JPH10212562A - Final annealing method for copper foil coiled stock - Google Patents
Final annealing method for copper foil coiled stockInfo
- Publication number
- JPH10212562A JPH10212562A JP9028352A JP2835297A JPH10212562A JP H10212562 A JPH10212562 A JP H10212562A JP 9028352 A JP9028352 A JP 9028352A JP 2835297 A JP2835297 A JP 2835297A JP H10212562 A JPH10212562 A JP H10212562A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- final annealing
- copper
- rolled
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、冷間圧延して得ら
れた銅箔を巻き取った巻取品（コイル）に、最終焼鈍す
る方法に関し、特に、巻取品（コイル）中で積層重合し
ている銅箔同士が接着しないように最終焼鈍する方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of final annealing a wound product (coil) obtained by winding a copper foil obtained by cold rolling, and more particularly to a method of laminating in a wound product (coil). The present invention relates to a method of final annealing so that polymerized copper foils do not adhere to each other.
【０００２】従来より、銅箔は、フレキシブルプリント
配線基板用，電池の集電体用，コンデンサの電極用，半
導体端子のリードフレーム材用等の素材として用いられ
ている。この銅箔は、銅鋳塊に均質化処理及び熱間圧延
を施して、所定厚さの銅薄板を得た後、これに冷間圧延
及び中間焼鈍を繰り返し施して、例えば５〜１００μｍ
程度の厚さとしたものである。このような銅箔は、用途
によっては柔らかさが要求されるため、最終焼鈍を施し
て軟化させる場合がある。Conventionally, copper foil has been used as a material for flexible printed wiring boards, for current collectors of batteries, for electrodes of capacitors, and for lead frame materials of semiconductor terminals. This copper foil is subjected to a homogenization treatment and hot rolling of a copper ingot to obtain a copper thin plate having a predetermined thickness, which is repeatedly subjected to cold rolling and intermediate annealing, for example, 5 to 100 μm
It is about the thickness. Since such a copper foil is required to be soft depending on the use, it may be subjected to final annealing to be softened.
【０００３】銅箔に最終焼鈍を施す方法としては、一般
に、アルミニウム箔等の金属箔と同様、冷間圧延を終え
た銅箔を巻き取ってコイル（巻取品）とし、このコイル
を焼鈍炉に入れる方法が採用されている。しかるに、ア
ルミニウム箔の場合には、コイル中のアルミニウム箔同
士の積層面が接着するということは殆ど無かったが、銅
箔の場合、最終焼鈍後において、コイル中の銅箔同士の
積層面が接着しており、巻き戻すことができないという
ことがあった。[0003] As a method of subjecting a copper foil to final annealing, generally, similarly to a metal foil such as an aluminum foil, a cold-rolled copper foil is wound into a coil (a wound product), and the coil is placed in an annealing furnace. Is adopted. However, in the case of aluminum foil, the laminated surfaces of the aluminum foils in the coil hardly adhered, but in the case of copper foil, the laminated surfaces of the copper foils in the coil were adhered after final annealing. And could not be rewound.
【０００４】[0004]
【発明が解決しようとする課題】本発明者は、最終焼鈍
時において、コイル中の銅箔同士の積層面が接着しやす
い理由を種々考察した。例えば、銅箔表面に、圧延油等
の油分が残留しているため、この油分が接着剤の如き作
用をして、銅箔同士が接着するのではないか、又は銅箔
表面に残存している銅微粉末が何らかの作用をして、銅
箔同士が接着するのではないかと考えた。残留油分や銅
微粉末を、ほぼ完全に銅箔表面から除去すると、確か
に、ある程度は銅箔同士の接着は防止できた。しかしな
がら、アルミニウム箔の場合に比べれば、箔同士の接着
は、依然として頻繁に発生した。The present inventor has considered various reasons why the laminated surfaces of the copper foils in the coil are likely to adhere to each other during the final annealing. For example, since oil such as rolling oil remains on the copper foil surface, this oil acts as an adhesive, and the copper foils may not adhere to each other or remain on the copper foil surface. We thought that the copper fine powder that had been acting might have some effect to bond the copper foils together. When the residual oil and the copper fine powder were almost completely removed from the copper foil surface, the adhesion between the copper foils could be prevented to some extent. However, adhesion between foils still occurred more frequently than in the case of aluminum foil.
【０００５】このため、本発明者は、銅箔同士の積層面
における接着は、実用的には銅箔に固有の問題であると
考え、種々検討した。その結果、銅原子は、一般の最終
焼鈍温度において、原子間結合が生じやすいということ
が判明した。即ち、銅箔同士の積層界面に存在する各々
の銅原子が、原子間結合によって結合されるため、積層
面で強固な接着が生じることが推定されたのである。原
子間結合が生じるのを防止するためには、最終焼鈍温度
をなるべく低温にして、原子間結合が生じにくいように
すること及び積層されている銅箔同士の距離を遠ざける
ことが考えられる。しかし、本発明者の知見によれば、
銅箔の場合、後者が最も有効な手段であることが分かっ
た。本発明は、このような知見に基づいてなされたもの
である。[0005] For this reason, the present inventor considered that the adhesion of the copper foils on the lamination surface is practically a problem inherent to the copper foils, and made various studies. As a result, it was found that copper atoms are likely to cause interatomic bonding at a general final annealing temperature. In other words, it is presumed that since the copper atoms present at the lamination interface between the copper foils are bonded by interatomic bonds, strong adhesion occurs on the lamination surface. In order to prevent the generation of interatomic bonds, it is conceivable to lower the final annealing temperature as much as possible so that interatomic bonds are hardly generated and to increase the distance between the laminated copper foils. However, according to the findings of the present inventors,
In the case of copper foil, the latter proved to be the most effective means. The present invention has been made based on such findings.
【０００６】[0006]
【課題を解決するための手段】即ち、本発明は、Ｃｕ含
有量が９９．９重量％以上で、厚さ５〜１００μｍの銅
箔を巻き上げた巻取品を最終焼鈍する際、該銅箔の巻き
上げ密度を９５％以下にすることを特徴とする銅箔巻取
品の最終焼鈍方法に関するものである。That is, the present invention relates to a method for producing a copper foil having a Cu content of 99.9% by weight or more and a thickness of 5 to 100 μm when the rolled product is subjected to final annealing. A final annealing method of a rolled copper foil, wherein the winding density of the copper foil is 95% or less.
【０００７】本発明において、巻き上げるべき銅箔は、
従来公知の方法で得る。即ち、銅を溶解して鋳造した銅
鋳塊に、均質化処理及び熱間圧延を施し、その後、所望
により中間焼鈍及び冷間圧延を繰り返し施して、所定厚
さ（例えば０．２ｍｍ程度）の銅薄板を得る。次いで、
この銅薄板に冷間圧延を繰り返し施して、所定厚さ（５
〜１００μｍ）の銅箔を得るのである。本発明において
は、銅鋳塊のＣｕ含有量は９９．９重量％以上であり、
したがって、銅箔のＣｕ含有量も９９．９重量％以上で
ある。銅箔のＣｕ含有量が９９．９重量％未満である
と、銅箔巻取品に最終焼鈍を施した場合、銅箔同士の積
層面における接着は生じにくく、上記した本発明の課題
は生じない。また、銅箔の厚さが１００μｍを超える場
合には、銅箔に施された冷間加工度が小さく、コイルに
して最終焼鈍を施した場合でも、積層されている銅箔同
士の接着は生じにくく、上記した本発明の課題は生じな
い。なお、銅箔の厚さを５μｍ未満にすることは、冷間
圧延では一般に困難であり、また極薄の銅箔は上記した
各種用途には一般的には用いられない。In the present invention, the copper foil to be wound is
Obtained by a conventionally known method. That is, a copper ingot in which copper is melted and cast is subjected to a homogenization treatment and hot rolling, and then, if necessary, is repeatedly subjected to intermediate annealing and cold rolling to obtain a predetermined thickness (for example, about 0.2 mm). Obtain copper sheet. Then
This copper thin plate is repeatedly subjected to cold rolling to obtain a predetermined thickness (5
〜100 μm). In the present invention, the Cu content of the copper ingot is 99.9% by weight or more,
Therefore, the Cu content of the copper foil is also 99.9% by weight or more. If the Cu content of the copper foil is less than 99.9% by weight, when the final annealing is performed on the copper foil rolled product, the adhesion of the copper foils to each other on the laminated surface is difficult to occur, and the above-described problem of the present invention occurs. Absent. Further, when the thickness of the copper foil exceeds 100 μm, the degree of cold working applied to the copper foil is small, and even when the coil is subjected to final annealing, adhesion between the laminated copper foils occurs. And the above-mentioned problem of the present invention does not occur. It is generally difficult to make the thickness of the copper foil less than 5 μm by cold rolling, and an ultra-thin copper foil is not generally used for the above-mentioned various uses.
【０００８】このようにして得られた銅箔を、巻き上げ
密度が９５％以下、好ましくは９５〜９０％となるよう
に巻き上げてコイル（巻取品）として、最終焼鈍を施
す。ここで、巻き上げ密度は、以下の式で算出されるも
のである。即ち、巻き上げ密度（％）＝［４Ｌｔ／３．
１４（Ｄ2−ｄ2）］×１００で算出されるものである。
この式中、Ｌは巻き取った銅箔の全長（ｍｍ）を表し、
ｔは銅箔の厚さ（ｍｍ）を表し、Ｄは巻上ダイア（ｍ
ｍ）を表し、ｄは巻芯（一般には鋼管が用いられる。）
の外径（ｍｍ）を表す。巻き上げ密度が９５％を超える
と、最終焼鈍時に、銅箔同士の積層面に接着が生じやす
くなるため、好ましくない。なお、巻き上げ密度を９０
％以下にすると、銅箔を巻き取ったコイルが不安定（例
えば、巻芯が外れやすくなる等）となり、取り扱いにく
い傾向が生じる。[0008] The copper foil thus obtained is rolled up to a winding density of 95% or less, preferably 95 to 90%, and subjected to final annealing as a coil (rolled product). Here, the winding density is calculated by the following equation. That is, the winding density (%) = [4Lt / 3.
14 (D 2 −d 2 )] × 100.
In this formula, L represents the total length (mm) of the wound copper foil,
t represents the thickness (mm) of the copper foil, and D represents the winding diameter (m
m), and d is a core (generally, a steel pipe is used).
Represents the outer diameter (mm) of If the winding density exceeds 95%, adhesion tends to occur on the laminated surfaces of the copper foils at the time of final annealing, which is not preferable. The winding density is 90
%, The coil around which the copper foil is wound becomes unstable (for example, the core is easily detached), and the coil tends to be difficult to handle.
【０００９】銅箔のコイルを最終焼鈍する際、その温度
は、１５０〜２７０℃であるのが好ましい。温度が１５
０℃未満であると、最終焼鈍時間を長くしないと、銅箔
が軟化しにくくなり、生産効率が悪くなる。また、温度
が２７０℃を超えると、最終焼鈍時に、銅箔同士の積層
面が接着しやすくなる傾向が生じる。また、最終焼鈍時
間は、従来採用されている程度の時間でよく、巻取製品
のコイルの大きさによる伝熱の程度にもよるが、例えば
１〜１０時間程度であれば良い。最終焼鈍時間が１時間
未満になると、比較的高い温度で最終焼鈍しても、銅箔
が十分に軟化しない傾向が生じる。また、最終焼鈍時間
を１０時間以上にすると、生産効率が悪くなる。When the copper foil coil is finally annealed, its temperature is preferably 150 to 270 ° C. Temperature 15
If the temperature is less than 0 ° C., unless the final annealing time is lengthened, the copper foil becomes difficult to soften, and the production efficiency deteriorates. On the other hand, when the temperature exceeds 270 ° C., the laminated surfaces of the copper foils tend to easily adhere to each other during the final annealing. Further, the final annealing time may be a time that is conventionally employed, and may be, for example, about 1 to 10 hours, depending on the degree of heat transfer depending on the size of the coil of the wound product. If the final annealing time is less than one hour, the copper foil tends not to be sufficiently softened even if the final annealing is performed at a relatively high temperature. Further, if the final annealing time is set to 10 hours or more, the production efficiency deteriorates.
【００１０】本発明においては、銅箔の冷間加工度との
関係において、図１のＡＢＣＤＥＦＧＨに囲まれた範囲
内の条件を満足する温度で最終焼鈍を行うのが好まし
い。即ち、銅箔の冷間加工度が大きいほど、温度を低く
して最終焼鈍を行うのが好ましく、また、銅箔の冷間加
工度が小さいほど、温度を高くして最終焼鈍を行うのが
好ましい。従って、図１のＡＢＣＤの線より上方の範囲
（最終焼鈍温度が高い範囲）で最終焼鈍を施すと、銅箔
同士の積層面が接着する恐れが生じる。逆に、図１のＨ
ＧＦＥの線より下方の範囲（最終焼鈍温度が低い範囲）
で最終焼鈍を施すと、銅箔が軟化しにくく、最終焼鈍時
間が長くなって、生産効率が低下する傾向が生じる。こ
のように、銅箔の冷間加工度が大きいほど、温度を低く
して最終焼鈍しなければならない理由は、銅箔の冷間加
工度が大きくなると、銅箔の再結晶温度が下がり、コイ
ル中の銅箔同士の積層面で原子間結合が生じやすくなる
ためと推定される。従って、銅箔の冷間加工度が大きい
ときは、最終焼鈍温度をなるべく低くして、銅箔同士の
積層面で原子間結合が生じにくいようにしなければなら
ない。In the present invention, the final annealing is preferably performed at a temperature that satisfies the conditions within the range surrounded by ABCDEFGH in FIG. 1 in relation to the degree of cold work of the copper foil. That is, as the degree of cold working of the copper foil is larger, it is preferable to perform the final annealing at a lower temperature, and as the degree of cold working of the copper foil is smaller, it is preferable to perform the final annealing at a higher temperature. preferable. Therefore, when the final annealing is performed in a range above the ABCD line in FIG. 1 (a range in which the final annealing temperature is high), there is a possibility that the laminated surfaces of the copper foils may adhere to each other. Conversely, H in FIG.
Range below GFE line (range where final annealing temperature is low)
When the final annealing is performed, the copper foil is hardly softened, the final annealing time is prolonged, and the production efficiency tends to decrease. Thus, the reason that the higher the degree of cold working of the copper foil is, the lower the temperature must be and the final annealing is performed, the higher the degree of cold working of the copper foil becomes, the lower the recrystallization temperature of the copper foil becomes, It is presumed that interatomic bonding is likely to occur on the stacking surfaces of the copper foils in the middle. Therefore, when the degree of cold working of the copper foil is large, the final annealing temperature must be lowered as much as possible so that interatomic bonding is unlikely to occur on the laminated surface of the copper foils.
【００１１】ここで、銅箔の冷間加工度とは、所定厚さ
（例えば０．２ｍｍ程度）の銅薄板を得た後、焼鈍等で
充分に再結晶させ、次いで冷間圧延を一回又は二回以上
施して所望厚さの銅箔を得る際における冷間加工度を意
味しており、次のような式で算出されるものである。即
ち、冷間加工度（％）＝［（ｔ0−ｔ1）／ｔ0］×１０
０なる式で算出されるものである。ここで、ｔ0は焼鈍
等で再結晶させた銅薄板の厚さ（ｍｍ）を表し、ｔ1は
冷間加工後の銅箔の厚さ（ｍｍ）を表す。例えば、焼鈍
等で再結晶させた銅薄板の厚さが０．２ｍｍであれば、
冷間加工度９７．５％の銅箔と言うのは、冷間加工後の
厚さが５μｍの銅箔のことである。同様に、冷間加工度
９６．５％の銅箔は厚さが７μｍであり、冷間加工度９
６．０％の銅箔は厚さが８μｍであり、冷間加工度９
４．０％の銅箔は厚さが１２μｍであり、冷間加工度９
３．５％の銅箔は厚さが１３μｍであり、冷間加工度８
７．５％の銅箔は厚さが２５μｍであり、冷間加工度８
７．０％の銅箔は厚さが２６μｍであり、冷間加工度８
０．０％の銅箔は厚さが４０μｍであり、冷間加工度７
９．５％の銅箔は厚さが４１μｍである。[0011] Here, the cold working degree of the copper foil means that after obtaining a copper thin plate having a predetermined thickness (for example, about 0.2 mm), it is sufficiently recrystallized by annealing or the like, and then cold rolled once. Alternatively, it means the degree of cold working when a copper foil having a desired thickness is obtained by performing the coating twice or more times, and is calculated by the following equation. That is, the degree of cold working (%) = [(t 0 −t 1 ) / t 0 ] × 10
0 is calculated. Here, t 0 represents the thickness (mm) of the copper thin plate recrystallized by annealing or the like, and t 1 represents the thickness (mm) of the copper foil after cold working. For example, if the thickness of the copper sheet recrystallized by annealing or the like is 0.2 mm,
The term “copper foil having a cold working degree of 97.5%” refers to a copper foil having a thickness of 5 μm after cold working. Similarly, a copper foil having a cold work degree of 96.5% has a thickness of 7 μm and a cold work degree of 9
6.0% copper foil has a thickness of 8 μm and a cold working degree of 9%.
4.0% copper foil has a thickness of 12 μm and a cold working degree of 9%.
3.5% copper foil has a thickness of 13 μm and a cold work degree of 8
7.5% copper foil has a thickness of 25 μm and a cold work degree of 8
The 7.0% copper foil has a thickness of 26 μm and a cold work degree of 8
0.0% copper foil has a thickness of 40 μm and a cold working degree of 7
The 9.5% copper foil has a thickness of 41 μm.
【００１２】また、本発明においては、巻き上げる前の
銅箔に洗浄処理を施して、銅箔表面から、銅微粉末や圧
延油等を除去しておくのが好ましい。銅微粉末が銅箔表
面に存在すると、コイル中の銅箔同士の積層面に銅微粉
末が介在することになり、この箇所で銅箔に過大な局部
応力が生じやすくなることがある。即ち、銅微粉末と銅
箔とが強く圧着された状態となると、最終焼鈍時におい
て、銅微粉末と銅箔とが接着しやすくなり、その結果、
銅箔同士の積層面においても接着しやすくなるため、銅
箔表面から銅微粉末を除去しておくのが好ましい。更
に、銅微粉末の周囲には、往々にして圧延油中の極性物
質が吸着していることが認められ、この極性物質は強く
吸着する性質があり、それ故、局部的に濃縮される結果
になり、銅箔同士が接着する原因ともなると推定され
る。また、圧延油が銅箔表面に多量に存在していると、
最終焼鈍時に圧延油が燃焼し、その残渣が銅箔表面に残
る。そして、この残渣には、粘着性を持つものもあり、
銅箔同士の積層面が接着しやすくなるため、銅箔表面か
ら圧延油を除去しておくのが好ましい。また、銅微粉末
や圧延油以外のものであっても、銅箔同士の接着を促進
する作用を有する可能性があるため、なるべく、銅箔表
面には不純物が存在しない方が好ましい。In the present invention, it is preferable that the copper foil before winding is subjected to a washing treatment to remove copper fine powder, rolling oil and the like from the copper foil surface. If the copper fine powder is present on the surface of the copper foil, the copper fine powder will intervene on the lamination surface of the copper foils in the coil, and an excessive local stress may easily occur in the copper foil at this location. That is, when the copper fine powder and the copper foil are in a state of being strongly pressed, during the final annealing, the copper fine powder and the copper foil are easily bonded, and as a result,
It is preferable to remove fine copper powder from the surface of the copper foil because the copper foil can be easily adhered even on the laminated surface. Furthermore, it is recognized that the polar substance in the rolling oil is often adsorbed around the copper fine powder, and this polar substance has a property of strongly adsorbing, and therefore, is locally concentrated. , And it is presumed that this also causes the copper foils to adhere to each other. Also, if a large amount of rolling oil is present on the copper foil surface,
During the final annealing, the rolling oil burns, and the residue remains on the copper foil surface. And some of these residues have stickiness,
It is preferable to remove the rolling oil from the surface of the copper foil since the lamination surfaces of the copper foils easily adhere to each other. In addition, even if it is other than copper fine powder or rolling oil, there is a possibility that it has an effect of promoting adhesion between copper foils. Therefore, it is preferable that impurities are not present on the copper foil surface as much as possible.
【００１３】銅箔表面から銅微粉末や圧延油等を除去す
る方法としては、従来公知の脱脂処理又は洗浄処理を採
用すれば良い。例えば、巻き上げる前の銅箔を、有機溶
剤（例えば石油系溶剤）や塩素系溶剤等の非水溶液より
なる洗浄液、又はこの非水溶液に所望により陰イオン界
面活性剤等の界面活性剤を含有させた洗浄液にて、脱脂
及び洗浄処理すれば良い。このような処理によって、銅
箔表面から銅微粉末はほぼ完全に除去することができ
る。また、圧延油については、残留油分が３ｍｇ／ｍ2
以下となる程度まで除去することができる。As a method for removing copper fine powder, rolling oil and the like from the copper foil surface, a conventionally known degreasing treatment or cleaning treatment may be employed. For example, a copper foil before winding is washed with a non-aqueous solution such as an organic solvent (eg, a petroleum-based solvent) or a chlorine-based solvent, or a surfactant such as an anionic surfactant is optionally contained in the non-aqueous solution. Degreasing and cleaning may be performed with a cleaning liquid. By such a treatment, the copper fine powder can be almost completely removed from the copper foil surface. For the rolling oil, the residual oil content was 3 mg / m 2.
It can be removed to the following degree.
【００１４】[0014]
実施例１ Ｃｕ含有量が９９．９重量％以上の銅鋳塊を作成し、従
来公知の方法で均質化処理し、熱間圧延及び冷間圧延を
施した後、焼鈍等で再結晶させた２００μｍの銅薄板を
得た。この銅薄板に、冷間圧延を施して、厚さ９μｍ
（冷間加工度９５．５％）の銅箔を得た。この銅箔を、
石油系溶剤と陰イオン界面活性剤を含有する溶液で洗浄
し、銅箔表面に付着している銅微粉末及び圧延油等を取
り除いた。洗浄後、この銅箔を、巻き上げ密度が９０％
となるようにして、鋼管に巻き取って巻取品を得た。こ
の巻取品を、温度２００℃で５時間の条件で、最終焼鈍
を行った。最終焼鈍を終えた銅箔巻取品を巻き戻したと
ころ、銅箔同士の接着もなく、スムースに巻き戻せた。Example 1 A copper ingot having a Cu content of 99.9% by weight or more was prepared, homogenized by a conventionally known method, subjected to hot rolling and cold rolling, and then recrystallized by annealing or the like. A 200 μm thin copper plate was obtained. This copper thin plate is subjected to cold rolling to a thickness of 9 μm.
A copper foil having a (cold work ratio of 95.5%) was obtained. This copper foil,
It was washed with a solution containing a petroleum solvent and an anionic surfactant to remove copper fine powder, rolling oil, and the like adhering to the copper foil surface. After washing, the copper foil is rolled up to 90%
And wound up on a steel pipe to obtain a rolled product. This rolled product was finally annealed at a temperature of 200 ° C. for 5 hours. When the copper foil wound product after the final annealing was rewound, there was no adhesion between the copper foils and the copper foil could be rewound smoothly.
【００１５】実施例２ 巻き上げ密度を９５％に変更した他は、実施例１と同様
にして、銅箔巻取品を得た。この巻取品を巻き戻したと
ころ、銅箔同士の接着もなく、スムースに巻き戻せた。Example 2 A copper foil roll was obtained in the same manner as in Example 1 except that the winding density was changed to 95%. When the rolled product was rewound, the copper foil could be smoothly rewound without adhesion between the copper foils.
【００１６】比較例１〜４ 巻き上げ密度を、各々９６％，９７％，９８％及び９９
％に変更した他は、実施例１と同様にして、四種の銅箔
巻取品を得た。この巻取品を巻き戻したところ、巻き上
げ密度が９６％の銅箔巻取品については、一部、巻き戻
せない箇所があった。また、巻き上げ密度が９７％，９
８％及び９９％の銅箔巻取品については、全く巻き戻す
ことができなかった。Comparative Examples 1 to 4 The winding densities were 96%, 97%, 98% and 99%, respectively.
%, Four kinds of rolled copper foil products were obtained in the same manner as in Example 1. When the rolled product was rewound, there was a part of the copper foil roll having a winding density of 96% that could not be rewound. In addition, the winding density is 97%, 9
8% and 99% copper foil rolls could not be rewound at all.
【００１７】実施例３ 銅箔の厚さを１５μｍ（冷間加工度９２．５％）とし、
最終焼鈍温度を２３０℃とした他は、実施例１と同様に
して、銅箔巻取品を得た。この巻取品を巻き戻したとこ
ろ、銅箔同士の接着もなく、スムースに巻き戻せた。Example 3 The thickness of the copper foil was set to 15 μm (the degree of cold working was 92.5%).
A copper foil roll was obtained in the same manner as in Example 1 except that the final annealing temperature was 230 ° C. When the rolled product was rewound, the copper foil could be smoothly rewound without adhesion between the copper foils.
【００１８】実施例４ 巻き上げ密度を９５％に変更した他は、実施例３と同様
にして、銅箔巻取品を得た。この巻取品を巻き戻したと
ころ、銅箔同士の接着もなく、スムースに巻き戻せた。Example 4 A copper foil roll was obtained in the same manner as in Example 3 except that the winding density was changed to 95%. When the rolled product was rewound, the copper foil could be smoothly rewound without adhesion between the copper foils.
【００１９】比較例５〜８ 巻き上げ密度を、各々９６％，９７％，９８％及び９９
％に変更した他は、実施例３と同様にして、四種の銅箔
巻取品を得た。この巻取品を巻き戻したところ、巻き上
げ密度が９６％の銅箔巻取品については、一応、スムー
スに巻き戻せた。一方、巻き上げ密度が９７％の銅箔巻
取品については、一部、巻き戻せない箇所があり、巻き
上げ密度が９８％及び９９％の銅箔巻取品については、
全く巻き戻すことができなかった。Comparative Examples 5 to 8 The winding densities were 96%, 97%, 98% and 99%, respectively.
% In the same manner as in Example 3, except that four types of rolled copper foil were obtained. When the rolled product was rewound, the copper foil roll having a winding density of 96% could be rewound smoothly. On the other hand, for a copper foil wound product having a winding density of 97%, there is a portion that cannot be unwound, and for a copper foil wound product having a winding density of 98% and 99%,
I could not rewind at all.
【００２０】実施例５ 銅箔の厚さを２０μｍ（冷間加工度９０．０％）とする
他は、実施例３と同様にして、銅箔巻取品を得た。この
巻取品を巻き戻したところ、銅箔同士の接着もなく、ス
ムースに巻き戻せた。Example 5 A rolled copper foil was obtained in the same manner as in Example 3 except that the thickness of the copper foil was changed to 20 μm (the degree of cold working was 90.0%). When the rolled product was rewound, the copper foil could be smoothly rewound without adhesion between the copper foils.
【００２１】実施例６ 巻き上げ密度を９５％とする他は、実施例５と同様にし
て、銅箔巻取品を得た。この巻取品を巻き戻したとこ
ろ、銅箔同士の接着もなく、スムースに巻き戻せた。Example 6 A copper foil roll was obtained in the same manner as in Example 5, except that the winding density was 95%. When the rolled product was rewound, the copper foil could be smoothly rewound without adhesion between the copper foils.
【００２２】比較例９〜１２ 巻き上げ密度を、各々９６％，９７％，９８％及び９９
％に変更した他は、実施例５と同様にして、四種の銅箔
巻取品を得た。この巻取品を巻き戻したところ、巻き上
げ密度が９６％の銅箔巻取品については、一応、スムー
スに巻き戻せた。一方、巻き上げ密度が９７％の銅箔巻
取品については、一部、巻き戻せない箇所があり、巻き
上げ密度が９８％及び９９％の銅箔巻取品については、
全く巻き戻すことができなかった。Comparative Examples 9 to 12 The winding densities were 96%, 97%, 98% and 99%, respectively.
%, And four kinds of rolled copper foil were obtained in the same manner as in Example 5. When the rolled product was rewound, the copper foil roll having a winding density of 96% could be rewound smoothly. On the other hand, for a copper foil wound product having a winding density of 97%, there is a portion that cannot be unwound, and for a copper foil wound product having a winding density of 98% and 99%,
I could not rewind at all.
【００２３】[0023]
【作用】本発明に係る銅箔巻取品の最終焼鈍方法は、銅
箔を巻き上げ密度が９５％以下、好ましくは９５％〜９
０％の範囲になるようにして、巻き取った巻取品に、所
定の温度で最終焼鈍するというものである。このような
範囲の巻き上げ密度で巻き取った巻取品は、銅箔同士が
積層面において過剰に密着していないため、所定の温度
で最終焼鈍した場合でも、銅箔間の積層面で原子間結合
が生じにくい。従って、最終焼鈍を終えた銅箔巻取品に
おいて、積層されている銅箔同士が接着しにくいのであ
る。In the final annealing method for a copper foil roll according to the present invention, the copper foil is wound up to a density of 95% or less, preferably 95% to 9%.
The final annealing is performed at a predetermined temperature on the wound product so as to be in the range of 0%. In the rolled product having the winding density in such a range, since the copper foils are not excessively adhered to each other on the lamination surface, even if the final annealing is performed at a predetermined temperature, the interlaminar surface is formed on the lamination surface between the copper foils. It is difficult for bonding to occur. Therefore, in the copper foil wound product after the final annealing, the laminated copper foils are not easily bonded to each other.
【００２４】[0024]
【発明の効果】本発明に係る方法によって得られた銅箔
巻取品は、積層されている銅箔同士が強固に接着してい
ないから、スムースに巻き戻すことができ、銅箔の破損
を防止できるという効果を奏する。従って、本発明に係
る方法で得られた銅箔巻取品は、そのままの状態で消費
者に供給しても、それを巻き戻して銅箔素材を取り出す
ことができ、フレキシブルプリント配線基板用，電池の
集電体用，コンデンサの電極用，電磁波シールド材用及
び電気回路端子のリードフレーム材用等の用途に好適に
用いうるものである。また、本発明に係る方法で得られ
た銅箔巻取品を巻き替えて、一定長の巻取品とする場合
においても、巻き戻しがスムースなため、確実に巻き替
えることができるという効果をも奏する。The copper foil wound product obtained by the method according to the present invention can be smoothly rewound because the laminated copper foils are not firmly adhered to each other, and the copper foil can be damaged. This has the effect that it can be prevented. Therefore, even if the copper foil wound product obtained by the method according to the present invention is supplied to a consumer as it is, it can be unwound and the copper foil material can be taken out, and for a flexible printed wiring board, The present invention can be suitably used for a current collector of a battery, an electrode of a capacitor, an electromagnetic wave shielding material, a lead frame material of an electric circuit terminal, and the like. In addition, even when the copper foil wound product obtained by the method according to the present invention is wound and a fixed length of the wound product is obtained, since the rewinding is smooth, the effect of being able to be reliably wound is provided. Also play.
【図１】本発明において採用する最終焼鈍温度の好適条
件を、銅箔の冷間加工度との関係で示したグラフであ
る。ＡＢＣＤＥＦＧＨに囲まれた範囲が、最終焼鈍温度
の好適条件である。縦軸は最終焼鈍温度を表し、横軸は
銅箔の冷間加工度を表している。ＡＢＣＤＥＦＧＨの座
標は、以下のとおりである。Ａ（７０％，２７０℃）、
Ｂ（７９．５％，２７０℃）、Ｃ（９３．５％，２４０
℃）、Ｄ（９７．５％，２１０℃）、Ｅ（９７．５％，
１５０℃）、Ｆ（９６．５％，１５０℃）、Ｇ（８０
％，２３０℃）、Ｈ（７０％，２４０℃）FIG. 1 is a graph showing preferred conditions of a final annealing temperature employed in the present invention in relation to a cold working degree of a copper foil. The range surrounded by ABCDEFGH is a suitable condition for the final annealing temperature. The vertical axis represents the final annealing temperature, and the horizontal axis represents the degree of cold working of the copper foil. The coordinates of ABCDEFGH are as follows. A (70%, 270 ° C),
B (79.5%, 270 ° C), C (93.5%, 240
° C), D (97.5%, 210 ° C), E (97.5%,
150 ° C.), F (96.5%, 150 ° C.), G (80
%, 230 ° C), H (70%, 240 ° C)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 1/03 ６７０ Ｈ０５Ｋ 9/00 Ｗ 9/00 Ｃ２２Ｆ 1/00 ６２２ // Ｃ２２Ｆ 1/00 ６２２ ６８５Ｚ ６８５ ６８６Ａ ６８６ ６９１Ｂ ６９１ ６９４Ａ ６９４ Ｈ０１Ｇ 1/01 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI H05K 1/03 670 H05K 9/00 W 9/00 C22F 1/00 622 // C22F 1/00 622 685Z 685 686A 686 691B 691 694A 694 H01G 1/01
Claims (5)
さ５〜１００μｍの銅箔を巻き上げた巻取品を最終焼鈍
する際、該銅箔の巻き上げ密度を９５％以下にすること
を特徴とする銅箔巻取品の最終焼鈍方法。When a rolled product obtained by winding up a copper foil having a Cu content of 99.9% by weight or more and a thickness of 5 to 100 μm is finally annealed, the winding density of the copper foil is set to 95% or less. A final annealing method for a copper foil rolled product.
する請求項１記載の銅箔巻取品の最終焼鈍方法。2. The method according to claim 1, wherein the winding density of the copper foil is 95% to 90%.
最終焼鈍温度とは、図１のＡＢＣＤＥＦＧＨに囲まれた
範囲内の条件を満足する請求項１又は２記載の銅箔巻取
品の最終焼鈍方法。3. The copper foil winding-up according to claim 1, wherein the degree of cold working and the final annealing temperature of the copper foil to be subjected to the final annealing satisfy conditions within a range surrounded by ABCDEFGH in FIG. The final annealing method of the product.
面に付着している銅の微粉末等を除去すると共に、表面
に残存する圧延油等の残留油分を３ｍｇ／ｍ2以下とし
た後に、銅箔を巻き上げる請求項１乃至３のいずれか一
項に記載の銅箔巻取品の最終焼鈍方法。4. The surface of the copper foil before being rolled is washed to remove fine copper powder and the like adhering to the surface, and the residual oil content such as rolling oil remaining on the surface is reduced to 3 mg / m 2 or less. The final annealing method of a rolled copper foil product according to any one of claims 1 to 3, wherein the copper foil is rolled up later.
方法で得られた銅箔巻取品を、フレキシブルプリント配
線基板用，電池の集電体用，コンデンサの電極用，電磁
波シールド材用及び半導体端子のリードフレーム材用か
らなる群より選ばれた用途に用いることを特徴とする銅
箔巻取品の使用方法。5. A copper foil wound product obtained by the method according to claim 1, which is used for a flexible printed wiring board, a current collector of a battery, an electrode of a capacitor, and an electromagnetic wave shield. A method for using a rolled copper foil product, wherein the method is used for an application selected from the group consisting of materials for semiconductor devices and lead frames for semiconductor terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9028352A JPH10212562A (en) | 1997-01-27 | 1997-01-27 | Final annealing method for copper foil coiled stock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9028352A JPH10212562A (en) | 1997-01-27 | 1997-01-27 | Final annealing method for copper foil coiled stock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10212562A true JPH10212562A (en) | 1998-08-11 |
Family
ID=12246223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9028352A Pending JPH10212562A (en) | 1997-01-27 | 1997-01-27 | Final annealing method for copper foil coiled stock |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10212562A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002526662A (en) * | 1998-10-01 | 2002-08-20 | ラミトレフ・インドゥストリース・ナムローゼ・フェンノートシャップ | Starting cathode comprising copper strip for copper electrolysis and method for producing the same |
| KR20190113628A (en) | 2018-03-28 | 2019-10-08 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery collectors and lithium ion battery |
| KR20190114814A (en) | 2018-03-29 | 2019-10-10 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery collectors and lithium ion battery |
| KR20210082228A (en) | 2018-10-29 | 2021-07-02 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery current collector and lithium ion battery |
| CN114561696A (en) * | 2022-02-25 | 2022-05-31 | 电子科技大学 | Preparation method of ultra-large-area single crystal metal foil |
-
1997
- 1997-01-27 JP JP9028352A patent/JPH10212562A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002526662A (en) * | 1998-10-01 | 2002-08-20 | ラミトレフ・インドゥストリース・ナムローゼ・フェンノートシャップ | Starting cathode comprising copper strip for copper electrolysis and method for producing the same |
| KR20190113628A (en) | 2018-03-28 | 2019-10-08 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery collectors and lithium ion battery |
| KR20190114814A (en) | 2018-03-29 | 2019-10-10 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery collectors and lithium ion battery |
| KR20210082228A (en) | 2018-10-29 | 2021-07-02 | 제이엑스금속주식회사 | Rolled copper foil for lithium ion battery current collector and lithium ion battery |
| DE112019005377T5 (en) | 2018-10-29 | 2021-07-15 | Jx Nippon Mining & Metals Corporation | Rolled copper foil for lithium-ion battery current collector, and lithium-ion battery |
| US11984606B2 (en) | 2018-10-29 | 2024-05-14 | Jx Metals Corporation | Rolled copper foil for lithium ion battery current collector, and lithium ion battery |
| CN114561696A (en) * | 2022-02-25 | 2022-05-31 | 电子科技大学 | Preparation method of ultra-large-area single crystal metal foil |
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