JPH1015196A - Sealed electronic part on circuit board for game machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure a difficulty in breaking and forging a sealing means at the time of the separation thereof by keeping a higher level of difficulty for replacing electronic parts and eliminating the separation trace of the sealing means. SOLUTION: This electronic part is made of a circuit board 6 and an integrated circuit part 191. Also, the first marking of identification information is engraved on the integrated circuit part 191. Furthermore, the second marking is engraved between a sealing member for sealing the integrated circuit part 191, and the integrated circuit part 191, and the third marking is also engraved between the circuit board 6 and the sealing member. In addition, a hologram is formed on the sealing member, and the second or the third marking is formed as a cut line. In this case, a laser beam is used to form the marking and reproducibility is made difficult in a multiple way.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the sealing of a sealed electronic circuit component having a sealing structure of a gaming machine, that is, a method or structure thereof. More specifically, the present invention relates to a method of sealing a sealed electronic circuit component having a sealing structure of a gaming machine capable of determining whether or not an important electronic component such as a CPU has been replaced.

[0002]

2. Description of the Related Art The replacement of important electronic components, which are the heart of a high-tech gaming machine, must be performed under strict control. In order to reduce the mass production by changing and assembling and assembling such electronic device parts without changing other mechanical systems in response to a program change or the like, they are assembled into the main body of the gaming machine in a plug-in manner. Generally, such electronic components are plug-in so that they can be originally mounted on a mechanical device and assembled. A control device box incorporating such components is also designed to be plugged into the gaming machine body.

[0003] In order to prevent such an unauthorized replacement of electronic device parts in the control box, not only disassembly of the control box but also replacement of electronic parts is prevented (reference). Literature: Jitsuho 5-4382
0).

[0004] However, it is also known that such a replacement prevention method can easily perform peeling without leaving a trace using a chemical such as oil and a cutter. There is a demand for a sealing process in which it is difficult to leave traces of peeling.

[0005]

SUMMARY OF THE INVENTION The present invention has been made based on such a technical background, and achieves the following objects.

It is an object of the present invention to provide a sealed electronic component on a circuit board of a gaming machine having a sealing structure for a gaming machine, which makes replacement of electronic components more difficult.

Another object of the present invention is to provide a sealed electronic component on a circuit board of a game machine, which makes it more difficult to erase traces of peeling of the sealing means.

It is still another object of the present invention to provide a sealed electronic component on a circuit board of a gaming machine which performs a stamping process to make it more difficult to erase traces of peeling of a sealing means.

It is still another object of the present invention to provide a sealed electronic component on a circuit board of a game machine, in which the sealing means is broken at the time of peeling, making it difficult to restore the sealing means.

Still another object of the present invention is to provide a sealing electronic component on a circuit board of a gaming machine which makes it difficult to forge a sealing means.

It is still another object of the present invention to provide a sealed electronic component on a circuit board of a game machine, which makes it difficult to recover after peeling off a sealing means which is difficult to forge.

[0012]

Means for Solving the Problems To solve the above-mentioned problems, the following means are adopted.

The sealed electronic component on the circuit board of the game machine according to the first aspect of the present invention comprises a circuit board and an integrated circuit component provided on the circuit board. Identification information for specifying the person name is engraved.

According to a second aspect of the present invention, there is provided a sealed electronic component on a circuit board of a game machine, wherein a control board for controlling a game of the game machine comprises a circuit board and an integrated circuit component provided on the circuit board. A sealing member for sealing the integrated circuit is fixed to the integrated circuit component, and is bridged and stamped between the integrated circuit component and the sealing member.

According to a third aspect of the present invention, there is provided a sealed electronic component on a circuit board of a gaming machine, wherein a control board for controlling a game of the gaming machine comprises a circuit board and an integrated circuit component provided on the circuit board. A sealing member for sealing the integrated circuit is fixed to the circuit board, and is bridged and stamped between the circuit board and the sealing member.

According to a fourth aspect of the present invention, there is provided a sealed electronic component on a circuit board of a gaming machine, wherein a control board for controlling a game of the gaming machine comprises a circuit board and an integrated circuit component provided on the circuit board. The identification information is the first in the integrated circuit component.
Engraved, a sealing member for sealing the integrated circuit is fixed to the circuit board, is bridged between the integrated circuit component and the sealing member, a sealing process is performed by a second stamping, the circuit board and The sealing process is performed by the third engraving by being bridged between the sealing member.

According to a fifth aspect of the present invention, there is provided a sealing electronic component on a circuit board of a game machine according to the invention selected from the first to fourth aspects, wherein a hologram is formed on the sealing member.

According to a sixth aspect of the present invention, there is provided a sealed electronic component on a circuit board of a game machine according to the invention selected from the second, third, and fourth aspects, wherein the engraving is formed as a cut line.

According to a seventh aspect of the present invention, there is provided a sealed electronic component on a circuit board of a gaming machine according to the invention selected from the second, third, and fourth aspects, wherein the engraving also serves as welding for joining the sealing member and the circuit board. It is characterized by having.

According to an eighth aspect of the present invention, there is provided a sealed electronic component on a circuit board of a game machine according to the sixth aspect, wherein the second engraving or the third engraving is performed by a laser.

Further, according to the present invention, the electronic component to be sealed is I
It is replaceably or detachably connected to the electronic circuit board via a C socket. The important electronic components are marked in advance with a security code, a name of a person involved in the manufacture of the game machine, and a model name by engraving processing. The sealing means has an adhesive layer that is simultaneously bonded and attached to the surface of the electronic component and the surface of the electronic circuit board, and adheres to both surfaces of the electronic circuit board and the electronic component. When the back side including the adhesive layer of the electronic circuit board is simultaneously bonded to the central part of the important electronic component and the surface of the electronic circuit board, and the engraving is performed by laser marking, mechanical engraving, unlike ultrasonic engraving,
Important electronic components can be imprinted quietly and without vibration, which is convenient without losing electronic circuit functions.

On the surface of the electronic component, the exposed area is divided into at least two areas by the sealing means, and the boundary of the exposed area coincides with the contour of the sealing means. Sealing processing is performed over the outline, and the sealing processing is sealing processing.
The engraving has the function of simultaneously welding the electronic component and the sealing means in a direction perpendicular to the surface. In particular, such a marking welds the important electronic component and the sealing means on the contour in a direction perpendicular to the surface.

It is extremely difficult to reproduce welding by laser marking, as will be described later. Forgery of the sealing means formed of a hologram is almost impossible.

Still another group of the present invention includes the combinations of the above-mentioned inventions, and further includes those that are more specifically subdivided and clarified through the following embodiments.

[0025]

The sealed electronic components on the circuit board of the gaming machine according to the present invention are sealed by engraving and are difficult to reproduce. If the inscription is a crest, reproduction is more difficult. Reproduction is even more difficult if the scribe is duplicated. Laser engraving is increasingly difficult to reproduce because welding occurs simultaneously with engraving. When the sealing means is a hologram, it is difficult to forge the sealing means itself. By multiplying the difficulty, reproduction becomes geometrically difficult.

[0026]

Next, an embodiment of the present invention will be described.

The sealing means Figure 1 of electronic components is a sectional view showing a first embodiment of sealing the electronic components on the circuit board of the gaming machine according to the present invention. The electronic device component 301 that controls the game of the gaming machine is provided by the control box 101.
, Which is detachably mounted, ie, inserted. The control box 101 includes a plurality of components described later. One of the components is a control circuit board 6.

FIG. 2 shows an arrangement and mounting structure of electronic device components provided on the electronic circuit board 6. On the electronic circuit board 6, electronic device components such as a CPU 41, a ram 42, and a ROM 43 are arranged and attached. For example, as shown in the ROM 43, the CPU 41, the ram 42, the ROM 43, and the like are connected to the electronic circuit board 6 via the IC socket 184.
Are removably or detachably connected. CPU4
1, the ram 42, the ROM 43 and the like are collectively referred to as important electronic components 401 of the gaming machine.

The important electronic components 401 include a security code 181, a manufacturer involved in the production of a game machine (a manufacturer, a seller such as a trading company having a sales contract with the manufacturer, and an electronic device having a trademark display contract with the manufacturer. Abbreviation name 182, model name 1 of the gaming machine manufacturer
83 is previously marked by a marking process.
Instead of the abbreviation name of the gaming machine manufacturer, a number or a figure may be used.

FIG. 3 shows an embodiment in which the CPU 41, the ram 42, and the ROM 43, which are electronic components for controlling the game of the gaming machine, are sealed using the sealing means 2. The central portion 192 on the front side of the important electronic component 191 is blank and has no display.

The important electronic component 191 is sealed by the sealing means 2. The sealing means 2 is simultaneously bonded and attached to the surface of the important electronic component 191 and the surface of the electronic circuit board 6. The sealing means 2 includes the sealing means 2 and the important electronic component 1.
91 has an adhesive layer that adheres to the surface. The back surface of the electronic circuit board 6 including the adhesive layer is the important electronic component 191.
And the surface of the electronic circuit board 6 at the same time. The back side of the sealing means 2 is an important electronic component 19
1 at the center. The sealing means 2 does not hide the security code 181, the abbreviated name 182 of the person involved in manufacturing, and the model name 183. Security code 18
1. The abbreviation name 182 and the model name 183 of the manufacturing related persons are collectively referred to as a display form 402.

The central portion of the back surface of the sealing means 2 is attached to the central portion 192 of the front surface of the important electronic component 191, and both side portions of the back surface of the sealing means 2 are attached to the substrate surface of the electronic circuit board 6. I have.

The surface of the important electronic component 191 is referred to as a first stamp. The display form 402 is displayed by the first stamp. When the first engraving is performed by laser marking, unlike the mechanical engraving and ultrasonic engraving, the important electronic component 191 is formed.
Can be imprinted quietly and without vibration, which is convenient without losing the electronic circuit function.

On the surface of the important electronic component 191, the exposed portion area 403 is divided by the sealing means 2 into at least two areas. The boundary line of the exposed portion area 403 is the sealing means 2
. First across the outline 55
Sealing processing ST4 has been performed. The sealing process ST4 is a sealing process. Manufacturer name or symbolized figure,
The seal processing is performed by the pattern. Such a seal straddling the outline 55 or the boundary line is referred to as a stamp.

That is, such a stamping / dividing process performed between the important electronic component 191 and the sealing means 2 is performed in the second mode.
Called engraving. The second engraving is also performed by a laser.
Such marking has the function of simultaneously welding the important electronic component 191 and the sealing means 2 in a direction perpendicular to the surface. In such a marking, in particular, the important electronic component 191 and the sealing means 2 are welded on the contour in a direction orthogonal to the surface.

Between the sealing means 2 and the electronic circuit board 6,
A second stamping process ST5, which is a form of the sealing process, is performed. The sealing process ST5 is a sealing process. As in the case of the fourth sealing process, the stamping process is performed using the manufacturer name or a symbol or pattern that is a graphic of the manufacturer name. Such a seal straddling the outline 55 or the boundary line is referred to as a stamp.

That is, such a stamping / marking process performed between the electronic circuit board 6 and the sealing means 2 is referred to as a third stamping. The third engraving is also performed by laser. Such marking has the function of simultaneously welding the electronic circuit board 6 and the sealing means 2 in a direction perpendicular to the surface. In such a marking, in particular, the electronic circuit board 6 and the sealing means 2 are welded on the contour in a direction orthogonal to the surface.

On the surface of the electronic circuit board 6, a marking process ST 6 is performed across the outline 55 of the sealing means 2. Each of the sealing means 2 is subjected to a sealing process by two cut lines 54. The two cut lines 54 are arranged on both sides of the important electronic component 191. Two cut lines 54
Are located near the boundary between the important electronic component 191 or the IC socket 184 and the electronic circuit board 6. That is, the cut line 54 is located near the intersection line where the important electronic component 191 and the board surface of the electronic circuit board 6 intersect.

The two cut lines 54 are engraved on the sealing means 2 and the electronic circuit board 6 across the respective contours 55 of the sealing means 2. Such a stamp is also referred to as a third stamp. The cut line 54, which is the third marking, is formed so as to easily break the sealing means 2. The third engraving is performed by laser marking. Such an inscription has a function of welding the electronic circuit board 6 and the sealing means 2 in a direction orthogonal to the surface. Such a laser marking is carried out, in particular, on the contour line 55 with the electronic circuit board 6 and the sealing means 2.
Are welded in a direction perpendicular to the surface. This laser marking can perform both welding and engraving at the same time.

A phenomenon in which the sealing means 2 in the sealing process shown in FIG. Sealing means 2
And the electronic circuit board 6 are not eliminated by the adhesive peeling liquid. When the sealing means 2 shown in FIG. 3 is peeled off from the end, the sealing means 2 which is welded to the electronic circuit board 6 with a strong adhesive or laser marking, as shown in FIGS. Is broken at The broken sealing means 2 is disassembled into pieces 2U, 2W, 2X, 2Y, 2Z. It is difficult to reproduce the first stamp imprinted on a genuine electronic component on a fake electronic component. Even if the peeling is successful without causing such a break, it is difficult to reproduce the marking forms of the second stamp and the third stamp when a new forged seal is reapplied.

It is extremely difficult to reproduce welding by laser marking, as will be described later. It is almost impossible to forge the sealing means 2 formed of a hologram described later.

Box and Sealing Means In order to more effectively prevent the replacement of the electronic components described above, double sealing means is provided. In the following, the sealing of the box housing the electronic circuit board 6 fixing the important electronic component 191 will be described.

FIG. 6 shows a first embodiment of a circuit board storage box having a sealing structure for a gaming machine according to the present invention. The embodiment product 101 is a support, a holder, or a container that holds, supports, and stores semiconductor circuit components including an electronic circuit board described later, for example, electronic components including a CPU, a RAM, a ROM, and the like. Called 1. Also,
The embodiment product 101 is a sealing means 2 for sealing the box 1.
It has.

That is, the product 101 of the embodiment comprises the box 1 and the sealing means 2. The sealing means 2 is preferably in the form of a sheet. When the sheet-like sealing means 2 is removed from the box 1 by peeling or flipping it off, the sheet-like sealing means 2 is easily broken or broken by itself, which is convenient. Box 1 is formed from a plurality of components that will be described in detail later. The sealing means 2 is fixed across a plurality of components, especially adjacent components so as to form a single surface, and is adhered to a single surface formed by the components. If the sealing means 2 is a paper sheet or a resin sheet, the sticking can be performed with an adhesive. If the sealing means 2 is a metal body, for example, a metal sheet, the bonding is not limited to the adhesive but can be performed by screwing. Can be.

Various printings are made on the surface of the sealing means 2. Printed are directly legible characters, symbols, patterns, holograms, and combinations of these. Holograms are virtually impossible to copy.

The sealing means 2 has a seal indicating a sealing intention. Further, a sealing process ST is performed between the box 1 and the sealing means 2. The sealing process ST is performed with the marking S
In addition to a well-known sealing process such as T1 and bonding, a box 1
Engraving across the boundary between the seal means 2 and the sealing means 2, and making a cut line ST2 such that the sealing means 2 itself is damaged when the sealing means 2 is peeled off from the box 1.

Form 1 of Box In the product 1 of the embodiment, the sealing means 2 is joined to an orthogonal plane formed by the box 1. Therefore, the sealing means 2 itself forms a right angle plane after the sealing. The box 1 in the case where the sealing means 2 forms a right-angled surface after sealing is shown in FIGS.
Is shown in As shown in FIG. 7, box 1 contains 5
It is composed of parts. The five parts are a front casing body 3, a rear casing body 4 formed of a carbon-containing conductive resin, a transparent bottom plate 5 fixed to the bottom of the rear casing body 4, and a rear side An electronic circuit board 6 fixed to the casing body 4 and a transparent lid 7. The lid 7 has a large number of small holes 7a for heat radiation.

When mounted on the gaming machine, the front casing body 3 is on the front side and the lid 7 is on the back side when viewed from the back side of the gaming machine. When mounted on the gaming machine, the front casing body 3 is on the front side and the lid 7 is on the back side. Before the mounting, the lid 7 is on the upper side and the front casing body 3 is on the lower side. In the following, the upper part of the figure is referred to as an upper side, and the lower part of the figure is referred to as a lower side.

On the upper surface side of the front casing body 3, two inner insertions 11 are provided longitudinally, and the rear casing body 4 is provided.
Are provided with two outer inserts 12 in a longitudinal shape. The front casing body 3 has side edges 13 on both sides, and the back casing body 4 has peripheral edges 14 on four sides. A large opening 15 is formed in the back casing body 4.
The opening 15 is formed inside a bottom edge 16 that is closed on four sides.

The peripheral edge 14 and the bottom edge 16 are formed integrally. As shown in FIG. 1, a bent step 17 is formed as a part of the bottom edge 16. The upper surface of the bent step 17 slides on the lower surface of the inner plug 11, and the side surface of the inner plug 11 slides longitudinally on the vertical surface of the bent step 17, so that the front casing body 3 is attached to the back casing body 3. 4 is inserted and attached.

The front casing 3 has, as a part, an engaging portion 19 that rises upward for detachably attaching the box 1 to the game machine main body. A release lever 19 for releasing the engagement to release the engagement portion 19 from the game machine main body.
a is provided so as to interlock with the engaging portion 19 integrally. The front casing 3 is provided with a stop hole 20 for combining the front casing 3 and the rear casing body 4.

Screw holes 21 are formed in the four corners of the electronic circuit board 6, and screw through holes 22 are formed in the bottom plate 5 corresponding to the positions of the screw holes 21, respectively. Screw holes 23 are formed in the rear casing body 4 corresponding to the positions of the screw holes 22. The screws 24 are passed through the screw holes 21 and the screw through holes 22 and screwed into the screw holes 23, and the electronic circuit board 6 is fixed to the rear casing body 4 with the bottom plate 5 interposed therebetween.

The lid 7 has hanging pieces 26 integrally at a plurality of locations on the edge thereof. The hanging piece 26 has a portion facing outward. The aforementioned portion of the hanging piece 26 corresponds to the position of the hanging piece 26,
A hook hole 27 that fits while being elastically deformed is formed in the peripheral edge 14 of the back casing body 4.

The lid 7 integrally has locking positioning pieces 28 at a plurality of locations on its edge. The locking positioning piece 28 faces downward and has a screw hole (not shown). A screw hole 29 is formed in the peripheral edge 14 of the rear casing body 4 corresponding to the position of the locking positioning piece 28. A screw (not shown) passed through the screw hole 29 is fastened to the screw hole of the hook positioning piece 28, and the lid 7 is firmly fastened to the back casing body 4 from the side.

When the box 1 assembled in this manner is disassembled, when the tightening force is weakened and the box is deformed, one of the plurality of sealing means 2 is slightly damaged such as a crack. The partition pieces 26a formed at the four corners of the lid 7
Is mounted on the rear casing body 4 for mounting. The latching pieces 26b formed downward at a number of locations on the periphery of the lid 7 are guide pieces that are guided on the outer surface of the peripheral edge 14 of the rear casing body 4 when the lid 7 is mounted on the rear casing body 4. is there. As shown in FIG. 1, a connection opening 30 for connecting sockets 31 to a predetermined location on the gaming machine side is provided between the back casing body 4 and the lid 7.

Various electronic components for operating the game machine are mounted and assembled on the electronic circuit board 6. As electronic components, CPU 41, RAM 42, RO
M43. In addition, the electronic circuit board 6 is provided with sockets 31 for electrically connecting the electronic components to the electric equipment of the main body of the gaming machine. The electronic component has a detachable portion so as to be detachable from the electronic circuit board 6.

As shown in FIG. 8, the box 1 is fitted on the back side of the gaming machine so as to be fitted. Sockets 31
As shown in FIG. 8, a first terminal 32 for connecting to a terminal box 100A (FIG. 8) and a speaker 100B
Terminal 33 (FIG. 8) for connection to the prize ball device 10
A third terminal 34 for connecting to 0C (FIG. 8), a fourth terminal 35 for connecting to the prize ball control panel 100D, a fifth terminal 36 for connecting to the variable display control panel 100E (FIG. 8), and the like. is there.

[0058] Sealed process Embodiment 1 FIG. 9 shows an embodiment of a seal process. FIG. 9 (b)
The sealing form and the sealing method are shown. The components of the box 1 to be sealed are the box 1 shown in FIG.
Of the rear casing body 4 and the lid 7. A positioning protrusion 51 is formed on the lower surface of the lid 7.

One vertical plane 52 is formed by the outer surface of the rear casing body 4 whose inner surface abuts the positioning protrusion 51 and the side surface forming the thickness of the lid 7. Vertical plane 5
2 and the surface 53 of the lid 7 are orthogonal to each other. That is, the rear casing body 4 and the lid 7 form one substantially continuous orthogonal plane.

The substantial term means that the vertical plane 52 is cut by the gap S between the rear casing body 4 and the lid 7 to form a gap. The sheet-like sealing means 2 is attached at a right angle to the substantially formed orthogonal plane. A glue and an adhesive are adhered to the back side of the sealing means 2.

The presence of the adhesive is one form of the sealing process. When the sealing means 2 is peeled off from the box 1, the adhesive remains on the box 1 side, or a trace of the adhesive remains.
FIG. 9 is a development view of FIG. 9B, which is one form of the sealing process.
As shown in (a), the sealing process ST is performed twice.

The sealing process ST is a dividing process ST1 and a break line process ST2. Since the break line 54 extends over both the box 1 and the sealing means 2, the break line 5
Reference numeral 4 also serves as a marking process ST1. The cut line 54 extends to both areas across the outline 55 of the box 1 and the sealing means 2.

The cut line 54 is a wavy line having a zigzag shape or the like which is difficult to reproduce. The marking process ST1 is, of course, performed at the boundary between the box 1 and the sealing means 2, that is, the outline 5 of the sealing means 2.
5 across both areas. Characters, graphics,
Patterns and symbols that are difficult to duplicate are used. The cut line 54 is orthogonal to the longitudinal direction.

As shown in FIG. 9 (b), a display form for marking and a display form such as a cut line are performed by laser marking processing. Engraving is also a kind of sealing process. If the sealing means 2 is a transparent body, a light beam 56 as a laser is focused on the joint surface between the box 1 and the sealing means 2. In this case, the sealing means 2 can be welded to the box 1 by melting the surface of the resin forming the box 1.

Laser irradiation device 61 for emitting light beam 56
Incorporates conventional laser deflection means. As a laser deflecting means, a dielectric vibrator and a deflecting mirror are known. The laser irradiation device 61 also includes a converging lens moving means for correcting a focal position. Laser irradiation device 6
As the laser built in 1, YAG is used in terms of heat absorption.
Lasers are preferred. The laser irradiation device 61 includes two light sources that respectively generate two orthogonal light beams 56.

It is preferable that the box 1 is formed of a material that easily absorbs a laser having a wavelength to be used. As a material to which conditions of transparency, easy injection molding, and toughness are added, polycarbonate is optimal, but ABS and acrylic resin can also be used. When ABS or acrylic resin is used, a black-based dye is mixed in the transparent material so as to easily absorb the YAG laser, thereby increasing the absorptance. The same material and absorption treatment are applied to the transparent sealing means 2. As the dye that enhances the light absorbability, a brown or dark blue dye can be effectively used in addition to black.

The marking applied between the box 1 and the sealing means 2 is not limited to the marking straddling the outline 55, and the marking between the back surface of the sealing means 2 and the front surface of the box 1 is also possible. When a laser is used, such a marking between the front and back surfaces is easy.

The marking and the marking can be made at random positions. In this case, random correction is performed on a signal obtained by extracting deflection information of the laser irradiation device 61 from the ram. Such random engraving can make forgery of the seal difficult.

FIG. 10 is an oblique axis projection view showing the processing state of the sealing processing mode 1. When one end in the longitudinal direction of the sealing means 2 is forcibly peeled off from the surface of the lid 7, the cut line 54 on the side to be peeled off is cut as shown in FIG. When the cut line 54 is engraved by a laser or the like,
Easy to cut. If the cut line 54 is hard to be cut, and if the peeling direction is inclined, any part of the stamp ST1 that has been engraved and easily broken is induced to break, and the partial fragment 2A remains and the part is broken. .

FIG. 12 shows a state in which the rear casing body 4 to the lid 7
4 shows a breaking state of the sealing means 2 when the sealing means 2 is completely peeled off from the box 1 in order to remove the sealing means. When such a peeling is performed, the sealing means 2 cuts the two cut lines 54, and separates the horizontal part 2B, the vertical part 2C, the center part 2D, and both the split side parts 2E and 2F, The line portion 54A and the mark display portion STA remain on the box 1 side.

FIG. 13 shows a situation in which the imprinting pattern and the cut line pattern are printed and printed on the box 1 and the imprinting means and the cut line pattern lose consistency. Is shown. It is extremely difficult to achieve consistency when the marking pattern and the score line pattern are formed by laser engraving. If the sealing means 2 is made of a hologram, it is almost impossible to make and obtain a replacement.

Box Form 2 FIG. 14 shows an embodiment product 102 according to the present invention. As shown in FIG. 15, the sealing means 2 is joined to a plane formed by the box 1. The point that the embodiment product 102 is composed of five constituent parts 3, 4, 5, 6, 7 is as follows.
It is the same as the product 101 of the embodiment except that it is slightly deformed because the model of the applied gaming machine is different. The parts and members indicated by the reference numbers shown in FIG. 7 are the same as the parts and members having the same reference numerals as those in FIG. 15, and therefore, the description given with reference to FIG. Is used as it is.

An extension portion 71 is provided on two opposing sides of the four peripheral edges 14 of the rear casing body 4 which is a component of the embodiment product 102. The extending portion 71 is partially bent at the upper end edge of the opposing side, and projects inward to the opposing side in a horizontal direction. The upper surface of the extension portion 71 is formed in a horizontal plane 72. Notch recess 73 through which extension 71 can pass during assembly
Are provided on the bottom plate 5. Similarly, the electronic circuit board 6
A notch recess 74 is also provided.

The lid 7 is provided with a fitting recess 75 for fitting at a position facing the extension portion 71. Both the two extending portions 71 and the two fitting recesses 75 are arranged in a cross-over direction, that is, in a linear direction crossing the longitudinal direction. The extending portion 71 and the fitting concave portion 75 have the same shape and the same size. That is, when assembling,
The extension portion 71 fits into the fitting recess 75, and the fitting recess 7
There is almost no gap between the edge of 5 and the extension 71.
During such assembling, the upper surface of the lid 7 and the upper surface of the extending portion 71 form substantially the same plane. The back casing main body 4 and the lid 7 are positioned by the locking positioning pieces 28.

Sealing Processing Mode 2 FIGS. 16A and 16B show a sealing processing mode 2 using stamping, engraving and the like. The sealing processing mode 2 is shown in FIGS.
Is sealed with respect to the embodiment product 102 shown in FIG. The horizontal surface 72 of the extension portion 71, which is the horizontal portion of the back casing body 4, and the surface of the lid 7 are substantially flush with each other.
5 shows a sealing process for forming No. 5. Sealing means 2
Are attached on the same plane 65 and straddle a boundary 66 between the rear casing body 4 and the lid 7, that is, a boundary between components of the box 1. The cut line 54 extends to both areas across the outline 55 of the box 1 and the sealing means 2 and the boundary 66 between the boxes 1. The boundary line 66 is formed from two parallel lines and an orthogonal line orthogonal to these lines. The cut line 54 crosses the contour 55 of the sealing means 2 and the orthogonal line. The break line 54 is a wavy line such as a zigzag shape that is difficult to reproduce. Split processing ST1
Naturally extends across both areas across the outline 55 of the box 1 and the sealing means 2. It is preferable that the sealing process ST1 and the break line process ST2 by the break line 54 are performed by engraving. The engraving is performed by laser marking. Since the laser marking is performed by the sealing process as described with reference to FIG. 9B, the description thereof will not be repeated, but as shown in FIG. 16B, one laser irradiation device 61 may be used. .

FIG. 17 is an oblique projection view showing the processing state of the sealing processing mode 2. When one end in the longitudinal direction of the sealing means 2 is forcibly peeled off from the surface of the lid 7, the cut line 54 is cut as shown in FIG. If the cut line 54 is engraved with a laser or the like, it is easily cut. If the cut line 54 is hard to be cut, and if the peeling direction is inclined, the part of the marking ST1 which is easily engraved and easily torn is induced to break, and the partial fragment 2A remains and the part is sealed. To be broken.

FIG. 19 shows a state in which the rear casing body 4 to the lid 7
4 shows a breaking state of the sealing means 2 when the sealing means 2 is completely peeled off from the box 1 in order to remove the sealing means. When such peeling is performed, the sealing means 2 is cut by one cut line 54, the sealing means 2 is divided into two bodies 2G and 2H, and a part of the marking display portion becomes two bodies 2I and 2J. Is broken.

FIGS. 13 (a) and 13 (b) show the marking pattern and the cut line pattern which are synthesized when the sealing means 2 ', which is printed and forged precisely, is attached to the box 1. FIG. Shows a situation where consistency is lost. It is extremely difficult to achieve consistency when the marking pattern and the score line pattern are formed by laser engraving. If the sealing means 2 is made of a hologram, it is almost impossible to make and obtain a replacement.

Sealing Process Mode 3 FIG. 21A shows still another embodiment of the sealing process. The seal ST3, which is not the mark, is also a kind of sealing process.
The seal ST3 does not straddle the outline 55. The cut line 54A also does not extend across the outline 55. The cut line 54A does not divide the area surrounded by the outline 55, that is, the sealing means 2 into two. Two such cut lines 54A are engraved. The end point of one end of the cut line 54A is the outline 5
The other end point 81, which is on 5, is inside the sealing means 2, that is, inside the area surrounded by the outline 55. 2 break lines 5
4A is distributed to two orthogonal surface areas A and B after sealing.

As shown in FIG. 21 (b), when peeling from one end of the sealing means 2, the cut line portion 54A on that side is cut. When the cut line portion 54A is not cut, a crack 82 enters from an end point 84 on an extension of the line, and the break proceeds at a stroke. The same breaking phenomenon occurs symmetrically when peeling from the other side.

Sealing Processing Mode 4 The sealing processing mode shown in FIGS. 22 and 23 is different from the sealing processing mode 1 in that the sealing means 2 forms a plane without forming an orthogonal plane, and the processing position is different. It differs from the sealing processing mode 2 in that it is not the upper surface but the side surface.

A second extending portion 91 formed by bending downward from the edge of the lid 7 which is a component of the embodiment product 103 shown in FIG. 22 is provided integrally with the lid 7. A second fitting recess 92 into which the second extension portion 91 fits so as to form the same plane is provided in the rear casing body 4. Although not shown, the second extension portion 91 and the second fitting concave portion 92 are provided at at least two places, respectively. The back casing main body 4 and the lid 7 are positioned and joined by a hook positioning piece 28.

The sealing processing mode 4 is exactly the same as the sealing processing mode 2 except that the processing position is on the side.

Embodiment of Welding Means The welding means shown in FIG. 24 is an ultrasonic welding means. The welding head 90 is movable in three orthogonal axes by a pneumatic cylinder 99. The pneumatic cylinder 99 is
It is controlled and driven by a pneumatic control circuit. Vibration energy is supplied to the welding head 90 from the ultrasonic vibrator 92a. The ultrasonic oscillator 93 includes an ultrasonic oscillator 92
a is vibration-controlled. A jig 95 is attached to the welding fixing base 94. A start switch 97 and an emergency stop switch 98 are provided on a base 96 on which the welding fixing base 94 is placed. The ultrasonic oscillator 93 and the pneumatic cylinder 99 are controlled by a sequencer as the control unit 111. FIG. 25 shows the space between the jig 95 and the welding head 90 in detail. A welding die 112 is attached to the lower end surface of the welding head 90. On the jig 95, the above-mentioned embodiment product, for example, the embodiment product 1, is positioned and mounted.

As the welding means, conventional means such as heat welding can be used in addition to laser welding and ultrasonic welding. Laser marking can be performed simultaneously with welding.

Hologram as Sealing Means FIG. 26 shows a reproducing method when a hologram is used as sealing means. Hologram seals can be mass produced by printing. Hologram seals are mass-produced as multi-layer sheets. As shown in FIG. 29, this sheet has a front side transparent protective layer 2a, a hologram print layer 2a.
b, a reflective layer 2c, and a back transparent protective layer 2d are a multilayer film formed in this order. The printing layer can be formed at low cost by printing means or the like on the back surface of the front transparent protective layer using a reflective ink or the like.

Although it is difficult to transfer and copy the same hologram from the hologram, it is very easy to reproduce the original image from the hologram. 1 which is sealing means 2
The hologram is formed on almost the entire surface of one sheet. Laser generator 123 that oscillates visible laser
Is a handy type, and uses a semiconductor laser oscillation element operated by a battery.

FIG. 26 shows a state in which a conical light beam 125 enlarged by the lens 121 is applied to a part of the sealing means 2, that is, a part of the hologram. From any region, exactly the same image is reproduced at a fixed angular position and distance position with respect to the hologram surface. For example, at the position indicated by reference numeral 122, "
OK "is reproduced. The same image is reproduced as a three-dimensional image (usually a virtual image) at the same relative position with respect to the hologram on the vertical side even when the light is irradiated on the vertical side. Therefore, in the present invention, a sealing process for determining whether or not the sealing unit 2 has been peeled off is a particularly important solution in practice.

Reference Embodiment FIG. 30 shows a front side of a gaming machine in which a circuit board storage box having a sealing structure for a gaming machine according to the present invention is plugged in on the back side. On the front side of the gaming machine 131,
The following equipment members are provided: an entire frame 132, a door holding frame 133, a glass door frame 135, a hit ball supply frame 136, the above-described speaker 100B, a surplus tray 138, an operation handle 139, a game effect lamp 140, a game board 141, Guide rail 142, game area 143, variable display 144,
Rotating drums 145a-c, decoration LED 150, start memory LED, line display LED 152, start winning opening 153,
Starting port switch 154, winning area 156, opening / closing plate 15
7, open / close solenoid 158, specific area 159, specific area switch 160, 10 count switches 161a, b,
V display LED 162, opening number display 163, attacker lamp 164, side lamp 165, windmill lamp 16
6, rail decoration lamp 168 and the like.

On the back side of the gaming machine 131, the following equipment members are provided: a winning ball collecting cover body 169, a relay board box 170, a window opening 172, a prize ball tank 173,
Prize ball dispensing device box 174, the prize ball dispensing control board 100D, card unit relay board box 176,
Card unit 177, decoration control board box 10
0C, a launch control board 179, a hit ball launching device 180, the terminal board box 100A, a drum display control circuit board box 100E, and the like. Embodiment of Laser Marking As shown in FIG. 29, a YAG laser beam is focused by a variable focal length optical system (not shown). The focus is narrowed to a height position which has entered slightly into the components of box 1. Since the sealing means 2 as a sheet is entirely transparent, the YAG laser beam easily reaches the focal position. Since the three-dimensional region above the focal position has a high light energy density, the resin in this region is melted. The hologram layer 2b, which is partially destroyed by the heat of fusion, does not lose any of its information, so that no problem arises for reproduction.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic device component on a circuit board according to the present invention.

FIG. 2 is an oblique axis projection view showing electronic device components on a circuit board according to the present invention.

FIG. 3 is an oblique axis projection view showing a sealing method for sealing the electronic device component of FIG. 1;

FIG. 4 is a cross-sectional view showing a breaking phenomenon when the electronic device part of FIG. 1 is illegally peeled off.

FIG. 5 is a plan view of FIG. 4;

FIG. 6 is a plan view showing an embodiment product 101 of the circuit board storage box having the sealing structure of the gaming machine of the present invention.

FIG. 7 is an oblique projection view showing the embodiment product 101 exploded into constituent parts.

FIG. 8 is a rear view showing a rear surface of the gaming machine.

FIGS. 9 (a) and 9 (b) are a plan view and a front sectional view, respectively, showing a sealing processing mode 1 and a laser marking method.

FIG. 10 is an oblique projection view showing a circuit board box in a sealing processing mode 1;

FIG. 11 is a perspective projection view illustrating a peeled state when the circuit board box of the sealing processing mode 1 is opened by fraudulent acts.

12 (a) and 12 (b) are a plan view and a front sectional view showing a peeled state when the circuit board box in the sealing processing form 1 is completely opened by fraudulent acts.

FIGS. 13 (a) and 13 (b) are a plan view and a front sectional view showing a state in which a counterfeit seal is attached to the circuit board box in the sealing processing mode 1. FIG.

FIG. 14 is a plan view showing an embodiment product 102 of the circuit board storage box having the sealing structure of the gaming machine of the present invention.

FIG. 15 is an oblique axis projection view showing the embodiment product 102 exploded into constituent parts.

FIGS. 16 (a) and (b) are a plan view and a front sectional view, respectively, showing a sealing processing mode 2 and a laser marking method.

FIG. 17 is a perspective projection view illustrating a circuit board box in a sealing processing mode 2;

FIG. 18 is an oblique axis projection view showing a peeled state when the circuit board box in the sealing processing mode 2 is opened by fraudulent acts.

FIGS. 19 (a) and 19 (b) are a plan view and a front sectional view showing a peeled state when the circuit board box in the sealing processing mode 1 is completely opened by fraud.

FIGS. 20 (a) and 20 (b) are a plan view and a front cross-sectional view showing a state in which a forged seal is attached to a circuit board box in the sealing processing mode 1. FIGS.

FIGS. 21A and 21B are plan views showing another embodiment of the sealing process.

FIG. 22 is a front cross-sectional view showing a laser marking method of Sealing Form 2;

FIG. 23 is a side view of a part of FIG. 22;

FIG. 24 is an apparatus configuration diagram showing a configuration of an ultrasonic welding unit for a sealing process.

FIG. 25 is a sectional view showing a part of FIG. 24 in detail;

FIG. 26 is a front sectional view showing a hologram reproducing method.

FIG. 27 is a plan view showing a hologram reproduction image.

FIG. 28 is a front view showing the front of the gaming machine.

FIG. 29 is a cross-sectional view illustrating a hologram sheet.

FIG. 30 is a cross-sectional view showing a conventional method of peeling a sealing member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Box 2 ... Sealing means 2 '... Sealing means 2b ... Hologram printing layer 2c ... Reflective layer 2c 2d ... Back transparent protective layer 3 ... Front casing 4 ... Back casing main body 5 ... Bottom plate 6 ... Electronic circuit board 7 ... Lid 11 ... Inner insertion 12 Outer insertion 13 Side edge 14 Peripheral edge 15 Opening 16 Bottom edge 17 Bending step 19 Engagement part 28 Latching positioning piece 31 Sockets 101 101 Embodiment 41 CPU 42, RAM 43, ROM 51, positioning projection 52, vertical plane 55, contour line 54, cut line 54A, cut line 56, light flux 61, laser irradiation device 65, coplanar surface 66, boundary line 71, extended portion 73 ... Notch recess 74... Notch recess 75. Fitting recess 81. Endpoint 84. Endpoint 90. Welding head 91. Second extended portion 92. Second fitting recess 93. Ultrasonic oscillator 101. Embodiment products 102 ... embodiment products 131 ... gaming machine 191 ... important electronic component ST ... seal process ST1 ... tally impression ST2 ... score line ST3 ... seal process (Approval) ST4 ... first seal process ST5 ... second seal process

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[Procedure amendment]

[Submission date] August 21, 1996

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] All figures

[Correction method] Change

[Correction contents]

FIG.

FIG. 4

FIG.

FIG. 5

FIG. 2

FIG. 3

FIG. 6

FIG. 16

FIG. 10

FIG. 13

FIG. 7

FIG. 8

FIG. 9

FIG. 11

FIG.

FIG. 29

FIG. 14

FIG.

FIG.

FIG.

FIG. 23

FIG.

FIG.

FIG. 21

FIG. 24

FIG. 25

FIG. 27

FIG. 26

FIG. 28

FIG.

Claims (8)

[Claims] 1. A control board for controlling a game of a gaming machine comprises: a circuit board; and an integrated circuit component provided on the circuit board. Sealed electronic components on the circuit board of the gaming machine, on which the identification information for identifying the electronic device is engraved. 2. A control board for controlling a game of a gaming machine, comprising: a circuit board; and an integrated circuit component provided on the circuit board, wherein a sealing member for sealing the integrated circuit is integrated. A sealed electronic component on a circuit board of a gaming machine, which is fixed to a circuit component and is hung and stamped between the integrated circuit component and the sealing member. 3. A control board for controlling a game of a gaming machine, comprising: a circuit board; and an integrated circuit component provided on the circuit board. A sealed electronic component on a circuit board of a game machine, which is fixed to a board, and is wound and stamped between the circuit board and the sealing member. 4. A control board for controlling a game of a gaming machine, comprising: a circuit board; and an integrated circuit component provided on the circuit board, wherein the identification information is first stamped on the integrated circuit component. A sealing member for sealing the integrated circuit is fixed to the circuit board, and is bridged between the integrated circuit component and the sealing member, and a sealing process is performed by a second stamping. A sealing electronic component on a circuit board of a gaming machine, which is wound between a sealing member and subjected to a sealing process by a third engraving. 5. The sealed electronic component according to claim 1, wherein a hologram is formed on the sealing member. 6. A sealed electronic component on a circuit board of a gaming machine according to claim 1, wherein the inscription is formed as a cut line. 7. The method according to claim 2, wherein the engraving or the third engraving also serves as welding for joining the sealing member and the circuit board. Sealed electronic components on the circuit board of a gaming machine. 8. The sealed electronic component on a circuit board of a game machine according to claim 6, wherein the second engraving or the third engraving is performed by a laser.