JPH10166158A - Seam welding equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain electronic parts in which the positioning of the package and the lid can be carried out with high precision and at a high speed by an extremely simple mechanism, in which cost effectiveness is superior, and in which the package and the lid free of deviation are hermetically sealed because tack welding is performed with the package and the lid positioned. SOLUTION: The seam welding equipment, by which electronic parts are hermetically sealed by seam-welding a package P containing the electronic parts elements and a lid L, is provided with a lid supplying mechanism 8 for placing one piece each of the lid L on the package P, a mechanism 9 for positioning the package P and the lid L, a tack-welding mechanism for tack- welding the package P to the lid L so positioned, a first seam-welding mechanism 11 for joining the two arbitrary oppositely-facing sides of the lid L, a second seam-welding mechanism 12 for joining other two oppositelyfacing sides of the lid L, and a mechanism 13 for discharging the seam-welded package P and the lid L; the positioning mechanism 9 is equipped with a tapered face for positioning by pushing the edge of the lid L and that of the package P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parallel type suitable for joining by rotating a pair of roll-shaped joining electrodes to an edge portion of a lid stacked on a package on which various elements of an electronic component are mounted. It relates to a seam joining device.

In a conventional parallel seam bonding apparatus of this type, as shown in FIG. 4, a carrier board 4 on which a plurality of rectangular packages P containing circuit elements such as a crystal oscillator and a semiconductor element are mounted is sequentially transported. (Not shown). After the lid L serving as a lid is supplied on the package P, the package P and the lid L are temporarily attached by the temporary attaching mechanism PP.

When the temporary attachment mechanism 10 starts operating,
As shown in FIG. 4, the tacking electrodes 10A and 10B move forward and descend until a predetermined pressure is applied to the short side of the lid L. Thereafter, a voltage is applied between the tacking electrodes 10A and 10B. By applying a current, the package P and the lid L are temporarily attached. When the temporary attachment of the package P and the lid L is completed, the temporary attachment electrodes 10A and 10B rise.

Next, the package P and the lid L on the carrier board 4 are sent to the Y-direction bonding mechanism 11 by the transport means, and stop at a predetermined position. When the package P and the lid L stop at a predetermined position of the Y-direction joining mechanism 11,
The directional joining mechanism 11 starts operating, and the roll-shaped electrodes 11A and 11B having trapezoidal cross sections descend to apply a predetermined pressure to the lid L and rotate in the longitudinal direction of the carrier board 4.
At this time, since a predetermined voltage is applied between the roll electrodes 11A and 11B, the roll electrodes 11A and 11B
As B rotates, a pair of opposite sides of the package P and the lid L are seam-joined.

When the seam joining of the pair of sides in the Y direction is completed, the roll-shaped electrodes 11 A and 11 B
Then, the package P and the lid L are again transported on the carrier board 4 to the X-direction bonding mechanism 12 by the transport means. Then, similarly to the Y-direction joining mechanism 12, the roll-shaped electrodes 12A and 12B operate to seam-join the other pair of sides of the package P and the lid L opposite to each other. Thus, the seam joining between the package P and the lid L is performed, and a hermetically sealed electronic component is obtained.

The bonding operation between the package P and the lid L is as described above. However, in performing the temporary bonding, the positioning between the package P and the lid L is accurately performed, and the positioning is performed. While holding the joint.

At present, a method using an image processing apparatus is widely used. Although this method is not shown, it is possible to accurately detect how much the package is displaced in the X direction, the Y direction, and the angle θ direction with respect to the target center point of the lid, and mount the carrier board by the deviation. X
Correction is performed by accurately moving in the direction, the Y direction, and the angle θ direction. In many cases, the image processing method is used for automatically and accurately positioning the electronic component with respect to the printed board even when the electronic component is mounted on the printed board and soldered.

[0008]

However, the method of positioning the package and the lid using the conventional image processing apparatus has a great merit that the package and the lid can be automatically positioned with high accuracy. Although,
Since it is necessary to mechanically move the carrier board in the X direction, the Y direction, and the angle θ direction sequentially by a driving device (not shown) by the amount corresponding to the displacement, the carrier board needs to be mechanically corrected. Another major disadvantage is that the cost is considerably high.

An object of the present invention is to automatically and accurately and quickly align a package and a lid with a simple and inexpensive mechanical structure in order to eliminate such a conventional disadvantage.

[0010]

Means for Solving the Problems A first aspect of the present invention aims to eliminate the above-mentioned drawbacks and to hermetically seal an electronic component by seaming a package containing an electronic component element and a lid. In a seam joining apparatus for performing a stop, a lid supply mechanism for placing the P pieces of the lid on the package, a positioning mechanism for performing alignment between the package and the lid, and the package that has been aligned. A tacking mechanism for tacking the lid, a first seam joining mechanism for seam joining any two opposing sides of the lid, and a second seam joining mechanism for seam joining other opposing two sides of the lid. A seam joining mechanism; and a discharge mechanism for discharging the seam-bonded package and lid from the turntable, wherein the positioning mechanism includes the lid and the package. It is an object of the present invention to provide a seam joining apparatus characterized by having a tapered surface capable of pressing an edge of a cage.

In order to eliminate the above-mentioned drawbacks, the second aspect of the present invention is based on the first aspect, wherein the positioning mechanism includes a plurality of blocks each having a tapered surface, and the blocks are moved forward and backward. The present invention provides a seam bonding apparatus comprising a driving mechanism, wherein the block advances and the tapered surface presses and aligns the lid and the edge of the package.

A third aspect of the present invention aims to eliminate the above-mentioned disadvantages, and in the first aspect, a minimum horizontal plane surrounded by the plurality of tapered surfaces of the positioning mechanism is larger than an area of the lid. The largest horizontal plane surrounded by the plurality of tapered surfaces is larger than the area of the lid, the alignment mechanism descends from above the lid, and the tapered surface moves the edges of the lid and the package. It is intended to provide a seam joining apparatus characterized in that the positioning is performed by pushing.

According to a fourth aspect of the present invention, in order to eliminate the above-mentioned drawbacks, in any one of the first and second aspects, the block is configured to move forward and backward in a first direction. And a pair of second blocks capable of moving forward and backward in a second direction perpendicular to the first direction. The first block and the second block move forward, and their tapered surfaces are The lid and the edge of the package are pushed to align the lid with the package, the first block holds the alignment state, the second block retreats, and the temporary attachment mechanism operates. The present invention is to provide a seam joining apparatus characterized in that the tacking electrode is brought into contact with the lid and pressurized, and an electric current is flown for tacking.

According to a fifth aspect of the present invention, in order to eliminate the above-described drawbacks, in any one of the first and second aspects, the block is provided with a pair of first and second movable members that can move forward and backward in a first direction. And a pair of second blocks capable of moving forward and backward in a second direction perpendicular to the first direction. The first block and the second block move forward, and their tapered surfaces are Press the lid and the edge of the package to perform alignment between the lid and the package, and in this state, the tacking mechanism operates to bring the tacking electrode into contact with the lid, pressurize, and flow current. It is an object of the present invention to provide a seam joining apparatus characterized by temporarily attaching.

A sixth aspect of the present invention is directed to any one of the first and second aspects of the present invention for removing the above-described disadvantages, wherein the block is configured to move forward and backward in a first direction. And a pair of second blocks capable of moving forward and backward in a second direction perpendicular to the first direction. The first block and the second block move forward, and their tapered surfaces are The lid and the edge of the package are pushed to align the lid with the package, the first block holds the alignment state, and the second block moves once to move the temporary electrode portion to the position. An object of the present invention is to provide a seam joining apparatus characterized in that it is brought into contact with a lid, is pressurized, and is supplied with an electric current to be temporarily attached.

According to a seventh aspect of the present invention, in order to eliminate the above-mentioned drawbacks, in any one of the first to sixth aspects, the package is mounted on a turntable, and the turntable is mounted on the turntable. It is an object of the present invention to provide a seam joining apparatus, wherein the second seam joining mechanism is disposed at a position rotated by about 90 degrees from the first seam joining mechanism.

[0017]

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, a displacement prevention plate 2 is provided at an outer peripheral portion on a turntable 1 which is intermittently rotated by a driving device (not shown) including a motor and a control device at a position indicating each time of a clock. Have been. The anti-displacement plates 2 provided at substantially constant intervals are fixed to the turntable 1 with four pins 3 or detachably mounted with the four pins 3 planted on the turntable 1. In the center thereof, there is provided a storage opening 2A for receiving the package P. The position shift prevention plate 2 is at a level such that when the package P is placed in the storage opening 2A, the upper side of the package P protrudes from the upper surface of the position shift prevention plate 2. Although the main function of the displacement prevention plate 2 will be described later, it is to prevent the package L and the lid L temporarily attached in that direction from being displaced by rotating the roller-shaped electrode at the time of joining. ,
It is not always necessary to use a misalignment prevention plate having such a structure.

The storage opening 2A of the displacement prevention plate 2 has
At a position a corresponding to 6 o'clock on the clock of the turntable 1, packages P (not shown) mounted and sent on a normal carrier board 4 are sent one by one by a package supply device 5 such as a package transfer robot. Supplied. The carrier board 4 is transported in the direction of the arrow by a transport means 6 such as a conveyor, and when the transport means 6 is stopped, the package supply device 5 picks up one package P from the carrier board 4 by vacuum suction or gripping claw. Then, it is transferred to the storage opening 2A of the displacement prevention plate 2.

Next, the turntable 1 rotates in the direction opposite to the clockwise direction (the direction of the arrow), and the position of the package P is corrected at the position c for the following reason. In an actual production line, packages P of various sizes are often handled. In this case, it is sufficient to prepare a carrier board 4 that fits the size of each package P. Often, small packages are mounted on a carrier board for transportation. In this case, there is a case where the package supply device 5 does not transfer the package P into the storage opening 2A of the displacement prevention plate 2 but places the package P on the displacement prevention plate 2 in the vicinity thereof. Carrier board 4 with such a possibility
In the case of the combination of the package P and the package P, the package position correcting means 7 is required. The package position correcting means 7 is configured such that, for example, a block capable of moving forward and backward moves forward from four directions to the storage opening 2A of the displacement prevention plate 2, pushes the package P into the storage opening 2A, and then retracts. It has a simple structure.

At a position d where the turntable 1 is further rotated by one step, the lid L is supplied onto the package P. The supply of the lid L is performed by a normal lid supply device 8. The lid supply device 8 includes an alignment unit that aligns the lids supplied by the lid magazine robot 8B from the lid magazine 8A in which a large number of lids are stored, and the displacement prevention plate 2 that positions the lids one by one at the position d.
And a lid supply robot unit to be transferred into the storage opening 2A.

Next, the position of the lid L and the package P of the present invention is adjusted by the alignment mechanism 9 at the position e where the turntable 1 is further rotated by one step.
Lid L supplied on package P in the previous step
Does not greatly deviate from the package P, but as described in the description of the alignment by the conventional image processing, the lid L and the package P are in the X direction, the Y direction, and the angle θ.
A shift has occurred in one or more of the directions. Therefore, not only must the lid L and the package P be accurately positioned, but also must be performed with a simple structure that is fast and economical.

The positioning mechanism 9 shown in FIGS. 3A and 3B has four blocks 9 A, 9 B, which can move up and down, move forward and backward with respect to four different sides of the lid L and the package P, respectively. 9C and 9D are provided. 4 blocks 9
In A to 9D, the distance between the opposing blocks is reduced when the lid L and the package P are moved substantially centered by a general driving mechanism (not shown), and the distance between the opposing blocks is increased when the rod moves backward. The features of the four blocks 9A to 9D are that the tapered surfaces 9a and 9 abut on the edges l and p of the lid L and the package P, respectively.
b, 9c and 9d. The angle of these tapered surfaces 9a to 9d with respect to the horizontal plane is preferably 60 degrees or less, and more preferably a smooth surface of about 45 degrees or less. This angle is the angle of a straight line connecting the edge 1 of the lid L and the edge p of the package P. Is determined by

When the package P placed on the turntable 1 and the lid L placed thereon come to the position e and stop, a drive mechanism (not shown) starts operating and the four blocks 9 A -9D is lowered to a set level slightly above the upper surface of the turntable 1 and then advanced at a constant speed. Even if the package P is displaced from the lid L placed thereon, first, the edges p of the package P and the edge l of the lid L where the tapered surfaces 9a to 9d of the four blocks 9A to 9D are displaced and project. When the package P is moved forward, the tapered surfaces 9a to 9d of the four blocks 9A to 9D lightly press the corresponding edge p of the package P and edge l of the lid L. And the lid L placed thereon is completed. Positioning can be performed with high accuracy by such a simple mechanism.

After the positioning of the package P and the lid L is completed, the temporary attachment is performed at that position. First, a pair of blocks 9A and 9B located on the left and right sides of the drawing of the four blocks 9A to 9D are lightly pressed against the package P and the lid L so as not to be displaced. The two blocks 9C and 9D located at the position L are retracted, and the pair of tacking electrodes 10A and 10B are lowered from above toward the position until they come into contact with the edge 1 of the lid L, and the force is further lowered. To give a predetermined pressure. Thereafter, a current is supplied from a power supply device (not shown) between the tacking electrodes 10A and 10B to perform tacking.

When the package P and the lid L are relatively large, as shown in FIG.
Immediately next to C and 9D, a pair of tacking electrodes 10A and 10B
Are arranged respectively, and the four blocks 9A to 9A
In a state where the tapered surfaces 9a to 9d of 9D lightly press the corresponding edge p of the package P and edge l of the lid L,
A pair of tacking electrodes 10A and 10B are connected to the lid L from above.
May be lowered until it comes into contact with the edge l portion of the above, and a predetermined pressure may be applied by further applying a downward force to perform temporary attachment. By performing the temporary attachment in this manner, the package P and the lid L are joined in an accurately aligned state without displacement.

When the tacking is completed, the turntable 1 rotates counterclockwise again, and seam joining of the pair of opposing sides of the package P and the lid L is performed at a position g corresponding to 12:00 of the timepiece. The joining mechanism that performs this joining direction is the first
Seam joining mechanism 11. First seam joining mechanism 1
Reference numeral 1 denotes a mechanism similar to the conventional one, and a pair of roll-shaped electrodes 11 is provided.
A rotates a pair of opposite sides of the lid L in the direction of the arrow,
Seam joining is performed by passing a current through a pair of roll-shaped electrodes through the lid L.

When the seam welding of the first pair of sides is completed, the turntable 1 again rotates counterclockwise, and the package P and the lid L face each other at the position j corresponding to 9 o'clock of the clock. Is performed. This seam joining is performed by the second seam joining mechanism 12. Since this seam joining is performed at a position j corresponding to 9 o'clock on the timepiece, the package P and the lid L are rotated 90 degrees from the time of the first seam joining, and therefore, the pair of rolls of the second seam joining mechanism 12 are rotated. The electrode 12A also rotates in the same arrow direction as the pair of roll electrodes of the first seam bonding mechanism 11 to perform seam bonding. Thus, the seam joining between the package P and the lid L is completed, and the hermetic seal is completed.

When the seam welding of the second pair of sides is completed, the turntable 1 rotates counterclockwise again, and the package P and the lid L hermetically sealed at the position k.
Is transferred from the turntable 1 to the empty carrier board 4 by the discharging device 13. In this way, the package P supplied to the position a of the turntable 1 and
Seam joining with the lid L placed on the package P at the position d is performed one after another, and at the position k, it is sequentially transferred from the turntable 1 onto the empty carrier board 4 and hermetically sealed. The electronic components are taken out by the carrier board 4.

In the above embodiment, the positioning mechanism 9 has been described as being composed of the four blocks 9A to 9D that can be moved separately, but within a certain range depending on the size of the tapered surface of the blocks 9A to 9D. When the package P and the lid L having a size of
A to 9D may consist of blocks of a single structure that cannot be moved separately, in which case the smallest horizontal plane formed by the four tapered surfaces is smaller than the area of the lid and formed by four tapered surfaces. It is sufficient that the maximum horizontal plane is larger than the area of the lid, and the single block is configured to be able to move up and down. With such a configuration, the corresponding tapered surface always comes into contact with the lid and the edge of the package in the process of lowering the block, and the four tapered surfaces lower while correcting the displacement thereof, and the lid L And the package P are aligned.
Therefore, bonding can be performed in a state where the lid L and the package P are accurately aligned.

The tapered surfaces of the four cubic blocks 9A to 9D of the positioning mechanism 9 are provided with a mechanism acting as a temporary electrode, and the tapered surfaces are used as described above. After the alignment of the package P and the lid L is completed, the four blocks 9A to
A mechanism for holding the two opposing blocks of 9D as they are, retreating the other two opposing blocks to a position not in contact with the package P and the lid L, and then acting as a temporary attachment electrode Rotate to the holding surface, advance again and press on the lid with these pair of blocks,
It is also possible to temporarily attach by applying a current.

Each of the blocks 9A to 9D has substantially the same four tapered surfaces. In order to align the package P and the lid L, if the tapered surfaces are worn or scratched, By rotating the taper by 90 degrees so that the tapered surface can be easily changed to a new one, it is possible to easily maintain high alignment accuracy.

[0032]

As described above, according to the present invention, the positioning of the package and the lid can be performed with high accuracy and at high speed by a very simple mechanical mechanism. Also, compared to the conventional image processing alignment, it is much more economical. Moreover, since the temporary attachment is performed with the package and the lid aligned, there is no gap between the package and the lid. Parts and the like can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an embodiment of the present invention.

FIG. 2 is a diagram for explaining an embodiment of the present invention.

FIG. 3 is a diagram for explaining one embodiment of the present invention.

FIG. 4 is a diagram for explaining a conventional example.

[Explanation of symbols]

P ・ ・ ・ Package L ・ ・ ・ Lid 1 ・ ・ ・ Turntable 2 ・ ・ ・ Position shift prevention plate 2A ・ ・ Storage opening of position shift prevention plate 3 ・ ・ ・ Pin 4 ・ ・ ・ ・ ・ ・ Carrier board 5 ・ ・ ・Package feeding device 6 ··· Conveying means 7 ··· Package position correcting means 8 ··· Lid supply mechanism 9 ··· Positioning mechanism 9A to 9D ··· Blocks of the positioning mechanism 9 10A, 10B ··· Temporary attachment Electrode for use 11: first seam joining mechanism 12: second seam joining mechanism 13: discharging device

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Makimeo Suzuki 1-18-1 Takada, Toshima-ku, Tokyo Origin Electric Co., Ltd.

Claims (7)

[Claims] 1. A seam joining apparatus for hermetically sealing an electronic component by seam joining a package containing an electronic component element and a lid, wherein a lid is placed on the package. A mechanism, an alignment mechanism for aligning the package and the lid, and a temporary attaching mechanism for temporarily attaching the aligned package and the lid,
A first seam joining any two opposing sides of the lid;
A seam joining mechanism, a second seam joining mechanism for seam joining the other two opposing sides of the lid, and a discharge mechanism for discharging the seam-joined package and the lid. A seam bonding apparatus comprising: a tapered surface that presses and aligns the lid and the edge of the package. 2. The positioning device according to claim 1, wherein the positioning mechanism includes a plurality of blocks each having a tapered surface.
A seam joining apparatus comprising a drive mechanism for moving these blocks up and down, and moving forward and backward, and wherein the tapered surface pushes the lid and the edge of the package to perform alignment as the blocks move forward. 3. The lid according to claim 1, wherein a minimum horizontal plane surrounded by the plurality of tapered surfaces of the positioning mechanism is smaller than an area of the lid, and a maximum horizontal plane surrounded by the plurality of tapered surfaces is the lid. A seam joining apparatus, wherein the area is larger than the area, and the alignment mechanism is lowered from above the lid, and the tapered surface presses the lid and the edge of the package to perform alignment. 4. The device according to claim 1, wherein the block advances in a first direction and advances in a second direction perpendicular to the first direction with a pair of first blocks capable of moving backward. A pair of second blocks that can be retracted, wherein the first block and the second block advance, and the tapered surfaces thereof push the lid and edges of the package to align the lid with the package. The first block holds its alignment state, the second block retreats, the tacking mechanism operates to bring the tacking electrode into contact with the lid and pressurize, Seam joining device characterized by flowing and temporarily attaching. 5. The block according to claim 1, wherein the block advances in a first direction and advances in a second direction perpendicular to the first direction with a pair of first blocks capable of moving backward. A pair of second blocks that can be retracted, wherein the first block and the second block advance, and the tapered surfaces thereof push the lid and edges of the package to align the lid with the package. And the tacking mechanism is operated in this state, the tacking electrode is brought into contact with the lid, pressurized, and a current is applied to temporarily bond the seam. 6. The block according to claim 1, wherein the block advances in a first direction and advances in a second direction perpendicular to the first direction with a pair of first blocks capable of moving backward. A pair of second blocks that can be retracted, wherein the first block and the second block advance, and the tapered surfaces thereof push the lid and edges of the package to align the lid with the package. And the first block holds its alignment state, and the second block moves once to bring its temporary electrode portion into contact with the lid, pressurize, and apply a current to temporarily attach. A seam joining apparatus. 7. The package according to claim 1, wherein the package is mounted on a turntable,
The seam joining apparatus, wherein the second seam joining mechanism is disposed at a position where the turntable is rotated by about 90 degrees from the first seam joining mechanism.