a vacuum container having a sufficient cooling effect. With the goal. Second, by using such a vacuum vessel, it is an object to provide a vapor deposition apparatus capable of processing an object to be processed in a favorable environment without adverse effects of particles.

【0007】[0007]

【課題を解決するための手段】本願第1の発明は、内部
に被処理物が配置される、内側が非溶接構造の円筒状の
容器本体と、この容器本体の外周壁に該外周壁を選択的
に削ることによって形成された冷却用の水路と、この水
路に冷却水を導入,排出する水路入口管及び水路出口管
と、前記容器本体に設けられたガス導入口及びガス排出
口とを具備することを特徴とする真空容器である。
According to a first aspect of the present invention, there is provided a cylindrical container body having a non-welded structure inside, in which an object to be treated is disposed, and the outer peripheral wall provided on the outer peripheral wall of the container body. A cooling water channel formed by selective shaving, a water channel inlet pipe and a water channel outlet pipe for introducing and discharging cooling water into the water channel, and a gas inlet and a gas outlet provided in the container body. It is a vacuum container characterized by comprising.

【0008】本願第2の発明は、請求項1記載の真空容
器と、前記容器本体内に配置されて前記被処理物を載置
するホルダーと、このホルダーを駆動する駆動系とを具
備することを特徴とする気相成長成膜装置である。
According to a second aspect of the present invention, there is provided a vacuum vessel according to the first aspect, a holder disposed in the vessel body for mounting the object to be processed, and a drive system for driving the holder. Which is a vapor deposition film forming apparatus.

【0009】本発明において、内側に溶接箇所が全くな
い容器本体を用いると、容器本体内にたとえ腐食性が高
いガスが存在しても、経時変化と共に容器本体内が劣化
することなく、ガスが外部へ漏れることもない。また、
容器本体の外周壁に該外周壁を選択的に削ることによっ
て形成される冷却用の水路を設け、水路入口管から冷却
水を水路へ導入し水路出口管から排出することにより、
水路の容器本体に接触する面積が従来(図1)の場合と
十分とれ、また水路を冷却水が均等に流れ、十分な冷却
効果を有する。
In the present invention, when a container body having no welding portion inside is used, even if a highly corrosive gas is present in the container body, the gas is not deteriorated with time and the inside of the container body is deteriorated. There is no leakage to the outside. Also,
By providing a cooling water channel formed by selectively shaving the outer peripheral wall on the outer peripheral wall of the container body, introducing cooling water into the water channel from the water channel inlet pipe and discharging it from the water channel outlet pipe,
The area of the channel in contact with the container body is sufficient compared with the conventional case (FIG. 1), and the cooling water flows evenly through the channel to have a sufficient cooling effect.

【0010】[0010]

【発明の実施の形態】以下、本発明の一実施例に係る気
相成長装置についてを図3を参照して説明する。図中の
付番11は、内側に溶接箇所が全くないステンレス製の円
筒状の容器本体である。この容器本体11の上部端,下部
端には、環状のフランジ11a,11bが容器本体11と一体
となって取り付けられている。前記容器本体11の外周壁
には、該外周壁を例えばステンレス製インゴットより削
り出して多数の段付き加工が施され、容器本体11とステ
ンレス製の筒状の押え板12により螺旋状の冷却用の水路
13が構成されている。なお、前記押え板12は水路13の外
側で前記容器本体11と溶接部14で溶接されている。前記
容器本体11の最下段,最上段に位置する前記水路13に
は、夫々水路入口管15,水路出口管16が連結されてい
る。ここで、水路入口管15,水路出口管16は水路13の外
側で前記容器本体11と溶接部17で溶接されている。つま
り、ウェハを処理する際は、水路入口管15から冷却水を
導入して容器本体11の最下段側の水路13へ送り、容器本
体11の外周の水路13に沿って回りながら徐々に上方向に
送り、水路出口管16から排出するものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a vapor phase growth apparatus according to one embodiment of the present invention will be described with reference to FIG. Reference numeral 11 in the drawing denotes a stainless steel cylindrical container body having no welded portion inside. At the upper end and the lower end of the container body 11, annular flanges 11a and 11b are attached integrally with the container body 11. The outer peripheral wall of the container body 11 is cut out from, for example, a stainless steel ingot and subjected to a number of steps, and the container body 11 and the stainless steel pressing plate 12 are used for spiral cooling. Waterway
13 are configured. The holding plate 12 is welded to the container body 11 at a welding portion 14 outside the water channel 13. A water channel inlet pipe 15 and a water channel outlet pipe 16 are connected to the water channels 13 located at the lowermost stage and the uppermost stage of the container body 11, respectively. Here, the water channel inlet pipe 15 and the water channel outlet pipe 16 are welded to the container main body 11 at the welding portion 17 outside the water channel 13. In other words, when processing a wafer, cooling water is introduced from the water channel inlet pipe 15 and sent to the water channel 13 on the lowermost side of the container body 11, and gradually upward while rotating along the water channel 13 on the outer periphery of the container body 11. And discharged from the water channel outlet pipe 16.

【0011】前記容器本体11の任意の側壁には、容器本
体11内のホルダー18上にウェハ19を出し入れするウェハ
出入口20が設けられている。前記ホルダー18の内部には
ヒータ21が配置され、ホルダー18の下部はホルダー18を
回転させる駆動系22が連結されている。前記フランジ11
aには容器本体11内に反応ガスを導入するガス導入口23
が設けられ、前記フランジ11aにOリング24を介してス
テンレス製の上蓋25が設けられている。また、容器本体
11のフランジ11bには、Oリング26を介して排気口27が
形成されたステンレス製の下蓋28が設けられている。
On an arbitrary side wall of the container body 11, a wafer entrance 20 for taking a wafer 19 in and out of a holder 18 in the container body 11 is provided. A heater 21 is disposed inside the holder 18, and a drive system 22 for rotating the holder 18 is connected to a lower portion of the holder 18. The flange 11
a is a gas inlet 23 for introducing a reaction gas into the container body 11;
And an upper cover 25 made of stainless steel is provided on the flange 11a via an O-ring 24. Also, the container body
The 11 flange 11b is provided with a stainless steel lower lid 28 having an exhaust port 27 formed through an O-ring 26.

【0012】上記実施例に係る気相成長成膜装置によれ
ば、内側に溶接箇所が全くないステンレス製の円筒状の
容器本体11を用いているため、腐食性の高いガス例えば
シラン,アルシン,塩素等が容器本体11内に存在して
も、経時変化と共に容器本体11内が劣化することなく、
外部へ漏れること心配がない。また、容器本体11の外周
壁には、該外周壁を削り出すことにより多数の段付き加
工が施され、容器本体11とステンレス製の押え板12によ
り冷却用の水路13が構成されているため、水路13の容器
本体11に接触する面積が従来(図1)と比べ十分とれ、
また従来(図2)と比べ冷却水が水路13を均等に流れる
ため、十分な冷却効果を有する。更に、上記構成の真空
容器を用いて気相成長を行なうことにより、容器本体11
を十分に冷却できるため、従来のようにパーティクルが
導入ガスに起因して容器本体11の内壁に在留することな
く、これがウェハに悪影響を及ぼすことを回避できる。
ウェハに均一な膜堆積を行なうことができる。
According to the vapor phase growth film forming apparatus of the above embodiment, since the stainless steel cylindrical container body 11 having no welding portion inside is used, a highly corrosive gas such as silane, arsine, or the like is used. Even if chlorine or the like is present in the container main body 11, the container main body 11 is not degraded with time.
There is no fear of leaking outside. In addition, the outer peripheral wall of the container body 11 is subjected to a number of steps by shaving the outer peripheral wall, and a cooling water channel 13 is configured by the container body 11 and the stainless steel holding plate 12. , The area of the water channel 13 that comes into contact with the container body 11 is sufficient compared to the conventional (FIG. 1),
In addition, since the cooling water flows evenly in the water channel 13 as compared with the related art (FIG. 2), the cooling water has a sufficient cooling effect. Further, by performing vapor phase growth using the vacuum container having the above configuration, the container body 11
Can be sufficiently cooled, so that the particles do not stay on the inner wall of the container body 11 due to the introduced gas as in the related art, thereby avoiding adverse effects on the wafer.
Uniform film deposition can be performed on the wafer.

【0013】なお、上記実施例では、容器本体の外周壁
を例えばステンレス製インゴットより削り出して多数の
段付き加工が施して筒状の押え板とにより冷却用の水路
を形成する場合につて述べたが、段付き加工は他の手段
を用いてもよい。また、押え板は筒状である場合に限ら
ず、図4に示すような多数のリング状の押え板41を図5
に示すように容器本体11の外周部の段差加工部を塞ぐよ
うに溶接で設けてもよい。
In the above embodiment, the case where the outer peripheral wall of the container body is cut out of, for example, a stainless steel ingot and subjected to a number of steps to form a water channel for cooling with the cylindrical pressing plate is described. However, the stepping process may use other means. Further, the holding plate is not limited to a cylindrical shape, and a number of ring-shaped holding plates 41 as shown in FIG.
As shown in (2), it may be provided by welding so as to cover the stepped portion on the outer peripheral portion of the container body 11.

【0014】[0014]

【発明の効果】以上詳述した如く本発明によれば、第一
に、内側が非溶接構造の円筒状の容器本体を用いること
により、容器本体の劣化を防止するとともに、この容器
本体の外周壁に該外周壁を選択的に削ることによって形
成される冷却用の水路を設け、水路に冷却水を流すこと
により、十分な冷却効果を有する真空容器を提供するこ
とを目的とする。第二に、こうした真空容器を用いるこ
とにより、パーティクルの悪影響もなく良好な環境中で
被処理物を処理しえる気相成長成膜装置を提供できる。
As described above in detail, according to the present invention, firstly, the use of a cylindrical container body having a non-welded structure inside prevents the deterioration of the container body and the outer periphery of the container body. An object of the present invention is to provide a vacuum vessel having a sufficient cooling effect by providing a cooling water channel formed by selectively shaving the outer peripheral wall on a wall and flowing cooling water through the water channel. Secondly, by using such a vacuum vessel, a vapor phase deposition apparatus capable of processing an object to be processed in a favorable environment without adverse effects of particles can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来の真空容器の断面図。FIG. 1 is a cross-sectional view of a conventional vacuum vessel.

【図2】従来の他の真空容器の断面図。FIG. 2 is a sectional view of another conventional vacuum vessel.

【図3】本発明の一実施例に係る気相成長成膜装置の断
面図。
FIG. 3 is a cross-sectional view of a vapor deposition apparatus according to an embodiment of the present invention.

【図4】図3の気相成長成膜装置に用いられた押え板と
異なる別な押え板の斜視図。
FIG. 4 is a perspective view of another holding plate different from the holding plate used in the vapor deposition apparatus of FIG. 3;

【図5】図4の押え板を用いた気相成長装置の要部の説
明図。
FIG. 5 is an explanatory view of a main part of a vapor phase growth apparatus using the holding plate of FIG. 4;

【符号の説明】[Explanation of symbols]

11…容器本体、 11a,11b…フランジ、 12,41…押え板、 13…冷却用の水路、 15…水路入口管、 16…水路出口管、 18…ホルダー、 19…ウェハ、 20…ウェハ出入口、 22…駆動系、 23…ガス導入口、 25…上蓋、 27…ガス排出口、 28…下蓋。 11 ... container body, 11a, 11b ... flange, 12, 41 ... holding plate, 13 ... cooling water passage, 15 ... water passage inlet tube, 16 ... water passage outlet tube, 18 ... holder, 19 ... wafer, 20 ... wafer entrance, 22: drive system, 23: gas inlet, 25: upper lid, 27: gas outlet, 28: lower lid.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 内部に被処理物が配置される、内側が非
溶接構造の円筒状の容器本体と、この容器本体の外周壁
に該外周壁を選択的に削ることによって形成された冷却
用の水路と、この水路に冷却水を導入,排出する水路入
口管及び水路出口管と、前記容器本体に設けられたガス
導入口及びガス排出口とを具備することを特徴とする真
空容器。
1. A cylindrical container body having a non-welded structure inside, on which an object to be treated is disposed, and a cooling member formed by selectively shaving the outer peripheral wall on the outer peripheral wall of the container body. A water channel, a water channel inlet pipe and a water channel outlet pipe for introducing and discharging cooling water into and from the water channel, and a gas inlet and a gas outlet provided in the container body.
【請求項2】 請求項1記載の真空容器と、前記容器本
体内に配置されて前記被処理物を載置するホルダーと、
このホルダーを駆動する駆動系とを具備することを特徴
とする気相成長成膜装置。
2. A vacuum container according to claim 1, further comprising: a holder disposed in the container main body for mounting the object to be processed.
And a drive system for driving the holder.
JP9026544A 1997-02-10 1997-02-10 Vacuum container and film forming apparatus using the same Expired - Fee Related JP3002649B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9026544A JP3002649B2 (en) 1997-02-10 1997-02-10 Vacuum container and film forming apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9026544A JP3002649B2 (en) 1997-02-10 1997-02-10 Vacuum container and film forming apparatus using the same

Publications (2)

Publication Number Publication Date
JPH10216500A true JPH10216500A (en) 1998-08-18
JP3002649B2 JP3002649B2 (en) 2000-01-24

Family

ID=12196459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9026544A Expired - Fee Related JP3002649B2 (en) 1997-02-10 1997-02-10 Vacuum container and film forming apparatus using the same

Country Status (1)

Country Link
JP (1) JP3002649B2 (en)

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WO2007026479A1 (en) * 2005-08-30 2007-03-08 Shinmaywa Industries, Ltd. Chamber for vacuum treatment
JP2008098497A (en) * 2006-10-13 2008-04-24 Tokyo Electron Ltd Water-cooled jacket for heat treatment furnace and manufacturing method thereof
JP2008153505A (en) * 2006-12-19 2008-07-03 Nhk Spring Co Ltd Cooling apparatus for heat treatment apparatus and manufacturing method thereof
JP2013007064A (en) * 2011-06-22 2013-01-10 Ulvac Japan Ltd Vacuum vessel
CN113280676A (en) * 2021-05-19 2021-08-20 陕西斯瑞新材料股份有限公司 Novel water-cooling heat shield structure and preparation process thereof

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JP2004235226A (en) * 2003-01-28 2004-08-19 Kyocera Corp Vacuum chamber device and vacuum stage device
WO2007026479A1 (en) * 2005-08-30 2007-03-08 Shinmaywa Industries, Ltd. Chamber for vacuum treatment
JP2008098497A (en) * 2006-10-13 2008-04-24 Tokyo Electron Ltd Water-cooled jacket for heat treatment furnace and manufacturing method thereof
JP2008153505A (en) * 2006-12-19 2008-07-03 Nhk Spring Co Ltd Cooling apparatus for heat treatment apparatus and manufacturing method thereof
JP2013007064A (en) * 2011-06-22 2013-01-10 Ulvac Japan Ltd Vacuum vessel
CN113280676A (en) * 2021-05-19 2021-08-20 陕西斯瑞新材料股份有限公司 Novel water-cooling heat shield structure and preparation process thereof

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