JPH10180553A - Parts feed device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly lower pressure of a parts temporary storing part after jetting positive pressure air so as to improve transfer efficiency of tip parts to a parts feed part by forming a communicating hole communicating the parts temporary storing part to the outside. SOLUTION: When a movable member 19 is moved, an air rise passage 20b and an air invasion passage 20e are generated, and positive pressure air jetted from a nozzle 25 for stirring parts is quickly released outward through two courses, a first air communicating passage 29: a stirring space 20d - the air rise passage 20b - an air exhaust passage - a communicating hole 15a, and a second air communicating passage 30: the stirring space 20d - the air invasion passage 20e - an air rise passage 20c - the air exhaust passage 20a - the communicating hole 15a. Hereby, pressure in a parts temporary storing part 13 is quickly lowered, and many tip parts fall into the temporary storing part 13 until the next jet of positive pressure air.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component supply device. Specifically, the chip components are supplied from a component storage unit that accommodates a large number of chip components to a component temporary storage unit to temporarily store the chip components, and the chip components stored in the component temporary storage unit are stirred by positive pressure air. In a component supply device that sequentially transfers components to the component supply unit to the component mounting machine through the component transfer path, the pressure in the component temporary storage unit is quickly reduced after the supply of positive pressure air, and the transfer efficiency of chip components to the component supply unit is improved. Technology to improve.

[0002]

2. Description of the Related Art A high-speed chip component mounting machine for mounting chip components on a printed circuit board is known. This will be briefly described with reference to FIGS.

[0003] The high-speed chip component mounting machine a is provided with a component mounting section b at a substantially central portion thereof for supplying chip components in a bulked, ie, unpacked state, to a printed circuit board.

[0004] The component mounting section b is provided with a moving base c, and the moving base c has a number of component supply devices d, d,.
Are arranged in the moving direction of the moving base c.

[0005] The component supply device d is known, and an engaging portion (not shown) at the front end thereof is engaged with the front end of the moving base c, and a clamp claw e provided at the rear end is provided with a clamp lever f. Is engaged with the rear end of the movable base c and attached to the movable base c.

The component accommodating portion g is formed as a transparent thin case body, and an opening (not shown) is formed at the front end surface thereof.
The opening is opened and closed by a shutter (not shown). A large number of substantially rectangular parallelepiped chip components h, h,... Are stored in the component storage portion g.

[0007] The component storage portion g is attached to the component storage portion mounting portion i of the component supply device d, and the shutter is slid to open the opening. In this way, the component storage section g is set in the component supply device d.

The air supply port j is opened at a position slightly forward of the upper end surface of the component supply device d, and an air supply path k extending from the air supply port j toward the inside of the component supply device d is formed. (See FIG. 13). The end of the air supply path k is branched into two parts, one of which is connected to a part stirring nozzle n which opens toward the part inlet part m side of the part temporary storage part l, and the other part is connected to the part transfer path o. Component transfer nozzle p open toward the opposite side of component inlet m
It is connected to the.

The chip components h, h,... Are taken out of the component storage portion g in the following manner.

When the shutter of the component accommodating portion g is slid and the opening is opened, the chip components h, h,... Accommodated in the component accommodating portion g are provided in the component supply device d. The chip component h supplied to the temporary storage unit k,
.. reach the component inlet m by their own weight.

Next, when a feed lever q provided on the component supply device d is pressed by a pressing lever (not shown), positive pressure air is supplied from a positive pressure air supply device (not shown) to an air supply port j, and the positive pressure air is supplied to the air supply port j. The compressed air is jetted from the two nozzles through the air supply path k, namely, the component stirring nozzle n and the component transfer nozzle p.

The chip components h, h,... Hardened in the vicinity of the component inlet m are blown up by the positive pressure air injected from the component stirring nozzle n, and fall near the component inlet m by their own weight. , One of which falls from the component entrance m into the component transfer path o. The chip component h that has fallen into the component transfer path o is the component transfer nozzle p.
It is sent to the component supply part r by the positive pressure air injected from.

The chip component h sent to the component supply unit r is suctioned by the suction nozzle s, and when the feed lever q is pressed again by the pressing lever, positive pressure air is supplied from the positive pressure air supply device to the air supply port. The operation of supplying the next chip component h to the component supply unit r is performed intermittently.

[0014]

As described above, in the component supply device d, the positive pressure air is intermittently supplied from the positive pressure air supply device to the component temporary storage unit k from the component stirring nozzle n via the air supply port j. The supply interval is set to a short time in order to shorten the component supply time to the component supply unit r of the chip components h, h,.

However, in the conventional component supply device d, the component temporary storage section 1 is in a state close to a closed space, and the supplied positive pressure air is supplied to a small gap in the component supply device d, for example. However, it is only gradually discharged to the outside from a small gap formed in the connection portion between the component storage portion g and the component storage portion mounting portion i.

Therefore, in the conventional component supply device d, it takes a long time until the pressure after the positive pressure air is injected at the component temporary storage unit 1, especially the component inlet m, decreases to the atmospheric pressure. Nozzle n for stirring parts
The chip component h blown up by the positive pressure air without returning to the atmospheric pressure until the next positive pressure air is injected from the
h,... do not fall to the bottom surface of the component inlet m, or the next positive pressure air is injected into the component temporary storage l while the number of drops is small, and the component transfer path from the component inlet m. are in a state where the chip components h, h,.

When the chip components h, h,... Do not fall into the component transfer path o and are not transferred to the component supply unit r, supply of the chip components h, h,. When such a supply delay occurs, the high-speed chip component mounting machine a, which is to be stopped, stops,
There is a problem that the operation rate is reduced.

Therefore, the component supply apparatus of the present invention overcomes the above-mentioned problems, rapidly reduces the pressure in the component temporary storage unit after the injection of the positive pressure air, and increases the efficiency of transferring chip components to the component supply unit. The task is to improve it.

[0019]

According to the present invention, there is provided a component supply apparatus comprising:
In order to solve the above-described problem, a communication hole that connects the component temporary storage unit and the outside is formed.

Therefore, in the component supply device of the present invention,
Immediately after the positive-pressure air is injected, the pressure in the component temporary storage section rapidly decreases.

[0021]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a component supply apparatus according to an embodiment of the present invention.

Required members are attached to the frame 2 of the component supply device 1 (see FIGS. 1 and 2).

A clamp lever 3 and a clamp claw 4 operated by the clamp lever 3 are attached to the frame 2, and are provided at a front end of a moving base 5 of a component mounting machine (not shown) at a front end of a lower surface of the frame 2. The engaging portion (not shown) is engaged and the clamp claw 4 is locked to the front edge of the rear end of the moving base 5, and the component supply device 1 is attached to the moving base 5.

A guide 6 is provided at the upper end of the frame 2 and a component accommodating portion 7 is attached by being guided by the guide 6 (see FIGS. 1 and 2).

The component accommodating portion 7 is formed as a flat box-shaped transparent case body, and an opening 8 is formed at the front end thereof, and the opening 8 is opened and closed by a shutter 9 (FIG. 1). 3). A knob 10 is provided at the base end of the shutter 9, and the knob 10 is located in a facing hole 11 formed on the upper surface of the component housing 7. The chip components 12 and 1 in the bulk state are stored in the
Are stored and supplied. When the component storage unit 7 is attached to the component supply device 1, the shutter 9
Is opened, and the opening 8 is opened.

A component temporary storage unit 13 which is a relatively large space for temporarily storing chip components 12, 12,... The leading end is the component inlet 14 (see FIGS. 4 and 5).

The component temporary storage section 13 is formed by a recess formed on one side surface of the frame 2 and a side cover 15 covering the opening of the recess (see FIG. 4). Then, the chip components 12, 1 and
Communication holes 15a, 15 arranged in parallel in the transfer direction of 2,.
a is formed.

A fixing member 16 fixed to the inside of the component temporary storage section 13 is provided in a substantially front half portion thereof (see FIGS. 5, 6, and 7).

The fixing member 16 is provided with a recess 17 at approximately two-thirds below the side cover 15 except for the front end, and the recess 17 is open to the side cover 15 and downward and rearward. Have been.

A notch 18 is formed at the lower end of the front end of the fixing member 16.
Are formed, whereby the arrangement recess 17 communicates with a component transfer path formed in front of the notch 18, which will be described later. The notch 18 is used to supply the chip components 12, 12,. This is a component supply port (see FIG. 5).

In the portion near the rear end of the arrangement recess 17, a component stirring arc 17a which is opened substantially downward and has an inner surface formed into a substantially arcuate surface.
Are formed (see FIG. 5). A surface 17b which is continuous with the rear end edge of the component stirring arc 17a is a component stopper surface which is displaced downward toward the rear (FIG. 5).
reference). Also, of the inner surface of the disposing concave portion 17 facing the inner surface of the side cover 15, approximately one-third of the lower surface is a support inclined surface 17 c displaced toward the side cover 15 as going downward.
(See FIGS. 6 and 7).

In the arrangement concave portion 17, the component stirring arc 1 is provided.
A movable member 19 is disposed at a front portion of the chip part 7a (see FIG. 5).
Are movable within the arrangement recess 17 when they are stirred by positive pressure air.

The movable member 19 has an outer shape slightly smaller than the inner shape of the arrangement concave portion 17 when viewed from the front-rear direction, and is formed in a pentagonal column shape having a vertically long pentagon when viewed from the front-rear direction (FIGS. 6 and 6). (See FIG. 7).

The movable member 19 has an upper surface 19a and two side surfaces 1a.
9b and 19c and two lower inclined surfaces 19d and 19e, and the inclined surface 19d formed on the side cover 15 is displaced away from the side cover 15 as it goes down, and vice versa. Inclined surface 19e formed on the side
Is displaced such that its area is smaller than the inclined surface 19d and approaches the side cover 15 as it goes downward.

When the positive pressure air is not supplied to the component temporary storage unit 13, the movable member 19 has one side surface 19 facing the inner surface of the side cover 15 due to its own weight.
b is in contact with the side cover 15 and the inclined surface 19e is located in the arrangement recess 17 with the inclined surface 19e in contact with the support inclined surface 17c of the arrangement recess 17 (see FIG. 6). As shown in FIG. 5, since the component temporary storage unit 13 is formed so as to be inclined forward and downward, the front surface of the movable member 19 is provided with the arrangement recess 17.
(See FIG. 5).

In this state, the arrangement recess 17 is provided.
Inside, an air discharge path 20a is formed above the upper surface 19a of the movable member 19, an air rising path 20c is formed between the side surface 19c and the inner side surface of the disposition recess 17, and an agitating space 20d is formed substantially below the inclined surface 19d. (See FIG. 6). The air discharge passage 20a is provided in the communication hole 15 formed in the side cover 15.
a, 15a.

Further, the movable member 19 is blown up by the positive pressure air when the positive pressure air is supplied to the component temporary storage section 13 as described later, and is moved in the arrangement recess 17.

Then, in this moved state,
In the arrangement recess 17, in addition to the air discharge path 20 a, the air ascending path 20 c, and the stirring space 20 d,
9b and the inner surface of the side cover 15 and the air rising path 20
b, an air entry path 20e is formed between the inclined surface 19e and the support inclined surface 17c (see FIG. 7). The movable member 1
9, an air discharge passage 20a formed above the upper surface 19a
Is formed as a relatively large space in a state where the positive-pressure air is not supplied to the component temporary storage unit 13, and is closed by the movable member 19 even when the movable member 19 is blown up by the positive-pressure air. There is no such thing as being lost.

The component inlet 14 communicates with the component transfer path 21 through the component supply port 18, and the leading end of the component transfer path 21 is a component supply unit 22 (FIGS. 1, 4, and 5). reference). The component transfer path 21 is formed in a tunnel shape except for a part on the component supply unit 22 side.

An air supply port 23 is opened at the upper end of the frame 2, and an air supply path 24 extending from the air supply port 23 toward the inside is formed (see FIG. 5).

The air supply path 24 is branched into two parts at the end, one of which is connected to a parts stirring nozzle 25 opened at the bottom of the end of the parts inlet 14, and the other is an intermediate part of the parts transfer path 21. Is connected to a component transfer nozzle 26 which is opened toward the component supply unit 22 on the bottom surface of the component.
The component stirring nozzle 25 is opened at a position closer to the side cover 15 on the bottom surface of the component inlet 14.

The air supply port 23 of the air supply path 24
A check valve 27 is interposed at a position nearer to prevent the positive pressure air supplied into the air supply path 24 from flowing back to the air supply port 23 side.

A feed lever 28, which is pressed by a pressing portion of a component mounting machine (not shown), is rotatably supported on one side surface of the substantially central portion of the frame 2 (see FIG. 1).

When the component accommodating portion 7 is mounted on the component supply device 1 by being guided by the guide 6 provided at the upper end of the frame 2, the shutter 9 is moved as described above.
Is opened, and the opening 8 is opened.

When the opening 8 is opened, the chip components 12, 12,... Accommodated in the component accommodating section 7 are supplied to the component temporary storage section 13, and the arrangement recess 17 of the fixing member 16 is provided.
The part enters the stirring space 20 d, and its tip is located at the component entrance 14 which is the tip of the component temporary storage unit 13.

When the pressing portion of the component mounting machine (not shown) presses the feed lever 28, the chip component 12
Is supplied to the individual component supply unit 22.

That is, the feed lever 28 is pressed, and at the same time, positive pressure air is supplied from a positive pressure air supply device (not shown) connected to the air supply port 23, and the positive pressure air passes through the air supply path 24 to stir the parts. From the nozzle 25 and the component transfer nozzle 26.

When the positive pressure air is jetted from the component stirring nozzle 25, the chip components 12, 12,... Located at the component inlet 14 are blown up and agitated and fall by their own weight.

At the same time, the movable member 19 provided in the placement recess 17 is blown up and moved by the positive pressure air in the placement recess 17.

That is, when the positive pressure air is jetted from the component stirring nozzle 25, the collision of the positive pressure air and the chip components 12, 12,... A force is applied to 19d in a substantially diagonally upper right direction as viewed in FIG. 7, and the movable member 19 is moved in that direction.

When the movable member 19 is moved, the side surface 19b
A gap is formed between the inner surface of the side cover 15 and the air ascending path 20b.
The gap between the side surface 19c and the inner side surface of the arrangement concave portion 17 is narrowed, resulting in a small space. At the same time, a gap between the inclined surface 19e of the movable member 19 and the inclined support surface 17c of the disposition concave portion 17, that is, the above-described air intrusion path 20e is generated.
Even if the movable member 19 is moved substantially upward, since the air discharge passage 20a is originally formed as a relatively large space as described above, the air discharge passage 20a is secured as a space of a certain size. Is done.

As described above, when the movable member 19 is moved, the air rising path 20b and the air inflow path 20e are generated, and the positive pressure air jetted from the component stirring nozzle 25 is supplied to the stirring space 20d-air rising path 20b-. A first air flow passage 29 of an air discharge passage 20a-communication hole 15a and a second air flow passage 30 of an agitating space 20d-air inflow passage 20e-air rising passage 20c-air discharge passage 20a-communication hole 15a. It is quickly released to the outside through the route (see FIG. 7). Although a space is also formed in the arrangement recess 17 behind the rear surface of the movable member 19,
As described above, since the component stirring nozzle 25 is opened at the front end of the bottom surface of the component inlet 14, the stirring space 20 d of the positive pressure air injected from the component stirring nozzle 25-the rear surface of the movable member 19. The amount of air discharged to the outside through the path of the rear space, the air discharge path 20a, and the communication hole 15a is determined by the first air flow path 29 and the second air flow path.
Is very small as compared with the amount of air discharged to the outside through the air flow passage 30.

When the movable member 19 is moved by the positive pressure air or the like, the movable member 19 is in a floating state in the arrangement recess 17 and can move freely in the arrangement recess 17 so that its posture is extremely unstable. It is in a state. In this state, as described above, the first air passage 2
Air is discharged to the outside through two paths 9 and the second air flow path 30, and the amount of air passing through these two paths changes instantaneously.

For example, when the movable member 19 is floating in the arrangement recess 17, the gap between the air rising path 20 b of the first air flow path 29 and that of the air rising path 20 c of the second air flow path 30 is formed. If it is larger,
The amount of air passing through the air ascending path 20b is the air ascending path 2
More than the amount passing through 0c. And at this time, a lot of air will pass through the air ascending path 20b at high speed,
Viscosity of passing positive pressure air and air ascending path 20
The movable member 19 is moved in the direction in which the side surface 19b approaches the side cover 15 due to the pressure difference between the movable member 19b and the air cover 20c.
Smaller than that of.

When the gap of the air ascending path 20b is smaller than that of the air ascending path 20c, the amount of air passing through the air ascending path 20c becomes larger than the amount of air passing through the air ascending path 20b. At this time, a lot of air passes at high speed through the air rising path 20c, and the viscosity of the passing positive pressure air and the air rising path 20b,
The movable member 19 has its side surface 19
c is moved in a direction approaching the inner side surface of the fixing member 16, whereby the gap of the air rising path 20 c is reduced.
b is smaller than that of b.

When the gap of the air ascending path 20c becomes smaller than that of the air ascending path 20b, the amount of the positive pressure air passing through the air ascending path 20b again becomes larger than the amount of passing through the air ascending path 20c as described above. The movable member 19
Is moved in the direction approaching the side cover 15, and when the gap of the air rising path 20b becomes smaller than that of the air rising path 20c, the movable member 19 is moved in the direction approaching the inner side surface of the fixed member 16 repeatedly. We, ie
The movable member 19 is moved in the arrangement recess 17 so as to vibrate in the left-right direction until it is blown up by positive pressure air or the like and falls by its own weight.

On the other hand, the chip components 12, 12,... Are blown up and agitated by the positive pressure air jetted from the component stirring nozzle 25, and a part thereof is vibrated as described above so as to vibrate. It collides with the inclined surface 19d of the movable member 19 that is moving inside, and falls into the component entrance 14.

The chip components 12, 12,... Are electronic components.
In many cases, if the movable member 19 collides with the movable member 19 in such a case, since the movable member 19 is moved so as to vibrate, the chip components 12, 12,.
Are easy to fall in a state where they are rubbed, and chip parts 1
Are hardened to block the component supply port 18, and the chip components 12, 12,.
Is smoothly supplied to the component transfer path 21 and the chip component 1
The supply rate of 2, 12,... To the component supply unit 22 is increased.

The blown chip parts 12, 1
A part of 2,... Enters into a part stirring arc 17a formed on the upper side of the arrangement concave portion 17 on the rear side,
The parts are stirred in the stirring arc 17a so as to be rotated in the counterclockwise direction as viewed in FIG.

Further, the remaining part is blown up and agitated in the direction of the component accommodating portion 7 so as to be discharged from the inside of the arrangement recess 17 to the rear side.

The chip components 12, 12,... Are blown up so that a part of them is discharged from the arrangement recess 17 as described above.
Many of the components 2,... Collide with the component stopper surface 17 b formed at an angle facing the chip components 12, 12,. Therefore, the chip components 12, 12,... Are not blown up more than necessary by the positive pressure air and are not stirred.

Chip component 1 that has fallen into component inlet 14
One of 12, 12, ... falls into the component transfer path 21, and is further sent to the component supply unit 22 by the positive pressure air jetted from the component transfer nozzle 26.

The chip component 12 sent to the component supply unit 22
Is sucked by a suction nozzle (not shown), the feed lever 28 is pressed again by the pressing lever, and positive pressure air is supplied from the positive pressure air supply device to the air supply port 23, and the next chip component 12 is supplied. Part 22
Is performed intermittently.

In the component supply device 1 described above, the communication holes 15a, 15a formed in the side cover 15 are provided.
a, the pressure of the component temporary storage unit 13 is quickly reduced after the injection, and the temporary storage unit 13, particularly, the bottom surface of the component inlet unit 14 before the next injection of the positive pressure air. Many chip components 12, 12,... Fall.

Therefore, the component transfer path 1
, The supply efficiency of the chip components 12, 12,... To the component supply unit 22 can be improved.

Thus, the chip components 12, 12,...
・ The supply delay does not occur, and the stoppage of the high-speed chip component feeder is avoided, contributing to the improvement of the operation rate.

Although the case where the communication holes 15a, 15a are formed in the side cover 15 has been described above, the communication holes may be formed in the frame 2 as long as they communicate with the component temporary storage unit 13. The same effect can be obtained as when formed on the side cover 15.

The communication holes 15a, 15a are formed in the side cover 15 because the side cover 15 is detachably attached to the side surface of the component mounting apparatus 1, so that the communication holes 15a, 15a are formed in a detached state. Is possible and the ease of processing is taken into account.

Hereinafter, a modified example of the communication hole 15a will be described with reference to FIGS.

FIG. 8 shows a first modification 15b.

The communication hole 15b is formed at a position substantially above the center of the movable member 19.

By forming the communication hole 15b at such a position, when the positive pressure air is jetted from the component stirring nozzle 25, the movable member 19 moves so as to vibrate not only in the left-right direction but also substantially in the front-rear direction. Is done.

This is because, of the positive-pressure air discharged from the communication hole 15b, the positive-pressure air discharged from the communication hole 15b through the front portion 31a of the air discharge passage 20a and the communication between the air discharge passage 20a. Since the amount of the positive pressure air discharged from the communication hole 15b through the rear portion 31b from the hole 15b is different, a pressure difference is generated between the front portion 31a and the rear portion 31b in the air discharge path 20a, and the positive pressure air is generated. For example, the pressure of the front portion 31a and the rear portion 31b is instantaneously changed due to the property of the movable member 19, and the pressure difference slightly moves the front or rear when the movable member 19 is moved in the arrangement concave portion 17 due to the pressure difference. This is because they are moved one by one, and this is repeated so as to generate vibration.

FIG. 9 shows a second modification 15c.

The communication hole 15c is provided with the chip parts 12, 12,
Are formed as long holes extending in the transfer direction.

FIG. 10 shows third modified examples 15d and 1d.
5d is shown.

The communication holes 15d, 15d are
Are formed as elongated holes which are spaced apart from the transfer direction of 2, 12,... And extend in a direction orthogonal to this direction.

In each of the first to third modifications, the communication hole 15 is formed in the same manner as in the above embodiment.
. b, 15c, 15d, and 15d, the positive pressure air jetted immediately is discharged, so that a large number of chip components 12, 12,... fall on the bottom surface of the component inlet 14, and the chip components 12, 12,. . Can be improved in the transfer efficiency to the component supply unit 22.

[0079]

As is apparent from the above description, the component supply apparatus of the present invention supplies the chip components from the component storage unit that stores a large number of chip components to the component temporary storage unit and temporarily stores the chip components. In a component supply device that stirs chip components stored in the component temporary storage unit with positive pressure air and sequentially transfers the chip components to a component supply unit to a component mounting machine through a component transfer path, the component temporary storage unit and the outside are connected. Since the communicating holes are formed, the pressure in the component temporary storage unit is quickly reduced after the injection of the positive pressure air, and a large number of chip components drop into the temporary storage unit before the next injection of the positive pressure air.

Accordingly, the supply efficiency of the chip components to the component transfer path is increased, the transfer efficiency of the chip components to the component supply section can be improved, and there is no delay in the supply of the chip components. Stops are avoided, which contributes to an increase in the operating rate.

According to the second aspect of the present invention, the side cover is attached to one side of the component supply device, and the communication hole is formed in the side cover. Processing can be performed in a state in which the communication hole is removed from the device, and formation of the communication hole is facilitated.

Further, according to the third and fourth aspects of the present invention, when the chip component is agitated by the positive pressure air, it is blown up by the positive pressure air and moved into the component temporary storage section. A movable member is provided, and a plurality of air passages serving as a path of the positive pressure air are formed between an outer surface of the movable member and an inner surface of the component temporary storage portion when the movable member moves. Since the movable member vibrates and is moved inside the component temporary storage unit, the chip component that collided with the movable member is easily crushed and falls easily, and the chip component is smoothly supplied to the component transfer path to the component supply unit. Parts supply rate increases.

In addition, according to the fifth and sixth aspects of the present invention, since the communication hole is formed at a position substantially above the center of the movable member, the movable member is formed of the chip component. Since the component is moved in the component temporary storage unit so as to vibrate also in the transfer direction, the component supply rate of the chip component to the component supply unit is further increased.

The specific shapes and structures of the respective parts shown in the above-described embodiments are merely examples of the embodiment for carrying out the present invention. The scope should not be construed as limiting.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a component supply device of the present invention together with FIGS. 2 to 7, which is a perspective view.

FIG. 2 is a side view showing a state of being attached to a moving base.

FIG. 3 is an enlarged perspective view showing a component storage unit.

FIG. 4 is an enlarged exploded perspective view of a main part.

FIG. 5 is an enlarged sectional view of a main part.

6 is a diagram for explaining the movement of the movable member together with FIG. 7, and FIG. 6 is an enlarged cross-sectional view taken along the line VI-VI in FIG. 5 showing a state before the movable member is moved.

FIG. 7 is an enlarged cross-sectional view showing a state where the movable member is being moved and cut at the same site as in FIG. 6;

FIG. 8 shows a modification of the communication hole together with FIGS. 9 and 10, and FIG. 8 is an enlarged side view showing a first modification.

FIG. 9 is an enlarged side view showing a second modification.

FIG. 10 is an enlarged side view showing a third modification.

11 is a perspective view showing an outline of a high-speed chip component mounting machine together with FIG. 12; FIG.

FIG. 12 is a side view.

FIG. 13 is an enlarged sectional view showing a conventional component supply device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Component supply apparatus, 7 ... Component storage part, 12 ... Chip component, 13 ... Component temporary storage part, 15 ... Side cover, 15a
... communication hole, 15b ... communication hole, 15c ... communication hole, 15d ...
Communication hole, 19: movable member, 21: component transfer path, 22: component supply section, 29: first air flow path (air flow path), 30: second air flow path (air flow path)

Claims (6)

[Claims] 1. A chip storage unit for storing a large number of chip components, supplies the chip components to a component temporary storage unit to temporarily store the chip components, and agitates the chip components stored in the component temporary storage unit by positive pressure air. A component supply device for sequentially transferring the component to a component supply unit to a component mounting machine through a component transfer path, wherein a communication hole for communicating the component temporary storage unit with the outside is formed. 2. The component supply device according to claim 1, wherein a side cover is attached to one side surface of the component supply device, and the communication hole is formed in the side cover. 3. A movable member which is blown up and moved by the positive pressure air when the chip component is agitated by the positive pressure air is provided in the component temporary storage section. 2. The component supply device according to claim 1, wherein a plurality of air flow paths serving as a path of the positive pressure air are formed between an outer surface and an inner surface of the component temporary storage unit. 3. 4. A movable member which is blown up and moved by the positive-pressure air when the chip component is agitated by the positive-pressure air, is provided in the component temporary storage section. The component supply device according to claim 2, wherein a plurality of air passages serving as a path of the positive pressure air are formed between an outer surface and an inner surface of the component temporary storage unit. 5. The communication device according to claim 3, wherein the communication hole is formed at a position substantially above the center of the movable member.
A component supply device according to claim 1. 6. A communication device according to claim 4, wherein said communication hole is formed at a position substantially above a central portion of said movable member.
A component supply device according to claim 1.