JP4672698B2 - Granular material removal device - Google Patents

Description

  The present invention relates to a granular material extracting device, and more particularly to a granular material extracting device that can reliably extract a granular material even if the granular material has a small particle size.

Solder balls are often used as external connection terminals for mounting a BGA element or CSP on a substrate. When the solder balls are joined to the connection electrode, the solder balls may be handled one by one. As a method of separating the solder balls one by one from the tray containing a large amount of solder balls, the solder balls are adsorbed to the tip of the suction nozzle by air, and the solder balls are separated one by one by grinding with a shutter. The solder ball is adsorbed to the adsorption nozzle while raising the adsorption nozzle from the bottom of the apparatus (Patent Document 1) or the solder ball accommodation tray in which the solder ball is accommodated, and aerated in the solder ball accommodation tray. A device (Patent Document 2) that separates solder balls one by one by leaving one solder ball has been proposed.
As described above, in the inventions of Patent Documents 1 and 2, it becomes possible to reliably separate the solder balls one by one from the solder ball containing tray in which a large number of solder balls are accommodated. It was used suitably in fields such as rework.
JP 2003-198114 A JP 2005-103577 A

However, like the solder ball take-out device in Patent Documents 1 and 2, after the solder ball is adsorbed to the adsorbing portion, the shutter provided in the solder ball containing tray is passed or air is blown inside the solder ball containing tray. In the case of the method of removing the solder ball that has been excessively adsorbed by the adsorption nozzle, it is necessary to perform the operation of adsorbing the solder ball to the adsorption nozzle and the operation of removing the solder ball, and the processing time cannot be shortened. is there.
Also, when handling extremely small diameter solder balls, it is necessary to process the suction portion of the suction nozzle with high precision, which makes it difficult to process the suction nozzle and increases the manufacturing cost of the solder ball take-out device. There is also a problem.

  Therefore, the present invention can easily take out granular materials one by one from a storage chamber in which a group of granular materials such as a plurality of solder balls is stored, and can greatly improve the extraction speed. The purpose is to provide a device.

  The present invention is a granular material take-out device for individually extracting a granular material from a granular material group consisting of a large number of granular materials accommodated in an accommodating chamber, provided in a member that covers an opening of the accommodating chamber, the granular material A plurality of granules are sucked from the group of granules into a nozzle having a diameter larger than the diameter of the body and having an inner diameter that allows only one granule to pass through. And a separating means for separating the uppermost granular material from the other granular materials among the plurality of granular materials aligned in a line in the nozzle, and the separating means. And a take-out means for taking out the granule separated by the above-mentioned method.

  In this invention, the aligning means includes stirring means for stirring the particles of the granular material group accommodated in the accommodation chamber, and the granular material agitated by the stirring means in the nozzle. And an air suction means for suction. As a result, the granular material group in the storage chamber can be prevented from becoming a flock and the granular material group is agitated to disperse the granular material, which facilitates the suction of the granular material in the storage chamber to the nozzle. .

  The agitating means includes an air outlet opening near the bottom surface of the inner wall surface of the accommodation chamber, and an updraft that forms an updraft in the accommodation chamber by colliding with the air blown from the air outlet. And generating means. Thereby, the granular material group in the storage chamber can be further stirred, and the suction of the granular material in the storage chamber to the nozzle is further facilitated. At the same time, by blowing air into the storage chamber, the pressure in the storage chamber increases, and the particulate matter is easily discharged from the storage chamber via the nozzle.

  The separating means includes a suction holding means for sucking and holding the uppermost granular body stronger than the other granular bodies among the plurality of granular bodies sucked into the nozzle and aligned in a line; Separation compressed air supply means for supplying compressed air into the storage chamber and separating it from the other granular bodies in a state where the uppermost granular bodies are sucked and held by the suction holding means. It is characterized by comprising. As a result, only the uppermost granular material can be easily and reliably separated from the other granular materials.

  The suction holding means is formed in the middle of the first air flow path connecting the air suction means used for the alignment means and the nozzles and in the vicinity of the upper end of the nozzles, and is sucked into the nozzles and aligned in a row. Among the plurality of granules, a narrowing portion formed narrower than the diameter of the granules is provided so that the uppermost granules can be sucked more strongly than the other granules, The compressed air supply means connects the separation compressed air supply means and the nozzle so that compressed air can be supplied into the nozzle chamber while the granular material is sucked into the narrow portion. Two air flow paths are formed. As a result, among the granular materials discharged through the nozzle, the first granular material that has entered the nozzle can be reliably adsorbed and held in the narrowed portion, so that only the uppermost granular material in the nozzle has a simple structure. Can be reliably separated from other particles.

  Further, the take-out means includes a guide passage for guiding the granular material separated into one by the separating means in the outlet direction, and a compressed air supply for sending out the granular material in the guide passage in the outlet direction. Means are provided. Thereby, it becomes easy to take out the separated granular material outside the apparatus.

  The compressed air supply means for delivery uses a first air flow path connecting the air suction means used for the alignment means and the separation means and the nozzle, and switches to the air suction means to switch the compressed air supply means. A switching means for switching between the air suction means and the compressed air supply means is provided so that it can be used. This makes it easy to supply the compressed air immediately after the air has been sucked, so that the separated granular material can be reliably taken out.

  The nozzle is a tube-like nozzle extending from a member covering the opening of the storage chamber toward the storage chamber. Thereby, even if the granular material in a storage chamber decreases, a granular material can be extracted.

  In addition, an inclined surface that is inclined with respect to the traveling direction of the granular material is provided in the middle of the guiding passage so that the traveling direction of the granular material that passes through the guiding passage is changed. . According to this, a granular material can be taken out to a desired location.

  According to the granular material take-out device of the present invention, it is possible to easily take out the granular material one by one from the storage chamber in which a large number of granular material groups such as solder balls are accommodated, and the take-out speed can be increased according to the conventional solder Compared to the ball take-out device, it can be greatly improved.

Embodiments of a granular material take-out device according to the present invention will be described below in detail with reference to the drawings. In the present specification, the explanation will be made while exemplifying a solder ball take-out device for taking out a solder ball as a granule as the granule take-out device, but the granule take-out device according to the present invention is limited to the solder ball take-out device. Of course, it may be a take-out device for taking out other granular materials such as ball bearings and resin balls.
FIG. 1 is a plan view of the solder ball take-out device of the present embodiment. FIG. 2 is a side view of the solder ball take-out device shown in FIG. 3 is a cross-sectional view taken along line AA in FIG. 4 is a cross-sectional view taken along line BB in FIG. FIG. 5 is a perspective view showing a main body portion of the storage chamber. FIG. 6 is a plan view of the first member constituting the upper lid portion of the storage chamber. FIG. 7 is a plan view of the second member constituting the upper lid portion of the storage chamber. FIG. 8 is a plan view of a third member constituting the upper lid portion of the accommodation chamber.

A solder ball take-out device 100 shown in FIG. 1 covers a concave storage chamber 10 for storing a solder ball group composed of a large number of solder balls B and an opening of the storage chamber 10 as shown in FIGS. The solder ball separation unit 20 and the take-out nozzle 30 provided on the back side of the storage chamber 10 are assembled to the holder 40, respectively. When assembling the storage chamber 10 or the like to the holder 40, a known attachment method such as screwing can be appropriately selected. The holder 40 is also formed to be attachable to a moving device (not shown) by screwing or the like.
Air plugs 16Z, 52Z, and 54Z are disposed on the side surface and the upper surface of the solder ball take-out device 100. The air plugs 16Z, 52Z, and 54Z are respectively connected to the compressed air supply means 80 and / or the air suction means shown in FIG. 82. As shown in FIG. 1, an electromagnetic valve V is disposed between the air plugs 16Z, 52Z, 54Z and the compressed air supply means 80 and the air suction means 82. This electromagnetic valve V functions as a switching means for selectively supplying compressed air or sucking air to the air plugs 16Z, 52Z, 54Z. The operations of the compressed air supply unit 80 and the air suction unit 82 are controlled by an air control unit (not shown). The switching operation of the electromagnetic valve V is also performed by the air control unit.

As shown in FIGS. 3 and 4, the housing chamber 10 for housing the solder balls B has side walls 12 attached to the front, rear, left and right surfaces of the main body 11. The main body 11 and the side wall 12 are fixed by a known method such as screwing. The side wall portion 12A located at least on the front side (front side) of the storage chamber 10 is formed of a transparent material such as an antistatic acrylic plate.
A through hole 13 penetrating in the height direction of the side wall portion 12Z is formed in the side wall portion 12Z located on the rear surface side (back side) of the storage chamber 10, and the take-out nozzle 30 is inserted from the lower side of the through hole 13. Has been. A bolt 32 for closing the upper side of the through hole 13 is inserted from above the through hole 13. The front end side of the bolt 32 is formed to have a predetermined diameter and a small diameter, and can enter the take-out nozzle 30. Further, the distal end portion 34 is slash-cut at the small diameter portion, and functions as an inclined surface for changing the course of the solder ball B that has passed through a guide passage 76 described later in the axial direction of the extraction nozzle 30. In this specification, the internal space of the take-out nozzle 30 is also included in a part of the guide passage 76.

  As shown in FIGS. 3 and 5, the shape of the internal space of the storage chamber 10 is formed in a concave shape in which the shape of the front view has a substantially inverted trapezoidal shape. Further, a step portion 14 is provided on the inner wall surface of the main body 11. The step portion 14 functions as a rising air flow forming portion in the storage chamber 10. A communication portion 16 that communicates with the compressed air supply means 80 is formed in the vicinity of the inner wall surface and the inner bottom surface on the opposite side of the step portion 14 of the main body 11. An end portion of the communication portion 16 is connected to a long hole 16B formed along the inner wall surface in the direction from the upper end side to the lower end side of the inner wall of the storage chamber 10. The elongated hole 16B is covered with a tape 16A made of metal foil or the like, and an opening 18 is formed at a boundary portion with the inner bottom surface portion of the main body portion 11 at a position near the bottom surface of the storage chamber 10. This opening 18 serves as an air outlet in the container 10. An air plug 16 </ b> Z is provided at an end of the communication portion 16 on the outside of the storage chamber 10, so that compressed air from the compressed air supply means 80 can be supplied into the storage chamber 10. As described above, the step portion 14, the communication portion 16, the opening 18, and the compressed air supply means 80 of the storage chamber 10 constitute stirring means for stirring the solder balls B, B,. ing.

In such a stirring means, the compressed air from the compressed air supply means 80 is supplied into the storage chamber 10 through the electromagnetic valve V, the air plug 16Z and the communication portion 16 from the opening 18 of the tape 16A and the main body portion 11. The After the compressed air supplied to the storage chamber 10 collides with the stepped portion 14, an upward airflow is formed in the storage chamber 10 and mixed so as to wind up the solder balls B in the storage chamber 10. Since the solder balls B are agitated in the storage chamber 10 in this manner, the solder balls B are less likely to solidify in a flock shape, and the opportunity for extracting the solder balls B from the storage chamber 10 increases.
Thus, by supplying compressed air to the inside of the storage chamber 10, the solder ball B is agitated and the internal pressure of the storage chamber 10 is increased. Since the extraction nozzle 22 is disposed in the storage chamber 10 and the extraction nozzle 22 communicates with the outside of the storage chamber 10, the solder balls B in the storage chamber 10 pass through the extraction nozzle 22 and the storage chamber 10. Will be discharged from.

  As shown in FIGS. 3 and 4, the main body 11 is provided with a solder ball separation unit 20 that also functions as an upper lid of the storage chamber 10. The solder ball separation unit 20 includes a first member 50, a second member 60, and a third member 70, and is assembled in a state where the third member 70 is sandwiched between the first member 50 and the second member 60. ing. The solder ball separation unit 20 is assembled in a state where the solder ball separation unit 20 is positioned by inserting screws (not shown) through the screw holes N provided in the first member 50, the second member 60, and the third member 70. ing.

  As shown in FIG. 3, the solder ball separation unit 20 is attached to the storage chamber 10 such that the lower surface side of the second member 60 faces the storage chamber 10. An extraction nozzle 22 that extends into the storage chamber 10 is attached to the lower surface of the second member 60. The extraction nozzle 22 has an inner diameter that is larger than the diameter of the solder ball B and has a diameter that allows only one solder ball B to pass therethrough, and has a tip portion that is half the inner space of the storage chamber 10. It is formed in the length dimension which becomes a height position of about. A plurality of solder balls B extracted from the storage chamber 10 by the extraction nozzle 22 are arranged in a row in the extraction nozzle 22.

Next, each member constituting the solder ball separation unit 20 will be described individually.
As shown in FIG. 6, the first member 50 is connected to a compressed air supply means 80 (FIG. 1) and an air suction means 82 (FIG. 1) via a solenoid valve V (FIG. 1) as a switching means. An air flow path 52, a second air flow path 54 communicating with the compressed air supply means 80, and a screw hole N for assembly are formed penetrating in the plate thickness direction. Air plugs 52Z and 54Z are inserted into the first air passage 52 and the second air passage 54, respectively.
Further, as shown in FIG. 7, the second member 60 has a communication hole 62 that penetrates in the thickness direction and communicates the storage chamber 10 and the second air flow path 54 of the first member 50, and a screw hole N for assembly. Are formed penetrating in the thickness direction. The communication hole 62 is formed in the solder ball separation unit 20 so as to be substantially the same planar position (a position below the second air flow path 54) as the second air flow path 54 position of the first member 50. The extraction nozzle 22 (FIGS. 3 and 4) is inserted into the communication hole 62 from the storage chamber 10 side.

  As shown in FIG. 8, the third member 70 communicates with the first air flow path 52 (FIG. 6) and the second air flow path 54 (FIG. 6) of the first member 50 and has an opening at the outer peripheral edge. A slit 72 having a portion and a screw hole N for assembly are formed penetrating in the plate thickness direction. One end side of the slit 72 extends to the outer peripheral edge of the third member 70. A narrow portion 74 where the width dimension of the slit 72 is narrowed is provided in the middle portion of the slit 72. The narrow portion 74 is near the opening of the communication hole 62 (FIG. 7) of the second member 60 in the assembled state of the solder ball separation unit 20, and is compressed air into the slit 72 rather than the planar position of the communication hole 62. It is provided at a position slightly shifted to the upstream side of the air flow supplied from the supply means 80 (FIG. 1). The width of the narrow portion 74 is formed to be about 1/3 to 1/2 of the diameter of the solder ball B.

  As shown in FIGS. 3 and 4, the solder ball separation unit 20 is formed in the horizontal direction by the lower surface of the first member 50, the upper surface of the second member 60, and the slits 72 after the narrowed portion 74 of the third member 70. The space to be formed becomes a guide passage 76. In addition, a vacuum gauge (not shown) is disposed upstream of the narrowed portion 74 (on the compressed air supply means 80 or air suction means 82 side). The vacuum gauge is electrically or mechanically connected to the air control unit, and is set to operate the air control unit according to the measurement value of the vacuum gauge.

  The solder ball separation unit 20 assembled from the first member 50, the second member 60, and the third member 70 formed as described above includes a compressed air supply unit 80, an air suction unit 82, and an air control unit (not shown). And operate together.

1 to 8 includes alignment means for aligning the solder balls B, B,... In the storage chamber 10 in a line in the vertical direction in the extraction nozzle 22. The aligning means includes an agitating means including the stepped portion 14, the communication portion 16, the opening 18, and the compressed air supply means 80, the first air flow path 54 and the first air connected to the extraction nozzle 22. The suction means 82 is connected to the flow path 52.
In this aligning means, compressed air is supplied from the compressed air supply means 80 to the storage chamber 10, and the interior of the storage chamber 10 is brought to a high pressure while stirring and dispersing the solder balls B, B,. In addition to increasing the internal pressure of the storage chamber 10, the air in the extraction nozzle 22 is sucked by the air suction means 82, and a plurality of solder balls B are sucked into the extraction nozzle 22 and aligned in a vertical line ( FIG. 10).

A separating means for separating only the uppermost solder ball B from the other solder balls B among the plurality of solder balls B aligned in the vertical direction in the extraction nozzle 22 of the aligning means is also provided in the aligning means. Yes. This separating means gives the strongest suction force to the solder ball B at the uppermost position among the solder balls B, B,... Aligned in the vertical direction in the extraction nozzle 22 constituting the aligning means. Suction holding means, and the compressed air supply means 80 for supplying the compressed air for separation to the solder balls B connected to the second air flow path 54 and the second air flow path 54 and sucked and held by the suction holding means. It is comprised by.
This separation means is a state in which the solder ball B located at the uppermost position among the solder balls B, B,. Then, the compressed air from the compressed air supply means 80 is blown onto the solder ball B in the extraction nozzle 22 (FIG. 12), and the solder balls B, B other than the solder ball B at the uppermost position are returned to the storage chamber 10, and the uppermost position is reached. The solder balls B are separated into one (FIG. 13).

Extraction means for taking out the solder balls B separated in this way to the outside of the solder ball take-out device 100 (solder ball separation unit 20) is attached to the alignment means and the separation means. The take-out means includes a guide passage 76, a first air passage 52 connected to the guide passage 76, a compressed air supply means 80 that is a compressed air means for delivery connected to the first air passage 52, and the guide passage 76. And a bolt front end portion 34 formed on an inclined surface that is inclined to the side of changing the traveling direction of the solder ball B that has passed through the guide passage.
The take-out means is attracted by the narrow portion 74 constituting the suction holding means, and is separated from the other solder balls B from the compressed air supply means 80 side in the direction in which the solder balls B are separated from the narrow portion 74. (FIG. 14), the solder ball B is moved in the guide passage 76 (FIGS. 15 to 17), and the solder ball B is taken out of the solder ball take-out device 100 (solder ball separation unit 20). Yes.

  Next, a method for taking out the solder balls using the solder ball taking out apparatus 100 in the present embodiment will be described. FIG. 9 is an enlarged view of a portion C in FIG. 4, and is an explanatory view showing a state where the solder balls are sucked from the storage chamber. FIG. 10 is an enlarged view of a portion D in FIG. FIG. 11 is an explanatory view of the solder ball facing from above in the state of FIG. 12-14 is explanatory drawing which shows the procedure which isolate | separates a solder ball in a solder ball separation unit, respectively. 15-17 is explanatory drawing which shows the state which the solder ball is moving in the inside of a guide path.

First, the housing portion 10 is formed by assembling the side wall portion 12 to the main body portion 11 with screws or the like, and after the solder balls B to be separated are accommodated in the accommodating chamber 10, the solder ball separating unit 20 is screwed or the like into the accommodating chamber 10. Assemble by. If necessary, the take-out nozzle 30, the holder 40, and the storage chamber 10 may be assembled together.
Subsequently, air plugs 52Z, 54Z, and 16Z are set in the first air supply path 52, the second air supply path 54, and the communication portion 16, respectively. The air plugs 52Z, 54Z, and 16Z, the compressed air supply means 80, and the air suction means 82 are set. Connect an air tube (not shown). An electromagnetic valve V is disposed between the air plugs 52Z, 54Z, 16Z and the compressed air supply means 80 and / or the air suction means 82 as necessary.

  The user activates an air control unit (not shown), causes the compressed air supply means 80 to supply compressed air by the air control unit, and supplies the compressed air only to the air plug 16Z connected to the storage chamber 10. (Stirring means start). The compressed air supplied from the air plug 16 </ b> Z blows into the interior of the container 10 from the opening 18 in the container 10, and then collides with the stepped portion 14 to form an ascending air current in the housing chamber 10. The solder ball B is lifted and stirred by the rising air flow generated in the storage chamber 10. At this time, the internal pressure of the storage chamber 10 is significantly higher than before the compressed air is supplied, and the internal air of the storage chamber 10 and the solder balls B pass through the extraction nozzle 22 communicating with the outside of the storage chamber 10. It is discharged outside the storage chamber 10.

  The air control unit agitates the solder balls B in the storage chamber 10 with the compressed air supplied from the compressed air supply means 80 and simultaneously activates the air suction means 82 to suck air through the first air flow path 52. Then, the solder balls B stirred in the storage chamber 10 are sucked into the extraction nozzle 22 as shown in FIG. 9 (alignment means start). One or a plurality of solder balls B are sucked into the extraction nozzle 22. The solder ball B that has first entered (sucked) into the extraction nozzle 22 is adsorbed at the narrow portion 74 of the guide passage 76 as shown in FIGS. The other solder balls B thus formed are aligned in a substantially vertical line from the narrow portion 74 of the guide passage 76 to the extraction nozzle 22. Since the solder ball B sucked first is pressed against the narrow portion 74, only a small amount of sucked air acts on the other solder balls B connected thereafter. In other words, the suction force acting on the solder ball B sucked first is stronger than the suction force acting on the other solder balls B.

  Further, since the amount of air sucked into the air suction means 82 is reduced by pressing the solder ball B against the narrow portion 74 of the guide passage 76, the degree of vacuum from the narrow portion 74 to the air suction means 82 side is reduced. Rise. When a vacuum gauge disposed between the narrowing portion 74 and the air suction means 82 measures a predetermined degree of vacuum, the air control section is activated, and the air control section continues air suction by the air suction means 82, The solenoid valve V is switched and the compressed air supply means 80 is operated to supply compressed air via the second air flow path 54 as shown in FIG. 12 (separation means start).

  Due to the positional relationship between the communication hole 62 of the second member 60 and the narrowed portion 74 of the third member 70, the solder ball B first sucked into the extraction nozzle 22 is located at a position directly above the extraction nozzle 22, as shown in FIG. Since it is sucked in a state of being pressed by the narrow portion 74 formed on the air suction means 82 side from the position directly above the extraction nozzle 22, as shown in FIG. A gap 90 is formed between the upper end opening of the nozzle 22.

  When compressed air is supplied from the second air flow path 54, most of the compressed air is a solder ball B (first solder ball B) first sucked into the extraction nozzle 22 and an inner diameter portion at the upper end of the extraction nozzle 22. It enters into the internal space of the extraction nozzle 22 through a gap 90 formed between them, or diffuses in the guide passage 76 and is aspirated or discharged outside the solder separation unit 20. The size of the gap 90 is preferably a width of about 10 to 30 percent with respect to the diameter of the solder ball B to be handled. As shown in FIGS. 11 and 12, the leading solder ball B is attracted to the narrow portion 74 of the guide passage 76, so that the center position of the leading solder ball B is aligned with the central axis of the second air flow path 54. It is in a state of being deviated. In addition to this, since the leading solder ball B is sucked with the strongest suction force, the compressed air from the second air flow path 54 does not hit directly and does not move by the compressed air. B stays at the narrow portion 74 position.

  Most of the compressed air from the second air flow path 54 flows into the extraction nozzle 22 through the gap 90 along the outer peripheral surface of the leading solder ball B. As described above, the other solder balls B connected below the leading solder ball B follow the attracting force applied to the leading solder ball B with a weak attracting force. 13, the other solder balls B, B, B... Are separated by the compressed air flowing down from the second air flow path 54. In this way, the plurality of solder balls B, B, B... Sucked from the storage chamber 10 by the extraction nozzle 22 can be separated into one.

  Next, the air control unit switches the electromagnetic valve V and supplies the compressed air from the compressed air supply means 80 to the guide passage 76 via the first air flow path 52 (takeout means start), and FIGS. The solder ball B is moved in the direction of discharging from the solder ball separation unit 20 as shown in FIG. In the present embodiment, the take-out nozzle 30 is connected to the guide passage 76 and is connected so that the respective axes are at right angles. Further, a bolt front end portion 34 that is slash-cut at an angle at which the solder ball B from the guide passage 76 reflects to the take-out nozzle 30 is located at a portion where the guide passage 76 and the axis of the take-out nozzle 30 intersect. As shown in FIG. 16, the solder ball B that has passed through the guide passage 76 has a bolt tip 34 formed on an inclined surface that is inclined in a direction that changes the course of the solder ball B that has passed through the guide passage 76. Then, the nozzle moves along the axial direction of the take-out nozzle 30 and is discharged from the end portion of the take-out nozzle 30 to the outside.

  If the holder 40 is attached to the moving device, the solder ball B separated from the storage chamber 10 can be taken out to an arbitrary position. In this way, the solder balls B accommodated in the accommodation chamber 10 can be individually extracted. In this embodiment, the extraction time of the solder balls B can be performed within 1 second, so that even a large amount of solder balls B can be extracted in a short time.

As described above, the present invention has been described in detail on the basis of this embodiment. However, the present invention is not limited to the above embodiment, and various modifications are made without departing from the scope of the invention. Needless to say, this belongs to the technical scope of the present invention.
For example, the main body 11 having the stepped portion 14 formed as the rising airflow generating means at the bottom of the storage chamber 10 has been described. However, the rising airflow generating means can be realized in a form other than the stepped portion 14. . In the first place, the present invention can be realized even if the ascending air flow generation means is not provided in the accommodation chamber 10.

  In addition, the air discharge mechanism is not connected to the storage chamber 10, and the granular material such as the solder balls B is not stirred inside the storage chamber 10, or the extraction nozzle 22 is not connected to the solder ball separation unit 20, and a plurality of solder A form in which the function as a nozzle is realized in the communication hole 62 formed in a shape and dimension that allows the balls B to be connected in a line in the vertical direction, the guide passage 76 is formed with a smooth curve, etc., and an inclined surface is formed in the guide passage 76 Of course, it is possible to adopt an embodiment in which no is provided. Although these embodiments are not the best mode, it is possible to exert the minimum operation and effect according to the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be applied to an apparatus for separating and processing granular materials, such as a ball bearing inspection / extraction apparatus, in addition to a solder ball inspection / extraction apparatus for manufacturing a test wiring board.

It is a top view of the solder ball taking out device of this embodiment. FIG. 2 is a side view of the solder ball take-out device shown in FIG. 1. It is sectional drawing in the AA line in FIG. It is sectional drawing in the BB line in FIG. It is a perspective view which shows the main-body part of a storage chamber. It is a top view of the 1st member which comprises the upper cover part of a storage chamber. It is a top view of the 2nd member which comprises the upper cover part of a storage chamber. It is a top view of the 3rd member which comprises the upper cover part of a storage chamber. FIG. 5 is an enlarged view of a portion C in FIG. 4 and is an explanatory view showing a state where a solder ball is sucked from a storage chamber. FIG. 10 is an enlarged view of a portion D in FIG. 9. It is explanatory drawing which faces a solder ball from upper direction in the state of FIG. It is explanatory drawing which shows the procedure which isolate | separates the solder ball in a solder ball isolation | separation unit. It is explanatory drawing which shows the procedure which isolate | separates the solder ball in a solder ball isolation | separation unit. It is explanatory drawing which shows the procedure which isolate | separates the solder ball in a solder ball isolation | separation unit. It is explanatory drawing which shows the state in which the solder ball is passing the inside of a guide channel. It is explanatory drawing which shows the state which the solder ball has collided with the reflecting plate. It is explanatory drawing which shows the state in which the solder ball is passing the inside of an extraction nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Storage chamber 11 Main body part 12 Side wall part 14 Step part 16 Communication part 16A Tape 16B Long hole 16Z, 52Z, 54Z Air plug 18 Opening part 20 Solder ball separation unit 22 Extraction nozzle 30 Extraction nozzle 32 Bolt 34 Bolt tip part 40 Holder 50 1st 1 member 52 1st air flow path 54 2nd air flow path 60 2nd member 62 Communication hole 70 3rd member 72 Slit 74 Narrow part 76 Guide passage 80 Compressed air supply means 82 Air suction means 90 Crevice 100 Solder ball taking out device B Solder ball N Screw hole V Solenoid valve

Claims (9)

A granular material take-out device for individually extracting a granular material from a granular material group consisting of a large number of granular materials accommodated in a storage chamber,
A nozzle that is provided on a member that covers the opening of the storage chamber, has a diameter larger than the diameter of the granule, and has an inner diameter that allows only one granule to pass through, and is capable of adsorbing a plurality of granules. An alignment means for sucking a plurality of granular materials from the granular material group and aligning them in a line in the vertical direction;
Separating means for separating the uppermost granular material from other granular materials among the plurality of granular materials aligned in a row in the nozzle;
And a take-out means for taking out the granule separated by the separating means.   The aligning means includes an agitating means for agitating so as to soar up the granular material of the granular material group accommodated in the accommodating chamber, and an air suction for attracting the granular material agitated by the agitating means into the nozzle. The granular material extracting device according to claim 1, further comprising: means.   The stirrer includes an air outlet opening near the bottom surface of the inner wall surface of the accommodation chamber, and an ascending airflow generating means for forming an updraft in the accommodation chamber by colliding with the air blown from the air outlet And a granular material take-out device according to claim 2.   The separating means includes a suction holding means for sucking and holding the uppermost granular body stronger than other granular bodies among the plurality of granular bodies sucked into the nozzle and aligned in a row, and the suction holding Separation air supply means for supplying compressed air into the storage chamber and separating it from the other granular materials in a state where the uppermost granular material is sucked and held by the means; It comprises, The granular material taking-out apparatus as described in any one of Claims 1-3 characterized by the above-mentioned. The suction holding means is formed in the middle of the first air flow path connecting the air suction means used for the alignment means and the nozzle and in the vicinity of the upper end of the nozzle, and is sucked into the nozzle and aligned in a row. Among the plurality of granules, a narrow portion formed narrower than the diameter of the granules is provided so that the uppermost granules can be sucked more strongly than the other granules,
The separation compressed air supply means and the nozzle are provided in the separation compressed air supply means so that compressed air can be supplied into the nozzle chamber while the granular material is sucked into the narrow portion. The granular body taking-out apparatus according to claim 4, wherein a second air flow path to be connected is formed.   The take-out means includes a guide passage for guiding the granular material separated into one by the separating means in the outlet direction, and a compressed air supply means for sending out the granular material in the guide passage in the outlet direction. The granular material taking-out device according to any one of claims 1 to 5, further comprising:   The delivery compressed air supply means uses a first air flow path connecting the air suction means used for the alignment means and the separation means and the nozzle, and is switched to the air suction means to change the compressed air supply means. The granular material taking-out apparatus according to claim 6, further comprising a switching means for switching between the air suction means and the compressed air supply means so as to be usable.   The granular material according to any one of claims 1 to 7, wherein the nozzle is a tube-like nozzle extending from a member covering the opening of the storage chamber toward the storage chamber. Take-out device.   The inclined surface which inclines with respect to the advancing direction of the said granular material is provided in the middle of the said guide passage so that the advancing direction of the granular material which passes the said guiding passage may be changed. The granular material taking-out device according to any one of 6 to 8.

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