JPH10163369A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the moisture resistance reliability and prevent the package crack from being developed by sealing with an org. material the front surface of a package and IC chip with part of a support frame exposed and back side of a circuit board exposed; the frame fixing and supporting the board. SOLUTION: A BGA package has an IC chip, laminate circuit board 2 having leading electrodes 3 and metal bumps to be outer electrodes bonded to the electrodes 3 on a mounting surface and support frame for fixing it. The support frame has a board-fixing frame 7 having through-holes 8 at parts to be adhered to the circuit board 2 with adhesives 13. The top and side face of the board 2 mounting the IC chip is sealed with a resin 12 to protect, with leaving the tops of the through-holes 8 exposed on the board-fixing frame 7. Thus, the water content in the adhesives 13 is quickly removed through the through-holes 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor device such as a resin-encapsulated semiconductor package and a method of manufacturing the same.

[0002]

2. Description of the Related Art The structure of a semiconductor package has been reduced in size and thickness in order to achieve high-density mounting. Also, the amount of information processing per chip tends to increase,
The number of input / output pins per package tends to increase. However, since the size of the package cannot be made too large, the number of pins increases, and the lead pin interval tends to be very narrow. For this reason,
At present, advanced mounting technology is required for mounting on a circuit board. In order to facilitate this mounting, packages having an external connection structure such as PGA (pin grid array) or BGA (ball grid array), in which the external connection form of the package is different from the conventional structure, have recently been seen. Have been. A structure suitable for producing this BGA package is disclosed in
No. 73246.

[0003]

It has become apparent that it is necessary to further improve the moisture resistance reliability in order to increase the reliability of the previously proposed BGA package.

[0004] An object of the present invention is to solve the above problems.
It is an object of the present invention to provide a semiconductor device realizing a highly reliable BGA package structure and a method of manufacturing the same.

[0005]

In order to achieve the above-mentioned object, the present invention provides a circuit board having an IC chip mounted on a front surface side to be electrically connected and an electrode portion connected to the outside on a rear surface side. A semiconductor device having a support frame for fixing and supporting the circuit board on the front surface side, with a part of the support frame on the circuit board exposed, and a back surface side of the circuit board exposed. In this state, the front surface side including the IC chip is sealed with an organic material.
The present invention also provides a semiconductor device having a circuit board provided with an electrode portion mounted on the front surface side for electrical connection and provided on the back side with an electrode portion for connection to the outside. A support frame fixedly supported by an adhesive at each location, and a plurality of bonding locations on the support frame are exposed, and the surface side including the IC chip is covered with an organic material so as to cover the side surface of the circuit board. It is characterized by being sealed.

The present invention also provides a semiconductor device having a circuit board provided with an electrode portion for mounting and electrically connecting an IC chip on the front side and providing an electrode portion for connecting to the outside on the back side. A through-hole was provided in the frame portion of the substrate bonding portion, and the sealing resin immediately above was removed, and the surface including the IC chip was sealed with an organic material so as to cover the side surface of the circuit board. It is characterized by the following. The present invention also provides a semiconductor device having a circuit board having an IC chip mounted on the front side and electrically connected thereto, and an electrode portion connected to the outside on the back side, wherein the substrate is fixed to a support frame substrate. Each of the leads has an independent shape, the sealing resin immediately above is removed, and the surface including the IC chip is sealed with an organic material so as to cover the side surface of the circuit board. I do.

Further, the present invention provides the semiconductor device,
An organic material immediately above a portion where the circuit board and the support frame are fixed is not formed in a hole shape or a cutout shape so that a part of the support frame on the circuit board is exposed. Further, the present invention provides the semiconductor device,
A through hole is formed in a portion of the support frame to be fixed. According to the present invention, in the semiconductor device, the support frame is formed of a metal material. Further, the present invention provides a first step of fixing and supporting a circuit board at a plurality of positions on a support frame with an adhesive, and a second step of mounting an IC chip on the circuit board and electrically connecting the circuit board to obtain a semiconductor device. Process, the support frame is sandwiched between an upper mold and a lower mold that constitute a molding die, and the support frame is pressed with a projection that is formed into a shape in which a plurality of bonding points on the support frame are exposed, and a molding die is formed. And filling and sealing the surface side including the IC chip with an organic material so as to cover the side surface of the circuit board.

Further, in the third step of the method for manufacturing a semiconductor device, at least a surface of the protrusion which is in contact with the support frame is covered or mounted with a flexible plastic material.
As described above, with the above configuration, it is possible to improve the moisture resistance reliability of the BGA package and prevent the occurrence of package cracks. Further, with the above configuration, resin burrs on the substrate electrode surface side generated during resin molding can be prevented, so that production efficiency can be improved and stable production can be achieved.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to FIGS. A first embodiment of the semiconductor device according to the present invention will be described. FIG.
BG as a first embodiment of the semiconductor device according to the present invention
It is a perspective view showing the outline of A (Ball Grid Array: ball grid array) package structure. FIG. 2 shows FIG.
It is an expanded sectional view in the A section shown in FIG. The configuration of the BGA package includes a laminated circuit board 2 having an IC chip 1, an external conduction electrode 3 on a mounting surface, and a metal bump 4 joined to the external conduction electrode 3 and an external electrode. It is composed of a support frame 5. That is,
The support frame 5 includes an outer frame 15 (shown in FIG. 3), a board fixing frame suspension lead 6, and a board fixing frame 7. The board fixing frame 7 is provided with a through hole 8 at a portion where the board fixing frame 7 is bonded to the laminated circuit board 2 with the adhesive 13. Then, the laminated circuit board 2 is mounted on the board fixing frame 7 at this portion.
And an adhesive 13. The base material of the multilayer circuit board 2 may be any insulating material. The pad portion 9 of the IC chip 1 and the wiring pad portion 10 of the substrate 2
They are electrically connected by wire bonding using a gold wire 11 or the like. In the multilayer circuit board 2, wiring (not shown) for obtaining conduction with the electrode 3 on the rear surface is formed from the pad 10 on the front surface connected by wire bonding. It goes without saying that these electric wires are protected by an insulator (not shown). In the laminated circuit board 2, those which are electrically connected to the back surface are wired to the respective electrodes 3. In this state, the resin 12 is sealed from the surface of the substrate on which the IC chip 1 is mounted to the side surface of the substrate 2 with the portion of the through hole 8 on the substrate fixing frame 7 removed (exposed). To protect and complete the package shape. After resin sealing, metal bumps, such as solder balls, are bonded to the electrodes 3 to complete the electrical wiring and complete the product.

That is, the laminated circuit board 2 and the board fixing frame 7 are fixed by the adhesive 13 at the portion where the through hole 8 exists, and the hole shape 14 excluding the resin above this, that is, the bonding portion is exposed. In this state, the resin 12 is sealed. Thus, the exposed state of the adhesive portion is displayed on the support frame (substrate fixing frame 7) of the adhesive portion through the through hole 8.
In the case of having a shape, it is effective to form a shape having an area at least larger than the hole diameter. Thus, the moisture in the adhesive 13 at the bonding portion can be quickly removed through the through hole 8 on the frame 7 for fixing the substrate, and the effect of improving the moisture resistance reliability can be obtained.

FIGS. 3 to 5 show the outline of the manufacturing process and their schematic diagrams. In resin molding, multi-cavity molding is usually performed, and a manufacturing process in this case will be described below. FIGS. 3A and 3B schematically show the steps of assembling the IC chip 1, the substrate 2, and the support frame 5, which are the components, and FIGS. In other words, the support frame 5 is formed as a series so that a plurality of moldings can be performed, and has a structure as shown in FIG. In the multiple support frame 5, in step 41, the substrate 2 is fixed with an adhesive 13 or the like at the intersection between each substrate suspension lead 6 and each substrate fixing frame 7,
Next, the IC chip 1 is fixed at a predetermined position on the laminated circuit board 2 with an adhesive or the like. On the outer frame 15 of the multiple support frame 5, a guide hole 16 for automatically performing each manufacturing process is provided. Then, in step 42, I
The pad portion 9 on the C chip 1 and the pad portion 10 on the substrate 2 are wire-bonded with gold wires 11 or the like to
And the result is that in step 43 FIG.
The chip / substrate mounting multiple support frame 17 is completed as shown in FIG. Thus, the fact that the laminated circuit board 2 is bonded to the support frame 5 using the adhesive 13 means that
This is for easily carrying and moving between the steps.
Therefore, the bonding portion needs to have a bonding strength that does not cause dropping or separation from the support frame during transfer of each process. As this adhesive, for example, in the case of a thermosetting resin-based adhesive,
Epoxy-based adhesives, polyimide-based adhesives, silicone-based adhesives, phenol-based adhesives, and the like can be used. For thermoplastic resin-based adhesives, polysulfone-based adhesives, polyetherimide-based adhesives, and polyamide-based adhesives Agents and the like can be used. When these adhesives are used, it is necessary to bond at least two or more places in order to stably transfer between the steps. At this time, in order to obtain the adhesive strength, a certain amount of adhesive area is required, and the dimensions of the substrate fixing frame and the substrate fixing frame lead portion of the support frame are preferably about 0.1 to 0.5 mm in width. It is.

FIG. 4 schematically shows a step of resin molding, and (b) to (e) show schematic views thereof. Here, the case where transfer molding is performed using epoxy resin which is a thermosetting resin in step 44 will be described. The chip / substrate mounting multiple support frame 17 shown in FIG. 4B is set in a cavity 19 provided in a molding die 18 as shown in FIG. At this time, the molding die 18 is in a state of being heated to a temperature at which the epoxy resin is cured. Next, the molded resin tablet (not shown) is put into a pot portion (not shown) in a mold, and pressed by a plunger (not shown). The resin 12 pressed by the plunger is shown in FIG.
(D) As shown in (e), it is heated and melted, flows from the runner 20 in the mold to the gate 21, flows into the cavity 19 through the gate 21, and is cured by a curing reaction to form a molded product. . FIG. 4D shows the state inside the cavity 19.
This will be described with reference to an enlarged sectional view shown in FIG. That is,
The chip / substrate mounting multiple support frame 17 is sandwiched between the upper mold 22 and the lower mold 23 and is set in the cavity 19. At this time, the position of the chip / substrate mounting multiple support frame 17 is
A cavity 19 is formed by a positioning hole (not shown) provided on the support frame 5 and a positioning pin (not shown) in a mold.
Needless to say, positioning within the device. 15 is
4 shows an outer frame of the support frame 5. In this manner, the resin 12 is allowed to flow while being installed in the cavity 19, and
As shown in (e), resin sealing is completed by covering portions other than the substrate electrode portion side. FIG. 4E is an enlarged cross-sectional view of the cavity at a portion where the substrate fixing frame 7 and the substrate 2 are bonded. The substrate 2 is pressed against the lower die 23 via the substrate fixing frame 7 by the projection 24 provided to form a hole shape from the upper die 22. For this reason, it is possible to prevent the resin from entering the electrode 3 side of the substrate 2, and to obtain an effect of preventing the occurrence of resin burrs. Further, since the projections 24 are in contact with each other, it is possible to prevent the resin from entering the surface of the substrate fixing frame 7 at the same time, and to obtain an effect of preventing the occurrence of resin burrs. By interposing the flexible member 25 on the bottom surface (tip surface) of the protrusion 24, the effect of preventing resin burr can be further improved. As the flexible material, for example, a silicone resin or a polytetrafluoroethylene resin is preferable. Here, the hole shape is formed by the protrusion 24 in the mold. First, an obstacle (member) for forming the hole shape is set on the support frame.
Needless to say, the same effect can be obtained by removing the obstacle (member) after resin sealing and forming a hole shape.

FIG. 5 shows an outline of steps from a molded article to a finished article, and (b) to (e) show schematic views thereof. FIG. 5B shows the resin-sealed molded product 26 in step 45. In the resin-sealed molded product 26, the outer frame portion 15 of the support frame, the gate 21, and the runner 22 that are unnecessary after the resin molding are formed.
In step 46, as shown in FIG. As shown in FIG. 5D, the cut molded product 28 obtained in step 47 is supplied with, for example, ball-shaped solder 4 to an electrode portion (not shown) on the substrate mounting surface by heating and bonding in step 48. External electrode portions are formed, and a resin-sealed BGA package is completed as shown in FIG. As described above, by using the chip / substrate mounting multiple supporting frame 17, the resin sealing step can be performed by a general transfer molding method currently performed, so that the production cost can be reduced and the production efficiency can be improved.

Next, a second embodiment of the semiconductor device according to the present invention will be described. FIG. 6 is a perspective view schematically showing a BGA package structure as a second embodiment of the semiconductor device according to the present invention. FIG. 7 is an enlarged sectional view of a portion A shown in FIG. The configuration of the BGA package is similar to that of the first embodiment shown in FIG.
A laminated circuit board 2 provided with an external conduction electrode 3 on a mounting surface and a metal bump 4 bonded to the external conduction electrode 3 as an external electrode
And a support frame 5 for fixing them. That is, the support frame 5 includes the outer frame 15, the board fixing frame suspension leads 6, and the board fixing frame 7. The board fixing frame 7 is provided with a through hole 8 at a portion where the board fixing frame 7 is bonded to the laminated circuit board 2 with the adhesive 13. The laminated circuit board 2 is in a state of being bonded to the board fixing frame 7 with the adhesive 13 at this portion.
The base material of the multilayer circuit board 2 may be any insulating material.
Pad part 9 of IC chip 1 and wiring pad part 10 of substrate 2
Is electrically connected by wire bonding using a gold wire 11 or the like. In the multilayer circuit board 2, wiring (not shown) for obtaining conduction with the electrode 3 on the rear surface is formed from the pad 10 on the front surface connected by wire bonding. It goes without saying that these electric wires are protected by an insulator (not shown). In the laminated circuit board 2, those which are electrically connected to the back surface are wired to the respective electrodes 3. In the case of the second embodiment, the resin immediately above the substrate fixing frame hanging lead portion 6 is formed by cutting out the resin.
9 so as to be exposed. By thus widening the portion where the resin is eliminated by forming the cutout 29, an effect of easily removing the water in the adhesive 13 can be obtained. That is, the substrate 2 and the substrate fixing frame 7 are
Is fixed by an adhesive 13 at a certain point, and the resin thereon is formed into a cutout shape 29, that is, a package shape including the adhesive portion and sealing the outer shape of the package without the resin. .

FIG. 8 is an enlarged sectional view of a cavity of a molding die for molding the second embodiment.
The upper mold part 22 and the notch part forming projection part 30 were made into an integrated structure. As a result, the area for pressing the substrate 2 against the lower mold portion 23 increases, and the effect of preventing the occurrence of resin burrs on the substrate electrode side is improved. Needless to say, the same effect is improved even in the bonded portion on the substrate fixing frame. Further, by preventing the occurrence of resin burrs, there is also an effect that the molding stability is improved. Also,
Since the angle of the protrusion (the inclination angle of the package outer shape) can be reduced by integrating the upper die with the outer periphery of the package, even if the cavity thickness (resin sealing thickness) is increased, the effect of being able to cope with the increase is achieved. can get. As described above, in the first and second embodiments, the moisture in the adhesive 13 can be quickly removed through the through hole 8 on the substrate fixing frame 7, and the effect of improving the moisture resistance reliability can be obtained. can get. Further, by forcibly pressing the substrate 2 against the lower mold portion 23 during resin molding, an effect of preventing resin burrs generated on the substrate fixing frame surface and the substrate electrode portion side can be obtained.

FIGS. 9A and 9B show a pattern of one molded part in the support frame 5 used in the first and second embodiments, wherein FIG. 9A is a plan view thereof, and FIG. It is sectional drawing in the -A arrow direction. Outer frame 15 and board fixing frame 7
Are connected by a frame fixing lead 6 for fixing the substrate. FIG. 10 shows the support frame 5 shown in FIG.
FIGS. 3A and 3B show a package form in the first embodiment when resin sealing is performed by using FIGS. 3A and 3B, wherein FIG. 3A is a plan view thereof, and FIG. FIG. 10 (a)
As shown in (1), hole shapes 14 are formed at four places of the resin sealing portion. At the hole bottom surface, a part of the through hole 8 formed in the support frame 5, the substrate fixing frame hanging lead 6, and a part of the substrate fixing frame 7 are exposed. In this manner, the resin sealing is stopped in a state where the substrate 2 is pressed against the lower mold portion 23 via the substrate fixing frame 7 by the projections 24 provided for forming the hole shape 14. In addition, it is possible to eliminate the occurrence of resin burrs on the lead surface, and since the through holes 8 are exposed, moisture in the adhesive 13 can be promptly removed, and the moisture resistance reliability can be improved. It goes without saying that the outer frame 15 is cut and removed after molding.

FIG. 11 shows the support frame 5 shown in FIG.
7A and 7B show a package form in a second embodiment when resin sealing is performed by using FIG. 7A, wherein FIG. 9A is a plan view thereof, and FIG. 9B is a sectional view taken along line AA in FIG. FIG. 11 (a)
As shown in FIG.
9 is formed. At the bottom of the hole, a portion of the through hole 8 formed in the support frame 5, the suspension lead 6 for the frame for fixing the substrate, and a part of the frame 7 for fixing the substrate are exposed to the package outer shape. In the second embodiment, the substrate 2 is
Since the area for pressing against 3 increases, it is possible to improve the effect of preventing the occurrence of resin burrs on the substrate electrode side. Further, by preventing the occurrence of resin burrs, there is also an effect of improving molding stability. Therefore, resin sealing can be performed in a state where no resin burrs are generated on the lead surface, and since the through holes 8 are exposed, moisture in the adhesive 13 can be quickly removed, so that the moisture resistance is improved. Performance can be improved. It goes without saying that the outer frame 15 is cut and removed after molding.

FIGS. 12A and 12B show patterns of one molded product portion in the support frame 5 having a structure different from the structure of the support frame shown in FIG. 9, FIG. 12A is a plan view thereof, and FIG.
FIG. 2 is a sectional view taken along the line AA in FIG. The structure of the support frame is configured such that the number of substrate fixing frame suspension leads 6 is increased to 12 and the substrate 2 is supported by the adhesive 13 at these 12 positions. FIGS. 13A and 13B show a package form according to the third embodiment when resin sealing is performed using the support frame shown in FIG. 12, wherein FIG. 13A is a plan view thereof, and FIG. −
It is arrow A sectional drawing. As shown in FIG. 13A, a hole shape 14 is formed in the resin sealing portion in a shape corresponding to the twelve locations where the board fixing frame suspension leads 6 are provided. At the bottom of the hole, a part of the through hole 8 of the support frame, the suspending lead 6 for the board fixing frame, and a part of the board fixing frame 7 are exposed. Further, in the sealing resin, no resin burrs are generated on the lead surface. As a result, the number of protrusions 24 provided for forming the hole shape 14 increases, and the pressing of the substrate against the lower mold portion 23 is increased, so that the effect of preventing the occurrence of resin burrs on the substrate electrode side can be improved. Further, by increasing the number of frame suspension leads for fixing the substrate, there is an effect of preventing the occurrence of resin burrs even when the outer shape of the substrate 2 becomes large. In addition, since the through holes 8 are exposed, moisture in the adhesive 13 can be quickly removed. It can be removed, and the moisture resistance reliability can be improved. It goes without saying that the outer frame 15 is cut and removed after molding.

FIGS. 14A and 14B show a package form in the fourth embodiment when resin is sealed using the support frame shown in FIG. 12, wherein FIG. 14A is a plan view thereof, and FIG. 3) is a sectional view taken along the line AA in FIG. FIG. 13 (a)
As shown in (1), a cutout shape 29 is formed in the resin sealing portion in a shape corresponding to the twelve locations where the substrate fixing frame hanging leads 6 are provided. At the bottom of the hole, a portion of the through hole 8 formed in the support frame, the board fixing frame suspension lead 6, and a part of the substrate fixing frame 7 are exposed to the package outer shape. Furthermore, no resin burrs are generated on the lead surface of the sealing resin. Since the area for pressing the substrate 2 against the lower mold portion 23 increases, the effect of preventing the occurrence of resin burrs on the substrate electrode side is improved. And there is also an effect that the molding stability is improved. Further, even when the outer shape of the substrate becomes large, there is an effect of preventing the occurrence of resin burrs.
Is exposed, the moisture in the adhesive 13 can be quickly removed, and the moisture resistance reliability can be improved. It goes without saying that the outer frame 15 is cut and removed after molding.

In the third and fourth embodiments described above, the pressing of the substrate against the lower mold portion is increased, and the effect of preventing the occurrence of resin burrs on the substrate electrode side and the surface of the bonding portion of the substrate fixing frame is improved. By increasing the number of suspension leads for the frame for fixing the substrate, it is possible to obtain the effect of preventing the occurrence of resin burrs even when the outer shape of the substrate becomes large. In addition, since the through holes 8 are exposed, the moisture in the adhesive 13 is reduced. It can be removed promptly, and the moisture resistance reliability can be improved. FIG. 15 shows a pattern of one molded product part in the support frame 5 having a structure different from the structure of the support frame shown in FIGS. 9 and 12, (a) is a plan view thereof,
(B) is a sectional view taken along the line AA in (a). Regarding the structure of the support frame, the form of the substrate fixing frame 7 is formed in the form of a substrate fixing lead indicated by 31.
At two places, the substrate 2 is supported by the adhesive 13.

FIGS. 16A and 16B show a package form in the fifth embodiment when resin sealing is performed using the support frame shown in FIG. 15, wherein FIG. 16A is a plan view thereof, and FIG. 3) is a sectional view taken along the line AA in FIG. FIG. 16 (a)
As shown in (1), the corners of the substrate 2 are fixed with the adhesive 13 at four places where the substrate fixing leads 31 are provided, and cutout shapes 29 are formed in the resin sealing portion in a form corresponding to the corners. At the bottom of the hole, the substrate fixing lead 31 is exposed to the package outer shape. In the case where the through-hole 8 is not provided on the supporting frame of the bonding portion, the exposed state of the bonding portion is at least larger than the bonding area, and is larger than the width of the substrate fixing frame 7 or the substrate fixing frame lead 6. It is effective to make the shape. Thereby, the moisture in the adhesive 13 at the bonding portion can be quickly removed through the outside of the substrate fixing lead 31, and the effect of improving the humidity resistance reliability can be obtained. In this support frame shape, since the substrate fixing leads 31 are independent of each other, even if the bonding portion of the lead portion is separated, the separation does not proceed inside the package even if the bonding portion of the lead portion is separated. is there. In particular, since the bonding portions 13 are independent of each other, it goes without saying that the same effect is obtained regardless of the presence or absence of the through-hole provided in the surface of the lead 31. Further, since the shape of the support frame can be further simplified, there is an effect that the cost can be reduced. The sealing resin does not generate resin burrs on the lead surface. The outer frame 15
Needless to say, is cut and removed after molding.

FIG. 17 shows a pattern of one molded part in the support frame 5 having a structure different from the structure of the support frame shown in FIGS. 9, 12 and 15, and FIG.
Is a plan view thereof, and (b) is a sectional view taken along the line AA in (a). The structure of this support frame is described in FIG.
Are formed in a shape in which the number of substrate fixing leads 31 is increased, and the substrate 2 is supported by the adhesive 13 at these twelve locations. FIGS. 18A and 18B show a package form according to the sixth embodiment when resin sealing is performed using the support frame shown in FIGS. 17A and 17B, where FIG. 18A is a plan view and FIG. It is sectional drawing in the -A arrow direction. As shown in FIG.
A cutout shape 29 is formed in the resin sealing portion in a shape corresponding to 12 locations where 1 is located. At the bottom of the hole, the substrate fixing lead 31 is exposed to the package outer shape. In this supporting frame shape, the substrate fixing leads 31 are used.
Are independent of each other, even if the bonding portion of the lead portion is peeled off, the peeling does not proceed inside the package, so that there is an effect that the moisture resistance reliability can be improved. Also,
Since the shape of the support frame can be further simplified, the cost can be reduced. Further, since the bonding portions are independent from each other, it goes without saying that the same effect is obtained regardless of the presence or absence of the through-hole provided on the surface of the lead 31. Further, the sealing resin does not generate resin burrs on the lead surface.

FIGS. 9, 12, 15, and 17
For example, a metal material such as an Fe—Ni alloy or a Cu alloy may be used as the support frame shown in FIG. As described above, when the bonding portion is exposed on the supporting frame (substrate fixing frame 7) of the bonding portion, the through-hole 8 is formed in a shape having an area at least larger than the hole diameter. When the through hole 8 is not provided on the frame, it is effective to set the area to be at least larger than the bonding area and to be larger than the width of the substrate fixing frame 7 or the substrate fixing frame lead 6. Thereby, the moisture in the adhesive 13 at the bonding portion can be quickly removed through the through hole 8 on the substrate fixing frame 7 or the outside of the substrate fixing frame 7 or the substrate fixing frame lead 6, thereby improving the moisture resistance reliability. The effect that can be performed is obtained.

FIG. 19 shows an embodiment in which the occurrence of package cracks and the separation of the lead bonding interface are summarized as a defect occurrence ratio. This is a result when rapid heating by irradiation with an infrared lamp is performed after standing in the moisture. The experimental conditions were as follows: 85 ° C./95% RH in wet, 168 h + 3
After leaving at 0 ° C./85% RH for 168 hours, the maximum temperature was set to 240 ° C. using an infrared lamp and held for 10 seconds. As a result, assuming that each defect occurrence ratio of the conventional example is 100, the occurrence ratio of package cracks was reduced to 5 and 1/20 in the first to fourth embodiments. Also,
In the fifth and sixth embodiments, the incidence ratio was 0. This is an effect due to the fact that the substrate fixing leads are independent of each other and are exposed to the package surface, as described above. On the other hand, in the peeling of the lead bonding interface, the incidence ratio was 5 in all the examples, and was reduced to 1/20.
This is considered to be the effect of providing the through hole 8 provided in the lead portion and widening the exposed portion as a cutout shape.

[0025]

According to the present invention, by removing the resin at the bonding portion between the substrate and the support frame, the moisture resistance reliability is improved and the effect of preventing the occurrence of package cracks can be obtained. Further, according to the present invention, resin burrs on the substrate electrode surface side which occur during resin molding can be prevented, so that production efficiency can be improved and stable production can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a BGA package structure as a first embodiment of a semiconductor device according to the present invention.

FIG. 2 is an enlarged sectional view of a portion A shown in FIG.

FIG. 3 is a process chart until a chip / substrate mounting multiple frame is completed.

FIG. 4 is a process chart until resin molding.

FIG. 5 is a process chart from a molded article to completion.

FIG. 6 is a perspective view showing a BGA package structure as a second embodiment of the semiconductor device according to the present invention.

FIG. 7 is an enlarged sectional view of a portion A shown in FIG. 6;

FIG. 8 is a cross-sectional view of a mold cavity portion for molding the second embodiment.

FIG. 9 is a plan view showing a shape of a support frame used in the first and second embodiments and a cross-sectional view taken along the line AA.

FIGS. 10A and 10B are a plan view and a cross-sectional view taken along the line AA, respectively, showing a package structure when resin sealing is performed in the first embodiment.

11A and 11B are a plan view and a cross-sectional view taken along line AA, respectively, showing a package structure when resin sealing is performed in the first embodiment.

FIG. 12 is a plan view showing a shape of a support frame used in the third and fourth embodiments of the semiconductor device according to the present invention, and a cross-sectional view taken along the line AA.

FIG. 13 is a plan view and a cross-sectional view taken along the line AA of the semiconductor device according to the third embodiment of the present invention, showing a package structure when resin sealing is performed.

FIGS. 14A and 14B are a plan view and a cross-sectional view taken along the line AA of a semiconductor device according to a fourth embodiment of the present invention, showing a package structure when resin sealing is performed.

FIG. 15 is a plan view showing the shape of a support frame used in a fifth embodiment of the semiconductor device according to the present invention, and FIG.
It is arrow sectional drawing.

FIGS. 16A and 16B are a plan view and a cross-sectional view taken along the line AA of the semiconductor device according to the fifth embodiment of the present invention, showing a package structure when resin sealing is performed.

FIG. 17 is a plan view showing the shape of a support frame used in a sixth embodiment of the semiconductor device according to the present invention, and FIG.
It is arrow sectional drawing.

FIGS. 18A and 18B are a plan view and a cross-sectional view taken along the line AA of a semiconductor device according to a sixth embodiment of the present invention, showing a package structure when resin sealing is performed.

FIG. 19 is a comparison diagram showing a defect rate ratio in the semiconductor device according to the present invention.

[Explanation of symbols]

1: IC chip, 2: laminated circuit board, 3: electrode,
4: Metal bumps, 5: Support frame, 6: Suspension lead for fixing frame for board, 7: Frame for fixing board, 8: Through hole,
9: pad part, 10: wiring pad part, 11: gold wire,
12: resin (organic), 13: adhesive, 14: hole shape, 17: multiple support frame for chip / substrate mounting,
24: Projection, 25: Flexible object, 29: Notch shape, 30: Notch-forming projection, 31: Board fixing lead

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 23/31 (72) Inventor Ryo Haruta 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo In the semiconductor division of Hitachi, Ltd. 72) Inventor Masahiro Ichitani 5-2-1, Josuihoncho, Kodaira-shi, Tokyo Inside the Semiconductor Division, Hitachi, Ltd. (72) Inventor Toshihiro Yamaguchi 5-2-1, Josuihoncho, Kodaira-shi, Tokyo Hitachi, Ltd. Manufacturing Division

Claims (6)

[Claims] 1. A semiconductor device comprising a circuit board having an IC chip mounted on a front surface side and electrically connected thereto and an electrode portion connected to the outside on a back side, wherein the circuit board is fixed on the front side. It has a supporting frame for supporting, and in a state where a part of the supporting frame on the circuit board is exposed, and a front surface side including the IC chip is sealed with an organic material in a state where the back surface side of the circuit board is exposed. A semiconductor device characterized by the following. 2. A semiconductor device comprising a circuit board having an IC chip mounted on the front side and electrically connected thereto, and an electrode portion provided on the back side for connection to the outside, wherein a plurality of the circuit boards are provided on the front side. A support frame fixedly supported by an adhesive at each location, and a plurality of bonding locations on the support frame are exposed, and the surface side including the IC chip is covered with an organic material so as to cover the side surface of the circuit board. A semiconductor device characterized by being sealed. 3. The method according to claim 1, wherein a portion of the support frame on the circuit board is exposed so that an organic material immediately above a portion where the circuit board and the support frame are fixed is not formed in a hole shape or a cutout shape. Item 3. The semiconductor device according to item 1 or 2. 4. The semiconductor device according to claim 1, wherein said support frame is made of a metal material. 5. A first step in which a circuit board is fixedly supported at a plurality of locations on a support frame by an adhesive, and a second step in which an IC chip is mounted on the circuit board and electrically connected to obtain a semiconductor device. Process, the support frame is sandwiched between an upper mold and a lower mold that constitute a molding die, and the support frame is pressed with a projection that is formed into a shape in which a plurality of bonding points on the support frame are exposed, and a molding die is formed. A step of filling and sealing the surface including the IC chip with an organic material so as to cover the side surface of the circuit board. 6. The method of manufacturing a semiconductor device according to claim 5, wherein, in the third step, at least a surface of the protrusion which is in contact with the support frame is covered or mounted with a flexible plastic material.