JPH10202594A - Fine hole forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fine hole forming device punching a fine hole in a film by passing the film between rollers having very small projecting parts formed with highly accurate sizes and arrangements. SOLUTION: A projecting roller impregnates a conductive cylindrical body 11 in resist, pulls up the cylindrical body 11 at constant speed and forms a resist film 12 of uniform film thickness which is thicker than the height of a very small projecting part 5. A post-bake is performed for this resist film 12, the resist film 12 is fixed to the surface of the cylindrical body 11, a laser abrasion elimination is performed via a mask and a fine hole 16 is formed in the resist film 12. The cylindrical body 11 coated with this resist film 12 is impregnated in an electrocast tank, an electrodepostion is performed, metal 17 to be the very small projecting part 5 is made to grow in only a part in which the fine hole 16 is formed on the surface of the cylindrical body 11 and the very small projecting part 5 is formed. The resist film 12 is peeled from the cylindrical body 11 and a projecting roller on the surface of which the very small projecting part 5 is formed. By passing a resin film between this projecting roller and a smoothing roller, the fine hole is formed in the resin film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine hole forming apparatus, and more particularly, to a method of forming a fine hole in a film by passing a film between rollers having minute protrusions by using a protrusion provided on the roller. The present invention relates to a micropore forming apparatus to be provided.

[0002]

2. Description of the Related Art Conventionally, as a micropore forming apparatus for forming micropores in a film, for example, there is a resin film punching apparatus and a punching method described in JP-A-4-2499. The punching device and the punching method have a pair of narrow pressure rollers, form fine irregularities on the surface of one narrow pressure roller, pass a resin film between the pair of narrow pressure rollers, and A fine hole is formed in the resin film by piercing the resin film with the convex portion of the uneven surface formed on the pressure roller. In the conventional punching device and the conventional punching method, specifically, a pair of narrow pressure rollers are provided in the middle of the resin film feeding path, and the pressing side narrow pressure roller is provided on the surface of the hollow steel roller body. The irregularities are formed by attaching artificial diamond particles. The resin film strongly pressed between the pair of narrow pressure rollers is pierced by artificial diamond particles to form fine holes.

[0003]

However, in such a conventional fine hole forming apparatus, artificial diamond particles are fixed on the roller surface, and the artificial diamond particles break through the resin film to form fine holes. Due to the opening, there is a problem that the size and shape of the fine holes formed in the resin film and the positions where the fine holes are formed vary.

That is, in the conventional micropore forming apparatus, the size of the artificial diamond particles fixed on the roller surface varies, and the roller surface formed by the fixing of the artificial diamond particles on the roller surface is varied. The height and size of the irregularities are irregular, and the density is also uneven. Therefore, when the resin film is passed through the roller to which the artificial diamond particles are fixed to form fine holes in the resin film, the fine holes formed in the resin film are as large as the largest diamond particles. Therefore, when the artificial diamond particles on the surface of the roller are in contact with each other, a larger hole is formed. As a result, there has been a problem that the fine holes formed in the resin film have a variation of several tens of microns in size, become non-uniform, and have an irregular shape.

In view of the above, according to the first aspect of the present invention, the minute projections are formed in a minute hole forming apparatus for passing a film between a pair of rollers on which a plurality of minute projections are formed to form minute holes. Roller, a non-conductive film such as resin is formed on a conductive cylindrical roller thicker than the height of the minute projections,
By forming a fine hole by decomposing and removing the film of the part corresponding to the minute convex part by laser ablation processing,
By growing a metal in the micropores by electroforming and forming microprojections directly on the roller surface, forming microprojections of any diameter at arbitrary positions, reducing the number of processes It is an object of the present invention to provide an inexpensive micro-hole forming apparatus capable of accurately and forming a micro-hole at an intended position with an intended size by forming the film at an intended size with high precision. .

According to a second aspect of the present invention, there is provided a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine protrusions. A non-conductive film such as a resin film is formed thicker than the height of the minute protrusions on a conductive flat substrate, and the non-conductive film corresponding to the position where the minute protrusions are formed is formed by laser ablation processing. A fine hole is formed by decomposition and removal, and a metal is grown on the flat substrate in the fine hole by electroforming to form a minute convex portion. By forming the surface with the surface formed as a surface and winding it into a cylindrical shape, by forming, a micro convex portion of any diameter at any position, more accurately, and at the intended density, to form a film, At the intended position with the intended size And its object is to provide a micropore forming apparatus capable of forming micropores in more accurate Ri.

According to a third aspect of the present invention, there is provided a roller having fine projections formed in a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections. A non-conductive film made of a photoresist is formed thicker than the height of the minute protrusions on a flat plate substrate having conductivity, and the portion of the non-conductive film corresponding to the formation position of the minute protrusions is removed by photolithography. The minute holes are formed by this, and a metal is grown on the flat substrate in the minute holes by electroforming to form minute projections. The flat substrate on which the minute projections are formed is formed with the minute projections. By winding the formed surface into a cylindrical shape and forming it, a microprojection with an arbitrary diameter at an arbitrary position can be formed more accurately and at an intended density, and intended for a film. Depends on size and intended position And its object is to provide a micropore forming apparatus capable of forming micropores in even higher accuracy.

According to a fourth aspect of the present invention, there is provided a roller having fine projections formed in a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections. Is formed on a glass substrate by forming a photosensitive polyimide layer thicker than the height of the minute protrusions, and forming a fine hole by patterning and removing the photosensitive polyimide layer corresponding to the position where the minute protrusions are formed by photolithography. Then, the photosensitive polyimide layer in which the micropores are formed is peeled from the glass substrate, fixed as a polyimide film on the surface of the cylindrical roller by post cure, and metal is grown on the roller surface in the micropores by electroforming. By forming a small convex portion by forming, by forming a small convex portion of any diameter at any position, more accurately, and, at the intended density, A fine hole forming apparatus that can form a small convex portion on the tip side narrower than the root and more precisely at the intended position in the film at the intended position, and can form finer fine holes. It is intended to provide.

According to a fifth aspect of the present invention, there is provided a roller having fine projections formed in a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections formed therein. After forming a photosensitive polyimide layer thicker than the height of the minute protrusions on the glass substrate and drying it below the glass transition temperature, laser ablation the photosensitive polyimide layer in the portion corresponding to the formation position of the minute protrusions Micropores are formed by removing by processing, the photosensitive polyimide layer in which the micropores are formed is peeled off from the glass substrate, a polyimide film is formed by post cure, and the polyimide film is formed on the surface of a cylindrical roller by the polyimide. The laser irradiation surface of the film is fixed according to the surface of the roller, and metal is grown on the roller surface in the micropores by electroforming to produce minute projections. By forming and forming, a minute convex portion of an arbitrary diameter at an arbitrary position is formed more precisely and at an intended density, and the minute convex portion is formed narrower at the tip side than at the base. It is another object of the present invention to provide a fine hole forming apparatus capable of forming finer fine holes with higher precision at a desired position in a film at a desired size.

[0010] According to a sixth aspect of the present invention, a non-conductive film is provided.
After immersing the roller or flat substrate in the liquid photosensitive polyimide, pull it up at a constant speed, bake it to form a solid photosensitive polyimide film, and by forming, raise the viscosity of the liquid photosensitive polyimide and raise it To precisely adjust the thickness of the non-conductive film by the speed, form minute projections inexpensively and accurately, and form fine holes in the film in the intended size and at the intended position with high precision. It is an object of the present invention to provide an even more inexpensive micropore forming apparatus.

According to a seventh aspect of the present invention, the non-conductive film is
After immersing the roller or flat substrate in the liquid for thick-film resist, pull it up at a constant speed, bake it to solidify it, and form it.Accurately with the viscosity and pull-up speed of the liquid pressure resist, By adjusting the film thickness of the non-conductive film, inexpensively, and precisely forming the minute projections, it is possible to form the fine holes in the film at the intended position with the intended size with high precision. It is intended to provide an inexpensive micropore forming apparatus.

[0012] The invention according to claim 8 is to provide a photosensitive polyimide layer by applying a positive photosensitive polyimide on a glass substrate without subjecting the glass substrate to a base treatment, thereby forming a hydrofluoric acid or the like. The film can be easily peeled off from the glass substrate without performing an etching process using a film, with good stability, and efficiently forming a roller with fine projections formed thereon, and the intended size of the film It is an object of the present invention to provide an even more inexpensive micropore forming apparatus capable of forming micropores at desired positions with high precision.

[0013]

According to a first aspect of the present invention, there is provided a fine hole forming apparatus for passing a film between a pair of rollers having a plurality of minute projections formed on at least one cylindrical roller. A fine hole forming apparatus for forming a fine hole in the film by the minute convex portion of the roller, wherein the roller having the minute convex portion is formed on a surface of a conductive cylindrical roller. A non-conductive film such as a resin film is formed thicker than the height of the minute protrusions, and the non-conductive film in a portion corresponding to the position where the minute protrusions are formed is decomposed and removed by laser ablation processing. Forming a hole to expose the surface of the roller,
The above-mentioned object is achieved by forming the minute projections by growing a metal to a predetermined height on the roller surface in the minute holes by electroforming.

[0014] According to the above configuration, the roller having the fine projections formed therein is formed by a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections formed therein. Form a non-conductive film of resin or the like thicker than the height of the minute protrusions on a conductive cylindrical roller, and form fine holes by decomposing and removing the film corresponding to the minute protrusions by laser ablation processing. Then, a metal is grown in the micropores by electroforming and the microprojections are formed directly on the roller surface. While reducing, it can be formed accurately and at the intended density, and it is possible to form the fine holes at the intended position with the intended size in the film with high precision, and to use a low cost micropore forming apparatus. Can be

According to a second aspect of the present invention, there is provided a micropore forming apparatus comprising:
A fine hole forming apparatus that allows a film to pass between a pair of rollers having a plurality of fine protrusions formed on the surface of at least one of the rollers, and drills fine holes in the film by the fine protrusions of the rollers. The roller on which the minute protrusions are formed is formed by forming a non-conductive film such as a resin film thicker than the height of the minute protrusions on a conductive flat substrate, and forming the minute protrusions. The non-conductive film in a portion corresponding to the position is decomposed and removed by laser ablation processing to form fine holes, exposing the surface of the flat plate substrate, and forming a metal by electroforming on the flat plate in the fine holes. By growing to a predetermined height on the substrate to form the minute convex portion, by winding the flat substrate formed with the minute convex portion in a cylindrical shape with the surface on which the minute convex portion is formed as a surface, By being made, we have achieved the above objects.

According to the above arrangement, the roller having the fine convex portions formed by the fine hole forming device of the fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine convex portions formed thereon is used. A non-conductive film, such as a resin film, is formed thicker than the height of the minute protrusions on a conductive flat substrate, and the non-conductive film corresponding to the position where the minute protrusions are formed is decomposed and removed by laser ablation processing. Forming fine holes by electroforming a metal on the flat substrate in the fine holes to form minute projections, and forming the flat substrate on which the minute projections are formed into minute projections. Since the formed surface is wound in a cylindrical shape and formed, a microprojection with an arbitrary diameter at an arbitrary position can be formed more accurately and at the intended density, and the film can be formed. The intended size in the intended size It is possible to form micropores in even higher accuracy.

According to a third aspect of the present invention, there is provided a micropore forming apparatus comprising:
A fine hole forming apparatus that allows a film to pass between a pair of rollers having a plurality of fine protrusions formed on the surface of at least one of the rollers, and drills fine holes in the film by the fine protrusions of the rollers. The roller on which the fine protrusions are formed is formed by forming a non-conductive film made of a photoresist thicker than the height of the fine protrusions on a conductive flat substrate, and forming the fine protrusions at a position where the fine protrusions are formed. By forming a fine hole by removing the non-conductive film of the portion corresponding to the by photolithography, to expose the surface of the flat substrate, a metal is formed by electroforming on the flat substrate in the fine hole. The micro-projections are formed by growing the micro-projections to a predetermined height, and the flat substrate on which the micro-projections are formed is wound in a cylindrical shape with the surface on which the micro-projections are formed as a surface. By and have achieved the above objects.

According to the above configuration, the roller having the fine projections formed therein is formed by a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections formed therein. A non-conductive film made of photoresist is formed thicker than the height of the minute protrusions on a flat plate substrate having conductivity, and the non-conductive film corresponding to the formation position of the minute protrusions is removed by photolithography. A micro hole was formed, a metal was grown by electroforming on a flat substrate in the micro hole to form a minute projection, and the flat substrate on which the minute projection was formed was formed with the minute projection. Since it is wound and formed into a cylindrical shape with the surface as the surface, it is possible to form a microprojection with an arbitrary diameter at an arbitrary position more accurately and at the intended density, and The intended position at the size It is possible to form a finer pores even more high precision.

According to a fourth aspect of the present invention, there is provided a micropore forming apparatus comprising:
A fine hole forming apparatus that allows a film to pass between a pair of rollers having a plurality of fine protrusions formed on the surface of at least one of the rollers, and drills fine holes in the film by the fine protrusions of the rollers. The roller on which the minute protrusions are formed is formed by forming a photosensitive polyimide layer on a glass substrate thicker than the height of the minute protrusions, and forming a photosensitive polyimide layer on a portion corresponding to a formation position of the minute protrusions. Micropores are formed by patterning and removing the conductive polyimide layer by photolithography, the photosensitive polyimide layer with the micropores formed is peeled from the glass substrate, and a polyimide film is formed on the surface of the cylindrical roller by post-curing. Fixed, and a metal is grown to a predetermined height on the surface of the roller in the micropores by electroforming to form the microprojections. By being formed, it has achieved the above objects.

According to the above configuration, the roller having the fine projections formed by the fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections formed thereon is used. The photosensitive polyimide layer is formed thicker than the height of the minute protrusions on the glass substrate, and the photosensitive polyimide layer in a portion corresponding to the formation position of the minute protrusions is patterned and removed by photolithography to form fine holes, The photosensitive polyimide layer in which the micropores were formed was peeled off from the glass substrate, fixed on the surface of the cylindrical roller as a polyimide film by post cure, and a metal was grown on the surface of the roller in the micropores by electroforming. Since the minute projections are formed and formed, the minute projections having an arbitrary diameter at an arbitrary position can be formed more accurately and at an intended density. In, than the root of the minute projections can be formed thin a leading end side, the more accurate the position intended in the size intended to film, and it is possible to form a finer micropores.

According to a fifth aspect of the present invention, there is provided a micropore forming apparatus comprising:
A fine hole forming apparatus that allows a film to pass between a pair of rollers having a plurality of fine protrusions formed on the surface of at least one of the rollers, and drills fine holes in the film by the fine protrusions of the rollers. The roller on which the fine protrusions are formed is formed on a glass substrate by forming a photosensitive polyimide layer thicker than the height of the fine protrusions, and dried at a glass transition temperature or lower. The photosensitive polyimide layer of the portion corresponding to the formation position of the photosensitive polyimide layer is removed by laser ablation processing to form fine holes, the photosensitive polyimide layer in which the fine holes are formed is peeled from the glass substrate, and a post is formed. The polyimide film is cured by curing, and the polyimide film is irradiated on the surface of the cylindrical roller by the laser irradiation surface of the polyimide film. The above-described object is achieved by forming the micro-convex portion by forming a metal to a predetermined height on the surface of the roller in the micro-hole by electroforming to fix the metal to the predetermined height. doing.

According to the above configuration, the roller having the fine projections formed by the fine hole forming apparatus, in which the film is passed between a pair of rollers having the plurality of fine projections formed therein to form fine holes, After forming a photosensitive polyimide layer thicker than the height of the minute protrusions on the glass substrate and drying it at the glass transition temperature or lower, the photosensitive polyimide layer corresponding to the formation position of the minute protrusions is subjected to laser ablation processing. The fine holes are formed by removing, the photosensitive polyimide layer in which the fine holes are formed is peeled off from the glass substrate, and a polyimide film is formed by post cure, and the polyimide film is formed on the surface of the cylindrical roller by the polyimide film. The laser irradiation surface is fixed to the surface of the roller, and metal is grown on the roller surface in the micropores by electroforming to form minute projections. And, since the form, the minute projections of any size at any position, more accurately, and,
Along with being formed at the intended density, the fine protrusions can be formed to be thinner at the tip side than at the root, and more precisely at the intended position at the intended size on the film, and more finer Micropores can be formed.

In the case of claim 1 or claim 2, for example, as described in claim 6, the non-conductive film is
The roller or the flat substrate may be formed by immersing the roller or the flat substrate in a liquid photosensitive polyimide, pulling it up at a constant speed, and performing a prescribed baking to form a solid photosensitive polyimide film.

According to the above construction, the non-conductive film is immersed in a roller or a flat substrate in a liquid photosensitive polyimide, then pulled up at a constant speed and baked to form a solid photosensitive polyimide film. Since it is formed, the thickness of the non-conductive film can be accurately adjusted by the viscosity and the pulling speed of the liquid photosensitive polyimide, and the minute projections can be formed at low cost and with high accuracy. . Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

In the case of claim 1 or claim 2, for example, the non-conductive film is formed by immersing the roller or the flat substrate in a liquid of a thick film resist. Then, it may be formed by pulling up at a constant speed, subjecting it to a prescribed bake and solidifying.

According to the above arrangement, the non-conductive film is formed by dipping the roller or the flat substrate in the liquid for the thick film resist, then pulling up at a constant speed, baking and solidifying. Therefore, the thickness of the non-conductive film can be accurately adjusted by the viscosity and the pulling speed of the liquid resist for pressure film, and the minute projections can be formed inexpensively and accurately. Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

Further, in the case of claim 4 or claim 5, for example, as described in claim 8, the photosensitive polyimide layer is formed on the glass substrate without subjecting the glass substrate to a base treatment. It may be formed by applying a positive photosensitive polyimide.

According to the above structure, the photosensitive polyimide layer is formed by applying a positive photosensitive polyimide on the glass substrate without subjecting the glass substrate to a base treatment. It is possible to easily peel off the film from the glass substrate without performing the used etching step, and to form the roller with the fine projections with good stability and efficiency. Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

[0029]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.

FIGS. 1 to 4 are views showing an embodiment of the apparatus of the present invention. FIG. 1 is a view of a micropore forming apparatus 1 to which an embodiment of the micropore forming apparatus of the present invention is applied. It is a principal part perspective view.

In FIG. 1, the fine hole forming apparatus 1 includes a smooth roller 2 and a convex roller 3.
The resin film 4 passes between the and the convex roller 3.

The smooth roller 2 is formed in a cylindrical shape, and has a smooth surface. The convex roller 3 is formed in a cylindrical shape, and a plurality of minute convex portions 5 are formed on a surface thereof. As shown in FIG. 2, in the micropore forming apparatus 1, the resin film 4 is passed between the rotating roller 3 and the smooth roller 2, and the minute protrusions 5 of the convex roller 3 break through the resin film 4. Fine holes 6 are formed in the resin film 4 according to the size of the minute protrusions 5.

The convex roller 3 of the micropore forming apparatus 1 is formed as described below. That is, as shown in FIG. 3 (a), the convex roller 3 first immerses the cylindrical body 11 having a conductive surface in a predetermined resist, and pulls up the cylindrical body 11 at a constant speed. The resist film 12 is formed in a uniform thickness on the surface of the substrate. At this time, the speed at which the cylindrical body 11 is pulled out of the resist and the viscosity of the resist are appropriately adjusted so that the resist film 12 has a thickness greater than the height of the minute projections 5. If necessary, the cylindrical body 11 is immersed in the resist, and is repeatedly pulled up, so that the thickness of the resist film 12 is formed to be thicker than the height of the minute projections 5. Post-baking is performed on the resist film 12 thus formed, and the resist film 12
Is fixed to the surface of the cylindrical body 11.

In this manner, the conductive cylindrical body 1
When a resist film 12 thicker than the height of the minute projections 5 was formed and fixed on the surface of No. 1, the position where the minute projections 5 were formed became an opening on the surface of the resist film 12 as shown in FIG. Through the mask 13 and the lens 14 of the pattern,
Laser light 15 having a certain energy or more, for example, wavelength 2
A 48 nm KrF excimer laser beam 15 is irradiated to ablate and remove the resist film 12 at the position where the minute protrusion 5 is to be formed, thereby forming the fine hole 16 at the position where the minute protrusion 5 of the resist film 12 is to be formed. . The irradiation of the laser beam 15 is performed by sequentially sending the cylindrical body 11 in the height direction and the circumferential direction, thereby performing the entire surface of the resist film 12 on the surface of the cylindrical body 11, and forming the fine holes 1 on the entire surface of the resist film 12.
6 is formed. When the fine holes 16 are formed on the entire surface of the resist film 12 in this manner, as shown in FIG. 3B, the resist film 12 has the fine holes 16 formed in the portions where the fine convex portions 5 are to be formed. Thus, the portion where the fine holes 16 are formed has a state in which the conductive surface of the cylindrical body 11 is exposed.

Next, the cylindrical body 11 covered with the resist film 12 having the fine holes 16 is immersed in an electroforming tank.
When electrodeposition is performed using the cylindrical body 11 as a cathode, as shown in FIG. 3 (c), the minute projections 5 are formed only at the portions where the fine holes 16 where the conductive surface of the cylindrical body 11 is exposed are formed. Metal 17 grows up to the height of the minute protrusion 5 to be formed,
Electrodeposition is stopped when the metal 17 is grown. In the electrodeposition, usually, the metal grows isotropically, but the conductive surface of the cylindrical body 11 is covered with the resist film 12 in which the fine holes 16 are formed, and the minute protrusions formed by the resist film 12 are formed. Since the metal 17 to be the minute projections 5 is formed to be thicker than the height of the portion 5, the growth direction is limited by the resist film 12 around the fine holes 16 of the resist film 12, and the fineness of the resist film 12 is reduced. It grows so as to fill the hole 16. Therefore, the metal 17 to be the minute convex portion 5 is formed according to the shape of the minute hole 16, and the height of the metal 17 is adjusted at the end timing of the electrodeposition, whereby the minute convex portion 5 having a required height is obtained. Metal 17 can be grown.

Next, when the resist film 12 is peeled off from the cylindrical body 11 by thermal decomposition or solvent treatment, etc.
As shown in (d), the convex roller 3 having the fine convex portions 5 formed on the surface of the cylindrical body 11 can be formed.

Therefore, the convex roller 3 has a size and a height intended by the minute convex portion 5, and has a uniform size and a height, and is arranged uniformly, as shown in FIG. Then, when the resin film 4 is passed between the convex roller 3 and the smooth roller 2 to form the fine holes 6 in the resin film 4, the resin film 4 has a uniform size, distribution and uniform fineness. A hole 6 is formed. Further, the minute convex portion 5 can be formed directly on the surface of the cylindrical body 11 to form the convex roller 3, and the man-hour for forming the convex roller 3 can be reduced, and the micropore forming apparatus 1 can be manufactured at low cost. Things.

In the above embodiment, the convex roller 3 is formed by forming the minute convex portion 5 directly on the surface of the cylindrical body 11, but the method of forming the convex roller 3 is limited to the above method. Instead, for example, a resin film is bonded to a conductive thin plate substrate having a shape corresponding to the circumferential surface of the convex roller 3 or a larger size via an adhesive, and fine holes are formed in the resin film. Formed on the flat substrate,
And the flat substrate on which the minute projections 5 are formed may be formed into a cylindrical shape to form the projection rollers 3.

That is, first, a non-conductive film (corresponding to the resist film 12 of FIG. 3A) such as a resin film is bonded to the surface of a flat substrate formed of a conductive thin plate by an adhesive. I do. At this time, the thickness of the resin film as a sum of the adhesive and the resin film is the minute protrusion 5.
Use a resin film with a thickness greater than the height of the resin film.
The surface of the resin film is irradiated with an excimer laser beam through a mask having a pattern in which the positions where the minute protrusions 5 are formed are open, and the resin film at the positions where the minute protrusions 5 are to be formed is subjected to laser ablation processing. To remove the fine holes (corresponding to the fine holes 16 in FIG. 3B).
Is formed on a resin film. Then, a metal (corresponding to the metal 17 in FIG. 3 (c)) having the height of the minute projections 5 is grown on the flat substrate to which the resin film having the fine holes formed is bonded by electrodeposition. The resin film is removed to form a flat substrate on which the minute projections 5 are formed. The flat substrate on which the minute projections 5 are formed is wound around the surface of a cylindrical roller so that the minute projections 5 are on the front side, and bonded or bonded by soldering or the like. The convex roller 3 having the minute convex portions 5 is formed.

In this case as well, the convex roller 3 can be configured such that the minute convex portions 5 thereof are uniform and have the intended size and height and are uniformly arranged at the intended density. Since the micropores are formed on the plane, the micropores can be formed with higher precision, and the microprojections 5 having a more uniform and intended size and height can be formed. As a result, as shown in FIG. 1, when the resin film 4 is passed between the convex roller 3 and the smooth roller 2 to form the fine holes 6 in the resin film 4, the resin film 4 becomes even more uniform. Thus, the fine holes 6 having the intended size and uniformly distributed are formed.

In the case where the convex roller 3 is formed using the above-mentioned flat substrate, as the film formed on the flat substrate, for example, if a non-conductive film made of a resist for pressure film is used, the diameter can be increased by photolithography. Micropores of about 30 μm and a depth of about 30 μm can be formed, and finer microprojections 5 can be accurately formed.

Further, a glass substrate was used as a flat substrate, and a film for forming fine holes in the glass substrate was
A photosensitive polyimide may be used. In this case, the photosensitive polyimide at a position where the minute convex portion 5 is to be formed is removed by patterning by photolithography to form a fine hole in the photosensitive polyimide film. Before the photosensitive polyimide film in which the micropores are formed is post-cured at a temperature equal to or higher than the glass transition temperature, the photosensitive polyimide film is separated from the glass substrate. At this time, the photosensitive polyimide film is peeled off by immersion in hydrofluoric acid or nitric hydrofluoric acid. In other words, the photosensitive polyimide film before curing has a rough structure, and hydrofluoric acid or the like penetrates through intermolecular gaps to etch the surface of the glass substrate, so that the photosensitive polyimide film can be collected. When the photosensitive polyimide film thus obtained is fixed on the surface of the cylindrical roller and electroformed, the minute projections 5 can be formed.

Accordingly, the minute projections 5 having an arbitrary diameter can be formed more precisely and at an intended density at an arbitrary position, and can be formed in the resin film 4 at an intended size and an intended position. The fine holes 6 can be formed with high precision and further finely.

Further, when a glass substrate is used and a photosensitive polyimide film is used as a film for forming micropores,
Fine holes may be formed in the photosensitive polyimide film by excimer laser processing. In this case, when the photosensitive polyimide layer is formed on the glass substrate, first, the photosensitive polyimide layer is dried at a temperature equal to or lower than the glass transition temperature, and then fine holes are formed in the photosensitive polyimide layer by excimer laser ablation.
The micropores formed in the photosensitive polyimide film by this laser ablation processing are formed such that the opening diameter on the side irradiated with the laser light is larger than the opening diameter on the non-irradiated side, and from the surface side toward the bottom. It is formed in a tapered shape whose opening diameter becomes narrow. The photosensitive polyimide film on which the micropores were formed in this manner was fixed such that the surface of the cylindrical roller and the surface with the larger opening diameter of the photosensitive polyimide film were aligned, and the photosensitive polyimide film was fixed. The minute roller 5 is formed on the surface of the cylindrical roller by electroforming the cylindrical roller to form the convex roller 3. Therefore, on the surface of the convex roller 3, a trapezoidal minute convex portion 5 having a smaller cross-sectional diameter from the root to the tip is formed. As a result, when the resin film 4 is passed between the convex roller 3 and the smooth roller 2, a high pressure is generated at the tip of the minute convex portion 5 of the convex roller 3, and the resin film 4
The micro holes 6 can be easily formed.

Therefore, it is possible to form the minute projections 5 having an arbitrary diameter at an arbitrary position more accurately and at an intended density, and to form the minute projections 5 on the tip side narrower than the root. The size of the resin film 4 in the intended size and at the intended position with higher accuracy, and
Even finer micropores 6 can be formed.

Further, when the above-mentioned photosensitive polyimide film is used, the photosensitive polyimide film may be coated on the substrate without performing the base treatment when the photosensitive polyimide film is applied. That is, among the photosensitive polyimides, the positive type, like the positive type photoresist, has a weak adhesion to the glass surface, and is usually subjected to a base treatment such as application of an adhesion enhancer to the substrate surface. Later, a photosensitive polyimide is applied. When a photosensitive polyimide film used to form the minute convex portions 5 of the convex roller 3 is formed on the substrate,
A photosensitive polyimide film is formed on a substrate without performing a base treatment such as application of an adhesion enhancer. In this way, when the photosensitive polyimide film is peeled off from the substrate after forming the fine holes for forming the minute projections 5 in the photosensitive polyimide film, the photosensitive polyimide film is not etched without acid etching the substrate. Can be easily separated from the substrate.

Although the invention made by the inventor has been specifically described based on the preferred embodiments, the invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

[0048]

According to the fine hole forming apparatus of the present invention, a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine convex portions formed thereon. A non-conductive film such as resin is formed thicker than the height of the micro-projections on the conductive cylindrical roller, and the film corresponding to the micro-projections is laser ablated. Micropores are formed by decomposition and removal by processing, and metal is grown in the micropores by electroforming to form minute protrusions directly on the roller surface. It is possible to accurately form small convex portions with a diameter of less than the number of steps and at the intended density, and to form fine holes with high precision at the intended positions in the film at the intended size. Can be done,
The micropore forming apparatus can be inexpensive.

According to the second aspect of the present invention, there is provided a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of fine projections. A non-conductive film such as a resin film is formed on a conductive flat plate substrate thicker than the height of the minute protrusions, and the non-conductive portion of the roller corresponding to the formation position of the minute protrusions is formed on the roller having the protrusions formed thereon. The conductive film is decomposed and removed by laser ablation processing to form micropores, and metal is grown on the flat substrate in the micropores by electroforming to form microprojections, and the microprojections are formed. Since the flat substrate is wound and formed into a cylindrical shape with the surface on which the fine protrusions are formed as a surface, the fine protrusions of any diameter are formed at any positions.
The film can be formed more accurately and at the intended density, and the fine holes can be formed at the intended position in the film at the intended size with higher precision.

According to the fine hole forming apparatus of the third aspect of the present invention, the fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of minute projections is formed. A non-conductive film of photoresist is formed thicker than the height of the minute protrusions on a flat plate substrate with conductivity, and the non-conductive portion of the roller corresponding to the position where the minute protrusions are formed is formed on the flat plate substrate having conductivity. A fine hole is formed by removing the film by photolithography, and a metal is grown on the flat substrate in the fine hole by electroforming to form a minute protrusion, and the plate substrate on which the minute protrusion is formed. Is wound in a cylindrical shape with the surface on which the microprojections are formed as a surface, so that the microprojections of any diameter at any position can be more accurately and at the intended density. Can be formed, It is possible to form a fine hole even more high precision by a position intended by the size of.

According to the fine hole forming apparatus of the fourth aspect of the present invention, a fine hole forming apparatus for forming a fine hole by passing a film between a pair of rollers having a plurality of minute projections is formed. On the roller on which the convex portions are formed, a photosensitive polyimide layer is formed thicker than the height of the minute convex portions on the glass substrate, and the photosensitive polyimide layer corresponding to the position where the minute convex portions are formed is patterned and removed by photolithography. The photosensitive polyimide layer in which the fine holes are formed is peeled off from the glass substrate, fixed as a polyimide film on the surface of the cylindrical roller by post-curing, and the fine holes are formed in the metal by electroforming. Since the micro-projections are formed by growing on the surface of the inner roller, the micro-projections of any diameter can be formed at any position more accurately and at the intended density. It is possible to form, can also be formed thin tip side of the base of the fine convex portion,
Finer pores can be formed with higher precision and at a desired position in a film at a desired size and at a desired position.

According to the fine hole forming apparatus of the present invention, the film is passed between a pair of rollers having a plurality of minute projections, and the fine hole is formed by the fine hole forming apparatus. The roller on which the convex portions are formed, a photosensitive polyimide layer is formed on the glass substrate thicker than the height of the fine convex portions, and after drying at a glass transition temperature or lower, the portion corresponding to the position where the fine convex portions are formed is formed. Micropores are formed by removing the photosensitive polyimide layer by laser ablation processing, the photosensitive polyimide layer in which the micropores are formed is peeled from the glass substrate, a polyimide film is formed by post cure, and the polyimide film is cylindrical. The laser irradiation surface of the polyimide film is fixed to the surface of the roller in accordance with the surface of the roller, and metal is formed by electroforming on the surface of the roller in the fine hole. To form a minute projection sections are grown,
Since it is formed, it is possible to form a minute convex portion with an arbitrary diameter at an arbitrary position more accurately and at an intended density, and to form the minute convex portion on the tip side narrower than the root. This makes it possible to form finer pores with higher precision and at a desired position in a film at a desired size and at a desired position.

According to the micropore forming apparatus of the present invention, the roller or the flat substrate is immersed in the liquid photosensitive polyimide, then pulled up at a constant speed and baked to obtain a solid. -Like photosensitive polyimide film is formed and formed, so that the thickness of the non-conductive film can be accurately adjusted by the viscosity and the pulling speed of the liquid photosensitive polyimide, inexpensively, and accurately. A minute projection can be formed. Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

According to the micropore forming apparatus of the present invention, the roller or the flat substrate is dipped in the liquid of the resist for the thick film, then pulled up at a constant speed and baked. The thickness of the non-conductive film can be accurately adjusted by adjusting the viscosity of the resist for liquid pressure film and the pulling speed. Can be formed. Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

According to the micropore forming apparatus of the present invention, the photosensitive polyimide layer is formed by applying a positive photosensitive polyimide on the glass substrate without subjecting the glass substrate to a base treatment. The film can be easily peeled off from the glass substrate without performing an etching process using hydrofluoric acid, etc., forming a roller with fine projections with good stability and efficiency. can do. Therefore, the micropores can be formed with high precision at the intended position in the film at the intended size, and the micropore forming apparatus can be made more inexpensive.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a micropore forming apparatus to which an embodiment of a micropore forming apparatus according to the present invention is applied.

FIG. 2 is an enlarged front view of a contact portion between a convex roller and a smooth roller in FIG. 1;

FIG. 3 is a view showing a manufacturing process of the convex roller of FIG. 1;

FIG. 4 is a front view showing a state in which laser ablation is performed on the resist film formed on the surface of the cylindrical body in FIG. 3A via a mask.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Micropore forming apparatus 2 Smooth roller 3 Convex roller 4 Resin film 5 Microprotrusion 6 Micropore 11 Cylindrical body 12 Resist film 13 Mask 14 Lens 15 Laser beam 16 Micropore 17 Metal

Claims (8)

[Claims] 1. A film is passed between a pair of rollers having a plurality of minute convex portions formed on at least one cylindrical roller, and minute holes are formed in the film by the minute convex portions of the roller. A device for forming a fine hole,
The roller in which the minute protrusions are formed is formed by forming a non-conductive film such as a resin film thicker than the height of the minute protrusions on the surface of a cylindrical roller having conductivity, and forming the minute protrusions. A portion of the non-conductive film corresponding to a position is decomposed and removed by laser ablation processing to form a fine hole to expose the surface of the roller, and a metal is formed by electroforming on the surface of the roller in the fine hole. By growing to a predetermined height to form the small convex portion,
A micropore forming apparatus characterized by being formed. 2. A film is passed between a pair of rollers having a plurality of minute projections formed on the surface of at least one roller, and minute holes are formed in the film by the minute projections of the rollers. In the fine hole forming apparatus, the roller in which the fine convex portion is formed, a non-conductive film such as a resin film is formed on a conductive flat plate substrate thicker than the height of the fine convex portion, By forming a fine hole by decomposing and removing the non-conductive film of the portion corresponding to the formation position of the minute projections by laser ablation processing,
The surface of the flat substrate is exposed, and a metal is grown to a predetermined height on the flat substrate in the fine hole by electroforming to form the minute convex portion. The flat substrate on which the minute convex portion is formed Characterized by being wound in a cylindrical shape with the surface on which the minute projections are formed as a surface. 3. A film is passed between a pair of rollers having a plurality of minute projections formed on the surface of at least one roller, and minute holes are formed in the film by the minute projections of the rollers. The micro-hole forming apparatus, wherein the roller on which the minute protrusions are formed, forms a non-conductive film of photoresist thicker than a height of the minute protrusions on a conductive flat substrate, and By forming the fine holes by removing the non-conductive film of the portion corresponding to the position where the convex portion is formed by photolithography, the surface of the flat substrate is exposed, and the metal in the fine holes is formed by electroforming. Forming the minute projections on the flat substrate by growing to a predetermined height, and winding the flat substrate on which the minute projections are formed into a cylindrical shape with the surface on which the minute projections are formed as a surface. Ri, micropore forming device, characterized in that it is formed. 4. A film is passed between a pair of rollers having a plurality of minute projections formed on the surface of at least one roller, and minute holes are formed in the film by the minute projections of the rollers. In the fine hole forming apparatus, the roller formed with the minute convex portion, a photosensitive polyimide layer is formed on a glass substrate thicker than the height of the minute convex portion,
A fine hole is formed by patterning and removing a portion of the photosensitive polyimide layer corresponding to the formation position of the minute convex portion by photolithography, and the photosensitive polyimide layer in which the minute hole is formed is separated from the glass substrate. Then, the polyimide film is fixed to the surface of the cylindrical roller as a polyimide film by post-curing, and the metal is grown to a predetermined height on the surface of the roller in the micropores by electroforming to form the micro convex portion, thereby forming the micro convex portion. A micropore forming apparatus characterized in that it is made. 5. A film is passed between a pair of rollers having a plurality of minute projections formed on the surface of at least one roller, and minute holes are formed in the film by the minute projections of the rollers. In the fine hole forming apparatus, the roller formed with the minute convex portion, a photosensitive polyimide layer is formed on a glass substrate thicker than the height of the minute convex portion,
After drying at a glass transition temperature or lower, a micropore is formed by removing the photosensitive polyimide layer in a portion corresponding to the formation position of the microprojection by laser ablation processing, and the micropore is formed. The photosensitive polyimide layer is peeled off from the glass substrate, a polyimide film is formed by post-curing, and the polyimide film is fixed to the surface of the cylindrical roller by aligning the laser irradiation surface of the polyimide film with the surface of the roller. ,
A micro-hole forming apparatus formed by growing a metal to a predetermined height on a surface of the roller in the micro-holes by electroforming to form the micro-projections. 6. The non-conductive film is formed by immersing the roller or the flat substrate in a liquid photosensitive polyimide, pulling it up at a constant speed, and performing a prescribed baking to form a solid photosensitive polyimide film. The micropore forming apparatus according to claim 1, wherein the micropore forming apparatus is formed by performing the process. 7. The non-conductive film is formed by immersing the roller or the flat substrate in a liquid for a thick film resist, pulling it up at a constant speed, subjecting it to a prescribed baking, and solidifying it. 2. The method according to claim 1, wherein
Or the micropore forming apparatus according to claim 2. 8. The photosensitive polyimide layer is formed by applying a positive photosensitive polyimide on the glass substrate without subjecting the glass substrate to a base treatment. The micropore forming apparatus according to claim 4 or 5.