JPH1018100A - Electrolytic polishing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrolytic polishing equipment capable of controlling deterioration of the treatment solution and performing the efficient electrolytic polish in a short time. SOLUTION: An electrolytic polishing equipment is provided with a frame 2 to turnably support a work 1 comprising a cylindrical metallic container in which an end cover on one end is removed and the axis is horizontal, a treatment tank 4 in which the upper side opened, at least the prescribed part on the lower side of the work 1 is stored together with the frame 2, and the treatment solution 3 is stored to the prescribed level higher than the lower end of the inner circumference of the work 1, an electrode 5 arranged in the work 1 loaded on the frame in the treatment tank 4, a power supply means 6 to apply the voltage between the electrode 5 and the work 1, and a turning device 7 to turn the work 1 loaded on the frame 2 in the treatment tank 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic polishing apparatus for mirror-finishing the inner surface of a cylindrical metal workpiece whose both ends are closed by end plates, such as a rubber processing tower, by electrolytic polishing.

[0002]

2. Description of the Related Art Each time a rubber kneading process for one lot is completed, the inside of the processing tower is mirror-polished by, for example, buff polishing and then electrolytic polishing to prepare for the rubber kneading process of the next lot. Need to finish.

[0003] As an apparatus for polishing the inner surface of a cylindrical metal workpiece closed at both ends by end plates as described above, a cylindrical metal workpiece closed at both ends by a head plate is polished by an axial center. And a gantry for supporting rotatably around the horizontal axis, a rotating device for rotating the workpiece mounted on the gantry, and a workpiece mounted on the gantry, which was accommodated in the workpiece. Some include an electrode disposed below the surface of the processing liquid and means for applying a voltage between the electrode and the object to be processed (see Japanese Patent Application Laid-Open No. 57-8600).

In addition to making the electrode rotatable,
There is a buffing cloth attached to the end face so that buffing and electrolytic polishing can be performed simultaneously (Japanese Patent Laid-Open No. 57-860).
No. 0).

[0005]

In these conventional examples,
There is a problem that the amount of the processing liquid (electrolytic solution) is limited by the volume of the object to be processed, and the deterioration of the processing liquid accompanying the progress of the processing reaches a limit in a relatively short time.

The present invention has been made in consideration of the above circumstances, and has as its object to provide an electrolytic polishing apparatus capable of suppressing deterioration of a processing solution.

[0007]

The electropolishing apparatus of the present invention employs the following technical means to achieve the above object.

That is, in the electrolytic polishing apparatus according to the present invention, first, after removing the end plate at one end of the cylindrical metal object to be processed 1 whose both ends are closed by the end plates 1a, the object to be processed 1 is moved to its axial center. And a base 2 rotatably supported about a horizontal axis, a base 2 and a predetermined lower portion of the processing target 1 mounted on the base 2 are accommodated, and a lower portion of the processing target 1 is accommodated. A processing tank 4 that has an open upper surface for storing the processing liquid 3 to a predetermined height higher than the inner peripheral surface;

As a result, the workpiece 1 mounted on the gantry 2 is immersed in the processing bath 3 at least at the lower peripheral portion thereof. The structure of the gantry 2 only needs to be able to rotate the workpiece 1 lying horizontally on a horizontal axis. For example, the frame 2a and the frame 2
A pair of rollers 2b rotatably supported around the horizontal axis may be provided on the upper portion of the pair a.

Next, in the electrolytic polishing apparatus of the present invention, an electrode 5 is provided which is disposed below the level of the processing liquid 3 in the processing object 1 at least partially mounted on the gantry 2. A power supply means 6 for applying a voltage between the workpiece 5 and the workpiece 1 is provided.

Thus, when a predetermined voltage is applied by the power supply means 6 between the electrode 1 and the object 1 placed on the gantry 2 in the processing tank 4, the inner surface of the object 1 is electrolytically polished. . Here, the distance between the electrode 5 and the inner peripheral surface of the workpiece 1 is
In order to increase the current density and promote the anodic reaction, it is desirable to make the width narrower. In particular, the rougher the surface roughness of the processing surface of the processing object 1, the narrower it is preferable.

Finally, the electrolytic polishing apparatus according to the present invention is provided with a rotating device 7 for rotating the object 1 mounted on the gantry 2 around its axis. The portion of the object 1 to be processed is moved in the circumferential direction, so that electrolytic polishing can be performed over the entire circumference of the object 1.

It is preferable that the rotational speed of the object 1 be slow to some extent in order to promote partial smoothing by electrolytic polishing. Therefore, the peripheral speed of the object 1 depends on the inner diameter of the object 1. It is preferable to be able to adjust the rotation speed so as to be below a certain value. Further, it is preferable that the rougher the surface roughness of the processing surface of the workpiece 1, the lower the rotational speed of the workpiece 1 is.

Deterioration of the processing liquid due to the electrolytic treatment mainly occurs between the electrode 5 and the inner peripheral surface of the processing target 1 facing the electrode 5, and the deteriorated processing liquid is rotated by rotating the processing target 1. The electrode 5 moves from the space between the electrode 5 and the inner peripheral surface of the object 1 facing the electrode 5 and is diffused around the electrode 5, causing deterioration between the electrode 5 and the inner surface of the object 1 opposed thereto. The treatment liquid whose influence has been significantly reduced flows in. Therefore, the processing liquid 3 interposed between the electrode 5 and the inner peripheral surface of the processing object 1 facing the electrode 5 is less affected by deterioration, and an efficient electrolytic treatment is maintained for a long time.

Moreover, in the electrolytic processing apparatus of the present invention, the processing liquid 3 is contained not only in the processing object 1 but also in the processing tank 4 around it, so that the processing liquid 3 is stored only in the processing object 1. A large amount of the processing liquid 3 is used as compared with the conventional example in which the processing liquid 3 is accommodated, and the deteriorated processing diffused from between the electrode 5 and the inner peripheral surface of the object 1 to be processed facing the electrode 5. The solution is further diluted with a large amount of the processing solution, and the progress of the deterioration of the processing solution 3 as a whole is significantly slowed down. As a result, deterioration of the processing solution can be further suppressed, and efficient electrolytic treatment can be maintained for a longer time.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be specifically described below with reference to the drawings. As shown in the longitudinal front view of FIG. 1, the plan view of FIG. 2 and the longitudinal side view of FIG. 3, the electrolytic treatment apparatus according to this embodiment is an electrolytic treatment of a rubber treatment tower used for kneading rubber raw materials. This rubber processing tower is made of cylindrical stainless steel having both ends closed by end plates 1a. The end plate at one end of the rubber processing tower is removed, and the end plate 1a at the other end and the cylindrical body are removed. The object 1 is connected to the object 1b.

This processing object 1 has its axis centered horizontally,
The pedestal 2 is rotatably supported about a horizontal axis, and a predetermined lower portion of the pedestal 2 is accommodated in a processing tank 4 having an open upper surface.

The gantry 2 includes a frame 2a, and three pairs of right and left rollers 2b supported on the upper portion of the frame 2a so as to be rotatable around a horizontal axis.
A plurality of types having different distances and heights b are prepared and exchanged according to the diameter of the workpiece 1. However,
The gantry 2 may be of one type, and may be configured such that the mounting position (left-right space) of the roller 2b of the gantry 2 can be changed.

Further, the gantry 2 is suspended by a lifting machine such as a crane or a hoist into the processing tank 4 before the object 1 is put into the processing tank 4, and is placed at a predetermined position on the bottom of the processing tank 4. .

Behind the processing tank 4, the left roller 2
b, a rotating device 7 for continuously rotating the workpiece 1 around the axis thereof at a predetermined constant speed is provided. The driving device 7 includes a motor 7a, a speed reducer 7b, and a chain drive. A device 7c is provided, and the rotation of the motor 7a is reduced by the speed reducer 7b and transmitted to the shaft 2c of the left roller 2b via the chain transmission 7c.

The rotation speed of the motor 7a is
The peripheral speed of the inner peripheral surface of the workpiece 1 is controlled so as to be lower than or equal to a low speed corresponding to the inner diameter of the workpiece 1, and the inner peripheral surface of the workpiece 1 measured in advance, ie, The rotation speed of the workpiece 1 can be increased or decreased corresponding to the surface roughness. That is, as the surface roughness of the inner peripheral surface of the processing object 1 increases, the rotation speed of the processing object 1 decreases as the surface roughness increases.

The chain transmission 7c includes a sprocket 7d connected to the reduction gear 7b, a sprocket 7e fixed to the shaft 2c, and both sprockets 7d,
A chain 7f wound around the shaft 7c. When the gantry 2 is replaced, the chain 7f is detached from the sprocket 7e on the shaft 2c side, and is remounted on the sprocket 7e of the gantry 2 that has been replaced.

Here, if necessary, the number of teeth of the sprocket 7e provided on the gantry 2 is increased or decreased in accordance with the inner diameter of the workpiece 1, so that a large-diameter workpiece can be processed with respect to the rotation of the motor 7a. The number of rotations of the object 1 can be reduced, and the number of rotations of the small-diameter object 1 can be increased.

In the processing tank 4 containing the gantry 2, the object 1 to be processed is lifted by a lifting machine such as a crane or a hoist.
When the object 1 is hung with its axis substantially horizontal and mounted on the gantry 2, the object 1 is automatically located at a position where it can be rotated about the axis.

In the processing tank 4, the processing liquid 3 is stored up to a predetermined height higher than the lower end of the inner peripheral surface of the workpiece 1.
As a result, at least the lower peripheral portion of the workpiece 1 mounted on the gantry 2 in the processing bath 4 is immersed in the processing liquid 3.

As the treatment liquid, for example, a concentrated phosphoric acid / concentrated sulfuric acid mixed liquid mixed at a ratio of 3 concentrated phosphoric acid to 1 concentrated sulfuric acid is used. Also, an electrode 5 is arranged below the liquid surface of the processing liquid 3 in the processing object 1 placed on the gantry 2 in the processing tank 4, and a voltage is applied between the electrode 5 and the processing object 1. A power supply means 6 for applying is provided.

As shown in the perspective views of FIGS. 1 and 4, the electrode 5 is supported on the peripheral surface of a hanger 8 having a semicylindrical frame shape.
A hook 8b serving also as a terminal fixed to the center of the upper chord 8a of the hanger 8 is electrically connected via a cable 8c.

The upper chord 8a is formed in a rectangular frame shape.
Both ends of a half-peripheral frame 8d of the hanger 8 are fixed to both ends of each of the long sides. Connection frames 8e are provided at appropriate intervals in the circumferential direction between the half-circle frames 8d on both sides, and the electrodes 5 are fixed to these connection frames 8e. The central portion and both ends of each long side of the upper chord portion 8a are connected to each other by a connecting frame 8e, and the hook 8b is fixed to the connecting frame 8e at the central portion.

Further, a buff cloth 8f is fixed to a lower peripheral portion of the half peripheral portion 8d of the hanger 8 and an outer surface of the connecting frame 8e at the lower peripheral portion. A plurality of the electrodes 5 are inserted into the object 1 at an appropriate interval in the axial direction of the object 1 before the object 1 is placed on the gantry 2. After the workpiece 1 is placed on the end plate 1, the beam 9 is passed through the hook 8 b of each hanger 8 from the open end of the workpiece 1, and
Both ends of the beam 9 are placed on the edge of the processing tank 4 through an opening 1c formed in the axis of a. At this time, the hanger 8 and the electrode 5 are suspended from the beam 9 such that the lower peripheral portion of the hanger 8 contacts the inner peripheral surface of the workpiece 1 by its own weight.

The procedure for arranging the electrode 5 and the hanger 8 in the workpiece 1 placed on the gantry 2 in the processing tank 1 is not limited to the above example. What is necessary is just to arrange | position so that the lower peripheral part of the hanger 8 may contact the inner peripheral surface of the to-be-processed object 1 by the weight of the hanger 8 in the to-be-processed object 1 mounted on the gantry 2 in the tank 1.

Although the above beam 9 may be omitted,
It is not preferable that the electrode 5 and the hanger 8 move at random in the workpiece 1. As in this embodiment, the electrode 5 and the hanger 8 are hooked on the beam 9 and the electrode 5 and the hanger 8 are moved.
Is preferably arranged to be able to move randomly only in the circumferential direction of the workpiece 1. Then, the electrode 5 and the hanger 8
Is moved axially with the beam 9 during the electrolysis process by automatically or manually moving the beam 9 axially as needed to average the polishing conditions.

Further, when a plurality of types of pedestals 2 having different distances and heights of the rollers 2b are prepared, a plurality of types of hangers 8 having different sizes corresponding to the types of the pedestals 2 are prepared. Is selected according to the diameter of the workpiece 1.

As shown in FIG. 1, after the object 1 is placed on the gantry 2 in the processing tank 4, the rotation of the object 1 is stabilized, and the electric connection between the object 1 and the power supply means 6 is established. For a dynamic connection,
Copper flat plate 10 straddling workpiece 1 between upper ends on both sides of processing layer 4
Are mounted via a pair of springs 11.

It is preferable that the body flat plate 10 is arranged as evenly as possible in the axial direction of the workpiece 1.
The body 1b may be configured to cover the entire length of the body 1b in the axial direction of the workpiece 1, but in this embodiment, as shown in FIG.
A plurality of body plates 10 are arranged at appropriate intervals (e.g., at equal intervals with the electrodes 5) in the axial direction of the processing object 1, whereby power is uniformly supplied to the processing object 1 and electrolytic processing is performed. The occurrence of unevenness is prevented.

Further, the electrode 5 is set in the object 1 to be processed,
After the processing liquid 3 is put into the processing tank 4 to a predetermined height higher than the lower end of the inner peripheral surface of the processing object 1, the positive electrode of the power supply means 6 is connected to the spring 11 and the electrode 5, and the hanger 8 is connected. When the negative electrode of the power supply means 6 is connected to the hook 8b and a voltage is applied between the workpiece 1 and the electrode 5, the inner surface of the workpiece 1 is electrolytically polished.

The rotation device 7 is operated simultaneously with the application of the voltage by the power supply means 6 to move the workpiece 1 in a certain direction in accordance with the inner diameter of the workpiece 1 and the surface roughness of its inner peripheral surface. The processing solution 3 is continuously rotated at a constant speed selected by
By continuously changing the portion of the inner surface of the object 1 immersed in the substrate, the inner surface of the object 1 is electrolytically polished over the entire circumference.

In other words, the current efficiency can be increased by reducing the electrolytic surface area, and the inner peripheral surface of the workpiece 1 is finished to a uniform mirror surface having a surface roughness smaller than, for example, 0.5 μmRmax by this electrolytic polishing. In addition, the inner peripheral surface of the object 1 can be finished to a surface having a low iron content and a high nickel and chromium content and having excellent wear resistance and corrosion resistance.

Further, since the end plate at one end of the object 1 is removed, the reaction gas generated during the electrolytic polishing does not remain in the object 1, and the reaction gas diffuses into the atmosphere. Since the polishing gas is diluted by the outside air, the contact efficiency between the polishing surface and the reaction gas is significantly lowered, and the polishing surface is prevented from being deteriorated by the reaction gas.

Degradation of the processing liquid due to the electrolytic treatment mainly occurs between the electrode 5 and the inner peripheral surface of the processing target 1 facing the electrode 5, and the degraded processing liquid causes the processing target 1 to rotate. As a result, the electrode 5 moves from between the electrode 5 and the inner peripheral surface of the workpiece 1 facing the electrode 5, is diffused around the electrode 5, and is located between the electrode 5 and the inner peripheral surface of the workpiece 1 opposed thereto. ,
The processing liquid that flows into the processing target 1 from the open end face of the processing target 1 and that has a significantly reduced influence of deterioration that moves with the rotation of the processing target 1 flows in. Therefore, the processing liquid 3 interposed between the electrode 5 and the inner peripheral surface of the processing object 1 facing the electrode 5 is less affected by deterioration, and an efficient electrolytic treatment is maintained for a long time.

Here, the amount of the processing liquid 3 in the processing object 1 and
Comparing the amount of the processing liquid 3 in the processing tank 4 including this, for example, the latter is 2 to 10 times as large as the former,
The deteriorated processing liquid diffused from between the electrode 5 and the inner peripheral surface of the processing object 1 facing the electrode 5 is further diluted with a large amount of the processing liquid, so that the deterioration of the processing liquid 3 as a whole progresses remarkably. Become slow. As a result, the deterioration of the treatment liquid 3 can be further suppressed, and efficient electrolytic treatment can be maintained for a longer time.

It is optional to use either the object 1 or the electrode 5 as the positive electrode, but in this embodiment, the object 1 was used as the positive electrode and the electrode 5 was used as the negative electrode. Further, the voltage and current applied by the power supply device 6 may be appropriately selected according to the area of the inner peripheral surface of the object 1 to be immersed in the processing liquid 3, and in this embodiment, the voltage is 5V. The current was 5 A per 10 cm ² of the inner peripheral surface of the object 1. Further, the processing time may be appropriately selected depending on the finishing condition of the inner peripheral surface of the processing object 1. In this embodiment, the processing is performed for 3 hours.

In this embodiment, as described above, the buff cloth 8f is fixed to the lower peripheral portion of the half peripheral portion 8d of the hanger 8 and the outer surface of the connecting frame 8e of the lower peripheral portion.
Since the electrode 5 is hung so that the lower peripheral portion of the hanger 8 contacts the inner peripheral surface of the workpiece 1 by its own weight, the buff contacting the inner peripheral surface of the workpiece 1 by its own weight. The inner peripheral surface of the workpiece 1 is buffed by the cloth 8f. The buff polishing removes foreign matter on the inner peripheral surface of the object 1 to increase the conductive area of the inner peripheral surface of the object 1, and increases the relatively large irregularities (number) of the inner peripheral surface of the object 1. μmR
By performing the polishing of max), the load of the electrolytic treatment is reduced.

Further, the grinding waste generated by the buff polishing hinders the electropolishing, and the grinding waste is rotated by rotating the workpiece 1 so that the buff cloth 8f and the inner periphery of the workpiece 1 facing the buff cloth 8f. Move from between the surface and diffuse around it,
Between the electrode 5 and the inner peripheral surface of the object 1 to be treated facing the electrode 5, a processing liquid in which the presence of the polishing debris is greatly reduced flows. Therefore, the processing liquid 3 interposed between the electrode 5 and the inner peripheral surface of the workpiece 1 facing the electrode 5 is less affected by abrasive chips,
An efficient electrolytic treatment is maintained for a long time.

Here, the amount of the processing liquid 3 in the processing object 1 and
Comparing the amount of the processing liquid 3 in the processing tank 4 including this, for example, the latter is 2 to 10 times as large as the former,
Since the polishing dust diffused from between the electrode 5 and the inner peripheral surface of the object 1 to be processed is diluted with a large amount of the processing liquid, the progress of the deterioration of the processing liquid 3 as a whole is significantly slowed down. . As a result, the deterioration of the processing liquid 3 can be further suppressed,
This means that efficient electrolytic treatment can be maintained for a longer time.

In the above embodiment, the buffing cloth 8f is provided on the lower periphery of the hanger 8 so that the buffing can be performed simultaneously with the electrolytic polishing. However, this is not essential to the present invention and is not essential to the present invention. In order to reduce the rotational resistance of the workpiece 1, the lower periphery of the hanger 8 may be raised from the lower inner peripheral surface of the workpiece 1 so that buffing is not performed.

In the above-described embodiment, the beam 9 supporting the hanger 8 is inserted through the opening 1c formed in the end plate 1a of the processing object 1. One end of the beam 9 is covered. The inner peripheral surface of the body 1b of the processing object 1 may be rotatably supported on the processing object via an appropriate base or frame.

Of course, the article to be treated 1 of the present invention is not limited to the rubber processing tower, but is subjected to batch processing, and it is necessary to remove impurities by mirror processing in the tower after one or more batch processing. Any type of metal container may be used as long as it is a cylindrical metal container whose both ends are closed by end plates. Examples of this type of metal container include other chemical reaction processing towers, chemical manufacturing containers, food processing containers, and biological culture. A container etc. can be mentioned as an example.

[0048]

As described above, in the electrolytic polishing apparatus of the present invention, as described above, the object to be processed from which the head plate is removed at one end is made horizontal so that the axis of the object is horizontal and the upper surface is opened. It is rotatably mounted on a pedestal disposed therein, and the electrodes are disposed therein, and the processing liquid is accommodated to a predetermined height higher than the lower end of the inner peripheral surface of the object to be processed, and at least a part of the processing liquid is contained in the processing liquid. A voltage is applied between the electrode in which is immersed and the object to be processed by a power supply means, and the object to be mounted mounted on the gantry is continuously rotated at a constant speed around its axis by a rotating device.

As a result, the current efficiency can be increased by reducing the polished area, and the inner surface of the object to be processed can be uniformly mirror-finished by electrolytic polishing over the entire circumference. In the case of a treated material, the iron content on the surface can be reduced, and the nickel and chromium content can be increased to finish the surface with high wear resistance and corrosion resistance.

Also, by adjusting the rotation speed of the object to be processed in accordance with the inner diameter of the object, the surface roughness of the inner peripheral surface, etc., electrolytic polishing can be performed under optimum processing conditions, and the processing time can be adjusted. In addition to this, the object to be processed can be surely mirror-finished.

Further, since the processing liquid is accommodated not only inside the object to be processed but also in a processing tank having a larger capacity, the processing liquid deteriorated due to the processing can be diffused into a large amount of processing liquid. Deterioration of the whole liquid can be suppressed. As a result, a decrease in the efficiency of the electrolytic treatment over time can be suppressed, so that an efficient electrolytic treatment can be performed for a long time and the treatment time can be reduced.

In addition, since the processing is performed by removing one of the head plates of the object to be processed, the reaction gas generated during the electrolytic polishing freely flows into the object to be processed or is diluted by the outside air. However, it becomes difficult to contact the polished surface, and it is possible to prevent the polished surface from being altered by the reaction gas.

In the present invention, in particular, when the conductor plate is brought into surface contact with the object and the object is connected to a power source via the copper plate, it is not necessary to move the contact position of the object. In addition, contact defects are eliminated, and unevenness in current distribution hardly occurs. Here, if the conductor flat plates are arranged at appropriate intervals in the axial direction of the object to be processed, or are disposed over the entire body length of the object to be processed, it is possible to more reliably eliminate defective contacts and uneven conduction. Can be.

Further, in the present invention, the gantry supporting the object to be processed in the processing tank can be disassembled from the processing tank, or the mounting position of the roller of the gantry supporting the object can be changed. In order to change the diameter of the workpiece, change the mounting position of the roller according to the diameter of the workpiece or change the mounting position of the roller according to the diameter of the workpiece. Can be processed.

In the present invention, in particular, when the distance between the object to be processed and the electrode is reduced, the current density is increased, so that the anodic reaction can be promoted even at the same voltage, and more efficient electrolytic polishing can be performed.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view of the present invention.

FIG. 2 is a plan view of the present invention.

FIG. 3 is a vertical sectional side view of the present invention.

FIG. 4 is a perspective view of a main part of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 object to be processed 1a head plate 2 gantry 3 processing solution 4 processing tank 5 electrode 6 power supply means 7 rotating device

Claims (1)

[Claims] 1. A gantry for supporting an object to be processed from which one end of a cylindrical metal container whose both ends are closed by end plates with its end plate removed has a horizontal axis and rotatably around the horizontal axis. The upper surface is open, and accommodates the gantry and at least a predetermined portion on the lower side of the object mounted thereon, and processes the pedestal to a predetermined height higher than the lower end of the inner peripheral surface of the object. A processing tank containing a liquid, an electrode at least partially disposed below the liquid surface of the processing liquid in the processing object mounted on the gantry, and a voltage between the electrode and the processing object. And a rotating device for rotating the object mounted on the gantry about its axis.