JPH1018021A - Sticking preventing parts in physical vapor depositing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the frequency of the reutilization of sticking preventing parts in a physical vapor depositing device, to remove physical vapor-deposited coating film to be stuck in a short time and to reduce the cost by forming Zn or Zn alloy coating film on the surface of the substrate of sticking preventing parts. SOLUTION: A masking jig 2 is used, and AU physical vapor-deposited coating film is formed on the surface of a CD-ROM substrate and to produce CD- ROM, and at the point of time in which the physical vapor-deposited coating film sticks to the surface of the masking jig 2, the masking jig 2 is immersed in an aq. soln. of hydrochloric acid while ultrasonic oscillation is applied thereto. In this way, Zn coating film on the surface of the masking jig substrate dissolves in the aq. soln. of hydrochloric acid, the stuck Au physical vapor-deposited coating film falls off into the aq. soln. of hydrochloric acid, and the AU physical vapor-deposited coating film can easily be recovered by filtering the aq. soln. of hydrochloric acid.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a physical vapor deposition apparatus for depositing a metal, particularly a noble metal physical vapor deposition film, on a CD-ROM, CD-R or CD-E (hereinafter, collectively referred to as CD) substrate using a physical vapor deposition apparatus. The present invention relates to an anti-adhesion part (for example, a masking jig, a shield ring, a shutter, etc.) used in a place where a physical vapor deposition film is not required to be formed when forming a metal. The present invention relates to a masking jig of an apparatus for performing physical vapor deposition.

[0002]

2. Description of the Related Art Conventionally, it is well known that a CD is formed by forming an Au physical vapor deposition film as a reflection film on the surface of a CD substrate, and an Au physical vapor deposition apparatus for that purpose is shown in FIG. A shield ring 5 for preventing the Au physical vapor deposition film from adhering to the inner wall of a container (not shown) of the Au physical vapor deposition apparatus, and a ring-shaped Au physical vapor deposition film 4 on the surface of the CD substrate 1 are provided. It has a shutter 6 for temporarily interrupting the flow of the active Au metal 7 generated from the Au target when it is replaced with a new CD substrate 1 after forming and manufacturing a CD.

A CD substrate 1 is prepared by using the Au physical vapor deposition apparatus.
To form a ring-shaped Au physical vapor deposition film 4 on the surface of
As shown in FIG. 1, a masking jig 2 is placed on a CD substrate 1 and placed in a shield ring 5 of an Au physical vapor deposition apparatus, and active A generated from an Au target 3 is generated.
The u metal 7 is physically deposited on the CD substrate 1.

The masking jig 2 mounted on the CD substrate 1 can be made of any metal material, but is mainly made of Cu or Cu alloy.
As shown in the perspective view of FIG. 2, the central shielding plate 2 has a disc-shaped central shielding plate 21 and a ring-shaped outer peripheral shielding plate 22.
1 and the ring-shaped outer peripheral shielding plate 22 are mounted concentrically and so as to form a ring-shaped opening 23 between the central shielding plate 21 and the outer peripheral shielding plate 22. Support column 2 by supporting arm 25 extended from
6 is supported.

When the masking jig 2 having such a structure is placed on the CD substrate 1 and the ring-shaped Au physical vapor deposition film 4 is formed on the surface of the CD substrate 1, the surface of the placed masking jig 2 is also formed. Naturally, the Au physical vapor deposition film 4 adheres. The Au physical vapor-deposited film 4 attached to the surface of the masking jig 2 is recovered. The recovery method is as follows: (a) a recovery method by mechanical peeling such as sandblasting, and (b) an aluminum film on the surface of the masking jig. A method of recovering an Au physical vapor-deposited film formed on an aluminum film by dissolving the aluminum film with an aqueous NaOH solution, and (c) forming a platinum group metal (Pt, Rh, Ir, R
A method is known in which a masking jig having an electroplated layer formed thereon such as u) is used, and Au physically deposited on the surface of the masking jig is recovered using a commercially available gold release agent.

[0006] After recovering and removing Au physically deposited by these methods, the masking jig is reused. Therefore, as a conventional masking jig, Cu or Cu
A masking jig consisting of only a masking jig base made of an alloy, a masking jig having an aluminum film formed on a surface of a masking jig base made of Cu or a Cu alloy,
A masking jig in which an electroplating layer of a platinum group metal (Pt, Rh, Ir, Ru, or the like) is formed on the surface of a masking jig base made of Cu or a Cu alloy is known.

[0007]

However, in a recovery method using mechanical peeling such as sandblasting, a masking jig requiring precise dimensional accuracy and levelness may be deformed if the recovery is repeated many times. The service life is extremely shortened due to the reduced size, and it is not preferable to reuse an expensive masking jig for a long time. In addition, the recovery of Au from the sandblasted powder is performed by using a Cu masking jig.
Alternatively, since a Cu alloy is also included, a large number of steps are required for recovery, so that the efficiency is low.

On the other hand, in a method in which an aluminum film is formed on the surface of a masking jig by physical vapor deposition or the like and Au is vapor-deposited on the aluminum film, the Au physical vapor-deposited film is collected and used every time the masking jig is reused. It is necessary to form a film, and furthermore, the formed aluminum film tends to become an alumina film, so care must be taken in storage, and there is a drawback that the Cu substrate is corroded by immersion in a NaOH solution at the time of recovery. .

Therefore, at present, a masking jig having an electroplating layer of a platinum group metal is used, and a masking jig for Au physical vapor deposition is replaced with a commercially available gold release agent, KCN and NaO.
The method of the above (c), in which the substrate is immersed in an aqueous solution in which H is dissolved while maintaining the temperature at 50 ° C. or lower and the physical vapor-deposited Au is recovered as a cyan complex, is most often used. However, the thickness of the electroplating layer of the platinum group metal varies significantly depending on the shape of the underlayer, and it has been difficult to obtain a uniform electroplating layer of the platinum group metal. For example, if there is a pinhole or an acute angle portion on the surface of the masking jig made of Cu or Cu alloy, the electroplating layer of the platinum group metal in that portion becomes extremely thin, and Cu or C is removed from the thin portion of this plating layer.
There is a problem that the u-alloy masking jig base is dissolved and corroded, and the number of times the masking jig can be reused is reduced.

[0010]

Means for Solving the Problems Accordingly, the present inventors have
As a result of conducting research to obtain a masking jig that can easily recover an Au physical vapor deposition film and can be reused many times as compared with the conventional masking jig, (a) a masking jig made of Cu or Cu alloy If a Zn or Zn alloy film is formed on the surface of the substrate, even if an Au physical vapor deposition film adheres to the surface of the Zn or Zn alloy film, the masking jig with the Au physical vapor deposited film adheres to the Zn or Zn alloy peeling. The Zn or Zn alloy film on the surface of the masking jig base can be easily removed in a short time by immersing in the agent and oscillating as necessary. Therefore, the Zn or Zn alloy film is removed simultaneously with the removal of the Zn or Zn alloy film. The Au physical vapor deposition film adhered to the surface of the alloy film can also be easily peeled off in a short time. (B) At this time, Zn which does not corrode Cu or Cu alloy little
Alternatively, the use of a Zn alloy stripper can further reduce the corrosion of the masking jig base, and the number of times the masking jig can be reused significantly compared to the conventional method of recovering physical vapor deposition Au adhered to the masking jig It was found that the number increased.

The present invention has been made on the basis of this finding, and (1) Zn masking jig substrate surface
Alternatively, a masking jig of an Au physical vapor deposition apparatus having a Zn alloy film formed thereon, particularly an Au having a Zn or Zn alloy film formed on the surface of a Cu or Cu alloy masking jig substrate
The masking jig of the physical vapor deposition apparatus has a feature.

Masking jig substrate, especially Cu or Cu
If the thickness of the Zn or Zn alloy film formed on the surface of the alloy masking jig base is less than 5 μm, the surface of the masking jig base cannot be sufficiently protected.
If it exceeds μm, it takes too much time to remove the Zn or Zn alloy film, which is not preferable. Therefore, the thickness of the Zn or Zn alloy film formed on the surface of the masking jig base is 5
１００100 μm. A more preferable range of the thickness of the Zn or Zn alloy film is 10 to 50 μm. Therefore, the present invention provides (2) a masking jig substrate,
Alternatively, a film thickness of the masking jig substrate made of Cu alloy:
Au formed by forming a 100 μm Zn or Zn alloy film
The masking jig of the physical vapor deposition apparatus has a feature.

The Zn alloy film is made of Al, Fe, N
1 to 30% by weight in total of one or more of i
It is preferable that the film is formed of a Zn alloy having a composition including Zn and unavoidable impurities. Accordingly, the present invention provides (3) a masking jig substrate, particularly, a masking jig substrate made of Cu or Cu alloy, which has Al, Fe, Ni
One or two or more of the above, containing 1 to 30% by weight in total, with the balance being a composition of Zn and unavoidable impurities.
A masking jig of an Au physical vapor deposition device formed with an n-alloy film is characterized.

This Zn or Zn alloy film can be used not only for the masking jig of the Au physical vapor deposition apparatus, but also for various types of deposition such as a shield ring and a shutter of an apparatus for physical vapor deposition of a noble metal (Ag, Pt, Pd, Rh) other than Au. By forming it on the surface of the component, the number of reuses of the deposition-preventing component (in the present invention, the deposition-preventing component is a general term for all the deposition-preventing components in a physical vapor deposition apparatus such as a masking jig, a shield ring, and a shutter) Can be increased. Therefore,
The present invention relates to (4) a metal-made metal deposited component base, particularly
Zn or Z on the surface of the substrate
The present invention has a feature in a deposition-preventing part of a noble metal physical vapor deposition apparatus formed with an n-alloy film.

[0015] The Zn or Zn alloy film formed on the surface of the metal deposited component base, particularly the Cu or Cu alloy deposited component base, is different from the Zn or Zn alloy film formed on the surface of the masking jig substrate. Accordingly, the present invention provides (5) a noble metal physics comprising a Zn or Zn alloy film having a film thickness of 5 to 100 μm formed on the surface of a metal deposition-preventing component substrate, particularly a Cu or Cu alloy deposition-preventing component substrate. Deposition parts for vapor deposition equipment, (6) metal deposition parts base, especially Cu or C
the surface of the u-alloy-made anti-adhesion component substrate contains 1 to 30% by weight in total of one or more of Al, Fe, and Ni;
A deposition-preventing component of a noble metal physical vapor deposition apparatus, the remainder of which forms a Zn alloy film having a composition consisting of Zn and unavoidable impurities;
(7) On the surface of the metal-made anti-reflection component base, especially the Cu or Cu alloy-made anti-deposition component base, a Zn film having a thickness of 5 to 100 μm or one or more of Al, Fe, and Ni in total. It is characterized in that it is a deposition-preventive part of a noble metal physical vapor deposition apparatus in which a Zn alloy film having a composition containing 1 to 30% by weight and the balance of Zn and unavoidable impurities is formed.

The metal-made anti-adhesive component base can be made of any metal material having excellent heat resistance.
In consideration of the price and the like, it is preferable to use Cu or a Cu alloy.
The alloy film can be formed by any other method such as an electroplating method, an electroless plating method, a physical vapor deposition method, and a sputtering method. In addition, in order to remove the metal film adhered by performing physical vapor deposition on the surface of the deposition-preventing component having the Zn or Zn alloy film of the present invention, the deposition-preventing component having the metal film deposited thereon is coated with copper such as dilute hydrochloric acid or dilute sulfuric acid. What is necessary is just to immerse in the acid which does not melt | dissolve, and to vibrate as needed.

The deposition-resistant part having the Zn or Zn alloy film of the present invention is made of a noble metal (Au, Ag, Pt, Pd, Rh).
Can be used not only as a deposition-preventing component of a device for performing physical vapor deposition, but also as a deposition-preventing component for a device for performing physical vapor deposition of metals other than noble metals, such as Cr, Ni, Al, and Cu. Therefore, the present invention relates to (8) a metal-made anti-adhesive component base, in particular, Cu
Alternatively, Zn or Zn is deposited on the surface of
An anti-deposition part of a metal physical vapor deposition device formed of an alloy film,
(9) A deposition-preventing component of a metal physical vapor deposition apparatus in which a Zn or Zn alloy film having a film thickness of 5 to 100 μm is formed on the surface of a deposition-preventing component substrate made of metal, particularly a substrate made of Cu or a Cu alloy. 1) One of Al, Fe, and Ni on the surface of the metal-made anti-corrosion component substrate, particularly the Cu or Cu alloy-made anti-corrosion component substrate.
(11) Metal deposition prevention of a metal physical vapor deposition apparatus in which a Zn alloy film having a composition of 1 to 30% by weight in total containing at least one species and two or more species and the remainder comprising Zn and unavoidable impurities is formed. On the surface of a component substrate, especially a Cu or Cu alloy deposition-preventing component substrate, Zn or Al, F having a thickness of 5 to 100 μm.
e, one or more of Ni, from 1 to 30 in total
The present invention is characterized in that it is a deposition-resistant part of a metal physical vapor deposition apparatus in which a Zn alloy film having a composition containing Zn and inevitable impurities is formed by weight and the remainder consists of Zn and unavoidable impurities.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION

Example 1 A Cu masking jig substrate for preparing a CD-ROM, which is the most common among CDs, was prepared. Further, a plating solution having a composition of zinc sulfate: 360 gr / l, ammonium chloride: 30 gr / l, sodium acetate: 15 gr / l, and glucose: 120 gr / l was also prepared.

Using the above plating solution, plating solution temperature: 20 ° C., stirring condition: 1000 r. p. m. (By magnetic stirrer), Cathode current density: 2 A / dm ² , Plating time: 20 minutes Thickness on the surface of the Cu masking jig substrate:
A masking jig 1 of the present invention was fabricated by forming a 10 μm Zn film.

Using the masking jig 1 of the present invention,
A CD-ROM is manufactured by forming an Au physical vapor deposition film on the surface of the D-ROM substrate, and when the 1 mm Au physical vapor deposition film adheres to the surface of the masking jig 1 of the present invention, the masking jig 1 of the present invention is removed. Hydrochloric acid: water = 1: 1 hydrochloric acid aqueous solution 5
3 liters (liquid temperature: 40 ° C) while applying ultrasonic vibration
Dipped for 0 minutes.

As a result, the Zn on the surface of the masking jig substrate
The film was dissolved in the aqueous hydrochloric acid solution, and the deposited Au physical vapor-deposited film was dropped into the aqueous hydrochloric acid solution. Au dropped in aqueous hydrochloric acid
The physical vapor-deposited film could be easily recovered by filtering off the aqueous hydrochloric acid solution. Such Au collection operation and regeneration of the masking jig base were repeated, and the dimensional accuracy of the masking jig base and the number of times the masking jig base could be reused without deformation (hereinafter referred to as the number of reuses) were measured. The number of reuses of the masking jig 1 of the present invention was 82 times.

Example 2 The surface of the Cu masking jig substrate was prepared under the same conditions as in Example 1 except that the plating time of the Cu masking jig substrate for CD-ROM preparation prepared in Example 1 was changed to 100 minutes. The masking jig 2 of the present invention was manufactured by forming a Zn film having a thickness of 50 μm.

Using the masking jig 2 of the present invention, C
A CD-ROM was prepared by forming an Au physical vapor deposition film on the surface of the D-ROM substrate, and when the 1 mm Au physical vapor deposition film adhered to the surface of the masking jig 2 of the present invention, the masking jig 2 of the present invention was replaced with hydrochloric acid. : 30% while applying ultrasonic vibration to 5 liters of 1: 1 aqueous hydrochloric acid solution (liquid temperature: 40 ° C.).
Minutes.

As a result, the Zn on the surface of the masking jig substrate
The film was dissolved in the aqueous hydrochloric acid solution, the deposited Au physical vapor-deposited film was dropped into the aqueous hydrochloric acid solution, and the Au physical vapor-deposited film in the dropped aqueous hydrochloric acid solution could be easily collected by filtering the aqueous hydrochloric acid solution. . By repeatedly performing such Au collection operation and regeneration of the masking jig base, the number of reuses of the masking jig 2 of the present invention was measured.
Five times.

Example 3 A Zn film having a thickness of 90 μm was formed on the surface of a Cu masking jig prepared in Example 1 on a surface of a Cu masking jig for manufacturing a CD-ROM by a vacuum deposition method under ordinary conditions. 3 was produced.

Using the masking jig 3 of the present invention, C
A CD-ROM was prepared by forming an Au physical vapor deposition film on the surface of the D-ROM substrate, and when the 1 mm Au physical vapor deposition film adhered to the surface of the masking jig 3 of the present invention, the masking jig was added to 20% by weight. Was immersed in 5 liters of an aqueous sulfuric acid solution (liquid temperature: 40 ° C.) for 30 minutes while applying ultrasonic vibration.

As a result, the Zn on the surface of the masking jig substrate
The film was dissolved in the aqueous sulfuric acid solution, the deposited Au physical vapor-deposited film dropped into the aqueous sulfuric acid solution, and the Au physical vapor-deposited film dropped into the aqueous sulfuric acid solution could be easily recovered by filtering off the aqueous sulfuric acid solution. . Such Au collection operation and regeneration of the masking jig base were repeated, and the number of reuses of the masking jig 3 of the present invention was measured.
It was times.

Example 4 A Zn-10% Al alloy film having a thickness of 90 μm was formed on the surface of a Cu masking jig substrate for CD-ROM production prepared in Example 1 by vacuum evaporation under ordinary conditions. The masking jig 4 of the present invention was manufactured.

Using the masking jig 4 of the present invention, C
A CD-ROM was prepared by forming an Au physical vapor-deposited film on the surface of the D-ROM substrate. When the 1 mm Au physical vapor-deposited film adhered to the surface of the masking jig 4 of the present invention, these masking jigs were replaced with hydrochloric acid: water = It was immersed in 5 liters of 1: 1 hydrochloric acid aqueous solution (liquid temperature: 40 ° C.) for 30 minutes while applying ultrasonic vibration.

As a result, the Zn on the surface of the masking jig substrate
The -10% Al alloy film dissolves in the hydrochloric acid aqueous solution, the deposited Au physical vapor-deposited film drops in the hydrochloric acid aqueous solution, and the Au physical vapor-deposited film dropped in the hydrochloric acid aqueous solution is easily collected by filtering off the hydrochloric acid aqueous solution. We were able to. Such Au collection operation and regeneration of the masking jig base are repeatedly performed,
As a result of measuring the number of reuses, the number of reuses of the masking jig 4 of the present invention was 57 times.

Example 5 A Zn-15% Fe alloy film having a thickness of 50 μm was formed on the surface of a Cu masking jig substrate for CD-ROM production prepared in Example 1 by sputtering under ordinary conditions. Thus, the masking jig 5 of the present invention was produced.

Using the masking jig 5 of the present invention, C
A CD-ROM was prepared by forming an Au physical vapor deposition film on the surface of the D-ROM substrate. When the 1 mm Au physical vapor deposition film adhered to the surface of the masking jig 5 of the present invention, these masking jigs were replaced with hydrochloric acid: water. It was immersed in 5 liters of a 1: 1 hydrochloric acid aqueous solution (liquid temperature: 40 ° C.) for 30 minutes while applying ultrasonic vibration.

As a result, the Zn on the surface of the masking jig substrate
The -15% Fe alloy film dissolves in the aqueous hydrochloric acid solution, the deposited Au physical vapor-deposited film drops in the hydrochloric acid aqueous solution, and the Au physical vapor-deposited film dropped in the hydrochloric acid aqueous solution is easily collected by filtering the hydrochloric acid aqueous solution. We were able to. Such Au collection operation and regeneration of the masking jig base are repeatedly performed,
As a result of measuring the number of reuses, the number of reuses of the masking jig 5 of the present invention was 65 times.

Example 6 A Zn-30% Ni alloy film having a thickness of 10 μm was formed on the surface of a Cu masking jig substrate for CD-ROM production prepared in Example 1 by a sputtering method under ordinary conditions.
The masking jig 6 of the present invention was manufactured.

Using the masking jig 6 of the present invention, C
A CD-ROM is manufactured by forming an Au physical vapor-deposited film on the surface of a D-ROM substrate. When the 1 mm Au physical vapor-deposited film adheres to the surface of the masking jig 6 of the present invention, the masking jig is replaced with hydrochloric acid: water. It was immersed in 5 liters of a 1: 1 hydrochloric acid aqueous solution (liquid temperature: 40 ° C.) for 30 minutes while applying ultrasonic vibration.

As a result, the Zn on the surface of the masking jig substrate
The -30% Ni alloy film is dissolved in the aqueous hydrochloric acid solution, the deposited Au physical vapor-deposited film is dropped into the hydrochloric acid aqueous solution, and the Au physical vapor-deposited film dropped into the hydrochloric acid aqueous solution is easily recovered by filtering the hydrochloric acid aqueous solution. We were able to. Such Au collection operation and regeneration of the masking jig base are repeatedly performed,
As a result of measuring the number of reuses, the number of reuses of the masking jig 6 of the present invention was 46 times.

Conventional Example 1 The thickness of the Cu masking jig substrate for CD-ROM production prepared in Example 1 was obtained under the normal electroplating conditions on the surface of the Cu masking jig.
A Rh film having a thickness of μm was formed, and a conventional masking jig 1 was manufactured. A CD-ROM using this conventional masking jig 1
By forming an Au physical vapor deposition film on the substrate surface, CD-
When a ROM was prepared and a 1 mm Au physical vapor-deposited film adhered to the surface of the conventional masking jig 1, these masking jigs were dissolved in a commercially available gold stripping agent (GS series manufactured by Kojima Chemical Co., Ltd.) (liquid temperature). : 30 ° C.) for 5 hours to recover Au and regenerate the masking jig repeatedly.
As a result of measuring the number of reuses, the number of reuses of the conventional masking jig 1 was eight times.

Conventional Example 2 The thickness of the Cu masking jig substrate for CD-ROM production prepared in Example 1 was set to 0.
A 5 μm Pt film was formed, and a conventional masking jig 2 was manufactured. CD-RO using this conventional masking jig 2
CD by forming Au physical vapor deposition film on M substrate surface
-Make a ROM and attach 1mm to the surface of the conventional masking jig 2.
When the Au physical vapor-deposited film adheres, these masking jigs are immersed in a gold stripper (liquid temperature: 30 ° C.) in which a commercially available gold stripper (GS series manufactured by Kojima Chemical) is dissolved for 5 hours to recover Au. At the same time, the masking jig was regenerated repeatedly, and the number of reuses of the conventional masking jig 1 was measured. As a result, the number of reuses was nine.

From the results shown in Examples 1 to 6 and Conventional Examples 1 and 2, (a) The masking jigs 1 to 6 according to the present invention in which a Zn or Zn alloy film was formed, (B) The time required to remove the deposited Au physical vapor-deposited film having a thickness of 1 mm is the same as that of the conventional masking jigs 1 to 3 formed with a platinum group film. In the case of 2, while 5 hours are required, the masking jigs 1 to 6 of the present invention can be peeled in 30 minutes, and it can be seen that the time required for peeling is extremely short and efficient.

The embodiment in which the Au physical vapor deposition film adhered to the masking jig of the physical vapor deposition apparatus is peeled off from the masking jig has been described in detail in comparison with the conventional example.
The present invention is not limited to the deposition-proof parts of the apparatus for physically depositing Au, and noble metals other than Au (Ag, Pt, Pd, R
h) Further, the present invention can be applied as a deposition-preventing part of an apparatus for physically depositing a metal such as Cr, Ni, Al, or Cu.

[0041]

As described above, the Zn or Z of the present invention is used.
The deposition prevention parts of the physical vapor deposition apparatus on which the n-alloy film is formed, in particular, the masking jig, greatly increase the number of times of reuse and can remove the attached physical vapor deposition film in a short time, thereby reducing costs. Can greatly contribute to

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing the structure of an Au physical vapor deposition apparatus.

FIG. 2 is a perspective view of a masking jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 CD-ROM board 2 Masking jig 3 Au target 4 Au physical vapor deposition film 5 Shield ring 6 Shutter 7 Active Au metal 21 Central shielding plate 22 Outer peripheral shielding plate 23 Ring opening 24 Outer trunk 25 Support arm 26 Support post

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yorishige Hashimoto 12-6 Technopark, Mita City, Hyogo Prefecture

Claims (7)

[Claims] 1. A deposition-preventing component for a physical vapor deposition apparatus, wherein a Zn or Zn alloy film is formed on the surface of a deposition-preventing component substrate. 2. A deposition-preventing component of a physical vapor deposition apparatus, wherein a Zn or Zn alloy film is formed on a surface of a deposition-preventing component substrate made of copper or a copper alloy. 3. A film having a thickness of 5 to 100 on the surface of the base of the component for preventing deposition.
3. The deposition component of a physical vapor deposition apparatus according to claim 1, wherein a Zn or Zn alloy film of μm is formed. 4. The Zn alloy film contains one or more of Al, Fe, and Ni in a total amount of 1 to 30% by weight, and the remainder has a composition of Zn and unavoidable impurities.
3. The method according to claim 1, wherein the film is made of an alloy film.
Or a deposition-preventive part of the physical vapor deposition apparatus according to 3. 5. The physical vapor deposition device according to claim 1, wherein said physical vapor deposition device is a component for physical vapor deposition of a noble metal. Wearing parts. 6. The component according to claim 5, wherein the noble metal is Au. 7. The deposition component of a physical vapor deposition apparatus according to claim 1, wherein the deposition component is a masking jig.