JPH10189693A - Tape pasting method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent air bubbles from being left between an adhesive tape and a work when the adhesive tape is pasted on the work by a method wherein the work and a frame are held on a prescribed holder by suction, and the adhesive tape is pasted on the work deforming it slightly like an arc by an air pressure. SOLUTION: When an adhesive tape pasting operation is started, a frame 80 in a frame mounting region 41 is attracted, and a wafer 70 placed on a mounting pad 42a of a movable table 40 in a tape pasting region 60 is slightly deformed like an arc by an air pressure and attracted. Thereafter, the adhesive tape 2 is pressed against the rear of a wafer 70 with a pasting roller 22 in a pasting operation. By this setup, the adhesive tape 2 is brought into contact with the protrudent center of the wafer 70 in a natural state. Therefore, air gets away in the circumferential direction of the surface of the wafer 70, so that air bubbles are prevented from being left between the wafer 70 and the adhesive tape 2, and the adhesive tape 2 can be pasted well on the wafer 70 without forming wrinkles.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a semiconductor wafer, which is, for example, a workpiece, and a ring-shaped frame for supporting and transporting the semiconductor wafer for processing and the like by using an adhesive tape. Related to the device.

[0002]

2. Description of the Related Art Conventionally, as a tape attaching device for integrating a semiconductor wafer and a frame with an adhesive tape, for example, the one disclosed in Japanese Patent Application Laid-Open No. Hei 6-177243 is known. This tape sticking device 1 is shown in FIGS.
As shown in the figure, the tape feeding section 20, the tape winding section 30, and the tape attaching area 60 located between them.
A tape cutter 31 movably provided at a standby position and an operation position for tape cutting in the tape application region 60; a tape application movable roller 22; tape separation movable rollers 23 and 24; The table 4 which advances and retreats in the direction perpendicular to the feed direction of the adhesive tape on the sticking area 60
0.

The table 40 is used as a work area 50.
, The frame 80 is mounted on the frame mounting area 41, and the wafer 70 is mounted on the wafer mounting area 42.

[0004] When the button A of the table 40 is pressed, the frame 80 and the wafer 70 are attracted to the table 40, and the table 40 moves in the direction of the arrow 90 and advances to the tape application area 60.

[0005] Then, the tape application movable roller 22 is moved forward in the same direction as the adhesive tape 2 feeding direction so that the adhesive tape 2 is applied to the frame 80 and the wafer 70 positioned in the tape application area 60, When it reaches the position of the tape sticking movable roller 22a indicated by the broken line, it is moved backward in the reverse direction to return to the original position.

As a result, the pressure-sensitive adhesive tape 2 is bonded to the frame 80 and the wafer 70 in a state of a pressure-sensitive adhesive tape 2a indicated by a dashed line. And the tape cutter 31
Is lowered to the operation position, and the disk cutter 32 is rotated by 360 ° about the rotation shaft 33 to cut the adhesive tape 2 along the frame 80 in a circular shape. Thereafter, the tape cutter 31 is returned to the standby area.

[0007] The used adhesive tape cut by the tape cutter 31 is transferred to the tape peeling movable roller 2.
The adhesive tape 2 is peeled off from the frame 80 by the movement of the rollers 3 and 24, and is wound around the winding shaft 25 of the tape winding unit 30.

[0008] The table 40 is retreated to the work area 50, and the frame 80 and the wafer 70 stuck together with the adhesive tape 2 are taken out by the operator and transferred to the next step. Thus, the tape attaching step is repeated.

[0009]

However, the conventional tape sticking apparatus has the following problems.
That is, in the tape attaching area 60, the attaching movable roller 2
2 is performed while the adhesive tape 2 is pressed against the back surface of the wafer 70 with the pressing force of the roller 22, so that the thin wafer 70 is pressed by the pressing force.
Is slightly dented, and a small amount of air is left as bubbles between the back surface of the wafer 70 and the adhesive tape 2,
The adhesive tape 2 may be wrinkled.

[0010] In particular, the wafer mounting area 42 of the reciprocating table 40 on which the wafer 70 is mounted is designed so that the surface (where a plurality of circuits are formed) of the wafer 70 serving as the mounting surface is not damaged. A ring-shaped wafer mounting table having a concave central portion is provided, and in the wafer 70 mounted thereon, the peripheral portion is supported in a line shape and the central portion is not supported, so the central portion is easily depressed due to a distortion phenomenon. In addition, even if the adhesive tape 2 is adhered by pressing with the attaching roller 22, the unsupported central portion is easily dented, and the wafer 7
There is a problem that air is easily left in the form of bubbles between the adhesive tape 2 and the adhesive tape 2.

As described above, the conventional example has a problem that must be solved so as not to leave air bubbles when the adhesive tape is applied.

[0012]

The gist of the tape attaching method according to the present invention for solving the above-mentioned problems is a tape attaching method in which a workpiece and a frame are integrated with an adhesive tape. And a frame are adsorbed and supported by a predetermined holding portion, and an adhesive tape is applied in a state where the workpiece adsorbed and supported by the holding portion is slightly deformed into an arc shape by air pressure, and A tape sticking device that integrates the frame with an adhesive tape,
The tape applying device includes a tape supply roller that supplies an unused tape, a tape feed roller that sends the tape, a tape take-up roller that winds up a used tape, a workpiece holding unit and a frame holding unit, A tape affixing section for integrally affixing the workpiece and the frame with an adhesive tape,
A tape cutter that cuts the adhesive tape along the frame when positioned at the working position and the non-working position and is positioned at the working position, wherein the workpiece holding unit has a space slightly higher than atmospheric pressure. That is, a weak high-pressure chamber to be formed is formed.

According to the tape attaching method of the present invention, since the adhesive tape is attached while the semiconductor wafer as the workpiece is deformed and maintained in an arc shape, the central portion of the wafer is raised. The contact between the central portion and the adhesive tape is performed in a natural state, and no air bubbles remain in the central portion.

According to the tape sticking apparatus of the present invention,
When the wafer placed on the holding part and supported by the suction by the weak high-pressure chamber of the workpiece holding part is formed into an arc shape, and the adhesive tape is applied while pressing the adhesive tape to the wafer,
Air escapes from the center of the wafer in the outer peripheral direction, and is supported by a gas slightly higher in pressure than the atmospheric pressure in the weak high-pressure chamber, so that no air remains between the wafer and the adhesive tape.

Thus, the entire surface of the wafer and the adhesive tape are securely adhered to each other, and the adhesive tape is stuck to the wafer cleanly.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a tape sticking apparatus according to the present invention. Note that, for easy understanding of the invention, portions corresponding to the conventional example will be denoted by the same reference numerals as the conventional example.

As shown in FIG. 1, the tape applying device 10 includes a tape supply roller 11 for supplying an unused adhesive tape 2, a tape feed roller 12 for supplying the adhesive tape 2,
Tape take-up roller 1 for taking up used adhesive tape
3, an advance / retreat table 40 which advances and retreats in a direction perpendicular to the feed direction of the adhesive tape 2, and an adhesive tape 2 along the frame 80.
And a tape cutter 31 for cutting the tape.

The tape supply roller 11 is rotatably mounted on a support shaft of the apparatus main body, and the tape take-up roller 13 is mounted on the support shaft of the apparatus main body and is driven in a tape winding direction by a driving motor or the like. The rotation is controlled.

The forward / backward table 40 in the work area 50 is shown in FIG.
As shown in FIG. 5, a frame mounting area 41 as a frame holding section for mounting the frame 80 and a wafer mounting area 42 as a workpiece holding section for mounting a wafer 70 as a workpiece are provided. ing.

In the frame mounting area 41, a plurality of suction holes 41a for adsorbing and supporting the frame 80 are provided at the periphery thereof at appropriate intervals. The suction hole 41a
Is provided with a suction valve 41b connected via a connection hose to a suction port (not shown) of a vacuum device built in the apparatus main body.

As shown in FIG. 4, a substantially ring-shaped mounting table 42a having a required width is provided in the wafer mounting area 42 along the outer shape of the wafer 70.
A plurality of suction holes 42b for sucking the wafer 70 are provided at appropriate intervals. Inside the suction hole 42b, a suction valve 42c connected via a connection hose to a suction port of a vacuum device provided in the apparatus main body is provided.

A concave groove 42d is provided inside the suction hole 42b of the ring-shaped mounting table 42a along the substantially ring-shaped outer shape of the table 42a.
In the concave groove 42d, an elastic rubber 42e is fitted with its upper part protruding from the surface of the mounting table 42a.

The inside of the ring-shaped mounting table 42a is formed as a concave weak high-pressure chamber 43 so that the circuit portion on the front surface side of the wafer 70 does not abut. At its center is a low-pressure chamber 4
3, a discharge hole 43a for introducing outside air is provided,
A valve body 43b that moves up and down according to the level of atmospheric pressure is provided in the hole.

The rear end of the discharge hole 43a is connected via a connection hose or the like to a supply port of a gas supply means such as a compressor provided inside the apparatus body.

In order to make the low-pressure chamber 43 slightly higher than the atmospheric pressure, the wafer 70 is mounted on the mounting table 42a, and the peripheral portion of the wafer 70 is sucked through a plurality of suction holes 42b. The peripheral edge of the wafer 70 is brought into close contact with the upper end surface of the elastic rubber 42e of the concave groove 42d. As a result, the wafer 70 is brought into tight contact with the mounting table 42a in an airtight state.

Thereafter, a gas such as air is injected into the chamber of the weak high-pressure chamber 43 from the discharge hole 43a by a compressor or the like, and the pressure of the weak high-pressure chamber 43 is maintained slightly higher than the atmospheric pressure. . Accordingly, the wafer 70 mounted on the mounting table 42a has its peripheral portion adsorbed and the inside of the weak high-pressure chamber 43 is slightly higher than the atmospheric pressure, so that the center portion bulges outward slightly and has an arc shape. It is supported in a deformed state.

The advance / retreat table 40 is configured to advance / retreat in a direction perpendicular to the feed direction of the adhesive tape 2 as indicated by an arrow 44 in FIG. Is reciprocated from the front side.

The tape sticking operation by the tape sticking apparatus 10 will be described. As shown in FIG. 2, the frame 80 is placed on the frame placing area 41 in the reciprocating table 40 of the working area 50, and the wafer The wafer 70 is mounted on the mounting table 42a in the mounting area 42 with the surface on which the circuit is formed facing down and the back side facing upward.

Thereafter, the advance / retreat table 40 is advanced to the tape attaching area 60. After the frame 80 in the frame mounting area 41 and the wafer 70 in the wafer mounting area 42 are sucked by the suction action of the suction valve 41b of the suction hole 41a or the suction valve 42c of the suction hole 42b in the work area 50, respectively. Alternatively, the advance / retreat table 40 may be advanced to the tape attachment area 60.

Before starting the operation of attaching the adhesive tape 2, the frame 80 in the frame mounting area 41 is sucked and the wafer 70 mounted on the mounting table 42a of the advancing / retreating table 40 in the tape applying area 60 is circled. Adsorb by deforming into an arc.

As shown in FIG. 4, the frame 80 is sucked by evacuating with a vacuum device through the suction valves 41b in the plurality of suction holes 41a of the frame mounting area 41.

Then, the wafer 70 is sucked to the mounting table 42a by evacuating with a vacuum device through each suction valve 42c in the plurality of suction holes 42b of the wafer mounting area 42.

Further, as shown in FIG. 5, in the weak high-pressure chamber 43 of the wafer mounting area 42, a compressor is operated to press a gas such as air into the chamber 43 from the discharge hole 43a. Pressure inside is slightly higher than atmospheric pressure.

Then, in the ring-shaped mounting table 42a, the peripheral edge of the wafer 70 is sucked by the plurality of suction holes 42b, and the wafer 70 is in an air-tight contact state by the elastic rubber 42e of the concave groove 42d. Wafer 70
5 slightly bulges outward due to the atmospheric pressure, and as shown by the broken line in FIG. 5, a wafer 70a deformed in an arc shape is formed.

Thereafter, the wafer 70 of the reciprocating table 40
The sticking operation is started by moving the sticking roller 22 in the tape feed direction while maintaining the state in which is deformed into an arc shape.

When the adhesive roller 22 presses the adhesive tape 2 against the back surface of the wafer 70, the wafer 70 rises in an arc shape by a pressure slightly higher than the atmospheric pressure. The contact with the tape 2 is performed in a natural state, the air escapes in the outer peripheral direction, and no air bubbles or the like remain between the wafer 70 and the adhesive tape 2 so that the adhesive tape 2 Is affixed.

After the frame 80 and the wafer 70 in the tape application area 60 have been integrally attached with the adhesive tape 2 in this manner, the tape cutter 31 operates in the same manner as in the conventional example.
The rotating shaft 31a descends and the cutter 31b positioned from the non-working position to the working position makes one rotation along the frame 80 to cut the adhesive tape 2 and wind the used adhesive tape 2 around the tape take-up roller 13. Then, the advancing / retreating table 40 is retreated from the tape attaching area 60 to the work area 50, and the frame 8 integrally attached with the adhesive tape 2 is removed.
0 and the wafer 70 are taken out, and the next sticking operation is started.

[0038]

As described above, the tape attaching method according to the present invention is a tape attaching method in which a workpiece and a frame are integrated with an adhesive tape, and the workpiece and the frame are held at a predetermined position. It is a method of sticking the adhesive tape in a state in which the workpiece suction-supported by the part and the workpiece suction-supported by the holding part is slightly deformed into an arc shape by air pressure,
Since the central portion of the workpiece is raised, the contact with the adhesive tape is in a natural state, and there is an excellent effect that no air bubbles remain between the workpiece and the adhesive tape.

The tape applying apparatus according to the present invention is a tape applying apparatus for integrating a workpiece and a frame with an adhesive tape, comprising: a tape supply roller for supplying unused tape; A roller, a tape take-up roller for winding up a used tape, a work holding part and a frame holding part, a tape sticking part for integrally sticking the work and the frame with an adhesive tape, A tape cutter that cuts the adhesive tape along the frame when positioned at the non-operating position and positioned at the operating position, wherein the workpiece holding portion forms a space slightly higher than atmospheric pressure. Since the high-pressure chamber is formed, the workpiece is deformed in an arc shape, and air escapes from the central portion in the outer peripheral direction. A clean surface, adhesive tape in which an excellent effect of being stuck to the wafer.

[Brief description of the drawings]

FIG. 1 is a perspective view of a tape applying device according to the present invention.

FIG. 2 is a schematic plan view of a tape application area and a work area in the tape application apparatus of the present invention.

FIG. 3 is a front view showing a schematic configuration and arrangement of the tape applying apparatus of the present invention.

FIG. 4 is a sectional view of an advancing / retreating table of the tape adhering device of the present invention.

FIG. 5 is a perspective view of the tape moving device of the present invention in which the wafer as a workpiece is formed in an arc shape;
It is explanatory drawing which shows a mode that an adhesive tape is stuck on a back surface.

FIG. 6 is a perspective view of a tape sticking device according to a conventional example.

FIG. 7 is an explanatory diagram showing a state of tape sticking by a tape sticking device according to the same example.

FIG. 8 is an explanatory diagram showing a state of tape cutting by the tape applying device according to the same example.

[Description of References] 1 Tape application device according to conventional example 2 Adhesive tape
2a opening, 10 tape application device, 11 tape supply roller, 12 tape feed roller, 13 tape take-up roller, 19 vertical movement roller, 20 tape feed unit, 22 application roller, 40 advance / retreat table, 41
Frame mounting area, 41a suction hole, 41b suction valve, 42 wafer mounting area, 42a mounting table, 42b
Suction hole, 42c Suction valve, 42d groove, 42e
Elastic rubber, 43 Low pressure chamber, 43a Discharge hole, 43b
Suction valve, 50 working area, 70 wafer, 80
flame.

Claims (3)

[Claims] 1. A method for attaching a workpiece and a frame to each other with an adhesive tape, wherein the workpiece and the frame are suction-supported by a predetermined holding portion, and the workpiece is suction-supported by the holding portion. Adhering an adhesive tape in a state where the workpiece is slightly arcuately deformed by air pressure, and applying a tape. 2. The method according to claim 1, wherein the workpiece is a semiconductor wafer. 3. A tape application device for integrating a workpiece and a frame with an adhesive tape, the tape application device comprising: a tape supply roller for supplying unused tape;
A tape application unit that includes a tape feed roller that feeds a tape, a tape take-up roller that winds up a used tape, a workpiece holding unit and a frame holding unit, and that integrally sticks a workpiece and a frame with an adhesive tape. And a tape cutter that cuts the adhesive tape along the frame when positioned at the working position and the non-working position and positioned at the working position, wherein the workpiece holding portion is slightly higher than atmospheric pressure. A low-pressure chamber forming a space is formed.