JPH10200152A - Semiconductor optical coupler and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance convergence, conversion efficiency and orientation, improve mounting property to a printed board, prevent malfunction due to external light, and provide a low-cost device in a semiconductor optical coupler such as a photo-interrruptor. SOLUTION: After a light emitting element 101 and a light receiving element 102 provided with lenses 101a and 102 on the front surface respectively are arranged in a mold, they are surrounded while slits 20 and 30a are still left open in front of the lens, and housings 20 and 30 (first parts) holding the lead roots of both elements are insertion molded individually by using a resin. Such a process is called first molding step. A semi-finished product 21 provided with a light emitting element formed through the molding step and a semi-finished product 31 provided with a light receiving element are made opposite to each other and they are arranged in a mold, and then a housing 40 (second part) coupling both elements is insertion molded by using the same resin. This process is called a second molding step, and a semiconductor optical coupler having integral structure is produced through these steps. The molds used for the first and second molding steps are worked within one-plane die and the first and second molding steps are performed by the same shot.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor optical coupling device such as a photo interrupter used for detecting the presence or absence of an object.

[0002]

2. Description of the Related Art Conventionally, a photo interrupter having a light emitting element and a light receiving element has been known as one used for detecting the presence or absence of an object. Among them, the so-called box type photointerrupter, in which each lead of the light emitting element and the light receiving element is soldered to the printed circuit board, is used in a bonding method, a caulking method, an insert method, depending on a method of fixing the element to the housing. It can be classified into a snap method, a two-piece method, and the like.

FIG. 8 shows the light emitting device. Reference numeral 11 denotes a metal conductive lead. An LED (light emitting diode) 12 is mounted on one end of the lead, and the LED 12 and the other lead 11 are connected by bonding with a metal wire 13. The lens 14 integrated with the element resin portion is formed of a resin such as epoxy. The structure of the light receiving element is the same as that shown in FIG. 8, except that the chip mounted on the light emitting element becomes a light receiving pellet.

FIGS. 9A and 9B show a method of fixing an element to a housing by the above-mentioned bonding method. After the light-emitting and light-receiving elements 101 and 102 having the above-described configuration are inserted through a lower opening into a recess provided in the integral housing 103 so as to be arranged to face each other, the light-emitting and light-receiving elements 101 and
02 to the inner surface of the housing 103.
a is provided and fixed by bonding. Housing 103
The slits 103b for providing directivity of optical coupling and for restricting the optical axis coupling area are provided for both the elements, respectively, on the opposing surfaces of the elements. In addition, light emitting and light receiving element 1
The lenses 01 and 102 are provided with lenses 101a and 102a, respectively, for improving conversion efficiency and directivity. Reference numeral 6 denotes a printed circuit board on which the semiconductor optical coupling device 1 having the above-described configuration is mounted. Reference numeral 61 denotes a lead hole provided on the printed circuit board 6 for inserting the respective leads 105 of the light emitting and light receiving elements 101 and 102. It is formed with a pitch.

FIGS. 10A and 10B show a method of fixing an element to a housing by the above-described caulking method. The light-emitting and light-receiving elements 101 and 102 are inserted into the housing 103 from the lower openings, similarly to the bonding method, and then the resin portions or the lead portions 105 of the light-emitting and light-receiving elements 101 and 102 are inserted.
Then, it is fixed by pressing with heat caulking in the direction of the arrow X so that a part 103c of the housing bites into the housing. Slit 103b,
The lenses 101a and 102a, the printed circuit board 6, and the lead hole 61 are the same as those described in the bonding method, and the housing 103 can be shared for the two methods.

FIG. 11A shows a method of fixing an element to a housing by the above-mentioned insert method. When molding the housing 106, the light emitting and receiving elements 10
1, 102 are inserted and molded and fixed. In this case, for the convenience of the molding process, the direction of pulling out the mold is the direction indicated by A in the figure, so that the light receiving elements 101 and 102 do not have a lens portion, that is, the light emitting surface, the light receiving surface, Use a flat surface. 106a is a slit formed on the element facing surface of the housing 106. Reference numeral 6 denotes a printed circuit board on which the semiconductor optical coupling device is mounted.
Reference numeral 1 denotes a light-emitting and light-receiving element 101 provided on a printed circuit board 6;
The lead holes 102 for inserting the respective leads 105 are formed at a predetermined pitch.

FIG. 12 shows a method of fixing the element to the housing by the above-mentioned snap method. Luminescence with lens,
The light receiving elements 101 and 102 are inserted from the upper opening of the housing 107 while excluding the locking claw 107a provided at the same position, and set on a seat provided at a predetermined position, so that the locking claw 107a is returned by elasticity. Then, the upper end of the element is locked and fixed. Illustration of the printed circuit board is omitted.

FIG. 13 shows a method of fixing an element to a housing by the two-piece method. Luminescence with lens,
The light receiving elements 101 and 102 are sandwiched between a two-piece housing, that is, an upper housing 108A and a lower housing 108B. A slit 108Aa is formed in the upper housing 108A on the element facing surface. Illustration of the printed circuit board is omitted.

[0009]

In the bonding method shown in FIG. 9, both the light emitting and light receiving elements and the respective leads are integrated, and the means for regulating the lead pitch includes a housing recess and both element main bodies. It depends on how the part is fixed.
In other words, since the root of the lead is not fixed, the lead is likely to bend, and when the lead 105 is inserted into the lead hole 61 of the printed circuit board 6, it is difficult for the lead to enter the hole. Further, in order to enhance the insertion workability, the lead 1
If you make 05 longer, after soldering to the printed circuit board,
There is also a disadvantage that it takes time to cut unnecessary lead portions.

Although the caulking method shown in FIG. 10 has a different working method, it has the same problem as the bonding method shown in FIG. 9 because the structure after assembly is the same.

In the insert method shown in FIG. 11A, unlike the bonding and caulking methods described above, the root of the lead is fixed with resin at the time of molding, so that the pitch does not change and the mountability on a printed circuit board is improved. Although it is good, the direction of pulling out the mold is limited to the direction of arrow A in FIG. 11A due to the forming process by integral insert molding. As described above, since the undercut portion B is generated and the product is damaged when the mold is opened, only an element without a lens can be used in this case. Therefore, there is a disadvantage that the light-collecting property is deteriorated and the conversion efficiency and the directivity are not good.

In the snap system shown in FIG. 12, since the housing is of an assembling type, the lens portion of the element does not interfere with the housing as in the insert system. Also, since the leads of the element are fixed by the lead holding holes 107b at the lower part of the housing 107, the mountability of the printed circuit board is good. However, the housing 107
Due to the upper opening and the locking claw 107a of the portion, many air gaps are formed on the upper surface, and the semiconductor optical coupling device has a problem that it is likely to malfunction due to the influence of external light. Met.

[0013] Next, in the two-piece system shown in FIG. 13, although there are no problems as described above, the number of parts increases by one in order to make the housing two-piece.
Therefore, there remains a problem that the cost of parts and the number of assembling man-hours associated therewith increase.

The present invention proposes a semiconductor optical coupling device which solves all of the above-mentioned problems. That is, (1) a malfunction does not occur due to the influence of external light; (2) A device provided with a lens can be used for both the light-emitting and light-receiving elements.
The directivity is good. (3) A slit is formed in the entire surface of the lens of the housing to secure the directivity of optical coupling and the coupling area can be regulated. It is fixed and has good mountability on printed circuit boards.
(5) The housing is one piece, and there is no increase in parts cost and assembly man-hour. It is an object of the present invention to provide such a semiconductor optical coupling device.

[0015]

According to the present invention, a light-emitting element and a light-receiving element each having a lens on the front surface are arranged in a mold, and the slit is opened in front of the lens. A first forming step of insert-molding a housing (first portion) having a structure surrounding each of the two elements and holding at least the vicinity of the root of each of the leads of the two elements as a separate body with the two elements, respectively; ,
A housing (first portion) including a light emitting element and a housing (first portion) including a light receiving element, which are formed in the molding step, are placed in a mold so as to face each other, and then a housing ( This is solved by adopting a manufacturing method including a second molding step of insert-molding the second portion) with a resin.

The above-mentioned problem is also solved in the above-mentioned item, in which the dies used in the first molding step and the second molding step are processed into one-sided mold, and the one-sided mold is removed. This can be solved by performing the first molding step and the second molding step using the same shot.

[0017] Further, the above object is to provide a semiconductor optical coupling device in which a light emitting element and a light receiving element each having a lens on the front face are arranged to face each other, and surround the two elements respectively with a slit opened in front of the lens. A housing (first portion) having a structure for holding at least the vicinity of the root of each lead of both elements is provided for each of the two elements, and a housing (first part) including the light emitting element and a light receiving element are provided. This is solved by providing a housing (first portion) and a housing (second portion) that couples both the housing and the housing (first portion), and the respective housings are integrally formed.

Further, the above problem can be solved by forming the housing (second portion) from resin in the preceding paragraph.

Further, the above-mentioned problem is solved in
The problem can be solved by forming the housing (second portion) with a band-shaped metal plate.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first forming step of insert-molding a light emitting and a light receiving element so as to be surrounded by separate housings (first portions), respectively, and insert molding both of the molded products to form both of them. Housing (second
The manufacturing method comprising the second molding step of molding the portion (2)) is advantageous in that the direction in which the mold is removed is favorable, so that light emission,
The use of a device having a lens on each front surface of both light-receiving elements is possible, and all other parts are covered except for a slit opened in front of them, and the leads of both devices are formed so as to fix the vicinity of the base. The semiconductor optical coupling device manufactured by using such a manufacturing method improves the light collecting property, the conversion efficiency, and the directivity, is easily inserted into a printed circuit board, and is less likely to malfunction due to external light. .

The molding process using a one-sided mold configured to perform both the first and second molding processes in one shot makes the operation efficient.

In the case where the housing (second portion) is formed of a strip-shaped metal plate, it is possible to arbitrarily set the interval between the light-emitting and light-receiving elements by forming the metal plate after molding. It becomes possible.

[0023]

1 to 7 show an embodiment of the present invention. FIG. 1 is a sectional view of a completed semiconductor optical coupling device 10 of the present invention, and FIG. 2 is a sectional view of a semi-finished product. The manufacturing process in the present invention is a primary molding process of insert-molding the light emitting element and the light receiving element into separate housings (first portions), respectively, and inserting two separate housings to form a joint portion between the two. It consists of a secondary molding step.
As shown in the semi-finished product state in FIG. 2, in the first molding step, the light emitting element 101 having the lens 101a is set in the mold at the illustrated position, and then the housing (first portion)
The primary molding is completed by molding 20. 20a is a slit on the front surface of the lens, 20b is a stepped portion recessed below the front surface of the housing, and 105 is a housing (first portion) 20.
This is a lead of the light emitting element 101 projecting a predetermined dimension from below. Arrow C indicates the direction in which the mold is removed. Although FIG. 2 shows the semi-finished product 21 on the light emitting element 101 side, the semi-finished product 31 in which the light receiving element 102 is inserted also has a symmetrical shape, so that illustration and description are omitted.

Next, the semi-finished product 21 in which the light emitting element 101 is inserted and the semi-finished product 31 in which the light receiving element 102 is inserted are set at a predetermined interval in a secondary molding die. Next molding is performed. In this case, FIG.
As shown as a finished product in FIG. That is, the two semi-finished products 21 and 31 are set vertically in a mold, and the housing (first portion) 2
A housing (second portion) 40 is formed of the same resin material as 0 and 30. This portion is a portion for connecting the stepped portion 20b below the front surface of the housing (first portion) 20 in which the light emitting element 101 is insert molded and the housing (first portion) 30 in which the light receiving element 102 is insert molded. Becomes

The housing (first part) 20, 3
Steps 20b, 30b with the lower part of the front part of 0 retracted
By setting the surface in contact with the end of the housing (second portion) 40 as a rough surface or a surface with unevenness,
The fusion of the molding materials on the contact surface can be achieved, and the mechanical strength of the housing formed as a unit after the secondary molding can be secured. Reference numeral 10 indicates a completed product after the secondary molding.

FIGS. 3 and 4 show a top view and a side view of a main part of a mold used for manufacturing the semiconductor optical coupling device of the present embodiment. 50 is a mold for molding, and the mold 50 on one side is provided.
A primary molding die 51 and a secondary molding die 52 are laid out and processed. 53 is a mold parting line, 54 is a spool runner, both primary and
Common to secondary molding.

The primary molding die 51 is used to mold the housing (first part) as shown in FIG.
The mold is machined in such a state that the part is horizontal as shown in the figure, and the mold removing direction is indicated by an arrow C, and the light emitting element 101 and the light receiving element 102 for insert are set in a horizontal state. Oriented mold. Therefore, both the light emitting and light receiving elements can be easily set, and the slits on the front surfaces of the lenses of both elements can be formed because of such a mold removing direction.

As shown in FIG. 1, the secondary molding die 52 inserts the housings (first parts) 20 and 30 to form the housing (second part) 40. It is formed in such a manner that it can be set upright as shown in FIG. 1 and the molded housing (first part), semi-finished products 21 and 31 can be set in the vertical direction, As described above, the direction in which the mold is removed is the direction of arrow D.

The primary molding die 51 and the secondary molding die 52 are in a combination of numbers such that two finished products are obtained in the embodiment shown in the figure. The number of items can be set in any way.

In order to process the semiconductor optical coupling device of this embodiment using such a mold 50, first, two light-emitting elements 101 and two light-receiving elements 102 are provided on a predetermined portion of a primary molding mold 51, respectively. It is supplied and set by robot or by hand. Then, the mold is closed, a predetermined resin is injected to perform molding, and a semi-finished product 21 in which the light emitting element 101 is inserted in the housing 20 and a semi-finished product 31 in which the light receiving element 102 is inserted in the housing 30 are obtained.

Next, the mold is opened and the semi-finished products 21 and 31 are opened.
Is taken out, supplied to a predetermined portion of the secondary molding die 52 by a robot or manually, and set. Then, the mold is closed, a predetermined resin is injected, and molding is performed, and a joined portion of the semi-finished products 21 and 31, that is, a housing (second portion) 40 is molded to obtain the finished product 10.

When the secondary molding step is performed in the secondary molding die 52, the primary molding step 51 is performed again in the primary molding die 51 provided on the same die surface. Are performed at the same time, thereby producing a semi-finished product 21 with the light emitting element 101 inserted therein and a semi-finished product 31 with the light receiving element 102 inserted therein. Thus, the processing steps are combined and repeated.

As shown in FIG. 4, since the resin molded by the primary molding die and the resin molded by the secondary molding die are supplied by the integral spool runner 54, A general-purpose molding machine can be used, and there is no need to use a special machine such as for two-color molding.

Further, by simultaneously molding with a single-sided mold, the cost of molding material and the number of molding steps can be reduced to the same level as those for manufacturing a one-piece type housing.

The above-mentioned housing (first part) 20, 3
Steps 20b, 30b with the lower part of the front part of 0 retracted
The structure of the connecting portion with the end of the housing (second portion) 40 is not limited to the structure of the embodiment, and various combinations of shapes are considered. What is necessary is just to ensure the mechanical strength of the changed housing.

In the present invention described above, the housing is composed of the first part and the second part, which are integrated by a secondary molding step as understood from the above description. It is one piece, not two pieces. In addition, since a single-sided mold is used for processing and molding in the same process and at the same time, it can be surely regarded as one piece. This is the same as one piece in that the cost reduction, which is the final goal, is also achieved by doing in this way.

Next, a second embodiment of the present invention is shown in FIGS. According to the present invention, the light emitting element 101 including the lens 101a and the light receiving element 102 including the lens 102a
As shown in the side view of FIG. 5, the strip-shaped metal plate 90 in which the ends of the leads 105 of both elements are opposed to each other and the elements are set horizontally with the elements turned upside down, and at the same time both ends are formed with angled portions 90a, 90b at right angles. After the both housings are formed, they are set so as to straddle the front side, insert molding of both housing portions is performed, and the housing 70 is formed on the light emitting element 101 and the housing 80 is formed on the light receiving element 102. Since the die-drawing direction is the direction of arrow E, a slit that opens to the front of the lens can be formed although not shown.

FIG. 6 is a view showing a state in which the above-mentioned molding is completed.
As shown in (1), the metal plate 90 is formed by press working to form right-angled bent portions 90c and 90d near both ends in the longitudinal direction, so that the housings 70 and 80 are made upright.

Further, the metal plate 90 is formed again after the above-mentioned steps are completed, and four right-angle bent portions 90e and 90 are formed in the middle portion in the longitudinal direction as shown in FIG.
f, 90g, 90h to form housings 70 and 80
And a shape that is close to each other. In this case, the housing 70
The distance Y between the front surfaces of the devices 80 and 80 is set according to the product specifications as the gap size between the elements, and an arbitrary one can be obtained only by preparing a forming mold. The shape of the forming, the number of bending points, and the like can be changed in any manner.

[0040]

As described above, according to the present invention, as a method for manufacturing a semiconductor optical coupling device such as a photo interrupter, light emission,
Since the housings of both light receiving elements are separately molded by inserting each element, and the molded product is further inserted to mold the joint portion of the housing, the direction of removing the mold is convenient, so that the collecting Light, conversion efficiency,
Since the base of each lead of the element is fixed with resin at the time of molding, a semiconductor optical coupling device excellent in mountability on a printed circuit board can be obtained. Further, since the elements are insert-molded, the housing portion covers the upper surface of each element, and malfunction due to external light can be prevented.

Further, since the structure is a one-piece structure, it can be inexpensive. Further, by performing two moldings with the same shot using a mold on one surface, a more inexpensive semiconductor can be obtained. An optical coupling device can be obtained.

Further, according to the second aspect of the present invention, the housings of the light-emitting and light-receiving elements are separately provided, and when the respective elements are inserted and molded, a metal plate for simultaneously connecting the molded articles is inserted. And then forming a metal plate as necessary to adjust the distance between the two housings, so that the distance can be set to any size, and the same part can be used for many types of products. This makes it possible to reduce the initial cost.

[Brief description of the drawings]

FIG. 1 is a sectional view of one embodiment of a semiconductor optical coupling device of the present invention.

FIG. 2 is a sectional view of a semi-finished product of one embodiment of the semiconductor optical coupling device of the present invention.

FIG. 3 is a plan view of a mold of the semiconductor optical coupling device of the present invention.

FIG. 4 is a side view of a mold of the semiconductor optical coupling device of the present invention.

FIG. 5 is a side view of a semi-finished product of one embodiment of the semiconductor optical coupling device according to the second invention of the present invention.

FIG. 6 is a side view of one embodiment of the semiconductor optical coupling device according to the second invention of the present invention.

FIG. 7 is a side view of one embodiment of the semiconductor optical coupling device according to the second invention of the present invention.

FIG. 8 is a perspective view of a light emitting device used in the present invention.

FIG. 9A is a perspective view of a conventional bonding type semiconductor optical coupling device.

FIG. 9 (b) is a side sectional view of a conventional bonding type semiconductor optical coupling device.

FIG. 10A is a perspective view of a conventional caulking type semiconductor optical coupling device.

FIG. 10 (b) is a side sectional view of a conventional caulking type semiconductor optical coupling device.

FIG. 11A is a side sectional view of a conventional insert-type semiconductor optical coupling device.

FIG. 11B is a partial side cross-sectional view of a conventional insert-type semiconductor optical coupling device.

FIG. 12 is a side sectional view of a conventional snap-type semiconductor optical coupling device.

FIG. 13 is a side sectional view of a conventional two-piece semiconductor optical coupling device.

[Explanation of symbols]

 Reference Signs List 10 semiconductor optical coupling device 101 light emitting element 101a lens 102 light receiving element 102a lens 105 lead 20 housing (first part) (light emitting element side) 20a slit 21 semi-finished product (light emitting element side) 30 housing (first part) (light receiving) Element side) 30a Slit 31 Semi-finished product (light receiving element side) 40 Housing (second part) 50 Mold 51 Primary molding die 52 Secondary molding die 53 Parting line 70 Housing 80 Housing 90 Metal plate 90a ~ 90h bending part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Daiji Fukuoka 1025 Yabe-cho, Totsuka-ku, Yokohama-shi, Kanagawa-ken Tokai Tsushin Kogyo Co., Ltd.

Claims (5)

[Claims] After arranging a light emitting element and a light receiving element each having a lens on the front surface in a mold, surrounding the two elements with a slit opened in front of the lens, and surrounding each of the two elements. A first molding step of insert-molding a housing (first portion) having at least the vicinity of the root of the lead near the root as a separate body with a resin, and a housing including a light emitting element molded in the molding step ( After the first part) and the housing (first part) provided with the light receiving element are arranged in the mold so as to face each other, the second part in which the housing (the second part) that couples the two is insert-molded with resin is formed. Forming a semiconductor optical coupling device. 2. A mold used in the first molding step and the second molding step is processed into a one-sided mold, and the first molding step is performed by using the one-sided mold. 2. The method according to claim 1, wherein the second molding step is performed with the same shot. 3. A light-emitting element and a light-receiving element each having a lens on the front surface are arranged to face each other, surround the two elements, respectively, except for a slit opened in front of the lens, and have at least one of the leads of the two elements. A housing (first portion) having a structure for holding the vicinity of the root is formed on both elements by resin, and a housing (first portion) including the light emitting element and a housing (first portion) including the light receiving element
(The second part)
Wherein each of the housings is integrally formed. 4. The semiconductor optical coupling device according to claim 3, wherein said housing (second portion) is formed of resin. 5. The semiconductor optical coupling device according to claim 3, wherein said housing (second portion) is formed of a strip-shaped metal plate.