JPH10150269A - Ceramic multilayer circuit substrate and its manufacturing method as well as electronic device package body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the electric resistance for lessening the dispersion in the electric resistance and characteristic impedance values to be stabilized while increasing the wiring density by increasing the sectional area of a conductor wiring pattern to exceed a specific ratio of the product of maximum width and film thickness. SOLUTION: Before performing the lamination and bonding steps, a fine conductor paste printed by improved screen printing process in the fine width of 25-50μm and at fine pitch of 150-250μm to is to be set. Through these procedures, the shape deformation in the lamination and bonding steps can be avoided so that a glass ceramic multilayer circuit substrate 15a in fine width also at fine pitch of 150-250μm further having a low resistant conductor wiring in the electric resistance not exceeding 10Ω may be manufactured. In such a constitution, the sectional area of the conductor wiring pattern of the circuit substrate 15a exceed 80% of the product of the maximum width and film thickness of the wiring, thereby enabling the dispersion in the electric resistance etc. to be lessened, and the high density conductor wiring to be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer circuit board suitable for mounting a semiconductor component or mounting a pin for inputting / outputting an electric signal to form a functional module, a method of manufacturing the same, and mounting of an electronic device. About the body.

[0002]

2. Description of the Related Art In recent years, in ceramic multilayer circuit boards for mounting a large number of highly integrated LSIs and various electronic components, demands for miniaturization and high densification have been increasing. Is becoming essential. By the way, in the prior art 1 (JP-A-6-119809), after solid printing a photosensitive conductive paste,
Exposure and development using a mask with a circuit pattern formed,
A method of performing rinsing to obtain a conductor circuit having a line width of about 40 μm is known. Further, the conventional technique 2 (Japanese Patent Laid-Open No.
No. 537), a thermosetting resin or an ultraviolet curable resin is used as a binder contained in a conductor paste containing palladium as a main component. There has been known a method of manufacturing a multilayer ceramic electronic component that prevents a conductor film from being undesirably deformed.

[0003]

In the above-mentioned prior art 1, since a conductor circuit having a line width of about 40 μm is cured by exposure, a fine wiring having a high aspect ratio without causing the wiring to be crushed in the laminating and bonding steps is obtained. However, since a liquid such as a developing solution and a rinsing solution is used in the developing and rinsing steps, there is a problem that application to a green sheet is difficult. Further, in the prior art 2, there is a problem that sufficient consideration has not been given to the point of realizing a ceramic multilayer circuit board having a miniaturized conductor circuit pattern with a reduced electric resistance.

It is an object of the present invention to solve the above-mentioned problems of the prior art by providing a conductor circuit pattern having a fine wiring width, a fine pitch, and a high aspect ratio, and having small variations in line width and film thickness. In addition, it is an object of the present invention to provide a ceramic multilayer circuit board having a stable and high wiring density by reducing variations in electrical resistance and characteristic impedance by reducing electrical resistance and a method of manufacturing the same. Another object of the present invention is to
It is an object of the present invention to provide a mounted body of an electronic element capable of mounting a large number of highly integrated LSIs and various electronic components on a ceramic multilayer circuit board.

[0005]

In order to achieve the above object, the present invention relates to a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired. Is a ceramic multilayer circuit board characterized in that the cross-sectional area of the ceramic multilayer circuit board is 80% or more of the product of the maximum width and the maximum film thickness. Also, the present invention provides a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein the aspect ratio between the wiring width and the wiring film thickness of the conductor wiring pattern is 0.3 or more. A ceramic multilayer circuit board characterized by the following. Further, according to the present invention, in the ceramic multilayer circuit board, the conductor wiring pattern is formed of a low-resistance material containing copper, gold, or silver as a main component, and has a wiring width of 20 to 50 μm.
The wiring pitch is 150 to 250 μm. Further, according to the present invention, in the ceramic multilayer circuit board, the conductor wiring pattern is formed of a low-resistance material containing any of copper, gold, and silver as a main component and has a wiring width of 20.
５０50 μm, the wiring pitch is 150-250 μm,
The electric resistance of the conductor wiring pattern is 10Ω or less. According to the present invention, in the ceramic multilayer circuit board, the ceramic is formed of glass ceramic.

Further, the present invention provides a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein the ceramic is formed of glass ceramic, and the conductor wiring pattern is made of copper, It is formed of a low-resistance material containing either gold or silver as a main component, and has a wiring width of 20 to 50 μm, a wiring pitch of 150 to 250 μm, and an electric resistance of the conductor wiring pattern of 10 Ω or less. Is a ceramic multilayer circuit board. Further, the present invention provides a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired,
The ceramics are formed of glass ceramics, the conductor wiring pattern is formed of a low-resistance material containing copper, gold, or silver as a main component, and the wiring width is 20 to 50 μm.
The wiring pitch is 150 to 250 μm, and the cross-sectional area of the conductor wiring pattern is 80% of the product of the maximum width and the maximum film thickness.
A ceramic multilayer circuit board characterized by the above.

The present invention also provides a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein the ceramic is formed of glass ceramic, and the conductor wiring pattern is made of copper, The wiring width is 20 to 50 μm, the wiring pitch is 150 to 250 μm, and the aspect ratio between the wiring width and the wiring film thickness is 0.3 or more. A ceramic multilayer circuit board characterized by the above. The present invention also provides a ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein the ceramic is formed of glass ceramic, and the conductor wiring pattern is formed of copper, gold, silver, Wherein the wiring width is 20 to 50 μm, the wiring pitch is 150 to 250 μm, and the electric resistance of the conductor wiring pattern is 10 Ω or less. It is a multilayer circuit board.

The present invention also provides an active energy ray-curable conductive paste composition containing an active energy ray-curable compound, wherein at least a wiring pattern portion of the conductor pattern has a wiring width of 20 to 50 μm and a wiring pitch of Printing on a glass-ceramic green sheet with a thickness of 150 to 250 μm and an aspect ratio between the wiring width and the wiring film thickness of 0.3 or more; and a glass ceramic printed on at least the wiring pattern portion in the printing step. A curing step of irradiating the green sheet with an active energy ray to cure the wiring pattern, and a lamination and bonding step of laminating and bonding a glass ceramic green sheet having the wiring pattern cured in the curing step; For glass-ceramic multilayer substrates laminated and bonded in the lamination and bonding process And a firing step of firing and removing the binder.

Further, the present invention provides a thermosetting conductive paste composition containing a compound curable at a temperature not higher than a temperature at which a binder is scattered, at least for a wiring pattern portion of a conductor pattern, and having a wiring width of 20 to 20. 50 μm,
A printing step of printing on a glass ceramic green sheet with a wiring pitch of 150 to 250 μm and an aspect ratio between the wiring width and the wiring film thickness of 0.3 or more, and at least a wiring pattern portion printed in the printing step A curing step in which the wiring pattern is cured by heat treatment at a temperature equal to or lower than the temperature at which the binder is scattered to the glass ceramic green sheet, and a glass ceramic green sheet having the wiring pattern cured in the curing step are laminated.
The laminating / adhering step of bonding and the laminating / adhering step
And a firing step of firing and removing the binder from the bonded glass ceramic multilayer substrate. Further, the present invention provides the method for manufacturing a ceramic multilayer circuit board,
10 wherein the glass ceramic green sheet, a SiO ₂ 75-85% by weight in terms of oxide, the B ₂ O ₃
70% by volume of borosilicate glass having a composition of 30% by weight, 1 to 10% by weight of Al ₂ O ₃ , 10% by weight or less of alkali metal oxide and 1% by weight or less, and 30% by volume of mullite It is characterized by comprising.

Further, the present invention provides a ceramic multilayer circuit board having a conductor wiring pattern having a cross-sectional area of 80% or more of the product of the maximum width and the maximum thickness in an insulator made of ceramics laminated, bonded and fired. And a semiconductor element mounted on the ceramic multilayer circuit board. The present invention also provides a ceramic multilayer circuit board having a conductor wiring pattern in which an aspect ratio between a wiring width and a wiring film thickness is 0.3 or more in an insulator made of ceramics laminated, bonded and fired. An electronic device package comprising: a semiconductor element mounted on a multilayer circuit board. The present invention also provides an insulating body made of glass ceramics obtained by laminating, bonding and firing,
It is formed of a low-resistance material containing copper, gold, or silver as a main component, and has a wiring width of 20 to 50 μm and a wiring pitch of 150.
An electronic device comprising: a ceramic multilayer circuit board having a conductor wiring pattern having an electrical resistance of 10 to Ω or less, and a semiconductor element mounted on the ceramic multilayer circuit board; It is a device package.

[0011] The present invention also provides a method for manufacturing a semiconductor device comprising a glass ceramic formed by laminating, bonding and firing.
It is formed of a low-resistance material containing any of silver as a main component, and has a wiring width of 20 to 50 μm and a wiring pitch of 150 to 250 μm.
m, and a cross-sectional area of the conductor wiring pattern is 80% or more of a product of a maximum width and a maximum film thickness. The ceramic multilayer circuit board has a conductor wiring pattern, and is mounted on the ceramic multilayer circuit board. An electronic device package comprising a semiconductor element. The present invention also provides
Formed with a low-resistance material containing copper, gold, or silver as a main component in an insulator made of glass ceramics laminated, bonded, and fired, and having a wiring width of 20 to 50 μm and a wiring pitch of 150 to 250 μm A ceramic multilayer circuit board having a conductor wiring pattern in which an aspect ratio between a wiring width and a wiring film thickness is 0.3 or more, and a semiconductor element mounted on the ceramic multilayer circuit board. It is an electronic device package. Further, according to the present invention, a low resistance material containing copper, gold, or silver as a main component and having a wiring width of 20 to 50 μm, A ceramic multilayer circuit board having a conductor wiring pattern having a pitch of 150 to 250 μm and an electric resistance of the conductor wiring pattern of 10 Ω or less, and a semiconductor element mounted on the ceramic multilayer circuit board. Electronic device package.

In the present invention, among those containing as a main component any of copper, gold and silver having a low electric resistance which can obtain a low electric resistance even with fine wiring, copper is particularly preferable from the viewpoint of low electric resistance and low cost. . Accordingly, low-temperature sintered ceramics such as glass ceramics are used as the insulating material. As glass ceramics, 75% of SiO ₂ is converted to oxide.
85 wt%, B ₂ O ₃ 10 to 30 wt%, Al ₂ O ₃ 1 to 10 wt%, alkali metal oxide 10 wt% or less, borosilicate having a composition to others 1% by weight 70% by volume of glass and 30% by volume of mullite (3Al ₂ O ₃ .2SiO ₂ ) having crystallinity for imparting strength
And the like. In the present invention, the active energy rays include ultraviolet rays, electron beams and the like. In the present invention, examples of the ultraviolet-curable compound include, for example, a combination of an acrylic copolymer having a carboxyl group and an ethylenically unsaturated group in a side chain, a photoreactive polymerizable compound, and a photopolymerization initiator. . Examples of the electron beam-curable compound include unsaturated polyester resin, polyester (meth) acrylate resin, epoxy (meth) acrylate resin, polyurethane (meth) acrylate resin, polyether (meth) acrylate resin, polyallyl compound, polyvinyl compound, Examples thereof include polyacrylated silicone resin and polybutadiene. Preferably, it is an epoxy (meth) acrylate resin. These resins can be used alone or in combination. A low-power ultraviolet irradiation device can be used, and a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is used as a light source for generating the ultraviolet light. As the electron beam irradiation device, a device having a low acceleration voltage can be used, and the irradiation dose is 2 to 30 Mrad.

Further, the present invention provides a combination of the binder of the ceramic green sheet and the thermosetting compound, for example, a combination of a methacrylic resin and an unsaturated polyester resin, a combination of a methacrylic resin and an epoxy resin,
Examples include a combination of a methacrylic acid-based resin and a melamine resin. In this case, the heat treatment temperature is suitably from 70 to 80C.

As described above, according to the above configuration,
In the sintered ceramic multilayer circuit board, as shown in FIG. 6, the cross-sectional area of the conductor wiring pattern 16 is 80% or more of the product of the maximum wiring width Wmax and the maximum wiring film thickness Hmax. The aspect ratio with the maximum wiring film thickness is 0.
If it is 3 or more, the wiring resistance R (Ω / cm) is represented by the following (Equation 1). In ^{ρ × 10 ~ 6 /(Wmax×0.3Wmax×0.8)=ρ×10~ 6 /0.24Wmax} 2 ≧ R ( Equation 1) Here, [rho is the specific resistance of the conductive wiring pattern part ([mu] [Omega] · c
m) and Wmax are the maximum conductor wiring width (cm). From this equation, in the case of Cu conductor wiring, if ρ = 2.7 μΩ · cm, when Wmax = 50 μm, R ≦ 0.45Ω / cm, Wm
When ax = 40 μm, R ≦ 0.70Ω / cm, Wmax = 30
When μm, R ≦ 1.25 Ω / cm, and when Wmax = 20 μm, R ≦ 2.81 Ω / cm. Therefore, in order to realize an electric resistance of 10Ω or less, it is possible for the maximum length to be 8 cm or less until Wmax becomes about 30 μm. When Wmax becomes about 20 μm, the maximum length becomes about 3.
Although it is necessary to be 6 cm or less, if the aspect ratio is increased, the maximum length can be made about 6 cm in order to realize an electric resistance of 10 Ω or less. As described above, if the wiring width is about 20 to 50 μm, it is possible to realize an electric resistance of 10Ω or less.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described. In recent years, in ceramic multilayer circuit boards for mounting a large number of highly integrated LSIs and various electronic components, demands for miniaturization and high density have been increasing, and for this purpose, finer conductive circuit patterns have become essential. Is coming. Therefore, in the present invention, the conductor paste is printed by an improved screen printing method applicable to the green sheet, and the conductive paste is printed with a fine width of 25 to 50 μm and 150 to 2 μm.
An object of the present invention is to obtain a multilayer ceramic circuit board having a low-resistance conductor wiring with a fine pitch of 50 μm and an electric resistance of 10 Ω or less even at the longest. In particular, due to the advancement of screen manufacturing technology and the optimization of the conductive paste composition, etc., the conductive paste is formed in a fine width of 25 to 50 μm, and a fine pitch of 150 to 250 μm,
Can be screen printed.

As the material of the conductor wiring, copper, gold, silver, or the like having a low electric resistance that can obtain a low resistance even with the fine wiring described above is preferable. However, in terms of low electrical resistance and low price,
Copper is particularly preferred. Accordingly, the melting point of copper is about 1083.
Since the temperature is ° C, low-temperature sintered ceramics such as glass ceramics that can be sintered at a low temperature of about 1000 ° C or less are required as an insulating material. Such glass ceramics that can be sintered at low temperature include Si in terms of oxides.
O ₂ 75 to 85 wt%, the B ₂ O ₃ 10 to 30 wt%,
Al ₂ O ₃ is 1 to 10% by weight, and alkali metal oxide is 10
Borosilicate glass powder having a composition of not more than 1% by weight and not more than 1% by weight, and mullite (3Al ₂ O ₃ .2Si) having crystallinity for enhancing strength.
O _2), and the like which are composed of a powder 40 to 5% by volume. That is, as a glass ceramic that can be sintered at a low temperature, there is a glass ceramic that is composed of a glass powder other than borosilicate and a mullite powder. Therefore, green sheets 11 made of glass ceramics that can be sintered at a low temperature are formed, and a hole of about 25 to 80 μmφ is formed in the formed green sheets by a punching method, a laser processing method, or the like. Is filled by a printing method to form a via, and a wiring width of 25 to 50 μm and a wiring thickness of 1
A wiring pattern 12 having a wiring pitch of 2 to 30 μm and a wiring pitch of 150 to 250 μm is printed by an improved screen printing method. Thereafter, a predetermined number of green sheets on which these wiring patterns are printed are laminated and bonded, and then sintered to form a glass ceramic multilayer. The circuit board 15 is completed.

However, even if a conductive paste of Cu or the like can be printed with a fine width of 25 to 50 μm and a fine pitch of 150 to 250 μm by the improved screen printing method, the above-mentioned laminating and bonding steps can prevent this shape. Is deformed to increase the line width and narrow the wiring conductor interval, resulting in a fine width of 25 to 50 μm and a width of 150 to 25 μm.
A multilayer ceramic circuit board having a low-resistance conductor wiring with a fine pitch of 0 μm and an electric resistance of 10 Ω or less even at the longest cannot be obtained. Therefore, in the present invention, before the laminating and bonding steps, a conductor such as fine Cu or the like printed with a fine width of 25 to 50 μm and a fine pitch of 150 to 250 μm by an improved screen printing method. By curing the paste, the shape is prevented from being deformed in the above-mentioned laminating and bonding steps, so that 25 to 5
An object of the present invention is to provide a glass ceramic multilayer circuit board 15 having a low-resistance conductor wiring having a fine width of 0 μm, a fine pitch of 150 to 250 μm, and an electric resistance of 10 Ω or less at the longest.

Next, a method for manufacturing a glass-ceramic multilayer circuit board having a high-density and low-resistance conductor wiring according to the present invention will be specifically described.

[First Embodiment] A description will be given with reference to FIG.
75 to 85% by weight of SiO ₂ in terms of oxide, B ₂ O ₃
10 to 30 wt%, Al ₂ O ₃ 1 to 10 wt%, alkali metal oxide 10 wt% or less, an average particle size 2μm about borosilicate glass powder 60 having the composition and others 1% by weight To 95% by volume and 40 to 5% by volume of a mullite powder having an average particle size of about 2 μm, and a water-dispersible methacrylic acid-based binder, a plasticizer,
A slurry containing a dispersant, an antifoaming agent and water is added and wet-mixed for about 24 hours with a ball mill to form a slurry. The slurry is then formed into a green sheet by a doctor blade method. 25 to 80 sheets by punching or laser processing
A hole of about μmφ was made, and a via was formed by filling the hole with a conductive paste of Cu by a printing method. Cu used here
The paste contains reduced Cu powder 9 having an average particle size of about 2 to 4 μm.
0 parts by weight, about 1: 9 by weight ratio of ethyl cellulose and solvent.
10 parts by weight of the vehicle prepared by heating and dissolving the mixture and 1 part by weight of a surfactant are mixed with a mill for 30 minutes, and then mixed with 3 parts by weight.
The roll was kneaded by passing through the roll several times and adjusted to an appropriate viscosity. A raiser is a combination of a pestle and a mortar, in which a pestle is mechanically moved by a motor, and is a machine for mixing and crushing things in the mortar. Further, as shown in FIG. 1A, a wiring width of about 25 to 50 μm, a wiring thickness of about 12 to 30 μm, and a wiring pitch of 150 to 250
A wiring pattern (conductor metal wiring) 12a of about μm was screen printed by an improved method. The Cu paste used here is a reduced Cu powder 50 having an average particle size of about 2 to 4 μm.
To 75 parts by weight, 30 to 15 parts by weight of epoxy acrylate, 15 to 7 parts by weight of pentaerythritol triacrylate, and 5 to 3 parts by weight of 2-hydroxyethyl acrylate were sufficiently kneaded with a three-roll mill. As shown in FIG. 1B, 5 to 10 Mra is applied to the green sheet 13 a on which the wiring pattern is printed by using an area beam type electron beam irradiation apparatus.
The wiring pattern was cured by irradiating the electron beam 17 with an irradiation dose of about d.

The green sheets on which these wiring patterns are printed are aligned so that the vias of each layer are connected.
About 0 to 30 sheets were laminated. After that, 130 ° C, 150
Bonding by heating and pressing under the condition of kg / cm ²
As shown in (c), a glass-ceramic laminate substrate 14a having three-dimensional wiring was prepared. in this way,
The binder of the green sheet (thermoplastic resin having a glass transition point of 130 ° C. or less) is melted and softened at a temperature of about 130 ° C., and further, a plurality of laminated green sheets are bonded by a pressure of about 150 kg / cm ^2. Be integrated. This glass ceramic laminate substrate 14a
Apply pressure of about kg / cm ² , and in a humid atmosphere,
After removing the organic binder by holding at about 50 ° C. for about 10 hours, baking in a non-oxidizing atmosphere at about 1000 ° C. for about 2 hours, as shown in FIG. The substrate 15a was obtained. The reason why the glass ceramic is kept at about 850 ° C. for about 10 hours in a humidified atmosphere is to remove an organic binder remaining in the form of carbon that inhibits sintering of glass ceramics. That is, carbon C is oxidized with water H ₂ O in a humidified atmosphere to produce CO 2.
And H ₂ , and the carbon is removed. The pressure of about 2 kg / cm ² is applied to prevent the substrate from shrinking in the XY directions during sintering.

The wiring width of the conductor wiring of the manufactured Cu / glass ceramic multilayer circuit board 15a is about 25 to 50 μm,
The wiring film thickness is about 10-20 μm, and the wiring pitch is 1
It remained about 50 to 250 μm. The ratio between the wiring width and the wiring film thickness is about 0.5 to 0.4, and the area of the conductor wiring cross section is about 85 to the product of the wiring cross section maximum width and the wiring cross section maximum film thickness.
90%. The specific resistance of the Cu conductor wiring is about 2.7μ
Ω · cm, so the wiring resistance is 0.32-1.2Ω
/ Cm, but by using high-density wiring, the length of the wiring can be shortened.
The following low-resistance conductor wiring was obtained. Also, the variation in the wiring width and the wiring film thickness was small, so that the variation in the value of the characteristic impedance could be reduced.

[Second Embodiment] A description will be given with reference to FIG.
In the same manner as in the first embodiment, a green sheet in which a Cu conductor paste was filled with vias was manufactured. As shown in FIG. 2A, a wiring width of 25 to 50 μm, a wiring thickness of 12 to 30 μm,
A wiring pattern (conductor metal wiring) 12b having a wiring pitch of 150 to 250 μm was screen-printed by an improved method. The Cu paste used here is an acrylic copolymer (30 to 50% methacrylic acid, 35 to 25% methyl methacrylate and 35 to 25% A polymer prepared by adding 0.1 to 1 equivalent of glycidyl acrylate to styrene) is dissolved in a solvent under heating, and a photopolymerization initiator is further added to 5 to 10 parts by weight of a vehicle. 93 to 85 parts by weight of reduced Cu powder and 2 to 5 parts by weight of a photoreactive compound were added, and mixed and dispersed with a three-roll mill. As shown in FIG. 2B, 30 to 50 green sheets 13b on which a wiring pattern is printed are provided.
The wiring pattern was cured by exposing to ultraviolet light 18 with an ultra-high pressure mercury lamp having an output of W / cm ² .

The green sheets on which these wiring patterns are printed are aligned so that the vias of each layer are connected.
About 0 to 50 sheets were stacked. Then, 130 ° C, 150k
g / cm ² under heat and pressure to adhere, and FIG. 2 (c)
As shown in (1), a glass-ceramic laminate substrate 14b on which three-dimensional wiring was formed was manufactured. A pressure of about ² kg / cm ² is applied to the glass-ceramic laminate substrate 14 b, the organic binder is removed in a humidified atmosphere at about 850 ° C. for about 10 hours, and then in a non-oxidizing atmosphere.
By firing at about 1000 ° C for about 2 hours,
As shown in (d), the glass ceramic multilayer circuit board 1
5b was obtained. The wiring width of the conductor wiring of the manufactured Cu / glass ceramic multilayer circuit board 15b is about 25 to 50 μm,
The wiring film thickness is about 10-20 μm, and the wiring pitch is 1
It remained about 50 to 250 μm. The ratio between the wiring width and the wiring film thickness is about 0.5 to 0.4, and the area of the conductor wiring cross section is about 85 to the product of the wiring cross section maximum width and the wiring cross section maximum film thickness.
90%. The specific resistance of the Cu conductor wiring is about 2.7μ
Ω · cm, so that the wiring resistance is about 0.32 to 1.2
The resistance is about 10 Ω / cm, but since the length of the wiring can be shortened by using high-density wiring, the electric resistance becomes 10 Ω / cm.
A low-resistance conductor wiring of Ω or less was obtained. Also, the variation in the wiring width and the wiring film thickness was small, so that the variation in the value of the characteristic impedance could be reduced.

[Third Embodiment] A description will be given with reference to FIG.
In the same manner as in the first embodiment, a green sheet in which a Cu conductor paste was filled with vias was manufactured. As shown in FIG. 3A, a wiring width of 60 μm, a wiring thickness of 30 μm, a wiring pitch of 2
A 50 μm wiring pattern (conductor metal wiring) 12c was screen printed by an improved method. The Cu paste used here was reduced Cu powder 57 having an average particle size of about 2 to 4 μm.
To 79 parts by weight, 9.5 to 4.75 parts by weight of a saturated polyester, 0.5 to 0.25 parts by weight of a melamine resin, and 33 to 16 parts by weight of cyclohexanone were kneaded using a three-roll mill. As shown in FIG. 3B, the green sheet 13c on which the wiring pattern is printed is heat-treated at about 80 ° C.
The wiring pattern was cured. Approximately 30 to 50 green sheets on which these wiring patterns were printed were stacked with their positions adjusted so that the vias of each layer were connected. Then 13
Under a condition of about 0 ° C. and about 150 kg / cm ^2, they were bonded by bonding under heat and pressure, as shown in FIG. 3C, to produce a glass-ceramic laminate substrate 14c having three-dimensionally formed wiring.

A pressure of about 2 kg / cm ² is applied to the glass-ceramic laminate substrate 14c, and the
The organic binder was removed by holding at 0 ° C. for 10 hours, and then baked at 1000 ° C. for 2 hours in a non-oxidizing atmosphere to obtain a glass ceramic multilayer circuit board 15c as shown in FIG. . The wiring width of the conductor wiring of the manufactured Cu / glass ceramic multilayer circuit board 15c is 25 to 60.
The wiring thickness was about 10 to 20 μm, and the wiring pitch remained about 150 to 250 μm. The ratio between the wiring width and the wiring film thickness was about 0.5 to 0.4, and the area of the conductor wiring cross section was about 85 to 90% of the product of the wiring cross section maximum width and the wiring cross section maximum film thickness. The specific resistance of the Cu conductor wiring portion is about 2.7 μΩ · cm, and thus the wiring resistance is about 0.3
Although it is about 2 to 1.2 Ω / cm, the length of the wiring can be shortened by using high-density wiring, so that a low-resistance conductor wiring having an electric resistance of 10 Ω or less could be obtained. Also, the variation in the wiring width and the wiring film thickness was small, so that the variation in the value of the characteristic impedance could be reduced.

[Embodiment 4] In this embodiment 4, as shown in FIG. 4, a conductive metal / glass ceramic multilayer circuit board 15a, 15
This is a mounting body of an electronic element including the components b and 15c. The line wiring 2 and the through hole 3 are formed on the conductive metal / glass ceramic multilayer circuit boards 15a, 15b, and 15c manufactured in the first, second, or third embodiment. The thin film multilayer circuit 4 was formed on the upper surface of the conductive metal / glass ceramic multilayer circuit board 15a, 15b, 15c such as Cu using copper and polyimide. Further, the LSI chip 5 was mounted with the solder 6. After that, Cu electric signal input / output pins 7 were brazed on the back conductor layer using AuSn solder. FIG. 4 shows the internal configuration of the module thus manufactured. In this module, high-precision connection with the LSI chip 5 is achieved. Because of the high mechanical strength of the insulating material 8, no cracks were observed around the pinned portion by brazing the pin 7 or soldering the LSI chip 5. No warping or deformation of the substrate was observed.

Fifth Embodiment As shown in FIG. 5, a fifth embodiment of the present invention relates to a conductive metal / glass-ceramic multilayer circuit board 15 made of Cu or the like manufactured in the first, second or third embodiment.
It is a mounting body of an electronic element including a, 15b, and 15c. In the fifth embodiment, a conductor metal such as Cu /
Glass ceramic multilayer circuit boards 15a, 15b, 15c
A carrier substrate 9 made of the same material as the multilayer circuit substrate 15 is sandwiched between the semiconductor chip and the LSI chip 5. Then, the cap 10 is joined to the upper end of the carrier substrate 9 and the upper surface of the LSI chip 5 by solder 6a, thereby sealing the carrier substrate 9. Conductive metal / glass ceramic multilayer circuit boards 15a, 15b, and 15c such as Cu are manufactured in the first, second, or third embodiment. On the upper surface of the carrier substrate 9, as in the fourth embodiment,
Are formed. LSI chip 5 and multilayer circuit board 15
a, 15b, and 15c are connected in the same manner as in the fourth embodiment.
This is done by solder 6.

[0028]

According to the present invention, in a glass-ceramic multilayer circuit board composed of a conductive metal portion such as Cu and an insulator portion made of glass ceramic, a wiring width of 25 mm is used.
About 60 μm, the wiring pitch is as small as about 150 to 250 μm, the aspect ratio of the wiring cross section can be as high as 0.3 or more, and the variation in the line width and film thickness can be reduced. Has an effect that a low resistance value of 10Ω or less can be realized as an electric resistance, and a variation in electric resistance value and characteristic impedance value is small, and stable and high-density conductor wiring can be realized. Further, according to the present invention, downsizing and high density can be realized as a glass-ceramic multilayer circuit board, so that a large number of highly integrated LSIs and various electronic components can be mounted thereon. There is an effect that it is possible to obtain a mounted body of an electronic device on which a large number of integrated LSIs and various electronic components are mounted.

[Brief description of the drawings]

FIG. 1 is a flowchart showing Embodiment 1 of a method for manufacturing a conductor metal / glass ceramic multilayer circuit board such as Cu according to the present invention.

FIG. 2 is a flowchart showing Embodiment 2 of a method for manufacturing a conductive metal / glass ceramic multilayer circuit board such as Cu according to the present invention.

FIG. 3 is a flowchart showing Embodiment 2 of a method for manufacturing a conductive metal / glass ceramic multilayer circuit board such as Cu according to the present invention.

FIG. 4 is a schematic diagram showing an internal structure of an electronic device package according to an embodiment of the present invention in which an LSI chip is mounted on a conductive metal / glass ceramic multilayer circuit board such as Cu.

FIG. 5 is a schematic view showing an internal structure of another embodiment of a mounted body of an electronic element in which an LSI chip is mounted on a conductive metal / glass ceramic multilayer circuit board such as Cu according to the present invention.

FIG. 6 is a diagram showing a cross section of a conductive metal wiring (wiring pattern) of Cu or the like in a sintered conductive metal such as Cu / glass ceramic multilayer circuit board according to the present invention.

[Explanation of symbols]

2: line wiring, 3: through-hole, 4: thin-film multilayer circuit, 5: LSI chip, 6: solder, 7: pin, 8: insulating material, 9: carrier substrate, 10: cap, 11: glass ceramic green sheet ,
12, 12a, 12b, 12c: conductive metal wiring (wiring pattern) such as Cu; 13a, 13b, 13c: green sheets on which wiring patterns are formed; 14a, 14b;
14c: glass ceramic laminate substrate, 15, 15
a, 15b, 15c: glass ceramic multilayer circuit board (conductor metal such as Cu / glass ceramic multilayer circuit board), 16: conductor wiring pattern

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor: Kinoshita Yen 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Pref.

Claims (18)

[Claims] 1. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein the cross-sectional area of the conductor wiring pattern is 80 times the product of the maximum width and the maximum film thickness. % Or more. 2. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein an aspect ratio between a wiring width and a wiring film thickness of the conductor wiring pattern is 0.3 or more. A ceramic multilayer circuit board, characterized in that: 3. The conductive wiring pattern is formed of a low-resistance material containing copper, gold, or silver as a main component, and has a wiring width of 20 to 50 μm and a wiring pitch of 150 to 250 μm.
The ceramic multilayer circuit board according to claim 1, wherein: 4. The conductor wiring pattern is formed of a low-resistance material containing copper, gold or silver as a main component, and has a wiring width of 20 to 50 μm and a wiring pitch of 150 to 250 μm.
3. The ceramic multilayer circuit board according to claim 1, wherein said conductor wiring pattern has an electric resistance of 10 Ω or less. 5. The ceramic multilayer circuit board according to claim 1, wherein said ceramic is formed of glass ceramic. 6. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein said ceramics is formed of glass ceramics, and said conductor wiring pattern is made of copper,
The wiring width is 20 to 50 μm and the wiring pitch is 150 to 25.
0 μm, and the electric resistance of the conductor wiring pattern is 10 μm.
A ceramic multilayer circuit board characterized by being Ω or less. 7. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein said ceramics is formed of glass ceramic, and said conductor wiring pattern is made of copper,
The wiring width is 20 to 50 μm and the wiring pitch is 150 to 25.
A ceramic multilayer circuit board, wherein the cross-sectional area of the conductive wiring pattern is 0% or more and 80% or more of a product of a maximum width and a maximum film thickness. 8. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein said ceramics is formed of glass ceramic, and said conductor wiring pattern is made of copper,
The wiring width is 20 to 50 μm and the wiring pitch is 150 to 25.
A ceramic multilayer circuit board, wherein an aspect ratio between a wiring width and a wiring film thickness is 0.3 μm or more. 9. A ceramic multilayer circuit board having a conductor wiring pattern in an insulator made of ceramics laminated, bonded and fired, wherein said ceramics is formed of glass ceramic, and said conductor wiring pattern is made of copper,
The wiring width is 20 to 50 μm and the wiring pitch is 150 to 25.
0 μm, and the electric resistance of the conductor wiring pattern is 10 μm.
A ceramic multilayer circuit board characterized by being Ω or less. 10. An active energy ray-curable conductive paste composition containing an active energy ray-curable compound, wherein at least a wiring pattern portion of the conductive pattern has a wiring width of 20 to 50 μm and a wiring pitch of 15 μm.
A printing step of printing on a glass ceramic green sheet having an aspect ratio of a wiring width and a wiring film thickness of 0.3 to 250 μm to 0 to 250 μm; A curing step of irradiating the green sheet with active energy rays to cure the wiring pattern; a laminating / adhering step of laminating and bonding a glass ceramic green sheet having the wiring pattern cured in the curing step; A method for producing a ceramic multilayer circuit board, comprising: a firing step of removing a binder and firing the glass ceramic multilayer substrate laminated and bonded in the bonding step. 11. A thermosetting conductive paste composition containing a compound curable at a temperature equal to or lower than a temperature at which a binder is scattered in at least a wiring pattern portion of a conductive pattern, and having a wiring width of 20 to 50 μm and a wiring width of 20 to 50 μm. A printing step of printing on a glass ceramic green sheet with a pitch of 150 to 250 μm and an aspect ratio of a wiring width to a wiring film thickness of 0.3 or more, and glass printed on at least a wiring pattern portion in the printing step A curing step of curing the wiring pattern by heat treatment at a temperature equal to or lower than the temperature at which the binder is scattered to the ceramic green sheets; and a lamination step of laminating and bonding glass ceramic green sheets having the wiring pattern cured in the curing step. A bonding step, and a glass ceramic laminated and bonded in the laminating and bonding step. And a firing step of firing and removing the binder from the layer substrate. 12. The glass ceramic green sheet contains 75 to 85% by weight of SiO ₂ in terms of oxide.
B ₂ O ₃ 10 to 30 wt%, the Al ₂ O ₃ 1 to 10% by weight, the alkali metal oxide 10 wt% or less, others 1
The method for producing a ceramic multilayer circuit board according to claim 10 or 11, comprising 70% by volume of borosilicate glass having a composition of not more than% by weight and 30% by volume of mullite. 13. A ceramic multilayer circuit board having a conductor wiring pattern having a cross-sectional area of 80% or more of a product of a maximum width and a maximum film thickness in an insulator made of ceramics laminated, bonded and fired. An electronic device package comprising: a semiconductor element mounted on a ceramic multilayer circuit board. 14. A ceramic multilayer circuit board having a conductor wiring pattern in which an aspect ratio between a wiring width and a wiring film thickness is 0.3 or more in an insulator made of ceramics laminated, bonded and fired. An electronic device package comprising: a semiconductor element mounted on a multilayer circuit board. 15. An insulator made of glass ceramics laminated, bonded and fired, formed of a low-resistance material containing copper, gold, or silver as a main component, and having a wiring width of 20 to 20.
A ceramic multilayer circuit board having a conductor wiring pattern having a wiring pitch of 50 μm, a wiring pitch of 150 to 250 μm, and an electric resistance of the conductor wiring pattern of 10 Ω or less; and a semiconductor element mounted on the ceramic multilayer circuit board. An electronic device package comprising: 16. An insulator made of glass ceramics laminated, bonded and fired, formed of a low-resistance material containing copper, gold or silver as a main component and having a wiring width of 20 to 20.
A ceramic multilayer circuit board having a conductor wiring pattern having a wiring pattern of 50 μm, a wiring pitch of 150 to 250 μm, and a cross-sectional area of the conductor wiring pattern being 80% or more of a product of a maximum width and a maximum film thickness; An electronic device package comprising: a semiconductor element mounted on a substrate. 17. An insulating body made of glass ceramics laminated, bonded and fired, formed of a low-resistance material containing copper, gold or silver as a main component and having a wiring width of 20 to
A ceramic multilayer circuit board having a conductor wiring pattern having a wiring pattern of 50 μm, a wiring pitch of 150 to 250 μm, and a wiring width and a wiring film thickness of 0.3 or more, and a semiconductor element mounted on the ceramic multilayer circuit board An electronic device package comprising: 18. An insulator made of glass ceramics laminated, bonded and fired, formed of a low-resistance material containing copper, gold or silver as a main component and having a wiring width of 20 to 20.
A ceramic multilayer circuit board having a conductor wiring pattern having a wiring pitch of 50 μm, a wiring pitch of 150 to 250 μm, and an electric resistance of the conductor wiring pattern of 10 Ω or less; and a semiconductor element mounted on the ceramic multilayer circuit board. An electronic device package comprising: