JPH10202465A - Bellows mechanism of machining device - Google Patents
Bellows mechanism of machining deviceInfo
- Publication number
- JPH10202465A JPH10202465A JP465797A JP465797A JPH10202465A JP H10202465 A JPH10202465 A JP H10202465A JP 465797 A JP465797 A JP 465797A JP 465797 A JP465797 A JP 465797A JP H10202465 A JPH10202465 A JP H10202465A
- Authority
- JP
- Japan
- Prior art keywords
- bellows
- main body
- processing apparatus
- bolt
- machining device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003754 machining Methods 0.000 title abstract description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004078 waterproofing Methods 0.000 abstract 2
- 239000002173 cutting fluid Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、加工装置のジャバ
ラ機構に関する。The present invention relates to a bellows mechanism of a processing apparatus.
【０００２】[0002]
【従来の技術】保持テーブルに保持された被加工物に切
削液を供給しながら切削する加工装置においては、図２
のように切削液が装置内部に浸入しないように、被加工
物を保持し移動可能な保持テーブル（図略）に防水カバ
ー１を装着すると共に、防水カバー１の両側には保持テ
ーブルの移動に追随する防水性のジャバラ本体２を取り
付けて、加工装置本体４の開口部４ａを覆うようにして
いる（例えば、特開平８−１５５７８４号公報）。2. Description of the Related Art In a processing apparatus for cutting while supplying a cutting fluid to a workpiece held on a holding table, FIG.
The waterproof cover 1 is mounted on a holding table (not shown) that holds and moves the workpiece so that the cutting fluid does not enter the inside of the apparatus as described above. A waterproof bellows main body 2 that follows is attached so as to cover the opening 4a of the processing apparatus main body 4 (for example, JP-A-8-155784).
【０００３】[0003]
【発明が解決しようとする課題】上記従来のジャバラ本
体２は、両端部に取付板３が設けられ、この取付板３を
加工装置本体４の廃液トレー５の側壁にボルト等で固定
して取り付け、メンテナンスの際には防水カバー１と一
体に着脱するようになっている。しかしながら、ジャバ
ラ本体２の取付箇所が多い（図例では片側５箇所、両方
で合計１０箇所）ため着脱が面倒であり、又ボルト等の
止め具を落下したり紛失したりする等のトラブルが多く
発生する問題があった。本発明は、このような問題を解
決するためになされ、取付箇所を片側１箇所にして着脱
が容易にできると共に、ボルト等の止め具の落下や紛失
を防止できるようにした加工装置のジャバラ機構を提供
することを目的とする。The bellows body 2 of the prior art is provided with mounting plates 3 at both ends, and the mounting plates 3 are fixed to the side walls of the waste liquid tray 5 of the processing apparatus body 4 by bolts or the like. During maintenance, the waterproof cover 1 is attached and detached integrally. However, there are many mounting locations for the bellows main body 2 (five locations on one side, 10 locations in total on both sides in the example in the figure), and it is troublesome to attach and detach, and there are many troubles such as dropping or losing fasteners such as bolts. There was a problem that occurred. SUMMARY OF THE INVENTION The present invention has been made in order to solve such a problem, and a bellows mechanism of a processing apparatus in which attachment and detachment can be easily performed with one attachment point on one side and a stopper such as a bolt can be prevented from being dropped or lost. The purpose is to provide.
【０００４】[0004]
【課題を解決するための手段】前記課題を技術的に解決
するための手段として、本発明は、被加工物を保持し移
動可能な保持テーブルと、この保持テーブルの移動方向
に沿って加工装置本体に形成されている開口部を覆うジ
ャバラ本体と、を少なくとも含む加工装置において、前
記ジャバラ本体にはジャバラ部と加工装置本体に着脱で
きる着脱部とが設けられており、加工装置本体には前記
着脱部が着脱する固定部が設けられていて、加工装置本
体に前記ジャバラ本体が容易に着脱できるように構成し
た加工装置のジャバラ機構を要旨とする。又、加工装置
本体の固定部には係合部と締結部が形成されており、ジ
ャバラ本体の着脱部には被係合部と被締結部とが形成さ
れていること、締結部は少なくとも１本のボルトを含
み、被締結部は前記ボルトに対応するねじ孔を含むこ
と、加工装置はダイシング装置であり、被加工物は半導
体ウェーハであること、を要旨とするものである。As means for technically solving the above-mentioned problems, the present invention provides a holding table capable of holding and moving a workpiece, and a processing apparatus along a moving direction of the holding table. A bellows body covering at least an opening formed in the body, wherein the bellows body is provided with a bellows portion and a detachable portion that can be attached to and detached from the machining device body, and the machining device body has the The gist of the present invention is a bellows mechanism of a processing apparatus which is provided with a fixing portion to which the attaching / detaching section is attached and detached, and which is configured so that the bellows body can be easily attached to and detached from the processing apparatus body. Further, an engaging portion and a fastening portion are formed on the fixed portion of the processing apparatus body, and an engaged portion and a fastened portion are formed on the attaching / detaching portion of the bellows body. The gist of the present invention includes that the bolt is included, the fastening portion includes a screw hole corresponding to the bolt, the processing device is a dicing device, and the workpiece is a semiconductor wafer.
【０００５】[0005]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて詳説する。図１において、４は加工装置
本体であり、要部に開口部４ａが設けられこの開口部４
ａの下方に保持テーブル（図略）の駆動機構６が設けら
れている。駆動機構６は、移動テーブル６ａと、この移
動テーブル６ａをＸ軸方向（開口部の長手方向）に移動
させるボールスクリュー６ｂ及びモータ６ｃを備え、移
動テーブル６ａの上に保持テーブルが装着され、この保
持テーブルを移動テーブル６ａと共にＸ軸方向に移動す
るようになっている。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 4 denotes a processing apparatus main body, and an opening 4a is provided in a main part.
A drive mechanism 6 for a holding table (not shown) is provided below the position a. The drive mechanism 6 includes a moving table 6a, a ball screw 6b for moving the moving table 6a in the X-axis direction (longitudinal direction of the opening) and a motor 6c, and a holding table is mounted on the moving table 6a. The holding table is moved in the X-axis direction together with the moving table 6a.
【０００６】前記加工装置本体４の開口部４ａの両端に
は固定部７が対設され、この固定部７の両側の下端部に
は略Ｌ形の係合部７ａが対設され、上端部には内側に折
曲された水平の締結部７ｂが設けられると共に、その中
央部にボルト挿通用の孔７ｃがそれぞれ形成されてい
る。At both ends of the opening 4a of the processing apparatus main body 4, fixed portions 7 are provided opposite each other, and substantially L-shaped engaging portions 7a are provided at lower ends on both sides of the fixed portion 7, and upper ends are provided. Is provided with a horizontal fastening portion 7b bent inward, and a hole 7c for bolt insertion is formed at the center thereof.
【０００７】防水カバー１は、図示を省略した保持テー
ブルに装着するための嵌合孔１ａが中央部に形成され、
両側部にはジャバラ本体２がそれぞれ取り付けられてお
り、このジャバラ本体２にはジャバラ部２ａと、その端
部に着脱部８がそれぞれ設けられている。The waterproof cover 1 has a fitting hole 1a formed at the center for mounting on a holding table (not shown).
The bellows body 2 is attached to both sides, and the bellows body 2 is provided with a bellows portion 2a and an attaching / detaching portion 8 at an end thereof.
【０００８】前記着脱部８は、略門形を呈しその両側の
下端部は前記固定部７の係合部７ａに係合する被係合部
８ａが形成され、上端部には内側に折曲された水平の被
締結部８ｂが設けられると共に、その中央部にボルト螺
着用のねじ孔８ｃがそれぞれ形成されている。The attachment / detachment portion 8 has a substantially gate shape, and the lower end portions on both sides thereof are formed with engagement portions 8a which engage with the engagement portions 7a of the fixing portion 7, and the upper end portion is bent inward. A horizontal fastened portion 8b is provided, and a screw hole 8c for screwing a bolt is formed in a central portion thereof.
【０００９】このように構成されたジャバラ本体２は、
防水カバー１と一体で前記加工装置本体４の開口部４ａ
を覆うようにして固定部７に取り付けられる。即ち、防
水カバー１を保持テーブルに装着すると共に、ジャバラ
本体２の着脱部８を固定部７の内側から斜めに挿入しな
がら被係合部８ａを係合部７ａに落とし込んでそれぞれ
係合させ、被締結部８ｂを締結部７ｂの下面に当接さ
せ、且つ締結部７ｂの孔７ｃからボルト９を差し込んで
前記ねじ孔８ｃに螺着することによりジャバラ本体２を
それぞれ取り付けることができる。The bellows main body 2 configured as described above is
An opening 4a of the processing apparatus main body 4 integrally with the waterproof cover 1.
Is attached to the fixing portion 7 so as to cover That is, while attaching the waterproof cover 1 to the holding table, and inserting the detachable portion 8 of the bellows body 2 obliquely from the inside of the fixing portion 7, the engaged portion 8a is dropped into the engaging portion 7a and engaged with each other. The bellows main body 2 can be attached to each of the bellows body 2 by bringing the fastened portion 8b into contact with the lower surface of the fastening portion 7b, inserting the bolt 9 from the hole 7c of the fastening portion 7b, and screwing into the screw hole 8c.
【００１０】従って、両側のジャバラ本体２は、それぞ
れ１本のボルト９で加工装置本体４の固定部７に取り付
けることができ、メンテナンスの際にはそのボルト９を
外すと共に、着脱部８を固定部７から抜けば容易に外す
ことができる。つまり、ジャバラ本体２の着脱は非常に
簡略化すると共に、止め具であるボルト９の落下や紛失
等のトラブルも防止することが可能となる。ジャバラ本
体２は、伸縮自在であるから着脱作業がし易い。Therefore, the bellows main body 2 on both sides can be attached to the fixing portion 7 of the processing apparatus main body 4 with one bolt 9 respectively, and at the time of maintenance, the bolt 9 is removed and the detachable portion 8 is fixed. If it is removed from the part 7, it can be easily removed. That is, attachment and detachment of the bellows main body 2 can be greatly simplified, and troubles such as dropping or loss of the bolt 9 serving as a stopper can be prevented. Since the bellows body 2 is extendable and retractable, it can be easily attached and detached.
【００１１】加工装置本体４がダイシング装置の場合に
は、保持テーブル上に被加工物である半導体ウェーハ
（図略）を保持し、この保持テーブルをＸ軸方向に移動
して図示を省略した回転ブレード等の切削手段により、
半導体ウェーハに切削液を供給しながら切削加工が行わ
れる。When the processing device body 4 is a dicing device, a semiconductor wafer (not shown) as a workpiece is held on a holding table, and the holding table is moved in the X-axis direction to rotate the semiconductor wafer (not shown). By cutting means such as blades,
Cutting is performed while supplying a cutting fluid to the semiconductor wafer.
【００１２】[0012]
【発明の効果】以上説明したように、本発明によれば、
ジャバラ本体の着脱部を１箇所ボルト止めするだけで加
工装置本体の固定部に取り付けられるようにしたので、
メンテナンスの際の着脱が容易になると共に、止め具の
落下や紛失を未然に防止できる等の優れた効果を奏す
る。As described above, according to the present invention,
Since the attachment and detachment part of the bellows body can be attached to the fixed part of the processing equipment body only by bolting it at one place,
Excellent effects such as easy attachment and detachment at the time of maintenance and prevention of dropping or loss of the stopper can be achieved.
【図１】本発明の実施の態様を示す概略斜視図である。FIG. 1 is a schematic perspective view showing an embodiment of the present invention.
【図２】従来例を示す概略斜視図である。FIG. 2 is a schematic perspective view showing a conventional example.
１…防水カバー １ａ…嵌合孔 ２…ジャバラ本体 ２ａ…ジャバラ部 ３…取付板 ４…加工装置本体 ４ａ…開口部 ５…廃液トレー ６…駆動機構 ６ａ…移動テーブル ６ｂ…ボールスクリュー ６
ｃ…モータ ７…固定部 ７ａ…係合部 ７ｂ…締結部 ７ｃ…孔 ８…着脱部 ８ａ…被係合部 ８ｂ…被締結部 ８ｃ…ねじ孔 ９…ボルトDESCRIPTION OF SYMBOLS 1 ... Waterproof cover 1a ... Fitting hole 2 ... Bellows main body 2a ... Bellows part 3 ... Mounting plate 4 ... Processing apparatus main body 4a ... Opening 5 ... Waste liquid tray 6 ... Drive mechanism 6a ... Moving table 6b ... Ball screw 6
c ... motor 7 ... fixed part 7a ... engaging part 7b ... fastening part 7c ... hole 8 ... detachable part 8a ... engaged part 8b ... fastened part 8c ... screw hole 9 ... bolt
Claims (4)
と、この保持テーブルの移動方向に沿って加工装置本体
に形成されている開口部を覆うジャバラ本体と、を少な
くとも含む加工装置において、 前記ジャバラ本体にはジャバラ部と加工装置本体に着脱
できる着脱部とが設けられており、加工装置本体には前
記着脱部が着脱する固定部が設けられていて、加工装置
本体に前記ジャバラ本体が容易に着脱できることを特徴
とする加工装置のジャバラ機構。1. A processing apparatus including at least a holding table capable of holding and moving a workpiece, and a bellows body covering an opening formed in the processing apparatus body along a moving direction of the holding table. The bellows main body is provided with a bellows portion and a detachable portion that can be attached to and detached from the processing device main body, and the processing device main body is provided with a fixing portion to which the detachable portion is attached and detached. A bellows mechanism for a processing device that can be easily attached and detached.
が形成されており、ジャバラ本体の着脱部には被係合部
と被締結部とが形成されている請求項１記載の加工装置
のジャバラ機構。2. An engaging portion and a fastening portion are formed on a fixed portion of the processing apparatus body, and an engaged portion and a fastened portion are formed on a detachable portion of the bellows body. Bellows mechanism of processing equipment.
被締結部は前記ボルトに対応するねじ孔を含む請求項２
記載の加工装置のジャバラ機構。3. The fastening portion includes at least one bolt,
3. The fastened portion includes a screw hole corresponding to the bolt.
The bellows mechanism of the processing device described in the above.
物は半導体ウェーハである請求項１又は２又は３記載の
加工装置のジャバラ機構。4. The bellows mechanism of a processing apparatus according to claim 1, wherein the processing apparatus is a dicing apparatus, and the workpiece is a semiconductor wafer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP465797A JP3848715B2 (en) | 1997-01-14 | 1997-01-14 | Bellows mechanism |
| TW87110143A TW401337B (en) | 1997-01-14 | 1998-06-24 | Machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP465797A JP3848715B2 (en) | 1997-01-14 | 1997-01-14 | Bellows mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10202465A true JPH10202465A (en) | 1998-08-04 |
| JP3848715B2 JP3848715B2 (en) | 2006-11-22 |
Family
ID=11590023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP465797A Expired - Lifetime JP3848715B2 (en) | 1997-01-14 | 1997-01-14 | Bellows mechanism |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3848715B2 (en) |
| TW (1) | TW401337B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002346906A (en) * | 2001-05-21 | 2002-12-04 | Tokyo Seimitsu Co Ltd | Cutting device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI448352B (en) * | 2010-10-08 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | Retractable shielding device |
| TW201424915A (en) * | 2012-12-26 | 2014-07-01 | Metal Ind Res & Dev Ct | Protection device |
| JP5918197B2 (en) * | 2013-11-25 | 2016-05-18 | Ｔｏｗａ株式会社 | Bellows mechanism and substrate cutting apparatus and apparatus having the same |
-
1997
- 1997-01-14 JP JP465797A patent/JP3848715B2/en not_active Expired - Lifetime
-
1998
- 1998-06-24 TW TW87110143A patent/TW401337B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002346906A (en) * | 2001-05-21 | 2002-12-04 | Tokyo Seimitsu Co Ltd | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3848715B2 (en) | 2006-11-22 |
| TW401337B (en) | 2000-08-11 |
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