JPH10166269A - Grinding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the change of slurry in flow rate, supplied between a grinding member and a workpiece. SOLUTION: A slurry supply mechanism 20 consists of a slurry reservoir 21 and a slurry collector 30 to collect slurry S1 in the slurry reservoir 21. The slurry collector 30 which is provided on the discharge port 32a side facing to the slurry S1 in the slurry reservoir 21 in a demountable manner has a filter 36 to accept grinding debris T and an antifoaming cylinder 37 extended to the downstream side with the lower part placed in the slurry S1 in the slurry reservoir 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding apparatus for supplying a slurry containing abrasive grains between a grinding member and a workpiece and performing grinding, and reusing the slurry.
The present invention relates to a grinding device capable of preventing a change in a flow rate of a slurry supplied between a grinding member and a workpiece.

[0002]

2. Description of the Related Art For example, in the process of manufacturing a semiconductor chip, there is a step of cutting a round bar-shaped semiconductor single crystal material in a direction perpendicular to the crystal axis to cut into a large number of semiconductor wafers. In this step, the following grinding apparatus is conventionally used. That is, it is a wire saw cutting machine that performs grinding and cutting using a slurry containing abrasive grains, and includes a wire for grinding a semiconductor single crystal material, and a slurry supply mechanism for supplying a slurry containing abrasive grains to the wire.

[0003] The slurry supply mechanism has a slurry storage section for storing the slurry, and a slurry recovery section for recovering the slurry supplied between the wire and the semiconductor single crystal material to the slurry storage section. The slurry recovery section is provided detachably on the discharge port side for discharging the slurry into the slurry storage section, and has a filter for receiving shavings.

[0004]

However, in such a conventional grinding device such as a wire saw cutting machine, the slurry flowing into the slurry storage unit from the discharge port of the slurry recovery unit through the filter is removed from the slurry in the slurry storage unit. In some cases, bubbling is caused on the liquid surface and bubbles are mixed into the slurry. As a result, there is a problem that the amount of discharged slurry, that is, the flow rate is reduced due to accumulation of air in the pump of the slurry supply mechanism.

The present invention has been made in view of such circumstances, and has as its object to provide a grinding apparatus capable of preventing a change in the flow rate of slurry supplied between a grinding member and a workpiece. And

[0006]

In order to achieve the above object, a grinding apparatus according to the present invention comprises: a grinding member for grinding a workpiece;
A slurry supply mechanism that supplies a slurry containing abrasive grains between the grinding member and the workpiece; the slurry supply mechanism includes a slurry storage unit that stores the slurry; Having a slurry recovery unit that recovers the slurry supplied between the material and the slurry storage unit,
The slurry recovery unit is detachably provided on a discharge port side toward the slurry in the slurry storage unit, and in a grinding device having a filter for receiving shavings, the slurry recovery unit is provided on a downstream side of the filter. And a cylindrical body having at least a lower portion disposed in the slurry in the slurry storage section.

Therefore, in the present invention as well, the slurry flowing into the slurry storage unit from the discharge port of the slurry recovery unit through the filter generates bubbles on the liquid surface of the slurry in the slurry storage unit and mixes air bubbles into the slurry. Let it. However, in the present invention, since the downstream side of the filter has a cylindrical body having at least a lower portion disposed in the slurry in the slurry storage section, the foaming stays near the liquid level in the cylindrical body, is isolated, and at least one of the air bubbles is isolated. The part is between the time when the recovered slurry passes through the cylinder and exits from the lower end opening,
It rises in the cylinder and exits from the upper end opening of the cylinder.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the grinding apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 2 is a perspective view showing the entire wire saw cutting machine 100 as one embodiment of the grinding device of the present invention.

As shown in FIG. 1, a wire saw cutting machine 100 includes a cutting machine main body 10 having a wire 11 as a grinding member for cutting a round bar-shaped semiconductor single crystal material 1 as a workpiece and a semiconductor single cutting machine. A crystal material support mechanism 50 that supports the crystal material 1 and presses the crystal material 1 against the wire 11 is provided. The cutting machine body 10 includes a wire winding portion 12 around which the wire 11 is wound and stretched, wire running drive reels 19 and 19 provided at both ends of the wire 11 for running the wire 11 back and forth, and A slurry supply mechanism 20 for supplying the slurry Sl containing the abrasive grains Gr.

The wire winding portion 12 includes a pair of upper grooved rollers 13 and 14 provided in parallel in a horizontal direction, and a lower grooved roller disposed in parallel below the pair of upper grooved rollers 13 and 14. 15 and a wire feed motor A for driving the upper grooved rollers 13 and 14 and the lower grooved roller 15 to rotate in conjunction with each other, and the wire 11 is provided with the pair of upper grooved rollers 13 and 14. And lower grooved roller 1
5 and between the pair of upper grooved rollers 13, 14 in the axial direction of the upper grooved rollers 13, 14 (arrows X 1,
The wire rows 17 are formed at regular intervals in the X2 direction).

The slurry supply mechanism 20 includes a slurry storage unit 21 for storing the slurry S1 shown in FIG. 1, a slurry supply unit 25 for pressure-feeding the slurry S1 of the slurry storage unit 21 of FIG. 1 to the wire 11 of FIG. A slurry collection unit 30 is provided for collecting the slurry S1 supplied to the wire 11 in FIG. 2 into the slurry storage unit 21 in FIG. The slurry storage unit 21 has a slurry storage container 22 that includes a body 22a that opens upward and a detachable lid 22b that closes the opening.

The slurry collecting section 30 is provided with a wire array 1 shown in FIG.
An oil pan 31 that is opened upward toward 7, and is connected to the lower end of the oil pan 31, and the collected slurry S1 penetrates the lid 22b as shown in FIG. Introducing pipe 3 to be introduced into container 22
2 and a filter device 35 with a bubble eliminator provided detachably with respect to the body 22a of the slurry storage container 22 on one end side of the introduction pipe 32, that is, on the discharge port 32a side for discharging the slurry S1 into the slurry storage unit 21. And

The filter device 35 with a bubble eliminator has a filter 36 formed of a wire mesh for receiving the shavings T and a filter 36 formed in a cylindrical shape.
And a bubble eliminator 37 whose lower part is arranged in the slurry S1 stored in the slurry storage part 21. The bubble erasing cylinder 37 is arranged in a vertical posture, and its upper end opening 37a is located above the liquid level LS of the slurry Sl. The length L1 of the bubble elimination cylinder 37 immersed in the slurry S1 corresponds to the flow rate or the flow rate of the slurry S1 flowing from the discharge port 32a of the slurry recovery unit 30, and the bubbles B1 generated by the inflow of the slurry S1 are defoamed. Cylinder 3
7 is long enough to ascend without flowing out from the lower end opening 37b.

Since the wire saw cutting machine 100 of FIG. 2 is configured as described above, the slurry Sl
Can be kept high quality. That is, the slurry S1 supplied to the wire 11 and used for the grinding and cutting falls on the oil pan 31 of the slurry collecting unit 30 and is discharged to the filter 36 from the outlet 32a of the slurry collecting unit 30 in FIG. . In the filter 36, the shavings T in the slurry Sl are received, and only the slurry Sl containing abrasive grains is introduced again into the slurry storage unit 21.

At this time, the flowing slurry Sl foams on the liquid level LS of the slurry Sl in the slurry storage section 21.
Is generated, and bubbles B1 are mixed into the slurry Sl. However, since the bubbling B2 floats on the liquid level LS in the bubble erasing cylinder 37 arranged downstream of the filter 36,
It stays at the upper part in the bubble erasing cylinder 37 and is isolated. Also, the bubbles B1 mixed in the slurry Sl pass through the bubble removing cylinder 37 where the collected and flowing slurry Sl flows through the bubble erasing cylinder 37, and the lower end opening 3
Before going out of 7b, it rises inside the bubble eliminator 37 and exits through the upper end opening 37a of the bubble eliminator 37.

Accordingly, the incorporation of bubbles B1 and the like into the slurry Sl in the slurry storage section 21 is reduced. This allows
It is possible to prevent a situation in which the supply flow rate of the slurry S1 fluctuates due to, for example, accumulation of the air bubbles B1 in the slurry supply unit 25. In addition, it is possible to prevent a decrease in the quality of the slurry Sl due to the mixing of the bubbles B1 and the like. In other words, the wire saw cutting machine 100 in FIG. 2 can improve the quality of the slurry Sl collected in the slurry storage container 22 and supplied to the wire 11 again, so that the cutting accuracy can be improved.

Since the filter 35 with a bubble eliminator shown in FIG. 1 is provided detachably with respect to the body 22a of the slurry storage container 22, when the shavings T accumulate, first, the slurry storage container 22 is removed. After removing the lid portion 22b, the filter 35 with the bubble erasing device is removed, the shavings T are discarded, and the re-attached device can be used repeatedly. The grinding apparatus of the present invention can be applied to any grinding apparatus using a slurry Sl containing abrasive grains Gr. For example, a grinding apparatus may be used.

[0018]

As described above, according to the grinding apparatus of the present invention, the bubbling and the entrainment of bubbles caused by the slurry flowing into the slurry storage section are isolated or eliminated by the cylindrical body, so that the flow rate of the slurry varies. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing a filter of a wire saw cutting machine as one embodiment of a grinding device of the present invention.

FIG. 2 is an overall view of the wire saw cutting machine of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor single crystal material (workpiece) 11 ... Wire (grinding member) 20 ... Slurry supply mechanism 21 ... Slurry storage part 30 ... Slurry recovery part 32a ... Exhaust port 36 ... Filter 37 ... Bubble erasing cylinder (tubular body) 100: wire saw cutting machine (grinding device) Sl: slurry Gr: abrasive grains T: shavings

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[Procedure amendment]

[Submission date] January 21, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

In order to achieve the above object, a grinding apparatus according to the present invention comprises: a grinding member for grinding a workpiece;
A slurry supply mechanism that supplies a slurry containing abrasive grains between the grinding member and the workpiece; the slurry supply mechanism includes a slurry storage unit that stores the slurry; Having a slurry recovery unit that recovers the slurry supplied between the material and the slurry storage unit,
The slurry recovery unit is detachably provided on a discharge port side toward the slurry in the slurry storage unit, and in a grinding device having a filter that receives shavings, the slurry recovery unit has at least a lower part in the slurry storage unit. It has a cylindrical body arranged in the slurry.

Claims (1)

[Claims] A grinding member for grinding a workpiece; and a slurry supply mechanism for supplying a slurry containing abrasive grains between the grinding member and the workpiece. And a slurry collection unit that collects the slurry supplied between the grinding member and the workpiece in the slurry storage unit. The slurry collection unit includes a slurry storage unit inside the slurry storage unit. In a grinding device having a filter that is detachably provided on a discharge port side toward the slurry and receives shavings, the slurry recovery unit is provided on the downstream side of the filter, and at least a lower part of the slurry collection unit is provided in the slurry storage unit. A grinding device having a cylinder disposed in a slurry.