JPH10154820A - Manufacture of vibrating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a vibrating element through simple steps with an improved yield. SOLUTION: A movable part 4 is formed on a sacrificial layer 10 on a substrate 1, parts of the sacrificial layer 10 located underside the movable part 4 are removed using an etching solution. And the substrate is washed to remove the etching solution and then dried to remove the washing solution. After the drying step, an electrode member 14 is disposed above the movable part 4. The electrode member 14 has an electrode face 14a opposed to the movable part 4 through a gap. A voltage is applied between the movable part 4 and the electrode face 14a to provide such an electrostatic force as to pull up the movable part 4 toward the electrode face. As a result, the movable part 4 adhered to the substrate 1 in the drying step is peeled off from the substrate 1 and a gap 5 is formed between the substrate 1 and movable part 4, thus completing a vibrating element. By using the above electrostatic force, the gap 5 between the substrate 1 and the movable part 4 can be reliably and simply formed, damage of the movable part 4 can be prevented, and the yield of the vibrating element can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a vibration element such as an acceleration sensor and a micro gyro.

[0002]

2. Description of the Related Art FIG. 3A shows an example of a vibrating element manufactured by a semiconductor micromachining technique or the like.
FIG. 3B is a cross-sectional view taken along the line AA shown in FIG. This vibration element includes a substrate 1, anchors 2 (2a, 2b, 2c, 2d) as fixed portions,
As shown in FIGS. 3A and 3B, an anchor 2 (2a, 2a) is provided on the substrate 1.
b, 2c, 2d) are fixedly formed. One end of a beam 3 is connected to each anchor 2 and a common movable part 4 is connected to the other end of each beam 3.

The beam portion 3 and the movable portion 4 are formed between the substrate 1 and the gap 5.
, And can be displaced in the height direction shown in FIG. 3 (b). Further, since the beam portion 3 shown in FIG. 3A is bent in a U-shape, the movable portion 4 is configured to be displaceable in the horizontal and vertical directions shown in FIG. ing.

The movable portion 4 is provided with a comb-shaped movable electrode 6 projecting therefrom. A comb-shaped fixed electrode 7 is extended from a support portion 8 fixed to the substrate 1 so as to mesh with the movable electrode 6. The electrode surfaces of the movable electrode 6 and the fixed electrode 7 face each other.

In the vibrating element having the above structure, for example, when the movable part 4 is displaced in the vertical direction shown in FIG. 3A, the distance between the movable electrode 6 and the fixed electrode 7 is changed, and The capacitance between the electrodes 7 varies. Therefore, the variable amount of the capacitance between the movable electrode 6 and the fixed electrode 7 is
Can be detected as the amount of displacement in the vertical direction.

For example, when the vibration element is used as an acceleration sensor, the displacement of the movable part 4 corresponds to the magnitude of the acceleration, and the magnitude of the acceleration is detected based on the displacement of the movable part 4. can do. Further, the vibrating element further includes vibration generating means for vibrating the movable section 4, and when used as a microgyro, the displacement of the movable section 4 corresponds to the magnitude of the angular velocity. The magnitude of the angular velocity can be obtained based on the amount of displacement of.

[0007]

By the way, the movable part 4 of the vibrating element having the above structure is manufactured as follows. First, as shown in FIG. 4A, the movable portion 4 connected to the anchor 2 via the beam portion 3 is formed on the sacrificial layer 10 formed in the formation region of the movable portion 4 on the substrate 1. I do. afterwards,
The sacrificial layer 10 below the movable part 4 is removed using an etchant (etchant).

Then, a cleaning step of cleaning the etching liquid and a drying step of drying the cleaning liquid are sequentially performed.
As shown in FIG. 4 (b), the movable part 4 disposed opposite to the substrate 1 via the gap 5 is completed.

However, in the etching liquid cleaning step, the movable part 4 adheres to the surface of the cleaning liquid due to the surface tension of the cleaning liquid that has entered a narrow gap of several μm between the substrate 1 and the movable part 4. Since the cleaning liquid is evaporated and dried in the next drying step, the movable section 4 is displaced toward the substrate 1 with the evaporation of the cleaning liquid, and when the cleaning liquid is completely dried, as shown in FIG. Is adhered and fixed to the substrate 1.

As described above, when the movable section 4 is fixed to the substrate 1, the movable section 4 cannot be displaced, so that there is a problem that the movable section 4 cannot function as a vibration element.

In order to solve the above problem, for example, a freeze-drying method has been proposed. The freeze-drying technique is that, after washing the etching solution, the washing solution is replaced with a dedicated solution for freezing such as 2-methyl-2-propanol, the dedicated solution for freezing is frozen, and the frozen solution is vacuumed. It is to sublimate.

However, the above-mentioned freeze-drying method requires a special liquid dedicated to freezing, and furthermore, after cleaning the etching liquid, the cleaning liquid is replaced with the special liquid, and the liquid dedicated to freezing is frozen to sublime. In such a case, the process becomes complicated.

If the amount of freezing liquid between the substrate 1 and the movable part 4 is too large, there is a problem that when the liquid is frozen, the movable part 4 is damaged due to the freezing action of the liquid. Contrary to the above, when the amount of the liquid dedicated to freezing between the substrate 1 and the movable part 4 is too small, the movable part 4 is not moved due to the surface tension of the liquid dedicated to freezing.
The freezing liquid is frozen and sublimated while the liquid adheres to the substrate 1, and the movable part 4 is adhered and fixed to the substrate 1.

In order to solve the problem of breakage of the movable part 4 and the problem of the movable part 4 adhering to the substrate 1, it is necessary to control the amount of the freezing liquid to be introduced between the substrate 1 and the movable part 4. Although it is necessary, it is very difficult to control the liquid amount, and as described above, the movable part 4 may be destroyed,
Is frequently adhered and fixed to the substrate 1, which lowers the yield of the vibrating element and increases the cost of the vibrating element.

A method for drying a cleaning liquid utilizing the supercritical state of carbon dioxide is also known. However, this drying method complicates the working process and is a dedicated apparatus for creating a supercritical state of carbon dioxide. Must be introduced, and the device is expensive, so that there is a problem that the price of the vibrating element becomes expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an inexpensive vibrating element which can be manufactured by a simple process and which can improve the manufacturing yield of the vibrating element. An object of the present invention is to provide a method of manufacturing a vibration element that can be provided.

[0017]

Means for Solving the Problems To achieve the above object, the present invention has the following structure to solve the above problems. That is, a first aspect of the present invention relates to a method of manufacturing a vibrating element having a fixed portion fixedly formed on a substrate and a movable portion supported by the fixed portion and disposed to face the substrate surface via a gap. Forming a movable portion connected to the fixed portion above the sacrificial layer formed in the movable portion forming region on the substrate surface, and then removing the lower sacrificial layer using an etchant, Thereafter, the etching solution is washed, and the washing solution is dried and removed in a subsequent drying step. Next, a counter electrode facing the movable portion is provided above the movable portion with a gap therebetween. To apply a voltage to the movable portion to apply an electrostatic force to pull up the movable portion to the counter electrode side, to peel off the movable portion attached to the substrate from the substrate due to the surface tension of the cleaning liquid during the drying step, to form a gap between the substrate and the movable portion. Means for solving the above-mentioned problems with a configuration To have.

According to a second aspect of the present invention, there is provided a method of manufacturing a vibrating element having a fixed portion fixedly formed on a semiconductor substrate and a movable portion supported by the fixed portion and disposed opposite to the substrate surface via a gap. First, a movable portion connected to the fixed portion is formed above a sacrificial layer formed in a movable portion formation region on a substrate surface,
Thereafter, the sacrificial layer below the movable portion is removed using an etchant, and thereafter, the etchant is washed, and the washing solution is dried and removed in a subsequent drying step. A lid made of a glass material is arranged, and the upper side of the movable part is covered with the lid via a gap, a voltage is applied to the semiconductor substrate and the lid, and the semiconductor substrate and the lid are joined by an anodic bonding method. At the same time, by applying a voltage to the lid, the lid of the glass material functions as an electrode, a voltage is applied between the movable part and the lid, and an electrostatic force is applied to pull up the movable part to the lid. A movable part attached to the semiconductor substrate is peeled off from the semiconductor substrate due to the surface tension of the cleaning liquid at the time of the process, and a gap is formed between the semiconductor substrate and the movable part.

According to a third aspect of the present invention, there is provided an adhesion preventing device for preventing the movable portion from being attached to a surface of an electrode disposed above the movable portion constituting the first or second invention via a gap. Means for solving the above-mentioned problem is provided by a structure in which a film is formed.

In the invention having the above structure, the movable portion adhered to the substrate by the surface tension of the cleaning liquid in the drying step is peeled off from the substrate by electrostatic force to form a gap between the substrate and the movable portion. It is not necessary to use, for example, a freeze-drying method so that the portion does not adhere to the substrate, and the drying step is not complicated.

Further, the control of the electrostatic force for lifting the movable portion is controlled by the magnitude of the voltage applied between the movable portion and the counter electrode provided opposite to the movable portion, and the voltage control is easy. The control of the electrostatic force can be easily performed, and the movable portion can be reliably peeled off from the substrate.
In addition, the movable part can be prevented from being damaged. Thus, the yield of the vibrating element can be improved, and the price of the vibrating element can be reduced.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a method of manufacturing the vibration element according to the first embodiment. The vibrating element shown in this embodiment is the vibrating element shown in FIG. 3, and the configuration of the vibrating element shown in FIG. FIG. 1 schematically shows a cross section taken along line AA of FIG.

The features of this embodiment are as follows.
The movable portion 4 adhered to the substrate 1 due to the surface tension of the cleaning liquid during the drying step is peeled off from the substrate 1 using an electrostatic force after the drying step to form a gap 5 between the substrate 1 and the movable portion 4. Hereinafter, a detailed description of the method for manufacturing the vibration element of this embodiment will be described.

In this embodiment, an SOI (Silicon on insulator) substrate shown in FIG. 1A is used. This S
The OI substrate is a substrate in which a sacrificial layer 10 formed of an oxide and a silicon layer 11 are sequentially stacked in advance on a substrate 1 formed of silicon.

First, the portion of the silicon layer 11 other than the region where the anchor 2, the beam 3, the movable portion 4, the movable electrode 6, the fixed electrode 7, and the support portion 8 shown in FIG. (B), dry etching is performed by RIE (reactive ion etching) or the like. And
As shown in FIG. 1C, the sacrificial layer 10 below the beam 3, the movable part 4, the movable electrode 6, and the fixed electrode 7 is removed by wet etching using an etchant such as an HF solution. In this etching removal step, the beam portion 3, the movable portion 4, and the movable electrode 6
And the fixed electrode 7 are separated from the substrate 1.

Next, the etchant is washed with pure water, and thereafter, the etchant is completely removed by switching to a highly volatile solution such as methanol or acetone, and subsequently performing washing. Then, after the above-mentioned cleaning step, the substrate 1 is placed in the air to dry the cleaning liquid. At this time, since the cleaning liquid attached to the substrate is a highly volatile solution as described above, the cleaning liquid evaporates faster from the substrate,
The time for drying the substrate can be reduced. During the drying step, the movable portion 4 adheres to the substrate 1 due to the surface tension of the cleaning liquid, as shown in FIG.

Next, as shown in FIG. 1D, the substrate 1 is placed on a predetermined work table 13 and
Electrode body 14 made of single crystal silicon on the upper side
Is arranged. A concave portion is formed in the electrode body 14 in a region facing the movable section 4, and the upper side of the movable section 4 can be covered by the electrode body 14 via a gap. The electrode body 1
The bottom surface 14a of the concave portion 4 is opposed to the movable portion 4 via a gap, and the bottom surface 14a of the concave portion of the electrode body 14 serves as a counter electrode. The work table 13 is formed of a highly conductive material.
5 is connected.

The electrode assembly 14 and the work table 13
A voltage is applied to the substrate 1 by the voltage applying means 15 through the movable portion 4 and the concave bottom surface 1 of the electrode body 14.
A voltage corresponding to the applied voltage is also applied between 4a, and an electrostatic force is applied to pull up the movable portion 4 to the electrode body 14 side.

The movable part 4 is pulled up to the electrode body 14 side by the electrostatic force and peeled off from the substrate 1, and as shown in FIG. 1E, a gap 5 is formed between the substrate 1 and the movable part 4 to vibrate. The device is completed.

The magnitude of the electrostatic force is set to an appropriate value that allows the movable part 4 to be peeled off from the substrate 1.
The magnitude of the electrostatic force is controlled by the voltage applying means 15 to the movable part 4.
And the voltage applied between the bottom surface 14a and the recess 14a. The depth of the concave portion of the electrode body 14 is set so that the movable portion 4 does not contact the concave bottom surface 14a of the electrode body 14 when the movable portion 4 is pulled up to the electrode body 14 side by the electrostatic force. .

According to this embodiment, after the drying step, the movable section 4 is peeled off from the substrate 1 by using electrostatic force to form a gap 5 between the substrate 1 and the movable section 4. Therefore, it is not necessary to use a special drying method such as the freeze drying method so that the movable portion 4 does not adhere to the substrate 1. As described above, the drying method such as the freeze-drying method has a problem that the process is complicated and troublesome. However, in this embodiment, as described above, without using a special drying method, Since the cleaning liquid is simply evaporated and dried by disposing 1 in the atmosphere, the drying step can be simplified.

Further, unlike the freeze-drying method, the liquid between the substrate 1 and the movable part 4 is not frozen, so that the problem that the movable part 4 is damaged by the freezing action of the liquid can be prevented. Further, the magnitude of the electrostatic force applied between the substrate 1 and the movable part 4 can be controlled by controlling the applied voltage between the substrate 1 and the movable part 4, and the control of the applied voltage is simple. The movable part 4 is simplified by controlling the electrostatic force,
And it can peel off from the board | substrate 1 reliably. As described above, the problem that the movable portion 4 is damaged and the problem that the movable portion 4 is adhered and fixed to the substrate 1 are both avoided, so that the yield of the vibrating element can be significantly improved.

Further, since the working equipment for applying a voltage between the substrate 1 and the movable part 4 is inexpensive, the cost for introducing the equipment is reduced, and this is combined with the effect of improving the yield of the vibrating element. In addition, the cost of the vibrating element can be significantly reduced.

Hereinafter, a second embodiment will be described. In this embodiment, as shown in FIG.
Are applied to the vibrating element packaged by the lid portion 16. In the description of this embodiment, the same reference numerals are given to the same components as those in the first embodiment, and the duplicate description will be omitted.

First, in the same manner as in the first embodiment, an SOI substrate as shown in FIG. 2A is prepared, and as shown in FIG. Are formed by a technique such as RIE. Thereafter, as shown in FIG. 2C, the lower sacrificial layer 10 such as the movable portion 4 is removed by etching, and the etchant is washed and dried.

After that, as shown in FIG. 2D, the substrate 1 is placed on the work table 13 and the lid 16 prepared in advance is placed on the substrate 1. The lid 16 is made of a glass material containing positive ions such as sodium positive ions, and a concave portion is formed in the lid 16 in a region opposed to the movable portion 4. Cover 16. The bottom surface of the concave portion formed in the lid portion 16 faces the movable portion 4, and an anti-adhesion film 17 is formed on the bottom surface of the concave portion. The anti-adhesion film 17 is made of a metal such as Au, Cr, aluminum, or Pt,
It is formed of a material having a small adhesion energy such as a nitride such as SiN.

By applying a voltage to the substrate 1 from the voltage applying means 15 via the lid 16 and the work table 13 while heating them to a bonding temperature (300 ° C. or higher) under a reduced pressure atmosphere, The contact surface between the silicon layer 11 and the silicon layer 11 (support portion 8) is anodically bonded, and the movable portion 4 is packaged.

At the same time, the positive ions contained in the cover 16 move inside the cover 16, and the cover 16 is polarized to form an electrode, and a voltage is applied between the bottom surface of the concave portion of the cover 16 and the movable part 4. Is applied, an electrostatic force acts to pull up the movable part 4 to the lid part 16 side, and the movable part 4 adhered to the substrate 1 by the surface tension of the cleaning liquid in the drying step is peeled off from the substrate 1, and FIG. As shown in ()), a gap 5 is formed between the substrate 1 and the movable part 4, and a vibration element in which the movable part 4 is packaged is completed.

As described above, since the adhesion preventing film 17 is formed of a material having a low adhesion energy, as described above, when the movable portion 4 is pulled up to the lid portion 16 by electrostatic force, the movable portion 4 Does not cause a bonding reaction on the contact surface between the movable part 4 and the anti-adhesion film 17,
After the stop of the electrostatic force, the movable portion 4 separates from the anti-adhesion film 17 and a gap can be formed between the movable portion 4 and the anti-adhesion film 17.

By setting the depth of the concave portion of the lid portion 16 so that the movable portion 4 does not contact the bottom surface of the concave portion of the lid portion 16 in the voltage application step, the movable portion 4 Since the contact with the bottom surface of the concave portion can be prevented, in such a case, the adhesion preventing film 17 need not be provided.

According to this embodiment, when the movable section 4 is packaged with the lid section 16, the lid section 16 functions as an electrode facing the movable section 4, and a voltage is applied between the movable section 4 and the lid section 16. Is applied, and the movable portion 4 attached to the substrate 1 is peeled off from the substrate 1 in the drying step by using the electrostatic force generated by the application of the voltage. Therefore, the same effect as in the first embodiment can be obtained. In addition, the package of the movable part 4 by the lid 16 and the work of peeling off the movable part 4 can be performed at the same time. There is no need to separately provide a step for peeling off, and the step can be simplified.

Further, the anti-adhesion film 1 is formed on the bottom surface of the concave portion of the lid portion 16.
7 is provided, the movable part 4 is moved by electrostatic force to prevent the adhesion preventing film 1
7, since the adhesion preventing film 17 is formed with a small amount of adhesion energy, the contact surface between the movable portion 4 and the adhesion preventing film 17 does not join, and the movable portion 4 is movable after stopping the electrostatic force. The part 4 is separated from the adhesion preventing film 17, which can reliably avoid the problem that the movable part 4 is adhered and fixed to the lid 16.

It should be noted that the present invention is not limited to the above embodiments, and various embodiments can be adopted. For example, in each of the above embodiments, the SOI substrate is used. However, the process of laminating the sacrifice layer 10 on the substrate 1 and forming the silicon layer 11 on the sacrifice layer 10 without using the SOI substrate is performed. After this, the same steps as in the above embodiments may be performed to manufacture the vibration element.

Although the electrode body 14 shown in the first embodiment is made of silicon, it may be made of a semiconductor other than silicon, may be made of metal, or may be made of sodium plus. It may be formed of a glass material containing positive ions such as ions. As described above, the electrode body 14 may be made of a material other than silicon as long as it can function as an electrode by applying a voltage.

Further, an anti-adhesion film similar to the anti-adhesion film 17 shown in the second embodiment may be provided on the bottom surface 14a of the concave portion of the electrode body 14 shown in the first embodiment. Furthermore, the anti-adhesion film 17 may be formed by a laminated film in which a plurality of layers of different materials are laminated.

Further, in each of the above embodiments, the substrate 1 is formed of silicon, but the substrate 1 may be formed of a semiconductor other than silicon.

Further, in each of the above embodiments, the components of the vibrating element such as the movable portion 4 are formed by the RIE method. However, a pattern for defining the formation region of the movable portion 4 and the like is formed on the silicon layer 11. Then, the area of the silicon layer 11 other than the pattern is removed by etching using an etching solution,
Thereafter, the pattern may be removed to form the movable portion 4 and the like.

Further, in each of the above embodiments, the movable section 4
Is made of silicon, but may be made of a material other than silicon, such as a semiconductor other than silicon or a metal such as aluminum, Ni, or Pt. Further, the movable portion 4 may be formed of a stacked body in which a plurality of semiconductors, metals such as aluminum, Ni, Pt, and the like, and insulators are stacked.

Further, in each of the above embodiments, the vibration element shown in FIG. 3 has been described as an example. However, the present invention is not limited to the vibration element shown in FIG. 3, and is opposed to the substrate surface via a gap. It is possible to apply to a vibration element having a movable part to be disposed, by forming a gap between the substrate surface and the movable part in the same manner as in each of the above embodiments to manufacture the vibration element,
It is possible to obtain the same excellent effects as in the above embodiments.

[0051]

According to the present invention, after the drying step, the electrodes are arranged opposite to each other on the movable part via a gap, and a voltage is applied between the movable part and the counter electrode. Is disposed, the upper side of the movable part is covered by a lid through a gap, the lid functions as an electrode, a voltage is applied between the lid and the movable part, and an electrostatic force is applied to pull the movable part upward. In the drying step, the movable part adhered to the substrate due to the surface tension of the cleaning liquid was peeled off from the substrate to form a gap between the movable part and the substrate. It is not necessary to use a complicated drying method, the cleaning liquid can be easily dried, and the drying process can be simplified.

Further, as described above, since it is not necessary to use the freeze-drying method, it is possible to avoid the problem that the movable portion is damaged in the drying step due to the freezing of the solution between the substrate and the movable portion. Further, the control of the electrostatic force for lifting the movable portion can be performed by controlling the applied voltage between the movable portion and the electrode, and the control of the applied voltage can be easily performed. The moving parts are simple and
It can be reliably peeled off from the substrate. In this way, the problem of breakage of the movable part and the problem of adhesion and fixation of the movable part to the substrate can both be avoided, so that the yield of the vibrating element can be remarkably improved. The price can be reduced.

Further, since the equipment for applying the electrostatic force to the movable part is inexpensive, the cost for introducing the equipment can be reduced, and the cost of the vibration element can be reduced in combination with the effect of improving the yield of the vibration element. Can be made cheaper.

A lid is disposed on the substrate, the upper side of the movable part is covered by a lid via a gap, a voltage is applied between the lid and the movable part with the lid functioning as an electrode, and the movable part is placed on the upper side. In the invention in which the electrostatic force to pull up is applied, the movable portion adhered to the substrate is peeled off from the substrate by the surface tension of the cleaning liquid in the drying step, and a gap is formed between the movable portion and the substrate. When the substrate and the lid are energized, the contact surface between the substrate and the lid is anodically bonded, and the movable part can be packaged by the lid. As described above, the operation of the package of the movable part and the operation of peeling the movable part can be performed at the same time, so that an increase in the number of manufacturing steps can be prevented.

In the invention in which the anti-adhesion film is provided on the electrode surface, the anti-adhesion film is formed of a material having a small adhesion energy so that the movable portion can contact the anti-adhesion film on the electrode surface by electrostatic force. In addition, it is possible to prevent a coupling reaction between the movable portion and the contact surface of the anti-adhesion film, and it is possible to reliably avoid the problem that the movable portion adheres to the electrode surface.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a first embodiment example.

FIG. 2 is an explanatory diagram showing a second embodiment.

FIG. 3 is an explanatory diagram illustrating an example of a vibration element.

FIG. 4 is an explanatory view showing a conventional method for manufacturing a vibration element.

FIG. 5 is a model diagram showing a conventional problem.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Anchor 4 Movable part 5 Air gap 10 Sacrificial layer 14 Electrode body 16 Lid 17 Adhesion prevention film

Claims (3)

[Claims] In a method of manufacturing a vibrating element having a fixed portion fixed to a substrate and a movable portion supported by the fixed portion and opposed to the substrate surface via a gap, first, a substrate surface is provided. Forming a movable portion connected to the fixed portion above the sacrificial layer formed in the movable portion forming region, and then removing the sacrificial layer below the movable portion using an etchant; Then, the etching liquid is washed, and the cleaning liquid is dried and removed in a subsequent drying step. Then, a counter electrode facing the movable section with a gap therebetween is provided, and a voltage is applied between the movable section and the counter electrode. A vibrating element that applies an electrostatic force to raise the movable portion to the counter electrode side, peels off the movable portion attached to the substrate by the surface tension of the cleaning liquid during the drying step, and forms a gap between the substrate and the movable portion. Manufacturing method. 2. A fixing part fixedly formed on a semiconductor substrate,
In the method of manufacturing a vibration element having a movable portion supported by the fixed portion and disposed opposite to the substrate surface via a gap, first, the above-mentioned sacrificial layer formed on the movable portion forming region of the substrate surface is provided above the sacrificial layer. A movable portion connected to the fixed portion is formed, and thereafter, the sacrificial layer below the movable portion is removed using an etchant. Thereafter, the etchant is washed, and the cleaning solution is removed in a subsequent drying step. Drying and removing, and then placing a lid made of a glass material on the upper side of the semiconductor substrate, covering the upper side of the movable part with the lid via a gap, and applying a voltage to the semiconductor substrate and the lid. The semiconductor substrate and the lid are joined by an anodic bonding technique, and a voltage is applied to the lid to make the lid of the glass material function as an electrode, and a voltage is applied between the movable part and the lid to cover the movable part. Apply the electrostatic force to the part Peel off the movable portion attached to the semiconductor substrate by the surface tension of the cleaning liquid when the semiconductor substrate, the manufacturing method of the transducer elements forming a space between the semiconductor substrate and the movable portion. 3. An anti-adhesion film for preventing the movable portion from adhering to the surface of the electrode disposed above the movable portion via a gap. A method for manufacturing the vibration element according to claim 2.