JPH10208973A - Manufacture of film capacitor - Google Patents

Manufacture of film capacitor

Info

Publication number
JPH10208973A
JPH10208973A JP2850697A JP2850697A JPH10208973A JP H10208973 A JPH10208973 A JP H10208973A JP 2850697 A JP2850697 A JP 2850697A JP 2850697 A JP2850697 A JP 2850697A JP H10208973 A JPH10208973 A JP H10208973A
Authority
JP
Japan
Prior art keywords
film
metal
sprayed
burn
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2850697A
Other languages
Japanese (ja)
Inventor
Yoichi Shirai
洋一 白井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Platforms Ltd
Original Assignee
Nitsuko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitsuko Corp filed Critical Nitsuko Corp
Priority to JP2850697A priority Critical patent/JPH10208973A/en
Publication of JPH10208973A publication Critical patent/JPH10208973A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a film capacitor which avoids depositing molten metal particles or makes the deposited metal particles easily removably when metal sprayed parts are formed at both ends of a film winding. SOLUTION: A metal deposition layer 13 on an outermost metallized film 11 is burned off to remove, winding the film and spraying a molten metal on both ends of the film winding 10 to be a capacitor element. A metal foil 14d for feeding a current to an electrode 14b of a burn-off apparatus is kept coated with a releasing agent 20 and wound by being transferred to a resin film at the deposited metal-free part A by the heating of the burn-off. The molten metal is sprayed on both ends of the winding 10 to form sprayed metal parts.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は樹脂フィルム表面に
金属を蒸着してなる金属化フィルムを巻回したコンデン
サ素子を具備するフィルムコンデンサの製造方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a film capacitor having a capacitor element formed by winding a metallized film formed by evaporating a metal on a resin film surface.

【0002】[0002]

【従来の技術】従来、この種のフィルムコンデンサは、
図2に示すように、樹脂フィルム表面に金属を蒸着して
なる金属化フィルム(メタライズドフィルム)11を巻
回したフィルム巻回体10の最外周に金属を蒸着してい
ない一般フィルムを保護フィルム12として巻回する
か、若しくは図3に示すように、巻回最終のメタライズ
ドフィルム11の蒸着金属層13を電気的に除去し、こ
の蒸着金属層13を除去した部分Aを最外周用保護フィ
ルムとして巻き上げ、熱により接着、巻き止めしてい
る。上記蒸着金属層13を電気的に除去する方法には通
常バーンオフ装置14を用いたバーンオフ工法と呼ばれ
る手法が採られている。
2. Description of the Related Art Conventionally, this type of film capacitor has
As shown in FIG. 2, a general film on which no metal is vapor-deposited is formed on a protective film 12 on the outermost periphery of a film roll 10 on which a metallized film (metallized film) 11 formed by vapor-depositing metal on the surface of a resin film. As shown in FIG. 3, or as shown in FIG. 3, the evaporated metal layer 13 of the metalized film 11 at the end of the winding is electrically removed, and the portion A where the evaporated metal layer 13 is removed is used as the outermost protective film. Rolled up, glued and stopped by heat. As a method for electrically removing the vapor-deposited metal layer 13, a method called a burn-off method using a burn-off device 14 is usually employed.

【0003】上記蒸着金属層13を除去し、巻き上げ、
熱により接着、巻き止めした後、素子を熱成形し、次工
程でフイルム巻回体10の両端部に溶融金属粒子を吹き
付け金属溶射部(一般的にはメタリコンと呼ばれる)を
形成するのであるが、この溶融金属粒子の吹き付けに際
し、溶融金属粒子が他の部分に付着するのを防止するた
め、図4(a)、(b)に示すようにフィルム巻回体1
0に2枚のマスキングテープ15、16を用いてマスキ
ングを施し、その後に溶融金属粒子を吹き付け金属溶射
部を形成している。
[0003] The above-deposited metal layer 13 is removed and rolled up.
After bonding and stopping by heat, the element is thermoformed, and in the next step, molten metal particles are sprayed on both ends of the film winding body 10 to form a metal sprayed portion (generally called metallikon). In order to prevent the molten metal particles from adhering to other parts when spraying the molten metal particles, as shown in FIGS.
0 is masked using two masking tapes 15 and 16, and thereafter, molten metal particles are sprayed to form a metal spray portion.

【0004】[0004]

【発明が解決しようとする課題】しかしながら上記マス
キングも完全なものではなく、両端部に金属溶射部を形
成するため溶融金属粒子を吹き付けると、マスキングの
隙間17に溶融金属粒子が入り込み、図5に示すよう
に、フィルム巻回体10の表面の一部に溶融金属粒子1
8が付着し、フィルム巻回体10の両端部に形成された
金属溶射部19を短絡して、絶縁抵抗や誘電正接(ta
nδ)を劣化させる原因となっている。特に、金属溶射
部19を形成するための溶融金属粒子18の温度は高
く、フィルムへの付着力がきわめて大きいためフィルム
巻回体10の表面に付着した溶融金属粒子18を除去す
ることが極めて困難である。
However, the above masking is not perfect, and when molten metal particles are sprayed to form a metal sprayed portion at both ends, the molten metal particles enter the gap 17 of the masking, and as shown in FIG. As shown, the molten metal particles 1
8 adheres and short-circuits the metal sprayed portions 19 formed at both ends of the film winding body 10 so that the insulation resistance and the dielectric loss tangent (ta) are reduced.
nδ). In particular, the temperature of the molten metal particles 18 for forming the metal spray portion 19 is high and the adhesion to the film is extremely large, so that it is extremely difficult to remove the molten metal particles 18 attached to the surface of the film roll 10. It is.

【0005】また、溶融金属粒子の付着を防止する目的
で、巻回したコンデンサ素子の最外周にワックス、シリ
コン等の離形剤を塗布する方法が検討されているが、離
形剤の塗布量を微少に管理しないと巻き止めフィルム間
の接着不良になったり、電極を取り出す端面(金属溶射
部19)に回り込み電気特性的に接続不良になるという
問題がある。このためこの離形剤塗布は技術的に難し
く、実施するためには精密な設備を必要として過大なコ
ストがかかるという問題があった。
In order to prevent the adhesion of the molten metal particles, a method of applying a release agent such as wax or silicon to the outermost periphery of the wound capacitor element has been studied. If the thickness is not controlled very finely, there is a problem that the adhesion between the winding-stop films becomes poor, or the electrode wraps around the end surface (metal sprayed portion 19) from which the electrode is taken out, resulting in poor connection in electrical characteristics. For this reason, there has been a problem that the application of the release agent is technically difficult, and precise equipment is required to implement the release agent, resulting in an excessive cost.

【0006】本発明は上述の点に鑑みてなされたもの
で、上記問題点を除去し、メタライズドフィルムを巻回
しコンデンサ素子を製作するとき、その最外周のメタラ
イズドフィルムの蒸着金属層をバーンオフで除去すると
同時にこの除去部分に微少量の離形剤を塗布し、フィル
ム巻回体の両端部に金属溶射部を形成する際、溶融金属
粒子の付着を防止し、或いは付着しても比較的容易に溶
融金属粒子を除去できるようにしたフィルムコンデンサ
の製造方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and eliminates the above-mentioned problems. When a metallized film is wound and a capacitor element is manufactured, a vapor-deposited metal layer of the outermost metallized film is removed by burn-off. At the same time, a small amount of release agent is applied to the removed part to prevent the adhesion of molten metal particles when forming metal sprayed parts on both ends of the film roll, or even if it adheres, it is relatively easy An object of the present invention is to provide a method of manufacturing a film capacitor capable of removing molten metal particles.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するた
め、樹脂フィルム表面に金属を蒸着してなる金属化フィ
ルムを巻回し、最外周の巻回金属化フィルムの蒸着金属
をバーンオフ工程により除去し、該蒸着金属を除去した
部分の樹脂フィルムを最外周用保護フィルムとし巻回
し、該金属化フィルム巻回体の両端に溶融金属を吹き付
けて金属溶射部を形成してコンデンサ素子とするフィル
ムコンデンサの製造方法において、バーンオフ工程の電
極に使用する金属箔に予め離形剤をコーティングしてお
き、バーンオフ時の熱により該離形剤を蒸着金属を除去
した部分の樹脂フィルムに転写して巻回し、その後に金
属化フィルム巻回体の両端に溶融金属を吹き付けて金属
溶射部を形成することを特徴とする。
In order to solve the above problems, a metallized film formed by evaporating a metal on the surface of a resin film is wound, and the evaporated metal of the outermost wound metallized film is removed by a burn-off process. A film capacitor as a capacitor element is formed by winding a resin film of a portion from which the vapor-deposited metal has been removed as a protective film for the outermost periphery and spraying a molten metal on both ends of the metallized film roll to form a metal sprayed portion. In the manufacturing method, a release agent is previously coated on a metal foil used for an electrode in a burn-off step, and the release agent is transferred to a resin film of a portion from which a deposition metal has been removed by heat at the time of burn-off and wound, Thereafter, a molten metal is sprayed on both ends of the metalized film roll to form a metal sprayed portion.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施の形態を説明
する。図1は本発明のフィルムコンデンサの製造方法を
説明する図である。同図(a)は巻回したメタライズド
フィルムの最外周部の金属蒸着部をバーンオフ工程で除
去する状態を示す図、同図(b)はその部分拡大図であ
る。
Embodiments of the present invention will be described below. FIG. 1 is a diagram illustrating a method for manufacturing a film capacitor according to the present invention. FIG. 3A is a diagram showing a state in which a metal deposition portion on the outermost periphery of a wound metallized film is removed by a burn-off process, and FIG. 3B is a partially enlarged view thereof.

【0009】図1において、メタライズドフィルム11
はPET(ポリエチレンテレフタレート)の表面にアル
ミニウムを蒸着した蒸着金属層(厚さ100〜150
Å)13を形成したものである。このメタライズドフィ
ルム11を巻回してフィルム巻回体10とするのである
が、巻回最終のメタライズドフィルム11の蒸着金属層
13をバーンオフ装置14を用いてバーンオフ除去し、
該蒸着金属層13を除去した部分Aに微量な離形剤20
を塗布し、この離形剤20を塗布した部分Aを最外周用
保護フィルムとして巻回し、熱により接着、巻き止めし
ている。
In FIG. 1, a metallized film 11
Is a vapor-deposited metal layer (thickness of 100 to 150) obtained by vapor-depositing aluminum on the surface of PET (polyethylene terephthalate).
Å) 13 is formed. The metallized film 11 is wound to form a film roll 10. The vapor-deposited metal layer 13 of the final metallized film 11 is removed by burn-off using a burn-off device 14.
A small amount of the release agent 20 is added to the portion A where the metal deposition layer 13 is removed.
Is applied, and the part A to which the release agent 20 is applied is wound as a protective film for the outermost periphery, and is adhered and stopped by heat.

【0010】バーンオフ装置14は一対の電極14b、
14c、該電極14b、14cに電流を供給するアルミ
ニウム箔等の金属箔14d、14e及び電源14aを具
備する構成である。金属箔14d、14eで覆われた一
対の電極14b、14cをメタライズドフィルム11の
蒸着金属層13に当接し、電極14b、14cの間に金
属箔14d、14eを介して電圧を印加すると蒸着金属
層13は飛散する。一対の電極14b、14cを移動さ
せることにより、巻回最外周のメタライズドフィルム1
1に蒸着金属層13が除去された部分Aが形成される。
The burn-off device 14 includes a pair of electrodes 14b,
14c, metal foils 14d and 14e such as aluminum foil for supplying a current to the electrodes 14b and 14c, and a power supply 14a. The pair of electrodes 14b and 14c covered with the metal foils 14d and 14e are brought into contact with the metallized metal layer 13 of the metallized film 11, and a voltage is applied between the electrodes 14b and 14c via the metal foils 14d and 14e. 13 scatters. By moving the pair of electrodes 14b and 14c, the outermost wound metallized film 1 is moved.
In FIG. 1, a portion A from which the deposited metal layer 13 has been removed is formed.

【0011】上記バーンオフ装置14の金属箔14dの
表面に予めワックスからなる離形剤20を温度約100
℃で均一になるべく薄く塗布する。このような状態で金
属箔14d、14eで覆われた一対の電極14b、14
cをメタライズドフィルム11の蒸着金属層13に当接
し、電極14b、14cの間に電圧を印加すると上記と
同様バーンオフにより蒸着金属層13が飛散する。これ
と同時にこのバーンオフ時に発生する熱で金属箔14d
に塗布された離形剤20は蒸着金属層13が除去された
部分Aに転写される。
A release agent 20 made of wax is previously applied to the surface of the metal foil 14d of the burn-off device 14 at a temperature of about 100.
Apply as thinly as possible at ℃. In this state, a pair of electrodes 14b, 14 covered with metal foils 14d, 14e
When c is brought into contact with the vapor-deposited metal layer 13 of the metallized film 11 and a voltage is applied between the electrodes 14b and 14c, the vapor-deposited metal layer 13 is scattered by burn-off as described above. At the same time, the heat generated at the time of burn-off
Is transferred to the portion A where the deposited metal layer 13 is removed.

【0012】上記のように最外周のメタライズドフィル
ム11の蒸着金属層13が除去され離形剤20を転写し
た部分Aを保護フィルムとして巻回し、熱により接着、
巻き止める。ここで転写された離形剤20は微量である
ため、巻き止めの熱シールによる接着力には影響を与え
ない。
As described above, the part A where the metallized film 13 of the outermost metallized film 11 is removed and the release agent 20 is transferred is wound as a protective film and adhered by heat.
Stop winding. Since the release agent 20 transferred here is very small, it does not affect the adhesive force by the heat seal for stopping the winding.

【0013】上記のようにバーンオフ工程により最外周
のメタライズドフィルム11の蒸着金属層13を除去
し、該除去した部分に微量の離形剤20を転写し、巻回
し、熱により接着、巻き止めした構成のフィルム巻回体
10は、従来のように全周をマスキングテープでマスキ
ングするという複雑なマスキングを施すことなく、図6
に示すような簡単な構成のマスキングで両端部に溶融金
属粒子を吹き付け(例えば溶融ハンダの吹き付け)金属
溶射部を形成することができる。該金属溶射部を形成し
た後、通常の清掃方法でフィルム巻回体10の周囲に付
着した溶融金属粒子を除去する。
As described above, the deposited metal layer 13 of the outermost metallized film 11 is removed by the burn-off process, a small amount of the release agent 20 is transferred to the removed portion, wound, adhered and stopped by heat. The film winding body 10 having the configuration shown in FIG. 6 does not have to be subjected to the complicated masking in which the entire circumference is masked with a masking tape as in the related art.
The molten metal particles can be sprayed on both ends (for example, sprayed with molten solder) to form a metal sprayed portion by masking having a simple structure as shown in FIG. After forming the metal spray portion, the molten metal particles attached around the film winding body 10 are removed by a normal cleaning method.

【0014】上記のようにして製造したコンデンサ素子
のテスターによるショートチェックを実施した結果、全
てのコンデンサ素子がショートすることなく良品とであ
った。また、フィルム巻き止めのシール不良によるはが
れも発生しない。比較検討のため、従来例のように、最
外周のメタライズドフィルムを通常のバーンオフにより
蒸着金属層13を除去し巻回し、熱により接着、巻き止
めしたフイルム巻回体に上記と同じ簡単なマスキングを
施した後、溶融金属粒子を吹き付けた金属溶射部を形成
し、その後通常の清掃方法でフィルム巻回体の周囲に付
着した溶融金属粒子を除去したコンデンサ素子では上記
テスターによりショートチェックは全て不良(ショー
ト)であった。
As a result of performing a short-circuit check of the capacitor element manufactured as described above using a tester, all the capacitor elements were non-defective without short-circuit. Also, peeling due to poor sealing of the film winding does not occur. For comparative study, as in the conventional example, the outermost metallized film was wound by removing the vapor-deposited metal layer 13 by ordinary burn-off, and the same simple masking as described above was applied to the film wound body which was bonded and stopped by heat. After that, a metal sprayed portion sprayed with molten metal particles is formed, and thereafter, the capacitor element in which the molten metal particles adhered to the periphery of the film wound body are removed by a normal cleaning method, all of the short checks by the above tester are defective ( Short).

【0015】[0015]

【発明の効果】以上説明したように本発明によれば、バ
ーンオフ工程の電極に使用する金属箔に予め離形剤をコ
ーティングしておき、バーンオフ時の熱により該離形剤
を蒸着金属を除去した部分の樹脂フィルムに転写し、そ
の後に金属化フィルムを巻回し、該フィルム巻回体の両
端に溶融金属を吹き付けて金属溶射部を形成するので、
簡単なマスキングを施すだけで、金属溶射部を形成する
際、溶融金属粒子の付着を防止し、或いは付着しても比
較的容易に溶融金属粒子を除去できる。従って、フィル
ムコンデンサの製造方法が極めて容易となる。
As described above, according to the present invention, a metal foil used for an electrode in a burn-off step is coated with a release agent in advance, and the release agent is removed by heat at the time of burn-off. Transferred to the resin film of the part, and then wound a metallized film, since the molten metal is sprayed on both ends of the film wound body to form a metal sprayed part,
By simply applying a simple masking, it is possible to prevent the adhesion of the molten metal particles when forming the metal sprayed portion, or to remove the molten metal particles relatively easily even if they are attached. Therefore, the manufacturing method of the film capacitor becomes extremely easy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のフィルムコンデンサの製造方法を説明
する図で、同図(a)は最外周部のメタライズドフィル
ムの金属蒸着部をバーンオフ工程で除去する状態を示す
図、同図(b)はその部分拡大図である。
FIG. 1 is a view for explaining a method of manufacturing a film capacitor according to the present invention. FIG. 1 (a) shows a state in which a metal deposition portion of a metallized film on the outermost periphery is removed by a burn-off step, and FIG. Is a partially enlarged view of FIG.

【図2】従来のフィルムコンデンサの製造方法を説明す
る図である。
FIG. 2 is a diagram illustrating a conventional method for manufacturing a film capacitor.

【図3】従来のフィルムコンデンサの製造方法を説明す
るための図で、同図(a)は最外周部のメタライズドフ
ィルムの金属蒸着部をバーンオフ工程で除去する状態を
示す図、同図(b)はその部分拡大図である。
3A and 3B are views for explaining a conventional method for manufacturing a film capacitor, in which FIG. 3A shows a state in which a metal deposition portion of a metallized film on the outermost periphery is removed by a burn-off step, and FIG. ) Is a partially enlarged view thereof.

【図4】同図(a)、(b)は従来のフィルムコンデン
サの製造方法におけるマスキング例を示す図である。
FIGS. 4A and 4B are diagrams showing an example of masking in a conventional method for manufacturing a film capacitor. FIGS.

【図5】従来のフィルムコンデンサの製造方法で製造し
たコンデンサ素子の外観図である。
FIG. 5 is an external view of a capacitor element manufactured by a conventional film capacitor manufacturing method.

【図6】フィルム巻回体に施す簡単なマスキング例を示
す図である。
FIG. 6 is a diagram showing a simple masking example applied to a film roll.

【符号の説明】[Explanation of symbols]

10 フィルム巻回体 11 メタライズドフィルム 13 蒸着金属層 14 バーンオフ装置 14a 電源 14b、14c 電極 14d、14e 金属箔 20 離形剤 DESCRIPTION OF SYMBOLS 10 Film roll 11 Metallized film 13 Metallized metal layer 14 Burn-off device 14a Power supply 14b, 14c Electrode 14d, 14e Metal foil 20 Release agent

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 樹脂フィルム表面に金属を蒸着してなる
金属化フィルムを巻回し、最外周の巻回金属化フィルム
の蒸着金属をバーンオフ工程により除去し、該蒸着金属
を除去した部分の樹脂フィルムを最外周用保護フィルム
とし巻回し、該金属化フィルム巻回体の両端に溶融金属
を吹き付けて金属溶射部を形成してコンデンサ素子とす
るフィルムコンデンサの製造方法において、 前記バーンオフ工程の電極に使用する金属箔に予め離形
剤をコーティングしておき、バーンオフ時の熱により該
離形剤を前記蒸着金属を除去した部分の樹脂フィルムに
転写して巻回し、その後に前記金属化フィルム巻回体の
両端に溶融金属を吹き付けて金属溶射部を形成すること
を特徴とするフィルムコンデンサの製造方法。
1. A metallized film formed by evaporating a metal on the surface of a resin film, and a metallized film of the outermost wound metallized film is removed by a burn-off process, and a portion of the resin film from which the evaporated metal is removed is removed. Is wound as a protective film for the outermost periphery, and a molten metal is sprayed on both ends of the metallized film wound body to form a metal sprayed portion to form a capacitor element. The metal foil to be coated is coated with a release agent in advance, and the release agent is transferred to a portion of the resin film from which the vapor-deposited metal has been removed and wound by heat at the time of burn-off. A method for manufacturing a film capacitor, characterized in that a molten metal is sprayed on both ends of the film to form a metal sprayed portion.
JP2850697A 1997-01-27 1997-01-27 Manufacture of film capacitor Pending JPH10208973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2850697A JPH10208973A (en) 1997-01-27 1997-01-27 Manufacture of film capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2850697A JPH10208973A (en) 1997-01-27 1997-01-27 Manufacture of film capacitor

Publications (1)

Publication Number Publication Date
JPH10208973A true JPH10208973A (en) 1998-08-07

Family

ID=12250573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2850697A Pending JPH10208973A (en) 1997-01-27 1997-01-27 Manufacture of film capacitor

Country Status (1)

Country Link
JP (1) JPH10208973A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074000A (en) * 2011-09-27 2013-04-22 Kojima Press Industry Co Ltd Manufacturing method of laminate film capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074000A (en) * 2011-09-27 2013-04-22 Kojima Press Industry Co Ltd Manufacturing method of laminate film capacitor

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